LOC112SE [IXYS]

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型号：	LOC112SE
厂家：	IXYS CORPORATION
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LOC112

Linear Optocoupler

INTEGRATED

CIRCUITS

DIVISION

Parameter

LED Operating Range

Rating

2-10

Units

Description

The LOC112 Single Linear Optocoupler features an

infrared LED optically coupled with two photodiodes.

One feedback (input) photodiode is used to generate

a control signal that provides a servomechanism

to the LED drive current, thus compensating

for the LED's nonlinear time and temperature

characteristics. The other (output) photodiode

provides an output signal that is linear with respect

to the servo LED current. The product features

wide bandwidth, high input to output isolation and

excellent servo linearity.

K3, Transfer Gain

0.733-1.072

3750

Isolation, Input to Output

V_rms

Features

• 0.01% Servo Linearity

• THD -87dB Typical

• Wide Bandwidth (>200kHz)

• Couples Analog and Digital Signals

• High Gain Stability

• Low Input/Output Capacitance

• Low Power Consumption

• 8-Pin Flatpack or DIP Package (PCMCIA

Compatible)

• Machine Insertable, Wave Solderable

• Surface Mount and Tape & Reel Versions Available

• VDE Compatible

Approvals

• UL Recognized Component: File E76270

• CSA Certified Component: Certificate 1175739

• Certified to:

IEC60950 -1: 2005

EN60950 -1: 2006

TUV Certificate B 09 07 49410 006

Applications

Ordering Information

• Modem Transformer Replacement With No

Insertion Loss

Part Number

LOC112

Description

8-Pin DIP (50/Tube)

• Digital Telephone Isolation

• Power Supply Feedback Voltage/Current

• Medical Sensor Isolation

• Audio Signal Interfacing

• Isolation of Process Control Transducers

LOC112P

8-Pin Flatpack (50/Tube)

8-Pin Flatpack (1000/Reel)

8-Pin Surface Mount (50/tube)

8-Pin Surface Mount (1000/Reel)

LOC112PTR

LOC112S

LOC112STR

K3 Sorted Bins

Bin D = 0.733 - 0.805

Bin E = 0.806 - 0.886

Bin F = 0.887 - 0.974

Bin G = 0.975 - 1.072

•

The LOC112 will be shipped using bins available at date of

order. Any bin (D - G) can be shipped. Each tube or reel will

contain one K3-sorted bin. Each device will be marked with the

designated bin.

Pin Configuration

- LED

N/C

+ LED

N/C

e₃

DS-LOC112-R05

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LOC112

INTEGRATED

CIRCUITS

DIVISION

Absolute Maximum Ratings @ 25ºC

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Parameter

Ratings

Units

Reverse LED Voltage

Input Control Current

Peak (10ms)

100

Input Power Dissipation¹

Total Package Dissipation²

Isolation Voltage, Input to Output

Operational Temperature

Storage Temperature

150

V_rms

°C

500

3750

-40 to +85

-40 to +125

°C

Derate linearly 1.33 mW / °C

Derate linearly 6.67 mW / °C

Electrical Characteristics @ 25ºC

Parameter

Conditions

Symbol Min

Typ

Max

Units

Input Characteristics

LED Voltage Drop

I_F= 2 - 10mA

V_R= 5V

V_F

I_R

0.9

1.2

1.4

Reverse LED Current

Coupler/Detector Characteristics

Dark Current

A

I_F=0mA, V_C1-A1=V_C2-A2=15V

I_D

0.007

0.030

1.072

K1, Servo Gain (I_C1/I_F)

K2, Forward Gain (I_C2/I_F)

0.004

I_F=2 - 10mA, V_C1-A1=V_C2-A2=15V

0.004

K3, Transfer Gain (K2/K1=I_C2/I_C1

)

0.733

K3, Transfer Gain Linearity (non-servoed)

K3 Temperature Coefficient

I_F=2 - 10mA

I_F=2 - 10mA, V_C1-A1=V_C2-A2= 5V

V=20V_P-P, R_L=2k, f=100Hz

f₀=350Hz, 0dBm

K3

K3/T

CMRR

THD

0.005

130

-87

200

% / ºC

Common-Mode Rejection Ratio

Total Harmonic Distortion

Frequency Response ¹

-96

-80

Photoconductive Configuration

Photovoltaic Configuration

f_-3dB

C_I/O

kHz

Input/Output Capacitance

¹Refer to Application Note, AN-107, for LOC112 configurations.

R05

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LOC112

INTEGRATED

CIRCUITS

DIVISION

PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

LED Forward Current

vs. LED Forward Voltage

LED Forward Current

vs. LED Forward Voltage

Typical LED Forward Voltage Drop

vs.Temperature

1.6

1.5

1.4

1.3

1.2

1.1

1.0

100

I_F=50mA

I_F=20mA

I_F=10mA

I_F=5mA

I_F=2mA

I_F=1mA

0.1

0.01

1.0

1.1

1.2

1.3

1.4

1.5

1.0

1.1

1.2

1.3

1.4

1.5

-40

-20

100

LED Forward Voltage (V)

Temperature (ºC)

LED Forward Voltage (V)

Servo Gain

vs. LED Current & Temperature

Servo-Photocurrent

vs. LED Current & Temperature

Normalized Servo-Photocurrent

vs. LED Current & Temperature

0.016

0.012

0.008

0.004

0.000

140

120

100

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0ºC

25ºC

0ºC

25ºC

50ºC

70ºC

85ºC

50ºC

70ºC

85ºC

50ºC

70ºC

85ºC

LED Current (mA)

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁcations, please

contact our application department.

R05

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LOC112

INTEGRATED

CIRCUITS

DIVISION

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Rating

LOC112 / LOC112P / LOC112S

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device

MaximumTemperature xTime

LOC112 / LOC112S

LOC112P

250ºC for 30 seconds

260ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

e₃

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LOC112

INTEGRATED

CIRCUITS

DIVISION

Mechanical Dimensions

LOC112

9.652 0.381

(0.380 0.015)

PCB Hole Pattern

7.620 0.254

(0.300 0.010)

2.540 0.127

(0.100 0.005)

8-0.800 DIA.

2.540 0.127

(8-0.031 DIA.)

(0.100 0.005)

9.144 0.508

(0.360 0.020)

6.350 0.127

(0.250 0.005)

6.350 0.127

(0.250 0.005)

3.302 0.051

Pin 1

0.457 0.076

(0.018 0.003)

(0.130 0.002)

7.620 0.127

(0.300 0.005)

7.239 TYP.

(0.285)

7.620 0.127

(0.300 0.005)

4.064 TYP

(0.160)

0.254 0.0127

(0.010 0.0005)

Dimensions

0.813 0.102

(0.032 0.004)

(inches)

LOC112P

2.286 MAX.

(0.090 MAX.)

PCB Land Pattern

0 MIN / 0.102 MAX

(0 MIN / 0.004 MAX)

2.540 0.127

(0.100 0.005)

2.54

(0.10)

0.635 0.127

(0.025 0.005)

7.620 0.254

(0.300 0.010)

6.350 0.127

(0.250 0.005)

9.398 0.127

(0.370 0.005)

8.70

(0.3425)

1.55

(0.0610)

Pin 1

0.203 0.013

(0.008 0.0005)

9.652 0.381

(0.380 0.015)

0.65

(0.0255)

2.159 0.025

(0.085 0.001)

0.457 0.076

(0.018 0.003)

Dimensions

0.864 0.120

(0.034 0.004)

(inches)

LOC112S

9.652 0.381

(0.380 0.015)

PCB Land Pattern

0.635 0.127

(0.025 0.005)

2.540 0.127

(0.100 0.005)

3.302 0.051

(0.130 0.002)

2.54

(0.10)

9.525 0.254

(0.375 0.010)

6.350 0.127

(0.250 0.005)

8.90

(0.3503)

1.65

(0.0649)

7.620 0.254

(0.300 0.010)

Pin 1

0.457 0.076

(0.018 0.003)

0.254 0.0127

(0.010 0.0005)

0.65

(0.0255)

4.445 0.127

(0.175 0.005)

Dimensions

(inches)

0.813 0.102

(0.032 0.004)

R05

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LOC112

INTEGRATED

CIRCUITS

DIVISION

LOC112PTR Tape & Reel

2.00

(0.079)

4.00

(0.157)

330.2 DIA.

(13.00 DIA.)

W = 16.00

(0.63)

7.50

(0.295)

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

Bo = 10.30

(0.406)

P = 12.00

(0.472)

Ao = 10.30

(0.406)

K₀= 2.70

(0.106)

Dimensions

(inches)

K₁= 2.00

(0.079)

User Direction of Feed

Embossed Carrier

NOTES:

1. All dimensions carry tolerances of EIA Standard 481-2

2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

Embossment

LOC112STR Tape & Reel

330.2 DIA.

(13.00 DIA.)

W=16.00

(0.63)

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

Bo=10.30

(0.406)

Ao=10.30

(0.406)

P=12.00

(0.472)

K₀=4.90

(0.193)

K₁=4.20

(0.165)

User Direction of Feed

Dimensions

Embossed Carrier

(inches)

NOTES:

1. Dimensions carry tolerances of EIA Standard 481-2

Embossment

2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to

its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-LOC112-R05

12/19/2012

LOC112SE [IXYS]

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