C0805X512F5HACTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R

Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Overview

KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic

Capacitor in Ultra-Stable X8R dielectric incorporates a unique,

ﬂexible termination system that is integrated with KEMET’s

standard termination materials. A conductive silver epoxy is

utilized between the base metal and nickel barrier layers of

KEMET’s standard termination system in order to establish

pliability while maintaining terminal strength, solderability and

electrical performance. This technology was developed in order

to address the primary failure mode of MLCCs– ﬂex cracks,

which are typically the result of excessive tensile and shear

stresses produced during board ﬂexure and thermal cycling.

Flexible termination technology inhibits the transfer of board

stress to the rigid ceramic body, therefore mitigating ﬂex cracks

which can result in low IR or short circuit failures.

CAP), Floating Electrode with Flexible Termination (FF-CAP),

and KEMET Power Solutions (KPS) product lines by providing a

complete portfolio of ﬂex mitigation solutions.

Combined with the stability of KEMET’s Ultra-Stable high

temperature dielectric technology, these ﬂex-robust devices

are RoHS Compliant, offer up to 5 mm of ﬂex-bend capability

and feature a 150°C maximum operating temperature. Ultra-

Stable X8R dielectric offers the same temperature capability as

conventional X8R but without the capacitance loss due to applied

DC voltage. These devices exhibit no change in capacitance with

respect to voltage and boast a minimal change in capacitance

with reference to ambient temperature. They are also suitable

replacements for higher capacitance and larger footprint devices

that fail to offer capacitance stability. Capacitance change with

respect to temperature is limited to ±15% from -55°C to +150°C.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide superior

ﬂex performance over standard termination systems.FT-CAP

complements KEMET’s Open Mode, Floating Electrode (FE-

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive Electronics

Council's AEC-Q200 qualiﬁcation requirements.

Ordering Information

C

1206

X

104

J

3

H

A

C

AUTO

Case Size Speciﬁcation/ Capacitance Capacitance

Failure Rate/

Design

Packaging/Grade

Ceramic

Voltage

Dielectric

Termination Finish¹

(L" x W")

Series

Code (pF)

Tolerance

(C-Spec)²

0603

0805

1206

1210

1812

X = Flexible 2 signiﬁcant

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

3 = 25 V H = Ultra-

5 = 50 V Stable X8R

1 = 100 V

A = N/A

C = 100% Matte Sn Blank = Bulk

Termination

digits +

number of

zeros.

L = SnPb (5%

TU = 7" Reel Unmarked

minimum)

AUTO = Automotive

Grade 7" Reel Unmarked

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

^1,2SnPb termination ﬁnish option is not available on Automotive Grade product.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1063_X8R_FT-CAP_SMD • 5/30/2013

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0603

0805

1206

1210

1812

1608

2012

3216

3225

4532

1.60 (.064) ± 0.17 (.007) 0.80 (.032) ±0.15 (.006)

2.00 (.079) ±0.20 (.008) 1.25 (.049) ±0.20 (.008)

3.30 (.130) ±0.40 (.016) 1.60 (.063) ±0.20 (.008)

3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)

4.50 (.178) ±0.40 (.016) 3.20 (.126) ±0.30 (.012)

0.45 (.018) ±0.15 (.006)

0.50 (0.02) ±0.25 (.010)

0.60 (.024) ±0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ±0.35 (.014)

0.58 (.023)

0.75 (.030)

Solder Wave

or

Solder Reﬂow

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

Beneﬁts

• -55°C to +150°C operating temperature range

• Superior ﬂex performance (up to 5 mm)

• Pb-Free and RoHS Compliant

• EIA 0603, 0805, 1206, 1210, and 1812 case sizes

• DC voltage ratings of 25 V, 50 V, and 100 V

• Capacitance offerings ranging from 430 pF to 0.22 μF

• Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%,

and ±20%

• High thermal stability

• High ripple current capability

• No capacitance change with respect to applied rated DC voltage

• Non-polar device, minimizing installation concerns

• Commercial & Automotive (AEC–Q200) Grades available

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• SnPb plated termination ﬁnish option available upon request (5%

minimum)

• Extremely low ESR and ESL

Applications

Typical applications include decoupling, bypass, ﬁltering and transient voltage suppression in critical and safety relevant circuits without

(integrated) current limitation including those subject to high levels of board ﬂexure or temperature cycling.

C1063_X8R_FT-CAP_SMD • 5/30/2013

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

Pb-Free and RoHS Compliant (excluding SnPb termination ﬁnish option)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +150°C

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

±15%

0%

250% of rated voltage

Dielectric Withstanding Voltage (DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

2.5%

1,000 megohm microfarads or 100 GΩ

(Rated voltage applied for 120 ±5 seconds @ 25°C)

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

Shift

Ultra-Stable X8R

All

2.5

0.3% or ±0.25 pF 10% of Initial Limit

C1063_X8R_FT-CAP_SMD • 5/30/2013

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)

Series

Voltage Code

Voltage DC

C0603

C0805

C1206

C1210

C1812

3

5

1

3

5

1

3

5

1

3

5

1

5

1

Capacitance

Code

Capacitance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

Capacitance Tolerance

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

123

153

183

223

273

333

473

563

683

823

104

124

154

184

224

F

G

J

K

M

CB

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

100,000 pF

120,000 pF

150,000 pF

180,000 pF

220,000 pF

DC

DD

DF

DG

DC

DD

DF

DC

DD

DE

DG

EB

EC

ED

EF

EH

EB

EE

EF

EH

EB

EC

EE

EH

FB

FC

FE

FG

FH

FJ

FB

FC

FF

FG

FH

FM

FB

FE

FF

FG

FH

FM

GB

GD

GH

GK

GB

GD

GH

GN

Voltage DC

Capacitance

C

1206

X

104

J

3

H₃

A₁

₅C

₅AUTO

1

Voltage Code

3

5

1

5

3

1

3

5

1

Capacitance

Code

Case Size Speciﬁcation/ Capacitance Capacitance

Series

Failure Rate/

C0805

Packaging/Grade

C1812

C0603

C1206

Termination Finish¹

C1210

Ceramic

Voltage

Dielectric

(L" x W")

Series

Code (pF)

Tolerance

Design

(C-Spec)²

0603

0805

1206

1210

1812

X = Flexible 2 signiﬁcant

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

3 = 25 V H = Ultra-

5 = 50 V Stable X8R

1 = 100 V

A = N/A

C = 100% Matte Sn Blank = Bulk

Termination

digits +

number of

zeros.

L = SnPb (5%

minimum)

TU = 7" Reel Unmarked

AUTO = Automotive

Grade 7" Reel Unmarked

C1063_X8R_FT-CAP_SMD • 5/30/2013

4

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

CB

DC

DD

DE

DF

DG

EB

EC

ED

EE

EF

EH

FB

FC

FE

FF

FG

FH

FM

FJ

GB

GD

GH

GK

GN

0603

0805

1206

1210

1812

0.80 ± 0.07

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.60 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.55 ± 0.15

1.70 ± 0.20

1.85 ± 0.20

1.00 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

1.70 ± 0.20

4,000

0

10,000

0

4,000

2,500

4,000

2,500

2,000

4,000

2,500

2,000

1,000

10,000

8,000

10,000

8,000

4,000

0

4,000

0

10,000

0

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1063_X8R_FT-CAP_SMD • 5/30/2013

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1812

1608

2012

3216

3225

4532

0.85

1.25

1.10

4.00

2.10

0.75

1.05

1.00

3.10

1.50

0.65

0.85

0.90

2.40

1.20

1.00

1.60

2.10

1.35

1.65

1.80

1.55

1.90

2.80

3.60

4.40

5.90

7.00

2.60

2.90

3.80

4.60

0.90

1.50

2.00

1.15

1.45

1.60

1.45

1.80

2.70

3.50

5.00

6.10

2.00

2.30

3.20

4.00

0.80

1.40

1.90

0.95

1.25

1.40

1.35

1.70

2.60

3.40

2.80

4.30

5.40

1.70

2.00

2.90

3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805, and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

C1063_X8R_FT-CAP_SMD • 5/30/2013

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 cycles (-55°C to +150°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85%RH and rated voltage. Add 100K ohm resistor. Measurement

at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at

Biased Humidity

24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours. +/- 2 hours

after test conclusion.

-55°C/+150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

time – 15 minutes. Air – Air.

MIL–STD–202 Method 108

/EIA–198

High Temperature Life

Storage Life

1,000 hours at 150°C with 2 X rated voltage applied.

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Vibration

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1063_X8R_FT-CAP_SMD • 5/30/2013

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Construction

Reference

Item

Material

A

B

C

D

E

F

Finish

100% Matte Sn

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Termination

System

Cu

Inner Electrode

Dielectric Material

Ni

CaZrO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1063_X8R_FT-CAP_SMD • 5/30/2013

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1063_X8R_FT-CAP_SMD • 5/30/2013

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

Double (8 mm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1063_X8R_FT-CAP_SMD • 5/30/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

0.10

G Minimum

Note 2

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1063_X8R_FT-CAP_SMD • 5/30/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1063_X8R_FT-CAP_SMD • 5/30/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1063_X8R_FT-CAP_SMD • 5/30/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

Bulk Cassette Packaging (Ceramic Chips Only)

Meets Dimensional Requirements IEC–286 and EIAJ 7201

Unit mm *Reference

53 3*

10*

1.5 ± ⁰₀^.1

2.0 ± ₀⁰_.1

3.0 ± ⁰₀^.2

5 0*

110 ± 0.7

Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

EIA Size Metric Size

S Separation

Minimum

Number of

Pieces/Cassette

L Length

W Width

B Bandwidth

T Thickness

Code

0402

1005

1.0 ±0.05

1.6 ±0.07

0.5 ±0.05

0.8 ±0.07

0.2 to 0.4

0.2 to 0.5

0.3

0.5 ±0.05

0.8 ±0.07

50,000

0603

1608

0.7

15,000

C1063_X8R_FT-CAP_SMD • 5/30/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1063_X8R_FT-CAP_SMD • 5/30/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speciﬁcally disclaims – any warranty concerning suitability for a speciﬁc customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

C1063_X8R_FT-CAP_SMD • 5/30/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 25 – 100 VDC (Commercial & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing Communications, cn=Jeannette Calvo,

email=jeannettecalvo@kemet.com

Date: 2013.06.10 12:26:41 -04'00'

C1063_X8R_FT-CAP_SMD • 5/30/2013 17


型号：	C0805X512F5HACTU
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, X8R, 15% TC, 0.0051uF, Surface Mount, 0805, CHIP 电容器
文件：	总17页 (文件大小：742K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0805X512F5HACTU [KEMET]

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