C0402C152J8JACTU_技术文档

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC

(Commercial & Automotive Grade)

Overview

KEMET U2J dielectric features a maximum operating

temperatureꢀofꢀ125°Cꢀandꢀisꢀconsideredꢀstable.ꢀTheꢀ

Electronics Industries Alliance (EIA) characterizes U2J

dielectric as a Class I material. Components of this

classiﬁcationꢀareꢀtemperatureꢀcompensatingꢀandꢀareꢀ

suited for resonant circuit applications or those where Q

and stability of capacitance characteristics are required.

U2J is an extremely stable dielectric material that exhibits

a negligible shift in capacitance with respect to voltage

and boasts a predictable and linear change in capacitance

with reference to ambient temperature with no aging

effect. In addition, U2J dielectric extends the available

capacitance range of Class I MLCCs to achieve values

previously only available using Class II dielectric materials

like X7R, X5R, Y5V and Z5U.

U2J is not sensitive to DC Bias as compared to Class

II dielectric materials and retains over 99% of nominal

capacitance at full rated voltage. KEMET automotive grade

capacitors meet the demanding Automotive Electronics

Council'sꢀAEC–Q200ꢀqualiﬁcationꢀrequirements.

Capacitanceꢀchangeꢀisꢀlimitedꢀtoꢀ−750ꢀ±120ꢀppm/°Cꢀfromꢀ

−55°Cꢀtoꢀ+125°C.ꢀTheseꢀdevicesꢀareꢀleadꢀ(Pb)-free,ꢀRoHSꢀ

and REACH compliant without exception and are capable

ofꢀwithstandingꢀmultipleꢀpassesꢀthroughꢀaꢀleadꢀ(Pb)-freeꢀ

solderꢀreﬂowꢀproﬁle.

Beneﬁts

•ꢀ AEC–Q200ꢀautomotiveꢀqualiﬁed

• Up to 10x increase in capacitance versus C0G

• Extremely low effective series resistance (ESR)

• Extremely low effective series inductance (ESL)

• High ripple current capability

• Low noise solution similar to C0G

• Retains over 99% of nominal capacitance at full rated voltage

• Small predictable and linear capacitance change with respect

to temperature

•ꢀ Operatingꢀtemperatureꢀrangeꢀofꢀ−55°Cꢀtoꢀ+125°C

• Capacitance up to 470 nF

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• DC voltage ratings up to 100 V

Applications

• High ripple current

• Critical timing

• Decoupling

• Wireless charging

• Resonant LLC converters

•ꢀ Powerꢀconversion

•ꢀ Pulseꢀcircuits

• Transient voltage suppression

One world. One KEMET

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Ordering Information

C

1206

C

104

J

3

J

A

C

TU

Case Size Speciﬁcation/ Capacitance

Capacitance Rated Voltage

Failure Rate/

Design

Packaging/

Grade (C-Spec)

Ceramic

Dielectric

J = U2J

Termination Finish³

(L" x W")

Series¹

Code (pF)

Tolerance²

(VDC)

0402

0603

0805

1206

1210

1812

C =

Standard

Twoꢀsigniﬁcantꢀ Fꢀ=ꢀ±1%

8 = 10

A = N/A

C = 100% Matte Sn

See

"Packagingꢀ

C-Spec

Ordering

Options Table"

digits and

number of

zeros.

Gꢀ=ꢀ±2%

Jꢀ=ꢀ±5%

Kꢀ=ꢀ±10%

Mꢀ=ꢀ±20%

4 = 16

3 = 25

5 = 50

1 = 100

¹Flexible termination option is available. Please see FT-CAP product bulletin C1087_U2J_FT-CAP_SMD.

²Additional capacitance tolerance offerings may be available. Contact KEMET for details.

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

Commercial Grade¹

Bulk Bag/Unmarked

7" Reel/Unmarked

Not required (blank)

TU

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

13" Reel/Unmarked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

7081

7082

Automotive Grade³

7" Reel

AUTO

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

3190

13" Reel/Unmarked

7" Reel/Unmarked/2 mm pitch²

13" Reel/Unmarked/2 mm pitch²

3191

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."

³Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information."

³For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."

³All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.

For more information see "Capacitor Marking."

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Qualiﬁcation/Certiﬁcation

Commercialꢀgradeꢀproductsꢀareꢀsubjectꢀtoꢀinternalꢀqualiﬁcation.ꢀDetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀ

referencedꢀinꢀTableꢀ4,ꢀPerformanceꢀ&ꢀReliability.

Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀtheꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQualiﬁcationꢀforꢀPassiveꢀ

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Leadꢀ(Pb)-free,ꢀRoHS,ꢀandꢀREACHꢀcompliantꢀwithoutꢀexemptions.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

DetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQuali ꢀcationꢀforꢀPassiveꢀ

Components.ꢀTheseꢀproductsꢀareꢀsupportedꢀbyꢀaꢀProductꢀChangeꢀNoti ꢀcationꢀ(PCN)ꢀandꢀProductionꢀPartꢀApprovalꢀProcessꢀ

warrantꢀ(PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

componentꢀwithoutꢀtheꢀrequirementꢀtoꢀsubmitꢀaꢀcustomerꢀSourceꢀControlledꢀDrawingꢀ(SCD)ꢀorꢀspeci ꢀcationꢀforꢀreviewꢀbyꢀaꢀ

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are

notꢀgrantedꢀtheꢀsameꢀ“privileges”ꢀasꢀotherꢀautomotiveꢀC-Specs.ꢀCustomerꢀPCNꢀapprovalꢀandꢀPPAPꢀrequestꢀlevelsꢀareꢀlimitedꢀ

(see details below.)

Product Change Notiﬁcation (PCN)

TheꢀKEMETꢀproductꢀchangeꢀnoti ꢀcationꢀsystemꢀisꢀusedꢀtoꢀcommunicateꢀprimarilyꢀtheꢀfollowingꢀtypesꢀofꢀchanges:

ꢀ •ꢀProduct/processꢀchangesꢀthatꢀaffectꢀproductꢀform,ꢀ ꢀt,ꢀfunction,ꢀand/orꢀreliability

• Changes in manufacturing site

ꢀ •ꢀProductꢀobsolescence

Customer Notiﬁcation Due To:

KEMET Automotive

C-Spec

Days Prior To

Implementation

Process/Productꢀchange

Obsolescence*

KEMET assigned¹

AUTO

Yes (with approval and sign off)

Yes (without approval)

Yes

180 days minimum

90 days minimum

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

TheꢀpurposeꢀofꢀtheꢀProductionꢀPartꢀApprovalꢀProcessꢀis:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

ꢀ •ꢀToꢀprovideꢀtheꢀevidenceꢀthatꢀallꢀcustomerꢀengineeringꢀdesignꢀrecordsꢀandꢀspeci ꢀcationꢀrequirementsꢀareꢀproperlyꢀ

understoodꢀandꢀful ꢀlledꢀbyꢀtheꢀmanufacturingꢀorganization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

PPAP (Product Part Approval Process) Level

KEMET Automotive

C-Spec

1

●

○

2

3

●

○

4

5

KEMET assigned¹

AUTO

●

¹KEMET assigned C-Specs require the submittal of a customer SCD or customer speciﬁcation for review. For additional information contact KEMET.

●ꢀPartꢀnumberꢀspeci ꢀcꢀPPAPꢀavailable

○ꢀProductꢀfamilyꢀPPAPꢀonly

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

4

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

L

W

T

B

S

EIA Metric

Size Size

Code Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

Solderꢀreﬂowꢀ

0402

0603

0805

1206

1210

1812

1005

1608

2012

3216

3225

4532

1.00ꢀ(0.040)ꢀ±0.05ꢀ(0.002) 0.50ꢀ(0.020)ꢀ±0.05ꢀ(0.002)

1.60ꢀ(0.063)ꢀ±0.15ꢀ(0.006) 0.80ꢀ(0.032)ꢀ±0.15ꢀ(0.006)

2.00ꢀ(0.079)ꢀ±0.20ꢀ(0.008) 1.25ꢀ(0.049)ꢀ±0.20ꢀ(0.008)

3.20ꢀ(0.126)ꢀ±0.20ꢀ(0.008) 1.60ꢀ(0.063)ꢀ±0.20ꢀ(0.008)

3.20ꢀ(0.126)ꢀ±0.20ꢀ(0.008) 2.50ꢀ(0.098)ꢀ±0.20ꢀ(0.008)

4.50ꢀ(0.177)ꢀ±0.30ꢀ(0.012) 3.20ꢀ(0.126)ꢀ±0.30ꢀ(0.012)

0.30ꢀ(0.012)ꢀ±0.10ꢀ(0.004) 0.30 (0.012)

0.35ꢀ(0.014)ꢀ±0.15ꢀ(0.006) 0.70 (0.028)

only

Solder wave

or

Solderꢀreﬂow

0.50ꢀ(0.02)ꢀ±0.25ꢀ(0.010)

0.60ꢀ(0.024)ꢀ±0.35ꢀ(0.014)

0.75 (0.030)

N/A

See Table 2

for thickness

Solderꢀreﬂowꢀ

only

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

−55°Cꢀtoꢀ+125°Cꢀꢀ

−750ꢀ±120ꢀppm/°C

0.1%

CapacitanceꢀChangeꢀwithꢀReferenceꢀtoꢀ+25°Cꢀandꢀ0ꢀVDCꢀAppliedꢀ

(TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

Dielectric Withstanding Voltage (DWV)

250% of rated voltage

(5ꢀ±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50ꢀmA)

0.1%

DissipationꢀFactorꢀ(DF)ꢀMaximumꢀLimitꢀatꢀ25°C

1,000ꢀMΩꢀµFꢀorꢀ100ꢀGΩ

(Ratedꢀvoltageꢀappliedꢀforꢀ120ꢀ±5ꢀsecondsꢀatꢀ25°C)

InsulationꢀResistanceꢀ(IR)ꢀLimitꢀatꢀ25°C

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 V_rms±0.2 V if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 V_rms±0.2 V if capacitance > 1,000 pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known

as Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

5

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Electrical Characteristics (Typical)

Capacitance vs. Temperature (TCC)

15

10

5

0

−5

−10

−15

−60

−40

−20

0

20

40

60

80

100

120

140

Tꢇꢍꢂꢇꢎꢁꢅꢏꢎꢇ ꢊꢐꢀꢌ

DCꢀ&ꢀACꢀBiasꢀEffectiveꢀCapacitance

0.0

0.00

−0.02

−0.04

−0.06

−0.08

−0.10

−0.1

−0.2

−0.3

−0.4

−0.5

0

5

10

15

20

25

0

5

10

15

20

25

ꢐꢁ Bꢂꢃꢄ ꢅꢆ_ꢑꢒꢓ

ꢇ

ꢀꢁ Bꢂꢃꢄ ꢅꢆꢇ

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance Dissipation Factor

Capacitance

Shift

Insulation

Dielectric

U2J

Value

(Maximum %)

Resistance

10% of Initial

limit

All

0.5

0.3%ꢀorꢀ±0.25ꢀpFꢀꢀ

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C1086_U2J • 11/8/2018

6

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

C1210C

C1812C

Cap

Code

Voltage Code

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

1

8

4

3

5

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

9,100 pF

10,000 pF

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

103

F

G

J

K

M

BB BB BB BB

BB BB BB BB CF CF CF CF

BB BB BB

CF CF CF CF

CF CF CF CF DN DN DN DN

F G

F

G

CF CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB FB

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

C1210C

C1812C

XX¹- Commercial Grade Only

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C1086_U2J • 11/8/2018

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont'd

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

C1210C

C1812C

Cap

Code

Voltage Code

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

1

8

4

3

5

Capacitance

Rated Voltage

(VDC)

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

12,000 pF

15,000 pF

18,000 pF

22,000 pF

27,000 pF

33,000 pF

39,000 pF

47,000 pF

56,000 pF

68,000 pF

82,000 pF

100,000 pF

120,000 pF

150,000 pF

180,000 pF

220,000 pF

270,000 pF

330,000 pF

390,000 pF

470,000 pF

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

F

G

J

K

M

CF CF CF

DN DN DN DN EB EB EB EB FB FB FB FB FB

DN DN DN DP EB EB EB EB FB FB FB FB FB

DP DP DP DP EB EB EB EB FB FB FB FB FB

DP DP DP DG EB EB EB EB FB FB FB FB FC GB GB GB

DG DG DG DG EB EB EB EB FB FB FB FB FC GB GB GB

DG DG DG

EB EB EB EC FB FB FB FB FE GB GB GB

EC EC EC EC FB FB FB FB FG GB GB GB

EC EC EC EE FB FB FB FB FG GB GB GB

EC EC EC EF FB FB FB FC FG GB GB GB

EF EF EF EH FC FC FC FE FH GB GB GB

EF EF EF EH FE FE FE FG FT GB GB GB

EH EH EH

FG FG FG FG FI GB GB GB

FG FG FG FH

FH FH FH FM

FM FM FM

GB GB GB

GC GC GC

GH GH GH

GK GK GK GN¹

Rated Voltage

(VDC)

Cap

Code

Capacitance

Voltage Code

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

8

4

3

5

Case Size/

Series

C0402C

C0603C

C0805C

C1206C

C1210C

C1812C

XX¹- Commercial Grade Only

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity¹

Plastic Quantity

Thickness Case Thickness ±

Code

Size¹Range (mm)

7" Reel

13" Reel

7" Reel

13" Reel

BB

CF

DN

DP

DG

EB

EC

EE

EF

EH

FB

FC

FE

FG

FH

FM

FT

FI

GB

GC

GH

GK

GN

0402

0603

0805

1206

1210

1812

0.50ꢀ±ꢀ0.05

0.80ꢀ±ꢀ0.07*

0.78ꢀ±ꢀ0.10*

0.90ꢀ±ꢀ0.10*

1.25ꢀ±ꢀ0.15

0.78ꢀ±ꢀ0.10

0.90ꢀ±ꢀ0.10

1.10ꢀ±ꢀ0.10

1.20ꢀ±ꢀ0.15

1.60ꢀ±ꢀ0.20

0.78ꢀ±ꢀ0.10

0.90ꢀ±ꢀ0.10

1.00ꢀ±ꢀ0.10

1.25ꢀ±ꢀ0.15

1.55ꢀ±ꢀ0.15

1.70ꢀ±ꢀ0.20

1.90ꢀ±ꢀ0.20

2.10ꢀ±ꢀ0.20*

1.00ꢀ±ꢀ0.10

1.10ꢀ±ꢀ0.10

1.40ꢀ±ꢀ0.15

1.60ꢀ±ꢀ0.20

1.70ꢀ±ꢀ0.20

10,000

4,000

50,000

15,000

0

2,500

4,000

2,500

2,000

4,000

2,500

2,000

1,500

1,000

10,000

8,000

10,000

8,000

7,000

4,000

10,000

0

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size¹

Thickness ±

Range (mm)

Paper Quantity¹

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

¹If ordering using the 2 mm tape and reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603

(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

Bulk Bag (default)

PackagingꢀC-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1812

1005

1608

2012

3216

3225

4532

50,000

20,000

1

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be included

in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial grade

product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for

automotive grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-static bulk bag and automotive grade products). The 15th

through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk

Bag" packaging.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0402

0603

0805

1206

1210

1210¹

1812

1005

1608

2012

3216

3225

4532

0.50

0.72

2.20

1.20

0.45

0.62

1.90

1.00

0.40

0.52

1.60

0.80

0.90

1.00

1.60

1.50

2.15

1.15

1.35

1.60

1.10

1.55

1.90

2.80

2.90

3.60

4.00

4.40

5.60

5.65

5.60

6.90

2.10

2.60

2.90

3.80

3.90

4.60

0.80

0.90

1.50

1.40

2.05

0.95

1.15

1.40

1.00

1.45

1.80

2.70

2.80

3.50

3.10

3.50

4.70

6.00

1.50

2.00

2.30

3.20

3.30

4.00

0.60

0.75

1.40

1.30

1.95

0.75

0.95

1.20

0.90

1.35

1.70

2.60

2.70

3.40

2.40

2.80

4.00

5.30

1.20

1.70

2.00

2.90

3.00

3.70

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreﬂowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206

ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreﬂowꢀonly

Recommended Reﬂow Soldering Proﬁle:

The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection,ꢀIRꢀorꢀvaporꢀphaseꢀreﬂowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀrecommendedꢀtoꢀavoidꢀextremeꢀthermalꢀ

stress.ꢀKEMET’sꢀrecommendedꢀproﬁleꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀreﬂowꢀreﬂectꢀtheꢀproﬁleꢀconditionsꢀofꢀtheꢀIPC/J-

STD-020ꢀstandardꢀforꢀmoistureꢀsensitivityꢀtesting.ꢀTheseꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreﬂowꢀpassesꢀatꢀ

these conditions.

Termination Finish

ꢀ_ꢃ

ꢀ_L

t_ꢃ

Proﬁle Feature

Maꢂimum ramp up rate ꢄ ꢅꢆCꢇsecond

Maꢂimum ramp doꢈn rate ꢄ ꢉꢆCꢇsecond

SnPb

100% Matte Sn

t_L

Preheat/Soak

Temperature Minimum (T_Smin

)

100°C

150°C

200°C

ꢀ_smaꢂ

ꢀ_smin

Temperature Maximum (T_Smax

Time (t_S) from T_Sminto T_Smax

)

t_s

60 – 120 seconds

3°C/secondꢀ

maximum

3°C/secondꢀ

maximum

Ramp-Up Rate (T_Lto T_P)

2ꢁ

2ꢁꢆC to ꢃeaꢊ

Liquidous Temperature (T_L)

Time Above Liquidous (t_L)

PeakꢀTemperatureꢀ(T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

Tꢀꢁꢂ

TimeꢀWithinꢀ5°CꢀofꢀMaximumꢀ

20 seconds

maximum

30 seconds

maximum

PeakꢀTemperatureꢀ(t_P)

6°C/secondꢀ

maximum

6°C/secondꢀ

maximum

Ramp-Down Rate (T_Pto T_L)

Timeꢀ25°CꢀtoꢀPeakꢀ

6 minutes maximum 8 minutes maximum

Temperature

Note: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

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C1086_U2J • 11/8/2018

11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Package Size (L" x W")

Force

Duration

Terminal Strength

JIS-C-6429

Appendixꢀ1,ꢀNote:

0402

0603

≥ꢀ0805

5 N (0.51 kg)

10 N (1.02 kg) 60 seconds

18 N (1.83 kg)

Board Flex

JIS-C-6429

J-STD-002

Appendixꢀ2,ꢀNote:ꢀ3.0ꢀmmꢀ(minimum).

Magniﬁcationꢀ50ꢀXꢀConditions:

a)ꢀMethodꢀB,ꢀ4ꢀhoursꢀatꢀ155°C,ꢀdryꢀheatꢀatꢀ235°C

b)ꢀMethodꢀBꢀatꢀ215°C,ꢀcategoryꢀ3

Solderability

c)ꢀMethodꢀDꢀatꢀ260°C,ꢀcategoryꢀ3

Temperature Cycling

Biased Humidity

JESD22 Method JA-104

MIL-STD-202 Method 103

1,000ꢀcyclesꢀ(−55°Cꢀtoꢀ+125°C).ꢀMeasurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.

Loadꢀhumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀratedꢀvoltage.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.

Lowꢀvoltꢀhumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀ1.5ꢀV.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.

tꢀ=ꢀ24ꢀhours/cycle.ꢀStepsꢀ7aꢀandꢀ7bꢀnotꢀrequired.ꢀMeasurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀ

test conclusion.

Moisture Resistance MIL-STD-202 Method 106

−55°C/+125°C.ꢀNote:ꢀNumberꢀofꢀcyclesꢀrequiredꢀ–ꢀ300.ꢀMaximumꢀtransferꢀtimeꢀ–ꢀ20ꢀ

Thermal Shock

High Temperature Life

Storage Life

MIL-STD-202 Method 107

seconds. Dwell time – 15 minutes. Air – air.

MIL-STD-202

Method 108/EIA -198

1,000ꢀhoursꢀatꢀ125°Cꢀwithꢀ2ꢀXꢀratedꢀvoltageꢀapplied.

MIL-STD-202 Method 108 125°C,ꢀ0ꢀVDCꢀforꢀ1,000ꢀhours.

5ꢀG'sꢀforꢀ20ꢀminutes,ꢀ12ꢀcyclesꢀeachꢀofꢀ3ꢀorientations.ꢀNote:ꢀUseꢀ8"ꢀXꢀ5"ꢀPCBꢀ0.031"ꢀthickꢀ

Vibration

MIL-STD-202 Method 204 7ꢀsecureꢀpointsꢀonꢀoneꢀlongꢀsideꢀandꢀ2ꢀsecureꢀpointsꢀatꢀcornersꢀofꢀoppositeꢀsides.ꢀPartsꢀ

mounted within 2" from any secure point. Test from 10 – 2,000 Hz.

Mechanical Shock

MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp

andꢀtapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40°Cꢀandꢀmaximumꢀ

storageꢀhumidityꢀnotꢀexceedꢀ70%ꢀrelativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀ

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Construction

Detailed Cross Section

Dielectric Material

(CaZrO₃)

Barrier Layer

(Ni)

Dielectric

Material (CaZrO₃)

End Termination/

External Electrode

(Cu)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Ni)

Capacitor Marking (Optional):

Laserꢀmarkingꢀoptionꢀisꢀnotꢀavailableꢀon:

• C0G, U2J, Ultra Stable X8R, and Y5V dielectric devices

• EIA 0402 case size devices

•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀﬂexibleꢀterminationꢀoption

•ꢀ KPSꢀcommercialꢀandꢀautomotiveꢀgradeꢀstackedꢀdevices

These capacitors are supplied unmarked only.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

ꢒar code laꢈel

Antiꢆstatic reel

®

ꢇmꢈossed plasticꢉ or

punched paper carrierꢃ

Chip and ꢍꢎS orientation in pocꢌet

(eꢋcept 1ꢀ2ꢏ commercial, and 1ꢀ2ꢏ and 222ꢏ Military)

KEMET

Sprocꢌet holes

ꢇmꢈossment or punched cavity

ꢀ mm, 12 mm

or 1ꢁ mm carrier tape

Antiꢆstatic cover tape

(0ꢃ10 mm (0ꢃ00ꢊꢄ) maꢋimum thicꢌness)

1ꢀ0 mm (ꢂꢃ00ꢄ)

or

ꢅꢅ0 mm (1ꢅꢃ00ꢄ)

ꢉꢇꢐA 0100ꢏ, 0201, 0ꢊ02 and 0ꢁ0ꢅ case siꢑes availaꢈle on punched paper carrier onlyꢃ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitchꢀ(P₁)* Pitchꢀ(P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotive grade 7" reel unmarked

Automotive grade 13" reel unmarked

Commercial grade 7" reel unmarked

Commercial grade 13" reel unmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ꢀ1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changesꢀandꢀincreasedꢀe ꢀꢀciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

KPSꢀ1210

8

KPSꢀ1812

and 2220

12

4

12

4

Array 0612

*Refer to Figures 1 and 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance speciﬁcations.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

ꢁ

ꢁ₂

ꢀ₂

(10 pitches cumulative

tolerance on tape ꢎ0ꢈ2 mm)

ꢊ₁

ꢀ₀

ꢉD₀

A₀

ꢂ

ꢅ₀

ꢃ

ꢊ₂

ꢄ₁

ꢄ₀

S₁

ꢀ₁

ꢁ₁

Cover ꢁape

ꢊmꢇossment

ꢂor cavity siꢋe,

see ꢌote 1 ꢁaꢇle ꢍ

Center Lines of Cavity

ꢉD₁

ꢄ₁is for tape feeder reference only,

includinꢆ draft concentric aꢇout ꢄ₀ꢈ

Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5ꢀ+0.10/−0.0ꢀ

(0.059ꢀ+0.004/−0.0)

1.75ꢀ±0.10ꢀ

4.0ꢀ±0.10ꢀ

2.0ꢀ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

E₂

T₂

W

Tape Size

8 mm

Pitchꢀ

F

P₁

A₀,B₀ꢀ&ꢀK₀

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

4.35

(0.171)

3.5ꢀ±0.05ꢀ

(0.138ꢀ±0.002) (0.157ꢀ±0.004)

4.0ꢀ±0.10

8.3

(0.327)

Single (4 mm)

8.2

10.25

5.5ꢀ±0.05ꢀ

8.0ꢀ±0.10

4.6

12.3

12 mm

16 mm

Note 5

and double (8 mm)

(0.323)

(0.404)

(0.217ꢀ±0.002) (0.315ꢀ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5ꢀ±0.05 12.0ꢀ±0.10

(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment

location and the hole location shall be applied independently of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6.)

3. If S₁< 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with suﬃcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been

removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape

(see Figure 4.)

(e) for KPS product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

ꢀ

(10 pitches cumulative

tolerance on tape ꢋ0ꢌ2 mm)

ꢃ₁

ꢁo

ꢂDo

A₀

ꢄ

ꢅ

ꢃ₂

ꢆ₀

ꢁ¹

ꢆottom Cover ꢀape

G

Cavity Siꢇe,

See

ꢀ¹

Center Lines of Cavity

ꢀop Cover ꢀape

ꢈote 1, ꢀaꢉle ꢊ

ꢆottom Cover ꢀape

Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

0.10

1.5ꢀ+0.10ꢀ-0.0ꢀ

(0.059ꢀ+0.004ꢀ-0.0)

1.75ꢀ±0.10ꢀ

(0.069ꢀ±0.004)

4.0ꢀ±0.10ꢀ

(0.157ꢀ±0.004)

2.0ꢀ±0.05ꢀ

(0.079ꢀ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0ꢀ±0.05ꢀ

(0.079ꢀ±0.002)

ꢀ4.0ꢀ±0.10ꢀ

(0.157ꢀ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5ꢀ±0.05ꢀ

(0.138ꢀ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with suﬃcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been

removed.

c) rotation of the component is limited to 20° maximum (see Figure 3.)

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6.)

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ

Tape Width

8 mm

Peel Strength

0.1 to 1.0 newton (10 to 100 gf)

0.1 to 1.3 newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165°ꢀtoꢀ180°ꢀfromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ

300ꢀ±10ꢀmm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

ꢁull ꢂadius,

ꢍ_ꢎ(ꢇncludes

flanꢏe distortion

at outer edꢏe)

Access ꢄole at

Slot Location

(ꢅ ꢆ0 mm minimum)

See ꢀote

ꢍ₂(Measured at huꢐ)

D

(See ꢀote)

A

ꢀ

C

(Arꢐor hole

ꢍ₁(Measured at huꢐ)

diameter)

ꢇf present,

tape slot in core

for tape startꢈ

2ꢉꢊ mm minimum ꢋidth ꢌ

10ꢉ0 mm minimum depth

ꢃ

(see ꢀote)

ꢀoteꢈ Drive spoꢑes optionalꢒ if used, dimensions ꢃ and D shall applyꢉ

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178ꢀ±0.20ꢀ

(7.008ꢀ±0.008)ꢀ

or

1.5

(0.059)

13.0ꢀ+0.5/−0.2ꢀ

(0.521ꢀ+0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

330ꢀ±0.20

(13.000ꢀ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4ꢀ+1.5/−0.0

(0.331ꢀ+0.059/−0.0)

14.4

(0.567)

50

(1.969)

12.4ꢀ+2.0/−0.0

18.4

Shall accommodate tape

width without interference

12 mm

16 mm

(0.488ꢀ+0.078/−0.0)ꢀꢀ

(0.724)

16.4ꢀ+2.0/−0.0

(0.646ꢀ+0.078/−0.0)

22.4

(0.882)

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢅmꢋossed Carrier

Carrier ꢀape

ꢉunched Carrier

ꢊ mm & 12 mm only

ꢂound Sprocꢃet ꢄoles

ꢃTꢄꢅT

ꢀꢁꢂ

ꢀop Cover ꢀape

ꢅlonꢆated Sprocꢃet ꢄoles

(ꢇ2 mm tape and ꢈider)

100 mm

minimum leader

ꢌ00 mm minimum

ꢀrailer

Components

1ꢁ0 mm minimum

ꢀop Cover ꢀape

Figure 8 – Maximum Camber

ꢆlonꢅated Sprocꢂet ꢃoles

(ꢈ2 mm & ꢉider tapes)

Carrier ꢀape

ꢁound Sprocꢂet ꢃoles

1 mm maꢄimum, either direction

Straiꢅht ꢆdꢅe

2ꢇ0 mm

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

KEMET Electronics Corporation Sales Oﬃces

Forꢀaꢀcompleteꢀlistꢀofꢀourꢀglobalꢀsalesꢀo ꢀꢀces,ꢀpleaseꢀvisitꢀwww.kemet.com/sales.

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀ

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given

herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications,ꢀbutꢀareꢀnotꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀ

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes

no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury

or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1086_U2J • 11/8/2018

20


型号：	C0402C152J8JACTU
厂家：	KEMET CORPORATION
描述：	Capacitor, Ceramic, Chip, General Purpose, 1500pF, 6.3V, ±5%, U2J, 0402 (1005 mm), -55º ~ +125ºC, 7" Reel/Unmarked 电容器
文件：	总20页 (文件大小：1401K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C0402C152J8JACTU [KEMET]

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