MCD161-20IO1 [IXYS]

High Voltage Thyristor Module; 高压晶闸管模块
MCD161-20IO1
型号: MCD161-20IO1
厂家: IXYS CORPORATION    IXYS CORPORATION
描述:

High Voltage Thyristor Module
高压晶闸管模块

高压
文件: 总3页 (文件大小:91K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MCC 161  
MCD 161  
ITRMS = 2x300 A  
ITAVM = 2x165 A  
High Voltage Thyristor Module  
VRRM = 2000-2200 V  
3
6 7 1  
5 4 2  
7
MCC  
MCD  
6
VRSM  
VDSM  
VRRM Type  
VDRM  
3
4
2
5
1
V
V
2100 2000 MCC 161-20io1 MCD 161-20io1  
2300 2200 MCC 161-22io1 MCD 161-22io1  
3
1
5 4 2  
Symbol  
Conditions  
Maximum Ratings  
Features  
ITRMS  
ITAVM  
TVJ = TVJM  
TC = 85°C; 180° sine  
300  
165  
A
A
• International standard package  
Direct Copper Bonded Al2O3-ceramic  
base plate  
• Planar passivated chips  
• Isolation voltage 3600 V~  
• UL registered, E 72873  
• Keyed gate/cathode twin pins  
ITSM  
TVJ = 45°C; t = 10 ms (50 Hz)  
VR = 0  
6000  
6400  
A
A
t = 8.3 ms (60 Hz)  
TVJ = TVJM  
;
t = 10 ms (50 Hz)  
t = 8.3 ms (60 Hz)  
5250  
5600  
A
A
VR = 0  
I2dt  
TVJ = 45°C; t = 10 ms (50 Hz)  
180000  
170000  
A2s  
A2s  
Applications  
VR = 0  
t = 8.3 ms (60 Hz)  
• Motor control  
• Power converter  
• Heat and temperature control for  
industrial furnaces and chemical  
processes  
TVJ = TVJM  
VR = 0  
;
t = 10 ms (50 Hz)  
t = 8.3 ms (60 Hz)  
137000  
128000  
A2s  
A2s  
(di/dt)cr  
TVJ = TVJM  
;
repetitive, IT = 500 A  
150  
A/µs  
f = 50 Hz; tP = 200 µs;  
VD = 2/3 VDRM  
IG = 0.5 A;  
;
• Lighting control  
• Contactless switches  
non repetitive, IT = ITAVM  
500  
A/µs  
V/µs  
diG/dt = 0.5 A/µs  
TVJ = TVJM; VDR = 2/3 VDRM  
Advantages  
(dv/dt)cr  
PGM  
1000  
RGK = ; method 1 (linear voltage rise)  
• Space and weight savings  
• Simple mounting  
• Improved temperature and power  
cycling  
TVJ = TVJM  
;
;
tP = 30 µs  
tP = 500 µs  
120  
60  
8
W
W
W
IT = ITAVM  
PGAV  
VRGM  
• Reduced protection circuits  
10  
V
TVJ  
TVJM  
Tstg  
-40...125  
125  
-40...125  
°C  
°C  
°C  
VISOL  
50/60 Hz, RMS; t = 1 min  
IISOL < 1 mA; t = 1 s  
3000  
3600  
V~  
V~  
Md  
Mounting torque (M6)  
Terminal connection torque (M6)  
2.25-2.75  
4.5-5.5  
Nm  
Nm  
Weight  
Typical including screws  
125  
g
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated  
IXYS reserves the right to change limits, test conditions and dimensions  
© 2005 IXYS All rights reserved  
1 - 3  
MCC 161  
MCD 161  
Symbol  
IRRM, IDRM  
VT  
Conditions  
VR = VRRM  
Characteristic Values  
;
TVJ = TVJM  
40  
mA  
V
IT = 300A; TVJ = 25°C  
1.36  
VT0  
rT  
For power-loss calculations only (TVJ = TVJM  
)
0.8  
1.6  
V
mΩ  
VGT  
VD = 6 V; TVJ = 25°C  
TVJ = -40°C  
2
2.6  
V
V
IGT  
VD = 6 V; TVJ = 25°C  
TVJ = -40°C  
150  
200  
mA  
mA  
VGD  
IGD  
VD = 2/3VDRM; TVJ = TVJM  
VD = 2/3VDRM; TVJ = TVJM  
0.25  
10  
V
mA  
IL  
TVJ = 25°C; VD = 6 V; tP = 30 µs  
diG/dt = 0.45 A/µs; IG = 0.45 A  
200  
mA  
IH  
TVJ = 25°C; VD = 6 V; RGK = ∞  
150  
2
mA  
µs  
tgd  
TVJ = 25°C; VD = 1/2 VDRM  
diG/dt = 0.5 A/µs; IG = 0.5 A  
tq  
TVJ = TVJM; VR = 100 V; VD = 2/3VDRM; tP = 200 µs  
dv/dt = 20 V/µs; IT = 160 A; -di/dt = 10A/µs  
typ. 150  
µs  
Fig. 1 Gate trigger characteristics  
QS  
IRM  
TVJ = TVJM  
-di/dt = 50 A/µs; IT = 300 A  
550  
235  
µC  
A
RthJC  
per thyristor; DC current  
per module  
per thyristor; DC current  
per module  
0.155 K/W  
0.078 K/W  
0.225 K/W  
0.113 K/W  
RthJK  
dS  
dA  
a
Creeping distance on surface  
Creepage distance in air  
Maximum allowable acceleration  
12.7 mm  
9.6 mm  
50 m/s2  
Dimensions in mm (1 mm = 0.0394")  
Fig. 2 Gate trigger delay time  
500  
IT,  
A
IF  
400  
350  
300  
250  
200  
150  
100  
50  
TVJ = 125°C  
TVJ = 25°C  
0
0.0  
0.5  
1.0  
1.5  
2.0  
V
Optional accessories for modules  
Keyed gate/cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red  
VT, VF  
Type ZY 180L (L = Left for pin pair 4/5)  
Type ZY 180R (R = right for pin pair 6/7)  
UL 758, style 1385,  
CSA class 5851, guide 460-1-1  
Fig 3: Forward current vs. voltage  
drop per thyristor/diode  
© 2005 IXYS All rights reserved  
2 - 3  
MCC 161  
MCD 161  
106  
A2s  
350  
6000  
50 Hz  
80% VRRM  
I2t  
A
300  
DC  
5000  
A
ITAVM  
,
IFAVM  
ITSM  
,
IFSM  
TVJ  
=
45°C  
200  
150  
100  
50  
TVJ = 45°C  
180° sin  
105  
3000  
2000  
1000  
0
120° rect  
TVJ = 125°C  
60° rect  
30° rect  
TVJ = 125°C  
104  
0
ms  
t
0.001  
0.01  
0.1  
1
1
s
10  
0
25  
50  
75  
°C  
125  
t
TC  
Fig. 4: Surge overload current  
TSM, IFSM = f(t)  
Fig. 5: I2t versus time per diode  
Fig. 6: Max. forward current at case  
temperature ITAVM/FAVM = f (TC,d)  
I
2000  
400  
W
320  
280  
240  
200  
160  
120  
80  
RthKA K/W  
0.02  
RthKA K/W  
W
0.1  
0.2  
0.3  
0.5  
0.8  
1.5  
2
Ptot  
Ptot  
0.04  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
0.06  
0.1  
0.15  
0.20  
0.30  
DC  
180° sin  
120° rect  
60° rect  
30° rect  
40  
0
A
0
100 200 300 400  
IDAVM  
0
25  
50  
75 C125  
TA  
C
0
50 100 150 A250  
IFAVM, ITAVM  
0
25  
50  
75 125  
TA  
Fig. 7: Power dissipation vs. on-state current and ambient  
temperature (per thyristor/diode)  
Fig. 8: Power dissipation vs. direct output current and  
ambient temperature (three phase rectifier bridge)  
0.3  
RthJC for various condition angles:  
d
RthJC (K/W)  
K/W  
DC_  
180°  
120°  
60°  
0.155  
0.171  
0.184  
0.222  
0.294  
0.2  
ZthJC  
30°  
Constants for ZthJC calculation (DC):  
0.1  
30°  
60°  
i
Rthi (K/W)  
ti (s)  
120°  
180°  
DC  
1
2
3
4
5
0.012  
0.008  
0.03  
0.073  
0.032  
0.00014  
0.019  
0.18  
0.52  
1.6  
0.0  
10-3  
10-2  
10-1  
100  
101  
102  
s
t
Fig. 9: Transient thermal impedance junction to case ZthjC  
at various conduction angles  
© 2005 IXYS All rights reserved  
3 - 3  

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