CPC2317N [IXYS]
Dual Single-Pole 8-Pin SOIC OptoMOS® Relay; 双路单刀8引脚SOIC OptoMOS®继电器
| 型号： | CPC2317N |
| 厂家： | 
IXYS CORPORATION |
| 描述： | Dual Single-Pole 8-Pin SOIC OptoMOS® Relay |
| 文件： | 总7页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPC2317N
Dual Single-Pole
8-Pin SOIC OptoMOS® Relay
INTEGRATED
CIRCUITS
DIVISION
Description
The CPC2317N is a miniature device with one
independent normally open (1-Form-A) solid state
relay and one independent normally closed
(1-Form-B) solid state relay in an 8-pin SOIC package.
It employs optically coupled MOSFET technology to
provide 1500Vrms of input/output isolation.
Parameter
Blocking Voltage
Load Current
Rating
Units
60
120
16
1
VP
mArms / mADC
On-Resistance (max)
LED Current to operate
mA
Features
The optically coupled outputs, which use IXYS
Integrated Circuits Division's patented OptoMOS
architecture, are controlled by a highly efficient
GaAIAs infrared LED.
• 1500Vrms Input/Output Isolation
• TTL/CMOS Compatible input
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to radiated EM fields
• SMD Pick & Place, Wave Solderable
• Small 8-Pin SOIC Package
This device uses IXYS Integrated Circuits Division’s
state of the art, double-molded vertical construction
packaging to produce one of the world’s smallest
relays. It is ideal for replacing larger, less-reliable reed
and electromechanical relays.
• Tape & Reel Version Available
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
Ordering Information
Part #
CPC2317N
Description
8-Pin SOIC (50/tube)
• Industrial Controls
CPC2317NTR
8-Pin SOIC (2000/reel)
Pin Configuration
Switching Characteristics of
Normally Open
Switching Characteristics of
Normally Closed
1
2
3
4
8
7
6
5
+ Control
Load
Form-B - Normally Closed
(Form-A) Devices
(Form-B) Devices
Form-A
Form-B
IF
– Control
+ Control
Load
IF
ILOAD
Load
90%
90%
10%
10%
ILOAD
Form-A - Normally Open
Load
t
t
on
t
t
off
on
off
– Control
Pb
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DS-CPC2317N-R03
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CPC2317N
INTEGRATED
CIRCUITS
DIVISION
Absolute Maximum Ratings @ 25°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Blocking Voltage
Ratings
60
Units
VP
Reverse Input Voltage
5
50
V
Input Control Current
Peak (10ms)
mA
A
1
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
600
mW
Vrms
°C
1500
-40 to +85
-40 to +125
260
°C
Soldering Temperature (10 Seconds)
°C
1
Derate linearly 5mW / ºC
Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics
Load Current
Normally Open (Form-A) Continuous 1
Normally Closed (Form-B) Continuous 1
Peak
IF=1mA
IF=0mA
IL
-
-
120
mArms / mADC
t =10ms
IL=120mA
ILPK
RON
-
-
-
-
350
16
mAP
On-Resistance 2
Switching Speeds
Turn-On
ton
toff
-
-
-
-
-
-
3
3
1
IF=5mA, VL=10V
VL=60VP
ms
µA
Turn-Off
Off-State Leakage Current
Output Capacitance
Normally Open (Form-A)
ILEAK
IF=0mA, VL=50V, f=1MHz
IF=5mA, VL=50V, f=1MHz
COUT
-
25
-
pF
Normally Closed (Form-B)
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
IL=100mA
-
IF
IF
-
0.40
0.35
1.2
-
1
-
mA
mA
V
0.1
0.9
-
IF=5mA
VR=5V
VF
IR
1.4
10
Reverse Input Current
µA
Common Characteristics
Capacitance, Input to Output
-
-
-
1
-
pF
1
2
3
Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended.
R03
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CPC2317N
INTEGRATED
CIRCUITS
DIVISION
COMMON PERFORMANCE DATA*
Typical Blocking Voltage Distribution
(N=50,TA=25ºC)
(Form-A IF=0mA, Form-B IF=2mA)
Typical LED Forward Voltage Drop
(N=50, IF=5mA,TA=25ºC)
Typical IF for Switch Operation
(N=50, IL=100mA,TA=25ºC)
35
30
25
20
15
10
5
35
30
25
20
15
10
5
25
20
15
10
5
0
0
0
80
82
84
86
88
90
92
1.17
1.19
1.21
1.23
1.25
0.30 0.35 0.40 0.45 0.50 0.55 0.60
LED Forward Voltage Drop (V)
Blocking Voltage (VP)
LED Current (mA)
Typical IF for Switch Operation
vs.Temperature
Maximum Load Current
vs.Temperature
(Form-A IF=2mA, Form-B IF=0mA)
Typical LED Forward Voltage Drop
vs.Temperature
(IL=80mA)
3.0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
130
120
110
100
90
IF=50mA
IF=20mA
IF=10mA
2.5
2.0
1.5
1.0
0.5
0
80
IF=5mA
IF=2mA
IF=1mA
70
60
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Blocking Voltage vs.Temperature
(N=50,TA=25ºC)
(Form-A IF=0mA, Form-B IF=2mA)
Energy Rating Curve
91
1.0
0.8
0.6
0.4
0.2
0.0
89
87
85
83
81
79
77
-40
-20
0
20
40
60
80
100
10Ps 100Ps 1ms 10ms 100ms 1s
10s 100s
Temperature (ºC)
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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CPC2317N
INTEGRATED
CIRCUITS
DIVISION
FORM-A PERFORMANCE DATA*
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA,TA=25ºC)
Typical On-Resistance Distribution
(N=50, IL=100mA,TA=25ºC)
Typical Turn-Off Time
(N=50, IL=100mA, IF=5mA,TA=25ºC)
25
20
15
10
5
25
35
30
25
20
15
10
5
20
15
10
5
0
0
0
6.8
6.9
7.0
7.1
7.2
7.4
1.0
1.1
1.2
1.3
1.4
1.5
1.6
0.26 0.28 0.30 0.32 0.34 0.36 0.38
7.3
On-Resistance (:)
Turn-On (ms)
Turn-Off (ms)
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=5mA)
Typical Turn-On vs. LED Forward Current
(IL=100mA)
Typical Turn-Off vs. LED Forward Current
(IL=100mA)
150
100
50
3.0
0.7
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.6
0.5
0.4
0.3
0.2
0
-50
-100
-150
0.1
0
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
0
5
10 15 20 25 30 35 40 45 50
0
5
10 15 20 25 30 35 40 45 50
Load Voltage (V)
LED Forward Current (mA)
LED Forward Current (mA)
Typical Turn-Off vs.Temperature
(IL=50mA)
Typical On-Resistance vs.Temperature
(IL=Max Rated @ Temperature)
Typical Turn-On vs.Temperature
(IL=50mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
3.5
3.0
2.5
2.0
1.5
1.0
14
12
10
8
IF=2mA
IF=5mA
IF=2mA
IF=5mA
Steady State
Instantaneous
IF=5mA
IF=5mA
IF=2mA
6
4
2
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Leakage vs.Temperature
(Measured Across Pins 5&6)
(IF=0mA, VL=60V)
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
4
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CPC2317N
INTEGRATED
CIRCUITS
DIVISION
FORM-B PERFORMANCE DATA*
Typical Turn-Off Time
(N=50, IF=2mA, IL=150mA,TA=25ºC)
Typical Turn-On Time
(N=50, IF=2mA, IL=150mA,TA=25ºC)
Typical On-Resistance Distribution
(N=50, IL=150mA,TA=25ºC)
25
25
20
15
10
5
35
30
25
20
15
10
5
20
15
10
5
0
0
0
0.30 0.32 0.34 0.36 0.38 0.40 0.42
0.28 0.30 0.32 0.34 0.36 0.38 0.40
5.0
5.1
5.2
5.3
5.4
5.5
5.6
Turn-Off (ms)
Turn-On (ms)
On-Resistance (:)
Typical Load Current vs. Load Voltage
(TA=25ºC)
Typical Turn-On vs. LED Forward Current
(TA=25ºC, IL=50mA)
Typical Turn-Off vs. LED Forward Current
(TA=25ºC, IL=50mA)
0.7
150
100
50
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.6
0.5
0.4
0.3
0.2
0.1
0
0
-50
-100
-150
0
5
10 15 20 25 30 35 40 45 50
0
5
10 15 20 25 30 35 40 45 50
-1.00 -0.66 -0.33
0
0.33
0.66
1.00
LED Forward Current (mA)
LED Forward Current (mA)
Load Voltage (V)
Typical Turn-On vs.Temperature
(IF=2mA, IL=50mA)
Typical Turn-Off vs.Temperature
(IF=2mA, IL=50mA)
Typical On-Resistance vs.Temperature
(IF=0mA, IL=150mA)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
8
7
6
5
4
3
2
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Leakage vs.Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
www.ixysic.com
5
CPC2317N
INTEGRATED
CIRCUITS
DIVISION
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC2317N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
MaximumTemperature xTime
CPC2317N
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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R03
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CPC2317N
INTEGRATED
CIRCUITS
DIVISION
MECHANICAL DIMENSIONS
CPC2317N
1.016 ± 0.025
(0.040 ± 0.001)
0.203 ± 0.025
(0.008 ± 0.001)
PCB Land Pattern
9.347 ± 0.203
(0.368 ± 0.008)
5.60
(0.22)
1.30
Pin 1
(0.051)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
0.432 ± 0.127
(0.017 ± 0.005)
2.54
(0.100)
0.55
(0.022)
2.184 MAX
(0.086 MAX)
Lead to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
Dimensions
mm
(inches)
0.838 ± 0.102
(0.033 ± 0.004)
0.381 ± 0.051
(0.015 ± 0.002)
CPC2317NTR Tape & Reel
1.75 0.10
4.00 0.10
8.00 0.10
330.2 DIA.
(13.00 DIA.)
2.00 0.10
7.50 0.10
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.20
Ø1.50
+0.1, -0
6.50 9.65 0.10
16.00 0.30
Embossed Carrier
3.50
6.55 0.10
Ø1.50 MIN
Embossment
2.35 0.10
2.85 0.10
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance 0.20.
3. Carrier camber is within 1mm in 250mm.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 0.05mm.
7. Component load per 13” reel : 2000 pcs.
4. Tape material : Black Conductive Polystyrene Alloy.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC2317N-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012
7
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