C0805X224J9RAC7867_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP) X7R Dielectric,

6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Overview

KEMET’s Flexible Termination (FT-CAP) multilayer ceramic

capacitor in X7R dielectric incorporates a unique, ﬂexible

termination system that is integrated with KEMET’s standard

termination materials. A conductive silver epoxy is utilized

between the base metal and nickel barrier layers of KEMET’s

standard termination system in order to establish pliability

while maintaining terminal strength, solderability and electrical

performance. This technology was developed in order to address

the primary failure mode of MLCCs—ﬂex cracks, which are

typically the result of excessive shear stresses produced during

board ﬂexure or thermal cycling. Flexible termination technology

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide superior

ﬂex performance over standard termination systems. The FT-

CAP complements KEMET’s Open Mode, Floating Electrode

(FE-CAP), Floating Electrode with Flexible Termination (FF-CAP)

and KEMET Power Solutions (KPS) product lines by providing a

complete portfolio of ﬂex mitigation solutions.

Combined with the stability of an X7R dielectric and designed to

accommodate all capacitance requirements, these ﬂex-robust

devices are RoHS-compliant, offer up to 5mm of ﬂex-bend

directs board ﬂex stress away from the ceramic body and into the capability and exhibit a predictable change in capacitance with

termination area, therefore mitigating ﬂex cracks which can result respect to time and voltage. Capacitance change with reference

in low IR or short circuit failures.

to ambient temperature is limited to ±15% from -55°C to +125°C.

Beneﬁts

• 100% pure matte tin-plated end metallization allowing for

excellent solderability

• SnPb end metallization option available upon request (5% min)

• Commercial and Automotive (AEC-Q200) grades available

• -55°C to +125°C operating temperature range

• Superior ﬂex performance (up to 5mm)

• High capacitance ﬂex mitigation

• Pb-Free and RoHS compliant

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 2220and 2225 case sizes

• DC voltage ratings of 6.3V, 10V, 16V, 25V, 50V, 100V, 200V and 250V

• Capacitance offerings ranging from 180pF to 22μF

• Available capacitance tolerances of ±5%, ±10% and ±20%

• Non-polar device, minimizing installation concerns

Ordering Information

C

1206

X

106

K

4

R

A

C

AUTO

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/ End Metallization

Design

Ceramic

Voltage Dielectric

Packaging/Grade (C-Spec)²

(L" x W")

Series

(Plated)¹

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination Number of Zeros K = ±10%

M = ±20%

2 Sig. Digits +

J = ±5%

9 = 6.3V

8 = 10V

4 = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

A = 250V

R = X7R

A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5% min) TU = 7" Reel Unmarked

TM = 7" Reel Marked

AUTO = Automotive Grade

7" Reel Unmarked

¹Additional termination options may be available. Contact KEMET for details.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET

C1013-1 • 9/14/2010

1

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

L

Dimensions – Millimeters (Inches)

W

B

T

S

EIA Size Metric Size

Mounting

Technique

L Length

W Width

B Bandwidth

T Thickness

Code

0603

0805

1206

1210

1808

1812

1825

2220

2225

Code

1608

2012

3216

3225

4520

4532

4564

5650

5664

1.6 (.063) ± 0.20 (.008)

2.1 (.083) ± 0.30 (.012)

3.3 (.130) ± 0.40 (.016)

4.7 (.185) ± 0.50 (.020)

4.5 (.178) ± 0.40 (.016)

4.6 (.181) ± 0.40 (.016)

5.9 (.232) ± 0.75 (.030)

0.80 (.032) ± 0.15 (.006)

1.25 (.049) ± 0.20 (.008)

1.60 (.063) ± 0.20 (.008)

2.50 (.098) ± 0.20 (.008)

2.00 (.079) ± 0.20 (.008)

3.20 (.126) ± 0.30 (.012)

6.40 (.252) ± 0.40 (.016)

5.00 (.197) ± 0.40 (.016)

6.40 (.248) ± 0.40 (.016)

0.45 (.018) ± 0.15 (.006)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ± 0.35 (.014)

Solder Wave or

Solder Reﬂow

See Table 2 for

Thickness

Solder Reﬂow

Only

Applications

Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without

(integrated) current limitation and any application that is subject to high levels of board ﬂexure or temperature cycling. Examples

include raw power input side ﬁltering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be

fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.

Qualiﬁcation/Certiﬁcation

Commercial grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in Table

4, Performance and Reliability.

Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC-Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC-Q200, please visit their website @www.aecouncil.com.

Environmental Compliance

RoHS PRC ( Peoples Republic of China) compliant

C1013-1 • 9/14/2010

2

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range:

-55°C to +125°C

±15%

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC):

Aging Rate (Max % Cap Loss/Decade Hour):

3.5%

250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding

50mA)

Dielectric Withstanding Voltage:

Dissipation Factor (DF) Maximum Limits @ 25ºC:

Insulation Resistance (IR) Limit @ 25°C:

5%(10V), 3.5%(16V & 25V) and 2.5%(50V to 200V)

See Insulation Resistance Limit Table

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and Dissipation Factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

Insulation Resistance Limit Table

1000 megohm microfarads

500 megohm microfarads

EIA Case Size

or 100GΩ

N/A

or 10GΩ

ALL

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

< .012µF

< .047µF

< 0.22µF

< 0.39µF

ALL

≥ .012µF

≥ .047µF

≥ 0.22µF

≥ 0.39µF

N/A

< 2.2µF

ALL

≥ 2.2µF

N/A

< 10µF

ALL

≥ 10µF

N/A

C1013-1 • 9/14/2010

3

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Table 1A – (0603 - 1210 Case Sizes)

Series

C0603X

C0805X

C1206X

C1210X

Cap

Code

Voltage Code

Voltage (VDC)

Cap Tolerance

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC

1,000 pF

1,200 pF

1,500 pF

1,800 pF

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 uF

0.12 uF

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB

CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

CB CB CB CB CB CB

CB CB CB CB CB

CB CB CB CD CD

CB CB CB

DC DC DC DC DC DC DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

DC DC DC DC DC DD DC DC EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

DC DC DC DC DC DD DE

DC DC DC DC DC DE DG

DD DD DD DD DD DE DG

DD DD DD DD DD DE

DC DC DC DC DD DG

DD DD DD DD DD

DG DG DG DG DE

DD DD DD DD DE

DD DD DD DG DH

DD DD DD DG

EB EB EB EB EB EB EB EB FB FB FB FB FB FB FB FB

EB EB EB EB EB EC EB EB FB FB FB FB FB FB FB FB

EB EB EB EB EB EC ED ED FB FB FB FB FB FB FC FC

EB EB EB EB EB EB ED ED FB FB FB FB FB FB FC FC

EB EB EB EB EB EB ED ED FB FB FB FB FB FC FF FF

EB EB EB EB EB EB EM EM FB FB FB FB FB FD FG FG

EC EC EC EC EC EC EM

EC EC EC EC EC EC EG

EC EC EC EC EC EC

EB EB EB EB EC EM

EB EB EB EB EC EG

EC EC EC EC EC EG

ED ED ED ED EC

EE EE EE EE ED

EF EF EF EF ED

EF EF EF EG ED

ED ED ED EG EH

FB FB FB FB FB FD

FC FC FC FC FC FD

FD FD FD FD FD FD

FD FD FD FD FD FF

FD FD FD FD FD FG

FF FF FF FF FF FL

FH FH FH FH FH FM

FH FH FH FH FG

0.15 uF

0.18 uF

0.22 uF

0.27 uF

0.33 uF

0.39 uF

0.47 uF

0.56 uF

0.68 uF

0.82 uF

1.0 uF

1.2 uF

1.5 uF

1.8 uF

2.2 uF

2.7 uF

3.3 uF

3.9 uF

4.7 uF

CB CB CB CD

CB CB CB

DD DD DD DG

DE DE DE

155

DG

EF

EF EG EH

FH FH FH FH FG

C

1206

X

106

^DGK^DG

4

R

^EA^F

C

AUTO

185

225

J

K

DG DG DG

EF EF EF EF EH

Failure Rate/ End Metallization

ED ED ED EF EH

EN EN EN EH

ED ED ED EH

EF EF EF EH FG FG FG FG FK

EF EF EF EH FC FC FC FG FS

EH EH EH

FH FH FH FH FG

FJ FJ FJ FJ FG

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

DG DG DG

Tolerance

J

M

Ceramic

Voltage Dielectric

Packaging/Grade (C-Spec)²

FE FE FE FG FH

(L" x W")

Series

Design

(Plated)¹

275

J

335

395

475

565

685

825

J

FF FF FF FM FM

0603

X = Flexible

2 Sig. Digits +

J = ±5%

9 = 6.3V

8 = 10V

4 = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

R = X7R

A = N/A

C = 100% Matte Sn Blank = Bulk

J

M

0805

J

Termination Number of Zeros K = ±10%

L = SnPb (5% min) TU = 7” Reel Unmarked

1206

M = ±20%

TM = 7” Reel Marked

FF FF FF FH

AUTO = Automotive Grade

FG FG FG FM

FH FH 7”FH FK

Reel Unmarked

5.6 uF

6.8 uF

8.2 uF

J

M

1210

J

1808

1812

Voltage (VDC)

1825

Cap

Code

Voltage Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

2220

A = 250V

2225

Series

C0603X

C0805X

C1206X

C1210X

C1013-1 • 9/14/2010

4

Roll Over for

Order Info.

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Table 1A con't – (0603 - 1210 Case Sizes)

Series

C0603X

C0805X

C1206X

C1210X

Cap

Code

Voltage Code

Voltage (VDC)

Cap Tolerance

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

10 uF

12 uF

15 uF

18 uF

22 uF

106

126

156

186

226

J

K

M

EH EH EH

FH FH FH FS

FS FS

Voltage (VDC)

Voltage Code

Series

Cap

Code

9

8

4

3

5

1

2

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

9

8

4

3

5

1

2

A

Cap

C0603X

C0805X

C1206X

C1210X

Table 1B – (1808 - 2225 Case Sizes)

Series

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

Voltage Code

Voltage (VDC)

Cap Tolerance

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

2,200 pF

2,700 pF

3,300 pF

3,900 pF

4,700 pF

5,600 pF

6,800 pF

8,200 pF

10,000 pF

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

0.10 uF

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

J

K

M

LD

GB

GE

GF

GB

GE

GG

HB

KC

KD

KE

KC

KD

KE

JC

JD

JF

JC

0.12 uF

0.15 uF

0.18 uF

0.22 uF

GB

GG GG

HB

JC

KC

AUTO

KB

C₂₇₄1206

X

106

K

4

R

A

C

0.27 uF

J

GB

GG GG GG

HB

JC

0.33 uF

0.39 uF

334

394

GB

HB

JC

KB

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Failure Rate/ End Metallization

Ceramic

Voltage Dielectric

Packaging/Grade (C-Spec)²

J

K

M

GB

HB

HD

HF

JC

JD

JC

JD

KB

KC

(L" x W")

Series

Tolerance

Design

(Plated)¹

0.47 uF

0.56 uF

0.68 uF

0.82 uF

1.0 uF

1.2 uF

474

564

684

824

105

125

J

M

GG

GJ

9 = 6.3V

8 = 10V

GJ

HB

HD

HF

HD

JC

0603

X = Flexible

2 Sig. Digits +

J = ±5%

GC

GEM =

GE

R = X7R

A = N/A

C = 100% Matte Sn Blank = Bulk

J

K

M

GC GG

HB

HD

JC

0805

Termination Number of Zeros K = ±10%

L = SnPb (5% min) TU = 7” Reel Unmarked

J

M

HB

HD

HF

JC

JD

KB

KC

12

J

06

G

±

E

20%GG 4 = 16V

JF JF KB KC

TM = 7” Reel Marked

J

GE

GG

JF

KB

KD

KE

1210

3 = 25V

5 = 50V

AUTO = Automotive Grade

J

KB

1808

7” Reel Unmarked

1812

1 = 100V

2 = 200V

A = 250V

Voltage (VDC)

1825

Cap

Code

Voltage Code

2220

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

2225

Series

C1808X

C1812X

C1825X

C2220X

C2225X

C1013-1 • 9/14/2010

5

Roll Over for

Order Info.

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Table 1B con't – (1808 - 2225 Case Sizes)

Series

C1808X

C1812X

C1825X

C2220X

C2225X

Cap

Code

Voltage Code

Voltage (VDC)

Cap Tolerance

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

1.5 uF

1.8 uF

2.2 uF

2.7 uF

3.3 uF

3.9 uF

4.7 uF

5.6 uF

6.8 uF

8.2 uF

10 uF

12 uF

15 uF

18 uF

22 uF

155

185

225

275

335

395

475

565

685

825

106

126

156

186

226

J

K

M

HC

HD

HF

JC

JD

JF

JC

JD

JF

KC

KD

GK

JF

JO

Voltage (VDC)

Voltage Code

Cap

Code

5

1

2

A

3

5

1

2

A

5

1

2

A

3

5

1

2

A

5

1

2

A

Cap

Series

C1808X

C1812X

C1825X

C2220X

C2225X

C

1206

X

106

K

4

R

A

C

AUTO

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/ End Metallization

Design

Ceramic

Voltage Dielectric

Packaging/Grade (C-Spec)²

(L" x W")

Series

(Plated)¹

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination Number of Zeros K = ±10%

M = ±20%

2 Sig. Digits +

J = ±5%

9 = 6.3V

8 = 10V

4 = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

A = 250V

R = X7R

A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5% min) TU = 7” Reel Unmarked

TM = 7” Reel Marked

AUTO = Automotive Grade

7” Reel Unmarked

C1013-1 • 9/14/2010

6

Roll Over for

Order Info.

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Table 2 – Chip Thickness / Packaging Quantities

Thickness

Code

Chip

Size

Thickness ± Qty per Reel Qty per Reel Qty per Reel Qty per Reel Qty per Bulk

Range (mm)

7" Plastic

13" Plastic

7" Paper

13" Paper

Cassette

AA

AB

BB

CB

CC

CD

DC

DD

DL

DE

DF

DG

DH

EB

EK

EC

EN

ED

EE

EF

EM

EG

EH

EJ

FB

FC

FD

FE

FF

FG

FL

FO

FH

FP

FM

FJ

FN

FT

FK

FR

FS

PA

MA

NA

LD

LA

LB

LC

GB

GC

GD

GE

GH

GF

GG

GK

GJ

GN

GL

GM

GO

HB

HC

HD

HE

HF

HG

JB

01005

0201

0402

0603

0805

1206

1210

1220

1632

1706

1808

1812

1825

2220

2225

0.20 ± 0.02

0.30 ± 0.03

0.50 ± 0.05

0.80 ± 0.07

0.80 ± 0.10

0.80 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.25 ± 0.20

0.78 ± 0.10

0.80 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.20 ± 0.15

1.25 ± 0.15

1.60 ± 0.15

1.60 ± 0.20

1.70 ± 0.20

0.78 ± 0.10

0.90 ± 0.10

0.95 ± 0.10

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.40 ± 0.15

1.50 ± 0.20

1.55 ± 0.15

1.60 ± 0.20

1.70 ± 0.20

1.85 ± 0.20

1.90 ± 0.20

2.10 ± 0.20

2.25 ± 0.20

2.50 ± 0.20

0.80 ± 0.10

0.90 ± 0.10

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.00 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.30 ± 0.10

1.40 ± 0.15

1.50 ± 0.10

1.55 ± 0.10

1.60 ± 0.20

1.70 ± 0.15

1.70 ± 0.20

1.90 ± 0.20

2.00 ± 0.20

2.50 ± 0.20

1.10 ± 0.15

1.15 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.60 ± 0.20

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.50 ± 0.15

1.60 ± 0.20

1.70 ± 0.15

1.80 ± 0.15

2.40 ± 0.15

1.00 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

15000

10000

4000

50000

10000

50000

15000

4000

2500

4000

2000

4000

2500

2000

4000

2500

2000

1500

2000

1000

4000

2500

1000

500

10000

8000

10000

8000

10000

8000

4000

8000

4000

10000

4000

2000

4000

2000

4000

10000

Package Quantity

Based on Finished Chip

Thickness Speciﬁcations

1000

500

JC

JD

JE

JF

JP

JG

JH

JO

KB

KC

KD

KE

KF

1000

C1013-1 • 9/14/2010

7

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle

• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

0.85

1.05

1.60

2.25

2.10

2.15

2.85

1.25

1.45

1.65

1.85

1.80

2.10

1.10

1.55

1.90

2.80

2.30

3.60

6.90

5.50

6.90

4.00

4.60

5.90

7.40

7.00

7.10

8.80

2.10

2.60

2.90

3.80

3.30

4.60

7.90

6.50

7.90

0.75

0.95

1.50

2.15

2.00

2.05

2.75

1.05

1.25

1.45

1.65

1.60

1.90

1.00

1.45

1.80

2.70

2.20

3.50

6.80

5.40

6.80

3.10

3.70

5.00

6.50

6.10

6.20

7.90

1.50

2.00

2.30

3.20

2.70

4.00

7.30

5.90

7.30

0.65

0.85

1.40

2.05

1.90

1.95

2.65

0.85

1.05

1.25

1.45

1.40

1.70

0.90

1.35

1.70

2.60

2.10

3.40

6.70

5.30

6.70

2.40

3.00

4.30

5.80

5.40

5.50

7.20

1.20

1.70

2.00

2.90

2.40

3.70

7.00

5.60

7.00

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

C1013-1 • 9/14/2010

8

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Heat Generation

∆T : 20ºC max.

Reﬂow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve.

(Ripple voltage must be < rated voltage)

Ripple Current

Terminal Strength

Board Flex

JIS-C-6429

Appendix 1, Note: Force of 1.8kg for 60 seconds.

Appendix 2, Note: 2mm (min) for all except 3mm for C0G.

Magniﬁcation 50X. Conditions:

JIS-C-6429

a) Method B, 4 hrs @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J-STD-002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA-104

MIL-STD-202 Method 103

1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion.

Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement

at 24 hrs. +/- 2 hrs after test conclusion.

Low Volt Humidity: 1000 hours 85C°/85%RH and 1.5V.Add 100K ohm resistor.

Measurement at 24 hrs. +/- 2 hrs after test conclusion.

t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered.

Measurement at 24 hrs. +/- 2 hrs after test conclusion.

-55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell

Moisture Resistance

Thermal Shock

MIL-STD-202 Method 106

MIL-STD-202 Method 107

time-15 minutes. Air-Air.

High Temperature Life

Storage Life

MIL-STD-202 Method 108

MIL-STD-202 Method 213

MIL-STD-202 Method 215

1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 1.5X rated voltage applied.

150°C, 0VDC, for 1000 Hours.

Mechanical Shock

Resistance to Solvents

Figure 1 of Method 213, Condition F.

Add aqueous wash chemical - OKEM Clean or equivalent.

C1013-1 • 9/14/2010

9

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in

8mm, 12mm and 16mm tape on 7" and 13" reels in accordance

with EIA standard 481. This packaging system is compatible with

all tape fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8mm, 12mm

or 16mm Carrier Tape

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

178mm (7.00")

or

330mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration (mm)

EIA Case Size

Tape size (W)*

Pitch (P₁)*

01005 - 0402

0603 - 1210

8

2

4

1805 - 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figure 1 for W and P₁carrier tape reference locations.

*Refer to Table 6 for tolerance speciﬁcations.

C1013-1 • 9/14/2010

10

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 6

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Min.

Note 1

1.0

R Ref.

Note 2

25.0

S₁Min.

Note 3

Tape Size

8mm

D₀

E₁

P₀

P₂

T Max. T₁Max.

(0.039)

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.600

(0.024)

0.600

(0.024) (0.004)

0.100

12mm

(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)

1.5

30

(0.059)

(1.181)

16mm

Variable Dimensions — Millimeters (Inches)

B₁Max.

Note 4

4.35

(0.171)

8.2

(0.323)

12.1

(0.476)

Tape Size

8mm

Pitch

E₂Min.

F

P₁

T₂Max

W Max

A₀,B₀& K₀

Note 5

6.25

(0.246)

10.25

(0.404)

14.25

3.5 ± 0.05

4.0 ± 0.10

2.5

(0.098)

4.6

(0.181)

4.6

8.3

(0.327)

12.3

(0.484)

16.3

Single (4mm)

(0.138 ± 0.002) (0.157 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

5.5 ± 0.05 8.0 ± 0.10

(0.217 ± 0.002) (0.315 ± 0.004)

Single (4mm) &

Double (8mm)

12mm

16mm

Triple (12mm)

(0.561)

(0.181)

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 5).

3. If S₁<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).

(e) for KPS Series product A₀and B₀are measured on a plane 0.3mm above the bottom of the pocket.

(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

C1013-1 • 9/14/2010

11

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ±0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Ref.

Note 2

25

Tape Size

8mm

D₀

E₁

P₀

P₂

T₁Max

G Min

1.5 +0.10-0.0

(0.059 +0.004, -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(.004) Max.

0.75

(.030)

(.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

Pitch

E2 Min

F

P₁

T Max

W Max

A₀B₀

2.0 ± 0.05

(0.079 ± 0.002)

4.0 ± 0.10

8.3

(0.327)

8.3

Half (2mm)

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

1.1

(0.098)

Note 5

8mm

Single (4mm)

(0.157 ± 0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 5).

C1013-1 • 9/14/2010

12

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

Peel Strength

8mm

0.1 Newton to 1.0 Newton (10g to 100g)

0.1 Newton to 1.3 Newton (10g to 130g)

12mm & 16mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the

carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16-200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16-56

72-200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

8mm & 12mm Tape

16mm Tape

0.5 mm maximum

1.0 mm maximum

0.5 mm maximum

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

R

Bending

Radius

R

C1013-1 • 9/14/2010

13

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm min.)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm min. width x

10.0 mm min. depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric Dimensions Will Govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8mm

A

B Min

C

D Min

178 ± 0.20

(7.008 ± 0.008)

or

330 ± 0.20

(13.000 ± 0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12mm

16mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8mm

N Min

W₁

W₂Max

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

16.4 +2.0/-0.0

14.4

(0.567)

18.4

(0.724)

22.4

50

(1.969)

Shall accommodate tape width

without interference

12mm

16mm

(0.646 +0.078/-0.0)

(0.882)

C1013-1 • 9/14/2010

14

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Punched Carrier

8 mm & 12 mm only

Round Sprocket Holes

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm Min.

Leader

Trailer

160 mm minimum,

Components

400 mm Minimum,

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

C1013-1 • 9/14/2010

15

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)

Meets Dimensional Requirements IEC-286 and EIAJ 7201

Unit mm *Reference

53 3*

10*

1.5 ± ⁰₀^.1

2.0 ± ₀⁰_.1

3.0 ± ⁰₀^.2

5 0*

110 ± 0.7

Table 9 – Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

EIA Size Metric Size

S Separation

minimum

0.3

Number of

Pcs/Cassette

L Length

W Width

B Bandwidth

T Thickness

Code

0402

1005

1.0 ± 0.05

1.6 ± 0.07

0.5 ± 0.05

0.8 ± 0.07

0.2 to 0.4

0.2 to 0.5

0.5 ± .05

0.8 ± .07

50,000

0603

1608

0.7

15,000

Table 10 – Capacitor Marking

Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to

identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any

Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)

Numeral

Alpha

Character

Capacitance (pF) For Various Numeral Identiﬁers

9

0

1

2

3

4

5

6

7

A

B

C

D

E

F

G

H

J

0.1

1

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

2500

3500

4000

4500

5000

6000

7000

8000

9000

10000

11000

12000

13000

15000

16000

18000

20000

22000

24000

27000

30000

33000

36000

39000

43000

47000

51000

56000

62000

68000

75000

82000

91000

25000

35000

40000

45000

50000

60000

70000

80000

90000

100000

110000

120000

130000

150000

160000

180000

200000

220000

240000

270000

300000

330000

360000

390000

430000

470000

510000

560000

620000

680000

750000

820000

910000

250000

350000

400000

450000

500000

600000

700000

800000

900000

1000000

1100000

1200000

1300000

1500000

1600000

1800000

2000000

2200000

2400000

2700000

3000000

3300000

3600000

3900000

4300000

4700000

5100000

5600000

6200000

6800000

7500000

8200000

9100000

2500000

3500000

4000000

4500000

5000000

6000000

7000000

8000000

9000000

10000000

11000000

12000000

13000000

15000000

16000000

18000000

20000000

22000000

24000000

27000000

30000000

33000000

36000000

39000000

43000000

47000000

51000000

56000000

62000000

68000000

75000000

82000000

91000000

25000000

35000000

40000000

45000000

50000000

60000000

70000000

80000000

90000000

0.11

0.12

0.13

0.15

0.16

0.18

0.2

0.22

0.24

0.27

0.3

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

1.1

1.2

1.3

1.5

1.6

1.8

2

2.2

2.4

2.7

3

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4

Example shown is 1,000 pF capacitor

K

L

M

N

P

Q

R

S

T

U

V

W

X

Y

Z

a

b

d

e

f

m

n

t

0.45

0.5

0.6

0.7

0.8

4.5

5

6

7

8

y

0.9

9

C1013-1 • 9/14/2010

16

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

Search Our FAQs: KnowledgeEdge

Product Information

Resource

Products

Location

http://www.kemet.com/products

Technical Resources (Including Soldering

Techniques)

http://www.kemet.com/technicalpapers

RoHS Statement

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

Sample Request

Engineering Kit Request

http://www.kemet.com/sample

http://www.kemet.com/kits

Contact

Resource

Website

Location

www.kemet.com

Contact Us

Investor Relations

Call Us

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1013-1 • 9/14/2010

17

SMD MLCCs – Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)

KEMET Corporation

Europe

20-21 Cumberland Drive

Granby Industrial Estate

Weymouth, Dorset DT4 9TE

United Kingdom

Tel: 44-1305-830747

Fax: 44-1305-760670

Room 305, Floor 3, #142

Sec. 4, Chung Hsiao East Road

Taipei 106

Taiwan ROC

Tel: 886-2-27528585

Fax: 886-2-27213129

Southern Europe

15bis chemin des Mines, 4th ﬂoor

1202 Geneva

World Headquarters

P.O. Box 5928

Greenville, SC 29606

2835 KEMET Way

Simpsonville, SC 29681

www.kemet.com

Switzerland

Tel: 41-22-715-0100

Fax: 41-22-715-0170

Tel: 864-963-6300

Fax: 864-963-6521

Thörnblads Väg 6

Färjestaden 386 90

Sweden

Tel: 46-485-563934

Fax: 46-485-563938

Southeast Asia

73 Bukit Timah Road

#05-01 Rex House

229832 Singapore

Tel: 65-6586-1900

Fax: 65-6586-1901

Zac Paris Rive Gauche

118-122 avenue de France

75013 Paris

France

Tel: 33-1-4646-1009

Fax: 33-1-4646-1599

North America

Corporate Ofﬁces

101 NE Third Avenue

Tower 101, Suite 1700

Fort Lauderdale, FL 33301

Tel: 954-766-2800

Stella Business Park

Lars Sonckin kaari 16

Espoo 02600

Finland

Tel: 358-9-5406-5000

Fax: 358-9-5406-5010

1-5-20 Krystal Point 2

Lebuh Bukit Kecil 6

11900 Bayan Baru

Penang

Malaysia

Tel: 6- 04-6430200

Fax: 6 -04-6444220

Via San Lorenzo 19

Sasso Marconi, BO

40037

Fax: 954-766-2805

Italy

Tel: 39-051-939111

Fax: 39-051-840684

Southeast

801 International Parkway, Suite 5070

Lake Mary, FL 32746

Tel: 407-855-8886

Asia

Viale Milanoﬁori 1

Palazzo E1

20090 Assago

Milano

Northeast Asia

30 Canton Road, Room 1512

Silvercord Tower II

Tsimshatshui, Kowloon

Hong Kong

Ofﬁce No. 605, 6th Floor

Barton Centre M.G. Road

Bangalore 560 001

India

Tel: 91-80-653-76817

Fax: 91-80-2532-0160

Northeast

340-X Fordham Road

Wilmington, MA 01887

Tel: 978-658-1663

Fax: 978-658-1790

Italy

Tel: 39-02-57518176

Fax: 39-02-57512093

Tel: 852-2305-1168

Fax: 852-2759-0345

Room 1411, 14/F New China

Insurance Ediﬁce

Mintian Road, CBD Futian District

Shenzhen 518001

Central Europe

Hermann-Koehl-Str. 2

Landsberg am Lech

86899 Germany

Tel: 49-8191-3350800

Fax: 49-8191-3350990

Central

1900 North Roselle Road, Suite 405

Schaumburg, IL 60195

Tel: 847-882-3590

China

Fax: 847-882-3046

Tel: 1-867-55-25181306

Fax: 1-867-55-25181307

West

Ruhrallee 9

Dortmund

44139 Germany

Tel: 49-2307-3619672

Fax: 49-2307-961527

Floor 17, Tower B, Ping An IFC

No.1-3 Xin Yuan South Road

Chao Yang District

Beijing 100027

1551 McCarthy Boulevard, Suite 117

Milpitas, CA 95035

Tel: 408-433-9946

Fax: 408-433-9946

China

Tel: 86-10-5829-1711

Fax: 86-10-5829-1963

Mexico

Northern Europe

Unit 1, Ducketts Wharf

South Street

Bishops Stortford

Hertfordshire CM23 3AL

United Kingdom

Tezozomoc No. 47

Col. Ciudad del Sol

Zapopan, Jalisco C.P. 45050

Mexico

Room 2602, Grand Gateway Tower 1

No.1 Hong Qiao Road

Shanghai 200030

China

Tel: 86-21-6447-0707

Fax: 86-21-6447-0070

Tel: 52-33-3123-2141

Fax: 52-33-3123-2144

Tel: 44-1279-757201

Fax: 44-1279-465237

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1013-1 • 9/14/2010

18


型号：	C0805X224J9RAC7867
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Ceramic, 6.3V, 5% +Tol, 5% -Tol, X7R, -/+15ppm/Cel TC, 0.22uF, 0805,
文件：	总18页 (文件大小：1485K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0805X224J9RAC7867 [KEMET]

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