C1210C474K5N1C7289 [KEMET]
Ceramic Capacitor, Ceramic, CHIP, ROHS COMPLIANT;型号: | C1210C474K5N1C7289 |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Ceramic, CHIP, ROHS COMPLIANT 电容器 |
文件: | 总15页 (文件大小:773K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric,
10 VDC – 50 VDC (Commercial & Automotive Grade)
Overview
KEMET Power Solutions High Temperature (KPS HT) stacked
capacitors utilize a proprietary lead-frame technology to
vertically stack one or two multilayer ceramic chip capacitors
into a single compact surface mount package. The attached
lead-frame mechanically isolates the capacitor(s) from the
printed circuit board, thereby offering advanced mechanical
and thermal stress performance. Isolation also addresses
concerns for audible, microphonic noise that may occur when
a bias voltage is applied. A two-chip stack offers up to double
the capacitance in the same or smaller design footprint when
compared to traditional surface mount MLCC devices. Providing
up to 10 mm of board flex capability, KPS Series capacitors
are environmentally friendly and in compliance with RoHS
legislation. Combined with X8L dielectric, these devices are
capable of reliable operation up to 150°C and are well suited for
high temperature filtering, bypass and decoupling applications.
X8L exhibits a predictable change in capacitance with respect to
time and voltage, and boasts a minimal change in capacitance
with reference to ambient temperature up to 125°C. Beyond
125°C, X8L displays a wider variation in capacitance. Capacitance
change is limited to ±15% from -55°C to +125°C and +15, -40%
from 125°C to 150°C.
In addition to Commercial grade, Automotive grade devices
are available and meet the demanding Automotive Electronics
Council's AEC-Q200 qualification requirements.
Benefits
• -55°C to +150°C operating temperature range
• Reliable and robust termination system
• EIA 1210 and 2220 case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, and 50 V
• Capacitance offerings ranging from 0.47 μF up to 47 μF
• Available capacitance tolerances of ±10% and ±20%
• Higher capacitance in the same footprint
• Potential board space savings
• Reduces audible, microphonic noise
• Extremely low ESR and ESL
• Pb-Free and RoHS Compliant
• Capable of Pb-Free reflow profiles
• Non-polar device, minimizing
installation concerns
• Tantalum and electrolytic
alternative
• Advanced protection against thermal and mechanical stress
• Provides up to 10 mm of board flex capability
• Commercial & Automotive
(AEC-Q200) grades available
Ordering Information
C
2220
C
476
M
4
N
2
C
7186
Case Size Specification/
Capacitance
Code (pF)
Capacitance Rated Voltage
Failure Rate/
Design
Leadframe
Finish
Packaging/Grade
(C-Spec)
Ceramic
Dielectric
(L"x W")
Series
Tolerance1
(VDC)
1210
2220
C =
Standard
2 significant
digits + number M = ±20%
of zeros.
K = ±10%
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
N = X8L 1 = KPS Single C = 100% 7186 = 7" Reel Unmarked
Chip Stack
Matte Sn
7289 = 13" Reel Unmarked
AUTO = Automotive Grade
7" Reel Unmarked
2 = KPS Double
Chip Stack
AUTO7289 = Automotive
Grade 13" Reel Unmarked
1 Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Top View
Single or Double
Profile View
Double Chip Stack
Single Chip Stack
Chip Stack
Chip
EIA
Metric Size
Code
L
W
Width
H
LW
Lead Width
Mounting
Technique
Stack Size Code
Length
Height
1210
3225
5650
3225
5650
3.50 (.138) ±0.30 (.012) 2.60 (.102) ±0.30 (.012) 3.35 (.132) ±0.10 (.004) 0.80 (.032) ±0.15 (.006)
6.00 (.236) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 3.50 (.138) ±0.30 (.012) 1.60 (.063) ±0.30 (.012)
3.50 (.138) ±0.30 (.012) 2.60 (.102) ±0.30 (.012) 6.15 (.242) ±0.15 (.006) 0.80 (.031) ±0.15 (.006)
6.00 (.236) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 5.00 (.197) ±0.50 (.020) 1.60 (.063) ±0.30 (.012)
Single
2220
Solder Reflow
Only
1210
Double
2220
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction (piezoelectric/
mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current
limitation and any application that is subject to extreme environments such as high temperature, high levels of board flexure and/or
temperature cycling. Markets include industrial, aerospace, automotive, and telecom.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Environmental Compliance
Pb-Free and RoHS Compliant.
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
-55°C to +150°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
±15% (-55ºC to 125ºC), +15, -40% (125ºC to 150ºC)
3.0%
250% of rated voltage
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
3.5% (10 V and 16 V) and 2.5% (25 V and 50 V)
500 megohm microfarads or 10 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ - µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
Dielectric
X8L
> 25
16 / 25
10
3.0
5.0
7.5
All
±20%
10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Series
Voltage Code
C1210
C2220
Cap
Code
8
4
3
5
1
A
8
4
3
5
1
A
Capacitance
Voltage DC
10
16
25
50
100
250
10
16
25
50
100
250
Capacitance Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
Single Chip Stack
0.10 µF
0.22 µF
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
15 µF
22 µF
33 µF
47 µF
104
224
474
105
225
335
475
106
156
226
336
476
107
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
FV
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
JP
100 µF
Double Chip Stack
0.10 µF
0.22 µF
0.47 µF
1.0 µF
2.2 µF
3.3 µF
4.7 µF
10 µF
22 µF
33 µF
47 µF
100 µF
220 µF
104
224
474
105
225
335
475
106
226
336
476
107
227
M
M
M
M
M
M
M
M
M
M
M
M
M
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
FW
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
JR
Voltage DC
10
8
16
4
25
3
50
5
100
1
250
A
10
8
16
4
25
3
50
5
100
1
250
A
Cap
Code
Voltage Code
Capacitance
Series
C1210
C2220
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
FV
FW
JP
1210
1210
2220
2220
3.35 ± 0.10
6.15 ± 0.15
3.50 ± 0.30
C
0
0
600
2,000
0
0
0
0
300
300
N
1,000
1,300
C
476
M
4
2
C
7186
Pac
Case Size Specification/
Capacitance
Code (pF)
Capacitance Rated Voltage
Tolerance
Failure Rate/
Design
Leadframe
Finish
Packaging/Grade
(C-Spec)
Ceramic
Dielectric
(L"x W")
Series
(VDC)
1210
2220
C =
Standard
2 significant
digits + number M = ±20%
of zeros.
K = ±10%
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
N = X8L 1 = KPS Single C = 100% 7186 = 7" Reel Unmarked
Chip Stack
Matte Sn
7289 = 13" Reel Unmarked
AUTO = Automotive Grade
7" Reel Unmarked
2 = KPS Double
Chip Stack
AUTO7289 = Automotive
Grade 13" Reel Unmarked
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
4
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 3 – KPS Land Pattern Design Recommendations (mm)
METRIC
SIZE
CODE
Median (Nominal) Land Protrusion
EIA SIZE
CODE
C
Y
X
V1
V2
1210
2220
3225
5650
1.50
1.14
1.75
5.05
3.40
2.69
2.08
4.78
7.70
6.00
Soldering Process
KEMET’s KPS Series devices are compatible with IR reflow
Profile Feature
SnPb Assembly Pb-Free Assembly
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended profile
conditions for IR reflow reflect the profile conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Temperature Maximum (TSmax
)
Time (ts) from Tsmin to Tsmax
Ramp-up Rate (TL to TP)
)
60 – 120 seconds
3°C/seconds maximum
183°C
60 – 120 seconds
3°C/seconds maximum
217°C
To prevent degradation of temperature cycling capability, care
must be taken to prevent solder from flowing into the inner side
of the lead frames (inner side of "J" lead in contact with the
circuit board).
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
60 – 150 seconds
235°C
60 – 150 seconds
250°C
Time within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
10 seconds maximum
Ramp-down Rate (TP to TL)
6°C/seconds maximum
6 minutes maximum
6°C/seconds maximum
8 minutes maximum
After soldering, the capacitors should be air cooled to room
temperature before further processing. Forced air cooling is not
recommended.
Time 25°C to Peak Temperature
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be taken
to avoid contact of the soldering iron to the capacitor body. The
iron should be used to heat the solder pad, applying solder
between the pad and the lead, until reflow occurs. Once reflow
occurs, the iron should be removed immediately. (Preheating is
required when hand soldering to avoid thermal shock.)
TP
tP
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds
TL
tL
T
smax
T
smin
tS
25
25ºC to Peak
Time
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Terminal Strength
Board Flex
Reference
JIS–C–6429
JIS–C–6429
Test or Inspection Method
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: 5.0 mm minimum
Magnification 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 @ 250°C
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
MIL–STD–202 Method 103
1,000 cycles (-55°C to +150°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance
Thermal Shock
MIL–STD–202 Method 106
MIL–STD–202 Method 107
-55°C/+150°C. Note: Number of cycles required- 300, maximum transfer time- 20 seconds, Dwell
time- 15 minutes. Air-Air.
High Temperature Life MIL–STD–202 Method 108 1,000 hours at 150°C with rated voltage applied.
Storage Life
Vibration
MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB .031" thick, 7 secure
MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz.
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Construction
Reference
Item
Material
A
B
C
D
E
F
Leadframe
Phosphor Bronze – Alloy 510
Leadframe Attach
HMP Solder
Cu
Ni
Termination
Sn
Inner Electrode
Ni
G
Dielectric Material
BaTiO3
Note: Image is exaggerated in order to clearly identify all components of construction.
HMP = High Melting Point
Product Marking
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Table 4 – Carrier Tape Configuration – Embossed Plastic (mm)
EIA Case Size
01005 – 0402
0603 – 1210
Tape Size (W)*
Pitch (P1)*
8
8
2
4
1805 – 1808
12
12
12
16
8
4
≥ 1812
8
KPS 1210
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 5 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 4
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum
Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
4.35
(0.171)
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum
2.5
(0.098)
Maximum
8.3
(0.327)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ± 0.05 12.0 ± 0.10
(0.138 ± 0.002) (0.157 ± 0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 3 – Maximum Lateral Movement
Figure 4 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape width
without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Round Sprocket Holes
Punched Carrier
8 mm & 12 mm only
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm
Minimum Leader
400 mm Minimum
Trailer
160 mm Minimum
Components
Top Cover Tape
Figure 7 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
KEMET Corporation
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Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
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Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Digitally signed by Jeannette Calvo
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications,
cn=Jeannette Calvo, email=jeannettecalvo@kemet.com
Date: 2013.06.07 16:25:54 -04'00'
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1038_X8L_KPS_150C_SMD • 5/28/2013 15
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