C1206R225K3RACT100 [KEMET]
Surface Mount Multilayer Ceramic Chip Capacitors;型号: | C1206R225K3RACT100 |
厂家: | KEMET CORPORATION |
描述: | Surface Mount Multilayer Ceramic Chip Capacitors |
文件: | 总22页 (文件大小:1631K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC
(Industrial Grade)
Overview
KEMET’s High Temperature X7R Dielectric capacitors are
formulated and designed for extreme temperature applications.
Constructed of a robust and proprietary base metal electrode
(BME) dielectric system, these devices are capable of reliable
operation in temperatures up to 175°C. Providing an attractive
combination of performance and robustness in general high
temperature applications, High Temperature X7R dielectric
capacitors are well suited for high temperature bypass and
decoupling applications or frequency discriminating circuits
where Q and stability of capacitance characteristics are not
critical. They exhibit a predictable change in capacitance with
respect to time, voltage and temperature up to 175°C.
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Ordering Information
1210
225
T050
C
R
K
3
R
A
C
Case Size1 Specification/ Capacitance Capacitance Rated Voltage
Failure Rate/ Termination
Ceramic
Dielectric
R = X7R
Packaging/Grade (C-Spec)2
(L" x W")
Series1
Code (pF)
Tolerance
(VDC)
Design
Finish
0402
0603
0805
1206
1210
1812
G = 175°C
with standard
termination
R = 175°C
w/ Flexible
Termination
First two digits J = ±5%
4 = 16
A = N/A
C = 100%
Matte Sn
Blank = Bulk
represent
significant
figures. Third
digit specifies
number of
zeros.
K = ±10%
M = ±20%
3 = 25
5 = 50
2 = 200
7292 = Waffle Pack/Tray
TU = 7" Reel - Unmarked
(full reel quantity)
T050 = 50 pieces/7" Reel -
Unmarked
T100 = 100 pieces/7" Reel -
Unmarked
T250 = 250 pieces/7" Reel -
Unmarked
T500 = 500 pieces/7" Reel -
Unmarked
T1K0 = 1,000 pieces/Reel -
Unmarked
1 Flexible termination option is only available in 0603 (1608 metric) and larger case sizes.
2 Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the "T1K0" packaging option, 1812 case size devices with
chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7" reels or a single 13" reel. The term "Unmarked" pertains to laser marking of components.
All packaging options labeled as "Unmarked" will contain capacitors that have not been laser marked. Additional reeling or packaging options may be available.
Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Dimensions – Millimeters (Inches) – Standard Termination
L
W
T
B
S
EIA
Size
Code Code
Metric
Size
S
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
0402
0603
0805
1206
1210
1812
1005
1608
2012
3216
3225
4532
1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002)
1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006)
2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008)
3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008)
3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008)
4.50 (0.177) ±0.30 (0.012) 3.20 (0.126) ±0.30 (0.012)
0.30 (0.012) ± 0.10 (0.004) 0.30 (0.012) Solder Reflow Only
0.35 (0.014) ± 0.15 (0.006) 0.70 (0.028)
Solder Wave
0.50 (0.02) ± 0.25 (0.010)
0.50 (0.02) ± 0.25 (0.010)
0.50 (0.02) ± 0.25 (0.010)
0.60 (0.024) ± 0.35 (0.014)
0.75 (0.030)
N/A
or
See Table 2
for Thickness
Solder Reflow
Solder Reflow Only
Solder Reflow Only
Dimensions – Millimeters (Inches) – Flexible Termination
EIA
Size
Code Code
Metric
Size
S
Mounting
Technique
T
L Length
W Width
B Bandwidth
Separation
Minimum
Thickness
0603
0805
1206
1210
1812
1608
2012
3216
3225
4532
1.60 (0.064) ±0.17 (0.007) 0.80 (0.032) ±0.15 (0.006)
2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008)
3.30 (0.130) ±0.40 (0.016) 1.60 (0.063) ±0.20 (0.008)
3.30 (0.130) ±0.40 (0.016) 2.50 (0.098) ±0.20 (0.008)
4.50 (0.178) ±0.40 (0.016) 3.20 (0.126) ±0.30 (0.012)
0.45 (0.018) ±0.15 (0.006) 0.58 (0.023)
Solder Wave
or
Solder Reflow
0.50 (0.02) ±0.25 (0.010)
0.60 (0.024) ±0.25 (0.010)
0.60 (0.024) ±0.25 (0.010)
0.70 (0.028) ±0.35 (0.014)
0.75 (0.030)
N/A
See Table 2
for Thickness
Solder Reflow Only
Solder Reflow Only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Overview cont'd
Concerned with flex cracks resulting from excessive stresses
produced during board flexure and thermal cycling? These
devices are available with KEMET's Flexible termination
technology which inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can result
in low IR or short circuit failures. Although flexible termination
technology does not eliminate the potential for mechanical
damage that may propagate during extreme environmental and
handling conditions, it does provide superior flex performance over
standard termination systems.
KEMET’s High Temperature X7R surface mount MLCCs are
manufactured in state of the art ISO/TS 16949:2009 certified
facilities and are proven to function reliably in harsh, high
temperature and high humidity, down-hole environments.
Benefits
• Operating temperature range of -55°C to +175°C
• Voltage derating not required
• Lead (Pb)-Free, RoHS and REACH compliant
• Base metal electrode (BME) dielectric system
• EIA 0402, 0603, 0805, 1206, 1210 and 1812 case sizes
• DC voltage ratings of 16 V, 25 V, 50 V & 200 V
• Capacitance offerings ranging from 2.7 nF to 3.3 µF
• Available capacitance tolerances of ±5%, ±10% & ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Flexible termination option available upon request
Applications
Typical applications include decoupling, bypass, filtering and transient voltage suppression in extreme environments such as down-hole
exploration, aerospace engine compartments and geophysical probes.
Application Notes
X7R dielectric is not recommended for AC line filtering or pulse applications.
Voltage derating of these capacitors is not required for application temperatures up to 175°C.
Qualification/Certification
High temperature Industrial grade products meet or exceed the requirements outlined Table 4, Performance & Reliability. Qualification
packages are available upon request.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Environmental Compliance
Lead (Pb)-Free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
-55°C to +175°C
±15% (-55°C to +125°C) beyond 125°C see "Capacitance vs. Temperature
Performance" plot - Reference Only
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
<3.0%
250% of rated voltage
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit at 25ºC
Insulation Resistance (IR) Limit at 25°C
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
See Dissipation Factor Limit Table
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ± 5 secs at 25°C)
Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Dissipation Factor Limit Table
Rated DC Voltage
Dissipation Factor
16/25
>25
3.5%
2.5%
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
Dielectric
X7R
16/25
>25
5.0
3.0
All
± 20%
10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Electrical Characteristics
Capacitance vs. Temperature Performance (-55°C to +175°C)
10.00
0.00
-10.00
-20.00
0603 (1608), 0.1µF, 25V
-30.00
0805 (2012), 0.27µF, 25V
-40.00
1206 (3216), 1.0µF, 25V
-50.00
1210 (3225), 2.2µF, 25V
-60.00
1812 (4532), 3.3µF, 25V
-70.00
-80.00
1812 (4532), 1.0µF, 50V
-55 -40 -25 -10
5
20
35
50
65
80
95
110 125 140 155 170
TEMPERATURE (°C)
Capacitance vs. Bias Voltage Performance (25 VDC Rated )
10.0
0.0
-10.0
-20.0
-30.0
0603 (1608), 0.1µF, 25V
0805 (2012), 0.27µF, 25V
1210 (3225), 2.2µF, 25V
1812 (4532), 3.3µF, 25V
-40.0
-50.0
-60.0
-70.0
-80.0
0
5
10
15
BIAS DC VOLTAGE
20
25
Capacitance vs. Bias Voltage Performance (1812 Case Size, 1.0 µF, 50 VDC Rated)
10.0
5.0
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
1812 (4532), 1.0µF, 50V
-30.0
-35.0
-40.0
0
5
10
15
20
25
BIAS DC VOLTAGE
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
Case Size/
Series
Voltage Code
C0402G
C1206G/R C1210G/R
C0603G/R C0805G/R
C1812G/R
4
3
1
1
5
1
3
5
1
3
5
1
3
5
3
5
3
5
1
2
Capacitance Cap Code
Rated Voltage
(VDC)
16
25
100
100
50 100
25
50 100
25
50 100
25
50
25
50
25
50 100 200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
2700 pF
3300 pF
3900 pF
4700 pF
5600 pF
6800 pF
8200 pF
10000 pF
12000 pF
15000 pF
18000 pF
22000 pF
27000 pF
33000 pF
39000 pF
47000 pF
56000 pF
68000 pF
82000 pF
0.1 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
0.56 µF
0.68 µF
0.82 µF
1 µF
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
125
155
185
225
275
335
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
BB
DN DN
DN DN
DN DN
DN DN
DN DN
DP DP
DP DP
GN GN GN GN
GM GM GM GM
ED ED
ED ED
ED ED
ED ED
DF
DF
FE
FE
FF
FF
FG
FG
FH
FE
FE
FF
FF
FG
FG
FH
DG DG
DG DG
DP
DP
DG
EP
EP
EJ
EJ
EJ
EP
EJ
EJ
EJ
EP
EP
EJ
EJ
EJ
GB GB
GB GB
GB GB
GB GB
GB GB
GB GB
GC GC
GE GE
GG GG
DG
DG
FM FM
FK
FK
FH
FM
FK
FK
FK
FK
1.2 µF
1.5 µF
1.8 µF
2.2 µF
2.7 µF
3.3 µF
GJ
GL
GE
GG
GJ
GL
GJ
GL
Rated Voltage
(VDC)
16
25
3
100
1
100
1
50 100
25
3
50 100
25
3
50 100
25
3
50
5
25
3
50
5
25
3
50 100 200
4
Capacitance
Cap Code
Voltage Code
5
1
5
1
5
1
5
1
2
Case Size/
Series
C0402G
C0603G/R
C0805G/R
C1206G/R
C1210G/R
C1812G/R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
7" Reel
13" Reel
BB
CF
DN
DP
DF
DG
ED
EP
EJ
0402
0603
0805
0805
0805
0805
1206
1206
1206
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
0.50 ± 0.05
0.80 ± 0.07
0.78 ± 0.10
0.90 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.00 ± 0.10
1.20 ± 0.20
1.70 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
1.00 ± 0.10
1.10 ± 0.10
1.30 ± 0.10
1.55 ± 0.10
1.70 ± 0.15
1.70 ± 0.20
1.90 ± 0.20
2.00 ± 0.20
10,000
4,000
4,000
4,000
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,500
2,000
2,500
2,500
2,500
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
500
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
2,000
FE
FF
FG
FH
FM
FK
GB
GC
GE
GG
GJ
GN
GL
GM
500
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0402
0603
0805
1206
1210
1812
1005
1608
2012
3216
3225
4532
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0.90
1.00
1.60
1.60
2.15
1.15
1.35
1.35
1.35
1.60
1.10
1.55
1.90
2.80
3.60
4.00
4.40
5.60
5.65
6.90
2.10
2.60
2.90
3.80
4.60
0.80
0.90
1.50
1.50
2.05
0.95
1.15
1.15
1.15
1.40
1.00
1.45
1.80
2.70
3.50
3.10
3.50
4.70
4.70
6.00
1.50
2.00
2.30
3.20
4.00
0.60
0.75
1.40
1.40
1.95
0.75
0.95
0.95
0.95
1.20
0.90
1.35
1.70
2.60
3.40
2.40
2.80
4.00
4.00
5.30
1.20
1.70
2.00
2.90
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0603
0805
1206
1210
1812
1608
2012
3216
3225
4532
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
3.10
1.50
0.65
0.85
0.90
2.40
1.20
1.00
1.60
1.60
2.10
1.35
1.65
1.65
1.80
1.55
1.90
2.80
3.60
4.40
5.90
5.90
7.00
2.60
2.90
3.80
4.60
0.90
1.50
1.50
2.00
1.15
1.45
1.45
1.60
1.45
1.80
2.70
3.50
3.50
5.00
5.00
6.10
2.00
2.30
3.20
4.00
0.75
1.40
1.40
1.90
0.95
1.25
1.25
1.40
1.35
1.70
2.60
3.40
2.80
4.30
4.30
5.40
1.70
2.00
2.90
3.70
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Termination Finish
TP
TL
tP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec
Profile Feature
100% Matte Sn
tL
Preheat/Soak
Tsmax
Tsmin
Temperature Minimum (TSmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
150°C
200°C
)
tS
60 – 120 seconds
Ramp-Up Rate (TL to TP)
Liquidous Temperature (TL)
Time Above Liquidous (tL)
Peak Temperature (TP)
3°C/second maximum
217°C
25
25° C to Peak
Time
60 – 150 seconds
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
6°C/second maximum
8 minutes maximum
Ramp-Down Rate (TP to TL)
Time 25°C to Peak Temperature
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Appendix 1, Note:
Package Size
(L" x W")
Force
Duration
0402
5 N (0.51 kg)
10 N (1.02 kg)
18 N (1.83 kg)
60 seconds
Terminal Strength
JIS–C–6429
0603
≥ 0805
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
J–STD–002
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
Solderability
c) Method D, category 3 at 260°C
Temperature Cycling
Biased Humidity
KEMET defined
50 cycles (-55°C to +220°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
MIL–STD–202 Method 103
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Moisture Resistance
High Temperature Life
Storage Life
MIL–STD–202 Method 106
Measurement at 24 hours +/- 2 hours after test conclusion.
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 175°C with 2 X rated voltage applied.
KEMET defined
200°C, 0 VDC for 1,000 hours.
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Vibration
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Construction – Standard Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
End Termination /
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination /
External Electrode (Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(BaTiO3)
Barrier Layer
(Ni)
End Termination /
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Epoxy Layer
(Ag)
Dielectric Material
(BaTiO3)
Inner Electrodes
(Ni)
End Termination /
External Electrode (Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be marked
as an extra cost option. Marking is available on most KEMET
devices but must be requested using the correct ordering
code identifier(s). If this option is requested, two sides of the
ceramic body will be laser marked with a “K” to identify KEMET,
followed by two characters (per EIA–198 - see table below) to
identify the capacitance value. EIA 0603 case size devices are
limited to the “K” character only.
Marking appears in legible contrast. Illustrated below is an
example of an MLCC with laser marking of “KA8”, which
designates a KEMET device with rated capacitance of 100 µF.
Orientation of marking is vendor optional.
2-Digit
KEMET
Capacitance
ID
Code
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive Grade stacked devices.
• X7R dielectric products in capacitance values outlined below
EIA Case Size
0603
Metric Size Code
Capacitance
≤ 170 pF
1608
2012
3216
3225
4520
4532
4564
5650
5664
0805
≤ 150 pF
1206
≤ 910 pF
1210
≤ 2,000 pF
≤ 3,900 pF
≤ 6,700 pF
≤ 0.018 µF
≤ 0.027 µF
≤ 0.033 µF
1808
1812
1825
2220
2225
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifiers
Numeral
Alpha
Character
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
B
C
D
E
F
G
H
J
0.1
0.11
0.12
0.13
0.15
0.16
0.18
0.2
1 0
1.1
1 2
1 3
1 5
1 6
1 8
2 0
2 2
2.4
2.7
3 0
3 3
3 6
3 9
4 3
4.7
5.1
5 6
6 2
6 8
7 5
8 2
9.1
2 5
3 5
4 0
4 5
5 0
6 0
7 0
8 0
9 0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1,000
1,100
1,200
1,300
1,500
1,600
1,800
2,000
2,200
2,400
2,700
3,000
3,300
3,600
3,900
4,300
4,700
5,100
5,600
6,200
6,800
7,500
8,200
9,100
2,500
3,500
4,000
4,500
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
15,000
16,000
18,000
20,000
22,000
24,000
27,000
30,000
33,000
36,000
39,000
43,000
47,000
51,000
56,000
62,000
68,000
75,000
82,000
91,000
25,000
35,000
40,000
45,000
50,000
60,000
70,000
80,000
90,000
100,000 1,000,000
110,000 1,100,000
120,000 1,200,000
130,000 1,300,000
150,000 1,500,000
160,000 1,600,000
180,000 1,800,000
200,000 2,000,000
220,000 2,200,000
240,000 2,400,000
270,000 2,700,000
300,000 3,000,000
330,000 3,300,000
360,000 3,600,000
390,000 3,900,000
430,000 4,300,000
470,000 4,700,000
510,000 5,100,000
560,000 5,600,000
620,000 6,200,000
680,000 6,800,000
750,000 7,500,000
820,000 8,200,000
910,000 9,100,000
250,000 2,500,000
350,000 3,500,000
400,000 4,000,000
450,000 4,500,000
500,000 5,000,000
600,000 6,000,000
700,000 7,000,000
800,000 8,000,000
900,000 9,000,000
10,000,000
11,000,000
12,000,000
13,000,000
15,000,000
16,000,000
18,000,000
20,000,000
22,000,000
24,000,000
27,000,000
30,000,000
33,000,000
36,000,000
39,000,000
43,000,000
47,000,000
51,000,000
56,000,000
62,000,000
68,000,000
75,000,000
82,000,000
91,000,000
25,000,000
35,000,000
40,000,000
45,000,000
50,000,000
60,000,000
70,000,000
80,000,000
90,000,000
100,000,000
110,000,000
120,000,000
130,000,000
150,000,000
160,000,000
180,000,000
200,000,000
220,000,000
240,000,000
270,000,000
300,000,000
330,000,000
360,000,000
390,000,000
430,000,000
470,000,000
510,000,000
560,000,000
620,000,000
680,000,000
750,000,000
820,000,000
910,000,000
250,000,000
350,000,000
400,000,000
450,000,000
500,000,000
600,000,000
700,000,000
800,000,000
900,000,000
0.22
0.24
0.27
0.3
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.4
b
d
e
0.45
0.5
f
m
n
0.6
0.7
t
0.8
y
0.9
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
KEMET
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
178 mm (7.00")
or
330 mm (13.00")
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
Embossed Plastic
Punched Paper
7" Reel
13" Reel
7" Reel
13" Reel
EIA Case Size Tape size (W)*
Pitch (P1)*
Pitch (P1)*
01005 – 0402
0603
8
8
2
4
4
4
2
4
4
4
0805
8
4
4
4
4
1206 – 1210
1805 – 1808
≥ 1812
8
12
12
12
16
8
4
4
8
8
KPS 1210
8
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 4
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum
Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
4.35
(0.171)
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum
2.5
(0.098)
Maximum
8.3
(0.327)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E
1
Po
ØDo
0
A
F
W
2
E
0
B
Bottom Cover Tape
P
1
G
Cavity Size,
See
1
T
1
T
Top Cover Tape
Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
8 mm
D0
E1
P0
P2
T1 Maximum
0.10
G Minimum
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002) (0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
8.3
(0.327)
8.3
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
(0.157 ±0.004)
(0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 5 – Bending Radius
Figure 4 – Maximum Lateral Movement
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 6 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape width
without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Round Sprocket Holes
Punched Carrier
8 mm & 12 mm only
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm
Minimum Leader
400 mm Minimum
Trailer
160 mm Minimum
Components
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Sasso Marconi, Italy
Tel: 39-051-939111
Northeast Asia
Hong Kong
Tel: 852-2305-1168
2835 KEMET Way
Simpsonville, SC 29681
Skopje, Macedonia
Tel: 389-2-55-14-623
Shenzhen, China
Tel: 86-755-2518-1306
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Beijing, China
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Tel: 86-10-5877-1075
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Shanghai, China
Tel: 86-21-6447-0707
Kamen, Germany
Tel: 49-2307-438110
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Seoul, South Korea
Tel: 82-2-6294-0550
Northern Europe
Harlow, United Kingdom
Tel: 44-1279-460122
Taipei, Taiwan
Tel: 886-2-27528585
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Espoo, Finland
Tel: 358-9-5406-5000
Southeast Asia
Singapore
Tel: 65-6701-8033
Northeast
Wilmington, MA
Tel: 978-658-1663
Penang, Malaysia
Tel: 60-4-6430200
Central
Novi, MI
Tel: 248-306-9353
Bangalore, India
Tel: 91-806-53-76817
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 175ºC, X7R Dielectric, 16 – 200 VDC (Industrial Grade)
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are
not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use. The Information is intended for use only
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1075_X7R_HT_SMD • 3/30/2015 22
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