C1206C474K5NACTU_技术文档

SurfaceꢀMountꢀMultilayerꢀCeramicꢀChipꢀCapacitorsꢀ(SMDꢀMLCCs)

X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Overview

KEMET’sꢀAutomotiveꢀGradeꢀSeriesꢀsurfaceꢀmountꢀcapacitorsꢀinꢀ

X5Rꢀdielectricꢀareꢀsuitedꢀforꢀaꢀvarietyꢀofꢀapplicationsꢀrequiringꢀ

proven,ꢀreliableꢀperformanceꢀinꢀharshꢀenvironments.ꢀWhetherꢀ

under-hoodꢀorꢀin-cabin,ꢀtheseꢀdevicesꢀemphasizeꢀtheꢀvitalꢀ

andꢀrobustꢀnatureꢀofꢀcapacitorsꢀrequiredꢀforꢀmissionꢀandꢀ

safetyꢀcriticalꢀautomotiveꢀcircuits.ꢀStricterꢀtestingꢀprotocolꢀandꢀ

inspectionꢀcriteriaꢀhaveꢀbeenꢀestablishedꢀforꢀautomotiveꢀgradeꢀ

productsꢀinꢀrecognitionꢀofꢀpotentiallyꢀharshꢀenvironmentalꢀ

conditions.ꢀKEMETꢀautomotiveꢀgradeꢀseriesꢀcapacitorsꢀmeetꢀ

theꢀdemandingꢀAutomotiveꢀElectronicsꢀCouncil'sꢀAEC–Q200ꢀ

qualiﬁcationꢀrequirements

KEMET’sꢀX5Rꢀdielectricꢀfeaturesꢀanꢀ85°Cꢀmaximumꢀoperatingꢀ

temperatureꢀandꢀisꢀconsideredꢀ“semi-stable.”ꢀTheꢀElectronicsꢀ

IndustriesꢀAllianceꢀ(EIA)ꢀcharacterizesꢀX5RꢀdielectricꢀasꢀaꢀClassꢀ

IIꢀmaterial.ꢀComponentsꢀofꢀthisꢀclassiﬁcationꢀareꢀﬁxed,ꢀceramicꢀ

dielectricꢀcapacitorsꢀsuitedꢀforꢀbypassꢀandꢀdecouplingꢀapplicationsꢀ

orꢀforꢀfrequencyꢀdiscriminatingꢀcircuitsꢀwhereꢀQꢀandꢀstabilityꢀ

ofꢀcapacitanceꢀcharacteristicsꢀareꢀnotꢀcritical.ꢀX5Rꢀexhibitsꢀaꢀ

predictableꢀchangeꢀinꢀcapacitanceꢀwithꢀrespectꢀtoꢀtimeꢀandꢀvoltageꢀ

andꢀboastsꢀaꢀminimalꢀchangeꢀinꢀcapacitanceꢀwithꢀreferenceꢀtoꢀ

ambientꢀtemperature.ꢀCapacitanceꢀchangeꢀisꢀlimitedꢀtoꢀ±15%ꢀfromꢀ

-55°C to +85°C.

Beneﬁts

Applications

•ꢀ AEC–Q200ꢀautomotiveꢀqualiﬁed

Typicalꢀapplicationsꢀincludeꢀdecoupling,ꢀbypassꢀandꢀﬁltering.

• -55°C to +85°C operating temperature range

•ꢀ Leadꢀ(Pb)-Free,ꢀRoHSꢀandꢀREACHꢀcompliant

•ꢀ Temperatureꢀstableꢀdielectric

•ꢀ EIAꢀ0402,ꢀ0603,ꢀ0805,ꢀ1206,ꢀandꢀ1210ꢀcaseꢀsizes

• DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 35 V,

andꢀ50ꢀV

•ꢀ Capacitanceꢀofferingsꢀrangingꢀfromꢀ0.012ꢀμFꢀtoꢀ22ꢀμF

•ꢀ Availableꢀcapacitanceꢀtolerancesꢀofꢀ±10%ꢀandꢀ±20%

•ꢀ Non-polarꢀdevice,ꢀminimizingꢀinstallationꢀconcerns

•ꢀ 100%ꢀpureꢀmatteꢀtin-platedꢀterminationꢀﬁnishꢀallowingꢀforꢀ

excellentꢀsolderability

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Ordering Information

C

1206

C

475

K

3

P

A

C

AUTO

CaseꢀSizeꢀ Speciﬁcation/

Capacitance

Codeꢀ(pF)

Capacitance

Tolerance

FailureꢀRate/

Design

Packaging/Gradeꢀ

Ceramic

Voltage Dielectric

TerminationꢀFinish¹

(L"ꢀxꢀW")

Series

(C-Spec)²

0402

0603

0805

1206

1210

Cꢀ=ꢀStandard 2ꢀSigniﬁcantꢀDigitsꢀ Kꢀ=ꢀ±10%

+ꢀNumberꢀofꢀZeros Mꢀ=ꢀ±20%

7 = 4 V

P = X5R A = N/A

Cꢀ=ꢀ100%ꢀMatteꢀSn AUTO = Automotive

Gradeꢀ7"ꢀReelꢀ

9 = 6.3 V

8 = 10 V

4 = 16 V

3 = 25 V

Unmarked

¹Additional termination ﬁnish options may be available. Contact KEMET for details

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0402

0603

0805

1206

1210

1005

1608

2012

3216

3225

1.00ꢀ(.040)ꢀ±ꢀ0.05ꢀ(.002) 0.50ꢀ(.020)ꢀ±ꢀ0.05ꢀ(.002)

1.60ꢀ(.063)ꢀ±ꢀ0.15ꢀ(.006) 0.80ꢀ(.032)ꢀ±ꢀ0.15ꢀ(.006)

2.00ꢀ(.079)ꢀ±ꢀ0.20ꢀ(.008) 1.25ꢀ(.049)ꢀ±ꢀ0.20ꢀ(.008)

3.20ꢀ(.126)ꢀ±ꢀ0.20ꢀ(.008) 1.60ꢀ(.063)ꢀ±ꢀ0.20ꢀ(.008)

3.20ꢀ(.126)ꢀ±ꢀ0.20ꢀ(.008) 2.50ꢀ(.098)ꢀ±ꢀ0.20ꢀ(.008)

0.30ꢀ(.012)ꢀ±ꢀ0.10ꢀ(.004)

0.35ꢀ(.014)ꢀ±ꢀ0.15ꢀ(.006)

0.50ꢀ(0.02)ꢀ±ꢀ0.25ꢀ(.010)

0.30 (.012)

0.70 (.028)

0.75 (.030)

SolderꢀReﬂowꢀOnly

SeeꢀTableꢀ2ꢀforꢀ

Thickness

SolderꢀWaveꢀorꢀ

SolderꢀReﬂow

N/A

SolderꢀReﬂowꢀOnly

Qualiﬁcation/Certiﬁcation

AutomotiveꢀGradeꢀproductsꢀmeetꢀorꢀexceedꢀtheꢀrequirementsꢀoutlinedꢀbyꢀtheꢀAutomotiveꢀElectronicsꢀCouncil.ꢀDetailsꢀregardingꢀtestꢀ

methodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQualiﬁcationꢀforꢀPassiveꢀComponents.ꢀForꢀadditionalꢀ

informationꢀregardingꢀtheꢀAutomotiveꢀElectronicsꢀCouncilꢀandꢀAEC–Q200,ꢀpleaseꢀvisitꢀtheirꢀwebsiteꢀ@www.aecouncil.com.

Environmental Compliance

Pb-FreeꢀandꢀRoHSꢀCompliant.ꢀ

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +85°C

±15%

CapacitanceꢀChangeꢀwithꢀReferenceꢀtoꢀ+25°Cꢀandꢀ0ꢀVDCꢀAppliedꢀ(TCC)

AgingꢀRateꢀ(Maximumꢀ%ꢀCapacitanceꢀLoss/DecadeꢀHour)

5.0%

250%ꢀofꢀratedꢀvoltage

(5ꢀ±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50ꢀmA)

DielectricꢀWithstandingꢀVoltageꢀ(DWV)

DissipationꢀFactorꢀ(DF)ꢀMaximumꢀLimitꢀ@ꢀ25ºC

SeeꢀDissipationꢀFactorꢀLimitꢀTable

SeeꢀInsulationꢀResistanceꢀLimitꢀTable

(Ratedꢀvoltageꢀappliedꢀforꢀ120ꢀ±5ꢀsecondsꢀ@ꢀ25°C)

InsulationꢀResistanceꢀ(IR)ꢀLimitꢀ@ꢀ25°Cꢀ

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

RatedꢀDC

Voltage

Capacitance

Value

DissipationꢀFactorꢀ Capacitance

Insulation

Resistance

Dielectric

X5R

(Maximumꢀ%)ꢀ

Shiftꢀ

> 25

25

3.0

All

7.5

±20%ꢀ

10%ꢀofꢀInitialꢀLimit

< 25

<ꢀ0.56ꢀµF

≥ꢀ0.56ꢀµF

12.0

Dissipation Factor Limit Table

Rated Voltage

50 – 200 V

25 V

Capacitance

All

Dissipation Factor

3%

5%

All

< 25 V

<ꢀ0.56ꢀµF

≥ꢀ0.56ꢀµF

5%

< 25 V

10%

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Insulation Resistance Limit Table

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

EIA Case Size

0402

0603

0805

1206

1210

<ꢀ0.012ꢀµF

<ꢀ0.047ꢀµF

<ꢀꢀ0.15ꢀµFꢀ

<ꢀ0.47ꢀµF

<ꢀ0.39ꢀµF

≥ꢀ0.012ꢀµF

≥ꢀ0.047ꢀµF

≥ꢀ0.15ꢀµF

≥ꢀ0.47ꢀµF

≥ꢀ0.39ꢀµF

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Table 1 – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)

Case Size/

Series

Voltage Code

C0402C

C0603C

C0805C

C1206C

C1210C

Cap

Code

7

9

8

7

9

8

4

3

5

7

9

8

4

3

5

9

8

4

3

1

9

8

4

3

6

5

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

12,000ꢀpF

15,000ꢀpF

18,000ꢀpF

22,000ꢀpF

27,000ꢀpF

33,000ꢀpF

39,000ꢀpF

47,000ꢀpF

56,000ꢀpF

68,000ꢀpF

82,000ꢀpF

0.10ꢀµF

0.12ꢀµF

0.15ꢀµF

0.18ꢀµF

0.22ꢀµF

0.27ꢀµF

0.33ꢀµF

0.39ꢀµF

0.47ꢀµF

0.56ꢀµF

0.68ꢀµF

0.82ꢀµF

1.0ꢀµF

1.2ꢀµF

1.5ꢀµF

1.8ꢀµF

2.2ꢀµF

2.7ꢀµF

3.3ꢀµF

3.9ꢀµF

4.7ꢀµF

5.6ꢀµF

6.8ꢀµF

8.2ꢀµF

10ꢀµF

12ꢀµF

15ꢀµF

18ꢀµF

22ꢀµF

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

155

185

225

275

335

395

475

565

685

825

106

126

156

186

226

K

M

BB BB BB

CG CG CG CG

EB EB EB EB

EC EC EC EC

ED ED ED ED

EE EE EE EE

EF EF EF EF

EF EF EF EH

EC EC EC EC

EE EE EE EE

EF EF EF EF

FD FD FD FD FD

FF FF FF FF FF

DC DC DC DC DC

DD DD DD DD DD

DE DE DE DE DE

DF DF DF DF DF

FH FH FH FH FH FH

FD FD FD FD

FG FG FG FG

FH FH FH FH

FJ FJ FJ FJ

FK FK FK FK

FG FG FG FE

FJ FJ FJ FJ

FK FK FK FG

FH FH FH FH

FD¹ FD FG

DC DC DC DC

DD DD DD DD

DL DL DL DL

DL DL DL DG

DG DG DG DG

EH EH EH EH

DG DG DG

EK EK EH

ED ED EH

FF FF FG

FG FG FH

FH FH FJ

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

7

9

8

7

9

8

4

3

5

7

9

8

4

3

5

9

8

4

3

1

9

8

4

3

6

5

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

C1210C

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

BB

CG

DC

DD

DL

DE

DF

DG

EB

EK

EC

ED

EE

EF

EH

FD

FE

FF

0402

0603

0805

1206

1210

0.50ꢀ±ꢀ0.05

0.80ꢀ±ꢀ0.10

0.78ꢀ±ꢀ0.10

0.90ꢀ±ꢀ0.10

0.95ꢀ±ꢀ0.10

1.00ꢀ±ꢀ0.10

1.10ꢀ±ꢀ0.10

1.25ꢀ±ꢀ0.15

0.78ꢀ±ꢀ0.10

0.80ꢀ±ꢀ0.10

0.90ꢀ±ꢀ0.10

1.00ꢀ±ꢀ0.10

1.10ꢀ±ꢀ0.10

1.20ꢀ±ꢀ0.15

1.60ꢀ±ꢀ0.20

0.95ꢀ±ꢀ0.10

1.00ꢀ±ꢀ0.10

1.10ꢀ±ꢀ0.10

1.25ꢀ±ꢀ0.15

1.55ꢀ±ꢀ0.15

1.85ꢀ±ꢀ0.20

2.10ꢀ±ꢀ0.20

10,000

4,000

0

50,000

15,000

10,000

0

4,000

2,500

4,000

2,000

4,000

2,500

2,000

4,000

2,500

2,000

10,000

8,000

10,000

8,000

10,000

8,000

4,000

10,000

0

FG

FH

FJ

FK

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0402

0603

0805

1206

1210

1210¹

1005

1608

2012

3216

3225

0.50

0.72

2.20

1.20

0.45

0.62

1.90

1.00

0.40

0.52

1.60

0.80

0.90

1.00

1.60

1.50

1.15

1.35

1.60

1.10

1.55

1.90

2.80

2.90

4.00

4.40

5.60

5.65

5.60

2.10

2.60

2.90

3.80

3.90

0.80

0.90

1.50

1.40

0.95

1.15

1.40

1.00

1.45

1.80

2.70

2.80

3.10

3.50

4.70

1.50

2.00

2.30

3.20

3.30

0.60

0.75

1.40

1.30

0.75

0.95

1.20

0.90

1.35

1.70

2.60

2.70

2.40

2.80

4.00

1.20

1.70

2.00

2.90

3.00

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Soldering Process

Recommended Soldering Technique:

ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreﬂowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206

ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreﬂowꢀonly

Recommended Reﬂow Soldering Proﬁle:

KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀ(SMDꢀMLCCs)ꢀareꢀcompatibleꢀwithꢀwaveꢀ(singleꢀorꢀdual),ꢀconvection,ꢀ

IRꢀorꢀvaporꢀphaseꢀreﬂowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀrecommendedꢀtoꢀavoidꢀextremeꢀthermalꢀstress.ꢀKEMET’sꢀ

recommendedꢀproﬁleꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀreﬂowꢀreﬂectꢀtheꢀproﬁleꢀconditionsꢀofꢀtheꢀIPC/J-STD-020ꢀstandardꢀforꢀmoistureꢀ

sensitivityꢀtesting.ꢀTheseꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreﬂowꢀpassesꢀatꢀtheseꢀconditions.

T_P

T_L

Termination Finish

t_P

Maximum Ramp Up Rate = 3°C/sec

Maximum Ramp Down Rate = 6°C/sec

Proﬁle Feature

SnPb

100%ꢀMatteꢀSn

t_L

Preheat/Soak

T_smax

T_smin

Temperature Minimum (T_Smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

100°C

150°C

200°C

)

t_S

60ꢀ–ꢀ120ꢀseconds

Ramp-Up Rate (T_Lto T_P)

LiquidousꢀTemperatureꢀ(T_L)

TimeꢀAboveꢀLiquidousꢀ(t_L)

Peak Temperature (T_P)

3°C/secondꢀmaximum 3°C/secondꢀmaximum

25

183°C

60ꢀ–ꢀ150ꢀseconds

235°C

217°C

60ꢀ–ꢀ150ꢀseconds

260°C

25° C to Peak

Time

TimeꢀWithinꢀ5°CꢀofꢀMaximumꢀ

20ꢀsecondsꢀmaximum 30ꢀsecondsꢀmaximum

Peak Temperature (t_P)

Ramp-Down Rate (T_Pto T_L) 6°C/secondꢀmaximum 6°C/secondꢀmaximum

Time 25°C to Peak

6 minutes maximum

8 minutes maximum

Temperature

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalꢀStrength

JIS–C–6429

Appendixꢀ1,ꢀNote:ꢀForceꢀofꢀ1.8ꢀkgꢀforꢀ60ꢀseconds.

Appendixꢀ2,ꢀNote:ꢀStandardꢀterminationꢀsystemꢀ–ꢀ2.0ꢀmmꢀ(minimum)ꢀforꢀallꢀexceptꢀ3ꢀmmꢀforꢀC0G.ꢀ

Flexibleꢀterminationꢀsystemꢀ–ꢀ3.0ꢀmmꢀ(minimum).

BoardꢀFlex

JIS–C–6429

Magniﬁcationꢀ50ꢀX.ꢀConditions:

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀa)ꢀMethodꢀB,ꢀ4ꢀhoursꢀ@ꢀ155°C,ꢀdryꢀheatꢀ@ꢀ235°C

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb)ꢀMethodꢀBꢀ@ꢀ215°Cꢀcategoryꢀ3

Solderability

J–STD–002

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀc)ꢀMethodꢀD,ꢀcategoryꢀ3ꢀ@ꢀ260°C

TemperatureꢀCycling

BiasedꢀHumidity

JESD22ꢀMethodꢀJA–104

MIL–STD–202ꢀMethodꢀ103

1,000ꢀCyclesꢀ(-55°Cꢀtoꢀ+125°C).ꢀMeasurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

LoadꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀratedꢀvoltage.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀMeasurementꢀ

atꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

LowꢀVoltꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀ1.5ꢀV.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

tꢀ=ꢀ24ꢀhours/cycle.ꢀStepsꢀ7aꢀandꢀ7bꢀnotꢀrequired.ꢀUnpowered.

Measurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

-55°C/+125°C.ꢀNote:ꢀNumberꢀofꢀcyclesꢀrequiredꢀ–ꢀ300,ꢀmaximumꢀtransferꢀtimeꢀ–ꢀ20ꢀseconds,ꢀdwellꢀ

Moisture Resistance

MIL–STD–202ꢀMethodꢀ106

MIL–STD–202ꢀMethodꢀ107

ThermalꢀShock

time – 15 minutes. Air – Air.

MIL–STD–202ꢀMethodꢀ108

HighꢀTemperatureꢀLife

1,000ꢀhoursꢀatꢀ125°Cꢀ(85°CꢀforꢀX5R,ꢀZ5UꢀandꢀY5V)ꢀwithꢀ2ꢀXꢀratedꢀvoltageꢀapplied.

/EIA–198

Storage Life

MIL–STD–202ꢀMethodꢀ108 150°C,ꢀ0ꢀVDCꢀforꢀ1,000ꢀhours.

5ꢀg'sꢀforꢀ20ꢀmin.,ꢀ12ꢀcyclesꢀeachꢀofꢀ3ꢀorientations.ꢀNote:ꢀUseꢀ8"ꢀXꢀ5"ꢀPCBꢀ0.031"ꢀthickꢀ7ꢀsecureꢀ

Vibration

MIL–STD–202ꢀMethodꢀ204 pointsꢀonꢀoneꢀlongꢀsideꢀandꢀ2ꢀsecureꢀpointsꢀatꢀcornersꢀofꢀoppositeꢀsides.ꢀPartsꢀmountedꢀwithinꢀ2"ꢀ

fromꢀanyꢀsecureꢀpoint.ꢀTestꢀfromꢀ10ꢀ–ꢀ2,000ꢀHz

MechanicalꢀShock

MIL–STD–202ꢀMethodꢀ213 Figureꢀ1ꢀofꢀMethodꢀ213,ꢀConditionꢀF.

Resistance to Solvents MIL–STD–202ꢀMethodꢀ215 Addꢀaqueousꢀwashꢀchemical,ꢀOKEMꢀCleanꢀorꢀequivalent.

Storage and Handling

Ceramicꢀchipꢀcapacitorsꢀshouldꢀbeꢀstoredꢀinꢀnormalꢀworkingꢀenvironments.ꢀWhileꢀtheꢀchipsꢀthemselvesꢀareꢀquiteꢀrobustꢀinꢀotherꢀ

environments,ꢀsolderabilityꢀwillꢀbeꢀdegradedꢀbyꢀexposureꢀtoꢀhighꢀtemperatures,ꢀhighꢀhumidity,ꢀcorrosiveꢀatmospheres,ꢀandꢀlongꢀtermꢀ

storage.ꢀInꢀaddition,ꢀpackagingꢀmaterialsꢀwillꢀbeꢀdegradedꢀbyꢀhighꢀtemperature–ꢀreelsꢀmayꢀsoftenꢀorꢀwarpꢀandꢀtapeꢀpeelꢀforceꢀmayꢀ

increase.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀstorageꢀhumidityꢀnotꢀexceedꢀ70%ꢀ

relativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀtheꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀ

chlorineꢀandꢀsulfurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀshouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀ1.5ꢀyearsꢀofꢀ

receipt.

C1024_X5R_AUTO_SMD • 6/6/2014

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Dielectric Material

(BaTiO₃)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Base Metal

(Cu)

Inner Electrodes

(Ni)

Base Metal

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Ni)

C1024_X5R_AUTO_SMD • 6/6/2014 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Capacitor Marking (Optional):

Theseꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀareꢀ

normallyꢀsuppliedꢀunmarked.ꢀIfꢀrequired,ꢀtheyꢀcanꢀbeꢀmarkedꢀ

asꢀanꢀextraꢀcostꢀoption.ꢀMarkingꢀisꢀavailableꢀonꢀmostꢀKEMETꢀ

devicesꢀbutꢀmustꢀbeꢀrequestedꢀusingꢀtheꢀcorrectꢀorderingꢀ

codeꢀidenti ꢀer(s).ꢀIfꢀthisꢀoptionꢀisꢀrequested,ꢀtwoꢀsidesꢀofꢀtheꢀ

ceramicꢀbodyꢀwillꢀbeꢀlaserꢀmarkedꢀwithꢀaꢀ“K”ꢀtoꢀidentifyꢀKEMET,ꢀ

followedꢀbyꢀtwoꢀcharactersꢀ(perꢀEIA–198ꢀ-ꢀseeꢀtableꢀbelow)ꢀtoꢀ

identifyꢀtheꢀcapacitanceꢀvalue.ꢀEIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀareꢀ

limitedꢀtoꢀtheꢀ“K”ꢀcharacterꢀonly.

Markingꢀappearsꢀinꢀlegibleꢀcontrast.ꢀIllustratedꢀbelowꢀisꢀanꢀ

exampleꢀofꢀanꢀMLCCꢀwithꢀlaserꢀmarkingꢀofꢀ“KA8”,ꢀwhichꢀ

designatesꢀaꢀKEMETꢀdeviceꢀwithꢀratedꢀcapacitanceꢀofꢀ100ꢀµF.ꢀ

Orientationꢀofꢀmarkingꢀisꢀvendorꢀoptional.ꢀ

2-Digit

KEMET

Capacitance

ID

Code

Laser marking option is notꢀavailableꢀon:

•ꢀ C0G,ꢀUltraꢀStableꢀX8RꢀandꢀY5Vꢀdielectricꢀdevicesꢀ

•ꢀ EIAꢀ0402ꢀcaseꢀsizeꢀdevicesꢀ

•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀFlexibleꢀTerminationꢀoption.

•ꢀ KPSꢀCommercialꢀandꢀAutomotiveꢀGradeꢀstackedꢀdevices.

•ꢀ X7Rꢀdielectricꢀproductsꢀinꢀcapacitanceꢀvaluesꢀoutlinedꢀbelow

EIA Case Size

0603

Metric Size Code

Capacitance

≤ꢀ170ꢀpF

1608

2012

3216

3225

4520

4532

4564

5650

5664

0805

≤ꢀ150ꢀpF

1206

≤ꢀ910ꢀpF

1210

≤ꢀ2,000ꢀpF

≤ꢀ3,900ꢀpF

≤ꢀ6,700ꢀpF

≤ꢀ0.018ꢀµF

≤ꢀ0.027ꢀµF

≤ꢀ0.033ꢀµF

1808

1812

1825

2220

2225

C1024_X5R_AUTO_SMD • 6/6/2014 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

Fꢀ

G

Hꢀ

Jꢀ

K

L

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

M

N

P

Q

R

S

T

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

U

V

Wꢀ

X

Yꢀ

Zꢀ

a

bꢀ

dꢀ

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

yꢀ

0.9

C1024_X5R_AUTO_SMD • 6/6/2014 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Tape & Reel Packaging Information

KEMETꢀoffersꢀmultilayerꢀceramicꢀchipꢀcapacitorsꢀpackagedꢀinꢀ8,ꢀ12ꢀandꢀ16ꢀmmꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀEIAꢀ

Standardꢀ481.ꢀThisꢀpackagingꢀsystemꢀisꢀcompatibleꢀwithꢀallꢀtape-fedꢀautomaticꢀpickꢀandꢀplaceꢀsystems.ꢀSeeꢀTableꢀ2ꢀforꢀdetailsꢀonꢀ

reelingꢀquantitiesꢀforꢀcommercialꢀchips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ꢀ1812

8

KPS 1210

8

KPS 1812 & 2220

Arrayꢀ0508ꢀ&ꢀ0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1024_X5R_AUTO_SMD • 6/6/2014 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

TapeꢀSize

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75ꢀ±0.10ꢀ

4.0ꢀ±0.10ꢀ

2.0ꢀ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

Wꢀ

Maximum

8.3

(0.327)

TapeꢀSize

8 mm

Pitchꢀ

Fꢀ

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

3.5ꢀ±0.05ꢀ

(0.138ꢀ±0.002) (0.157ꢀ±0.004)

4.0ꢀ±0.10

Single (4 mm)

Single (4 mm) &

8.2

10.25

5.5ꢀ±0.05ꢀ

8.0ꢀ±0.10

4.6

12.3

12 mm

16 mm

Note 5

Doubleꢀ(8ꢀmm)

(0.323)

(0.404)

(0.217ꢀ±0.002) (0.315ꢀ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5ꢀ±0.05 12.0ꢀ±0.10

(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1024_X5R_AUTO_SMD • 6/6/2014 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

TapeꢀSize

D₀

E₁

P₀

P₂

T₁Maximum

0.10

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75ꢀ±0.10ꢀ

(0.069ꢀ±0.004)

4.0ꢀ±0.10ꢀ

(0.157ꢀ±0.004)

2.0ꢀ±0.05ꢀ

(0.079ꢀ±0.002) (0.004) Maximum

0.75

(0.030)

25

(0.984)

8 mm

Variable Dimensions — Millimeters (Inches)

TapeꢀSize

8 mm

Pitch

E2 Minimum

Fꢀ

P₁

T Maximum

WꢀMaximum

A₀B₀

2.0ꢀ±0.05ꢀ

(0.079ꢀ±0.002)

ꢀ4.0ꢀ±0.10ꢀ

8.3

(0.327)

8.3

Halfꢀ(2ꢀmm)

Single (4 mm)

6.25

(0.246)

3.5ꢀ±0.05ꢀ

(0.138ꢀ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157ꢀ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1024_X5R_AUTO_SMD • 6/6/2014 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12ꢀandꢀ16ꢀmm

Theꢀdirectionꢀofꢀtheꢀpullꢀshallꢀbeꢀoppositeꢀtheꢀdirectionꢀofꢀtheꢀcarrierꢀtapeꢀtravel.ꢀTheꢀpullꢀangleꢀofꢀtheꢀcarrierꢀtapeꢀshallꢀbeꢀ165°ꢀtoꢀ180°ꢀ

fromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ300ꢀ±10ꢀmm/minute.

3. Labeling:ꢀBarꢀcodeꢀlabelingꢀ(standardꢀorꢀcustom)ꢀshallꢀbeꢀonꢀtheꢀsideꢀofꢀtheꢀreelꢀoppositeꢀtheꢀsprocketꢀholes.ꢀRefer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1024_X5R_AUTO_SMD • 6/6/2014 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

TapeꢀSize

8 mm

A

B Minimum

C

D Minimum

178ꢀ±0.20ꢀ

(7.008ꢀ±0.008)ꢀ

or

330ꢀ±0.20

(13.000ꢀ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

TapeꢀSize

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

8 mm

50

(1.969)

12.4 +2.0/-0.0

18.4

Shallꢀaccommodateꢀtapeꢀwidthꢀ

withoutꢀinterference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1024_X5R_AUTO_SMD • 6/6/2014 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

Bulk Cassette Packaging (Ceramic Chips Only)

MeetsꢀDimensionalꢀRequirementsꢀIEC–286ꢀandꢀEIAJꢀ7201

Unit mm *Reference

53 3*

10*

1.5 ± ⁰₀^.1

2.0 ± ₀⁰_.1

3.0 ± ⁰₀^.2

5 0*

110 ± 0.7

Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

EIA Size Metric Size

S Separation

Minimum

Number of

Pieces/Cassette

L Length

W Width

B Bandwidth

T Thickness

Code

0402

1005

1.0ꢀ±0.05

1.6ꢀ±0.07

0.5ꢀ±0.05

0.8ꢀ±0.07

0.2 to 0.4

0.2 to 0.5

0.3

0.5ꢀ±0.05

0.8ꢀ±0.07

50,000

0603

1608

0.7

15,000

C1024_X5R_AUTO_SMD • 6/6/2014 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris,ꢀFrance

Tel:ꢀ33-1-4646-1006ꢀ

Northeast Asia

HongꢀKong

Tel:ꢀ852-2305-1168

2835ꢀKEMETꢀWay

Simpsonville, SC 29681

SassoꢀMarconi,ꢀItaly

Tel:ꢀ39-051-939111

Shenzhen,ꢀChina

Tel:ꢀ86-755-2518-1306

MailingꢀAddress:

P.O. Box 5928

Greenville, SC 29606

Beijing,ꢀChina

Central Europe

Tel:ꢀ86-10-5829-1711

www.kemet.com

Landsberg,ꢀGermanyꢀꢀ

Tel:ꢀ49-8191-3350800ꢀꢀ

Tel:ꢀ864-963-6300ꢀ

Fax:ꢀ864-963-6521

Shanghai,ꢀChina

Tel:ꢀ86-21-6447-0707

Kamen,ꢀGermany

Tel:ꢀ49-2307-438110

Corporate Ofﬁces

FortꢀLauderdale,ꢀFL

Tel:ꢀ954-766-2800

Taipei, Taiwan

Tel:ꢀ886-2-27528585

Northern Europe

Bishop’sꢀStortford,ꢀUnitedꢀKingdomꢀ

Tel:ꢀ44-1279-460122ꢀ

North America

Southeast Asia

Singapore

Southeast

Tel:ꢀ65-6586-1900

LakeꢀMary,ꢀFL

Tel:ꢀ407-855-8886

Espoo,ꢀFinland

Tel:ꢀ358-9-5406-5000

Penang,ꢀMalaysia

Tel:ꢀ60-4-6430200

Northeast

Wilmington,ꢀMA

Tel:ꢀ978-658-1663ꢀ

Bangalore,ꢀIndia

Tel:ꢀ91-806-53-76817

Central

Novi, MI

Tel:ꢀ248-306-9353

West

Milpitas, CA

Tel:ꢀ408-433-9950

Mexico

Guadalajara,ꢀJaliscoꢀ

Tel:ꢀ52-33-3123-2141ꢀꢀ

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1024_X5R_AUTO_SMD • 6/6/2014 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Automotive Grade)

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀcheckingꢀandꢀ

verifyingꢀtheꢀextentꢀtoꢀwhichꢀtheꢀInformationꢀcontainedꢀinꢀthisꢀpublicationꢀisꢀapplicableꢀtoꢀanꢀorderꢀatꢀtheꢀtimeꢀtheꢀorderꢀisꢀplaced.

AllꢀInformationꢀgivenꢀhereinꢀisꢀbelievedꢀtoꢀbeꢀaccurateꢀandꢀreliable,ꢀbutꢀitꢀisꢀpresentedꢀwithoutꢀguarantee,ꢀwarranty,ꢀorꢀresponsibilityꢀofꢀanyꢀkind,ꢀexpressedꢀorꢀimplied.

StatementsꢀofꢀsuitabilityꢀforꢀcertainꢀapplicationsꢀareꢀbasedꢀonꢀKEMETꢀElectronicsꢀCorporation’sꢀ(“KEMET”)ꢀknowledgeꢀofꢀtypicalꢀoperatingꢀconditionsꢀforꢀsuchꢀapplications,ꢀbutꢀareꢀ

notꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀTheꢀInformationꢀisꢀintendedꢀforꢀuseꢀonlyꢀ

byꢀcustomersꢀwhoꢀhaveꢀtheꢀrequisiteꢀexperienceꢀandꢀcapabilityꢀtoꢀdetermineꢀtheꢀcorrectꢀproductsꢀforꢀtheirꢀapplication.ꢀAnyꢀtechnicalꢀadviceꢀinferredꢀfromꢀthisꢀInformationꢀorꢀotherwiseꢀ

providedꢀbyꢀKEMETꢀwithꢀreferenceꢀtoꢀtheꢀuseꢀofꢀKEMET’sꢀproductsꢀisꢀgivenꢀgratis,ꢀandꢀKEMETꢀassumesꢀnoꢀobligationꢀorꢀliabilityꢀforꢀtheꢀadviceꢀgivenꢀorꢀresultsꢀobtained.

AlthoughꢀKEMETꢀdesignsꢀandꢀmanufacturesꢀitsꢀproductsꢀtoꢀtheꢀmostꢀstringentꢀqualityꢀandꢀsafetyꢀstandards,ꢀgivenꢀtheꢀcurrentꢀstateꢀofꢀtheꢀart,ꢀisolatedꢀcomponentꢀfailuresꢀmayꢀstillꢀ

occur.ꢀAccordingly,ꢀcustomerꢀapplicationsꢀwhichꢀrequireꢀaꢀhighꢀdegreeꢀofꢀreliabilityꢀorꢀsafetyꢀshouldꢀemployꢀsuitableꢀdesignsꢀorꢀotherꢀsafeguardsꢀ(suchꢀasꢀinstallationꢀofꢀprotectiveꢀ

circuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀpropertyꢀdamage.

Althoughꢀallꢀproduct–relatedꢀwarnings,ꢀcautionsꢀandꢀnotesꢀmustꢀbeꢀobserved,ꢀtheꢀcustomerꢀshouldꢀnotꢀassumeꢀthatꢀallꢀsafetyꢀmeasuresꢀareꢀindictedꢀorꢀthatꢀotherꢀmeasuresꢀmayꢀnotꢀ

beꢀrequired.

C1024_X5R_AUTO_SMD • 6/6/2014 20


型号：	C1206C474K5NACTU
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X8L, -40/+15% TC, 0.47uF, Surface Mount, 1206, CHIP 电容器
文件：	总20页 (文件大小：1492K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1206C474K5NACTU [KEMET]

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