ISP817AXSMT/R [ISOCOM]
OPTOISO 5.3KV TRANS 4SMD;型号: | ISP817AXSMT/R |
厂家: | ISOCOM COMPONENTS |
描述: | OPTOISO 5.3KV TRANS 4SMD |
文件: | 总15页 (文件大小:6822K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISOCOM
COMPONENTS
DESCRIPTION
The ISP817, ISP827 and ISP847 series of optically
coupled isolator consist of an infrared light emitting
diode and an NPN silicon photo transistor in a space
efficient Dual In Line Plastic Package.
ISP817
ISP827
ISP847
FEATURES
•
•
•
AC Isolation Voltage 5300VRMS
CTR Selections Available
Wide Operating Temperature Range
-55°C to +110°C
-30°C to +100°C
ISP817
ISP827 / ISP847
•
•
•
Lead Free and RoHS Compliant
UL File E91231 Package Code “EE”
VDE Approval Certificate No. 40028086
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
•
•
•
•
Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems of
Different Potentials and Impedances
Input
Forward Current
50mA
1A
ORDER INFORMATION
Peak Forward Current
Pulse 100µs, Frequency 100Hz
•
•
•
•
Add X after PN for VDE Approval
Add G after PN for 10mm lead spacing
Add SM after PN for Surface Mount
Add SMT&R after PN for Surface Mount
Tape & Reel
Reverse Voltage
Power dissipation
6V
70mW
Output
Collector to Emitter Voltage VCEO
(Available for ISP817SM and ISP827SM)
Consult Factory for Tape and Reel version of
ISP847SM
ISP817 80V
ISP827 / ISP847 35V
•
Emitter to Collector Voltage VECO
6V
Collector Current
Power Dissipation
50mA
150mW
Total Package
Isolation Voltage
5300VRMS
200mW
Total Power Dissipation
Operating Temperature
ISP817 -55 to 110 °C
ISP827 / ISP847 -30 to 100 °C
-55 to 125 °C
Storage Temperature
Lead Soldering Temperature (10s)
260°C
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
http://www.isocom.com
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ISOCOM
COMPONENTS
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
Parameter
Forward Voltage
Symbol
Test Condition
IF = 20mA
Min
Typ.
Max
1.4
Unit
V
VF
IR
1.2
Reverse Leakage
Terminal Capacitance
VR = 4V
10
µA
pF
Ct
V = 0V, f = 1KHz
30
250
OUTPUT
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Collector−Emitter
BVCEO
IC = 0.1mA, IF = 0mA
V
Breakdown Voltage
ISP817
80
35
6
ISP827 / ISP847
IE = 10µA, IF = 0mA
Emitter−Collector
Breakdown Voltage
BVECO
ICEO
V
Collector−Emitter
VCE = 20V, IF = 0mA
100
nA
Dark Current
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COMPONENTS
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
COUPLED
Parameter
Symbol
Test Condition
IF = 5mA, VCE = 5V
Min
Typ.
Max
Unit
Current Transfer Ratio
CTR
50
600
%
Optional CTR Grades
GB
BL
A
B
C
100
200
80
130
200
300
600
600
160
260
400
600
D
Collector−Emitter
VCE(sat)
IF = 20mA, IC = 1mA
0.1
0.2
V
Saturation Voltage
Floating Capacitance
Cut-Off Frequency
Cf
fc
V = 0V, f = 1MHz
0.6
80
1
pF
VCE = 5V, IC = 2mA,
RL = 100Ω,
-3dB
kHz
Output Rise Time
Output Fall Time
tr
tf
VCE = 2V,
Ic = 2mA,
RL = 100Ω
4
3
18
18
µs
ISOLATION
Parameter
Symbol
Test Condition
Min
Typ.
Max
Unit
Input to Output
Isolation Voltage
VISO
AC 1 minute, RH = 40% to 60%
Note 1
5300
VRMS
Input to Output
Isolation Resistance
RISO
VIO= 500V, RH = 40% to 60%
Note 1
5x1010
1x1011
Ω
Note 1 : Measure with input leads shorted together and output leads shorted together.
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COMPONENTS
ISP817
ISP817
Fig 1 Forward Current vs Ambient Temperature (1)
Fig 2 Collector Power Dissipation vs
Ambient Temperature (1)
ISP827 / ISP847
ISP827 / ISP847
Fig 3 Forward Current vs Ambient Temperature (2)
Fig 4 Collector Power Dissipation vs
Ambient Temperature (2)
Fig 5 Forward Current vs Forward Voltage
Fig 6 Collector Current vs
Collector-Emitter Voltage
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COMPONENTS
Fig 7 Normalized Current Transfer Ratio vs
Forward Current
Fig 8 Normalized Current Transfer Ratio vs
Ambient Temperature
Fig 9 Collector-Emitter Voltage vs Forward Current
Fig 10 Collector-Emitter Saturation Voltage vs
Ambient Temperature
Fig 11 Collector Dark Current vs
Ambient Temperature
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COMPONENTS
Fig 12 Response Time vs Load Resistance
Response Time Test Circuit
Fig 13 Frequency Response
Frequency Response Test Circuit
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COMPONENTS
ORDER INFORMATION
ISP817 (UL Approval)
After PN
PN
Description
Packing quantity
None
ISP817, ISP817GB, ISP817BL,
ISP817A, ISP817B,
Standard DIP4
100 pcs per tube
ISP817C, ISP817D
G
ISP817G, ISP817GBG, ISP817BLG,
ISP817AG, ISP817BG,
ISP817CG, ISP817DG
10mm Lead Spacing
Surface Mount
100 pcs per tube
100 pcs per tube
1000 pcs per reel
SM
ISP817SM, ISP817GBSM, ISP817BLSM,
ISP817ASM, ISP817BSM,
ISP817CSM, ISP817DSM
SMT&R
ISP817SMT&R,
Surface Mount Tape & Reel
ISP817GBSMT&R, ISP817BLSMT&R,
ISP817ASMT&R, ISP817BSMT&R,
ISP817CSMT&R, ISP817DSMT&R
ISP827 (UL Approval)
After PN
PN
Description
Packing quantity
None
ISP827, ISP827GB, ISP827BL,
ISP827A, ISP827B,
Standard DIP8
50 pcs per tube
ISP827C, ISP827D
G
ISP827G, ISP827GBG, ISP827BLG,
ISP827AG, ISP827BG,
ISP827CG, ISP827DG
10mm Lead Spacing
Surface Mount
50 pcs per tube
50 pcs per tube
1000 pcs per reel
SM
ISP827SM, ISP827GBSM, ISP827BLSM,
ISP827ASM, ISP827BSM,
ISP827CSM, ISP827DSM
SMT&R
ISP827SMT&R,
Surface Mount Tape & Reel
ISP827GBSMT&R, ISP827BLSMT&R,
ISP827ASMT&R, ISP827BSMT&R,
ISP827CSMT&R, ISP827DSMT&R
ISP847 (UL Approval)
Description
After PN
PN
Packing quantity
None
ISP847, ISP847GB, ISP847BL,
ISP847A, ISP847B,
Standard DIP16
25 pcs per tube
ISP847C, ISP847D
G
ISP847G, ISP847GBG, ISP847BLG,
ISP847AG, ISP847BG,
ISP847CG, ISP847DG
10mm Lead Spacing
Surface Mount
25 pcs per tube
25 pcs per tube
SM
ISP847SM, ISP847GBSM, ISP847BLSM,
ISP847ASM, ISP847BSM,
ISP847CSM, ISP847DSM
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COMPONENTS
ORDER INFORMATION
ISP817X (UL and VDE Approvals)
After PN
PN
Description
Packing quantity
None
ISP817X, ISP817XGB, ISP817XBL,
ISP817XA, ISP817XB,
Standard DIP4
100 pcs per tube
ISP817XC, ISP817XD
G
ISP817XG, ISP817XGBG, ISP817XBLG,
ISP817XAG, ISP817XBG,
ISP817XCG, ISP817XDG
10mm Lead Spacing
Surface Mount
100 pcs per tube
100 pcs per tube
SM
ISP817XSM,
ISP817XGBSM, ISP817XBLSM,
ISP817XASM, ISP817XBXSM,
ISP817XCSM, ISP817XDSM
SMT&R
ISP817XSMT&R,
Surface Mount Tape & Reel
1000 pcs per reel
ISP817XGBSMT&R, ISP817XBLSMT&R,
ISP817XASMT&R, ISP817XBSMT&R,
ISP817XCSMT&R, ISP817XDSMT&R
ISP827X (UL and VDE Approvals)
After PN
PN
Description
Packing quantity
None
ISP827X, ISP827XGB, ISP827XBL,
ISP827XA, ISP827XB,
Standard DIP8
50 pcs per tube
ISP827XC, ISP827XD
G
ISP827XG, ISP827XGBG, ISP827XBLG,
ISP827XAG, ISP827XBG,
ISP827XCG, ISP827XDG
10mm Lead Spacing
Surface Mount
50 pcs per tube
50 pcs per tube
SM
ISP827XSM,
ISP827XGBSM, ISP827XBLSM,
ISP827XASM, ISP827XBSM,
ISP827XCSM, ISP827XDSM
SMT&R
ISP827XSMT&R,
Surface Mount Tape & Reel
1000 pcs per reel
ISP827XGBSMT&R, ISP827XBLSMT&R,
ISP827XASMT&R, ISP827XBSMT&R,
ISP827XCSMT&R, ISP827XDSMT&R
ISP847 (UL and VDE Approvals)
Description
After PN
PN
Packing quantity
None
ISP847X, ISP847XGBL, ISP847XBL,
ISP847XA, ISP847XB,
Standard DIP16
25 pcs per tube
ISP847XC, ISP847XD
G
ISP847XG, ISP847XGBG, ISP847XBLG,
ISP847XAG, ISP847XBG,
ISP847XCG, ISP847XDG
10mm Lead Spacing
Surface Mount
25 pcs per tube
25 pcs per tube
SM
ISP847XSM,
ISP847XGBSM, ISP847XBLSM,
ISP847XASM, ISP847XBSM,
ISP847XCSM, ISP847XDSM
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COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
DIP
ISP817
ISP827
ISP847
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COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
G Form
ISP817
ISP827
ISP847
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COMPONENTS
PACKAGE DIMENSIONS in mm (inch)
SMD
ISP817
ISP827
ISP847
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COMPONENTS
RECOMMENDED PAD LAYOUT FOR SMD (mm)
ISP817SM
ISP827SM
ISP847SM
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COMPONENTS
TAPE AND REEL PACKAGING
ISP817SMT&R
ISP827SMT&R
Dimension
mm (inch)
Description
Symbol
Tape Width
W
P0
16 ± 0.3 (0.63)
4 ± 0.1 (0.15)
Pitch of Sprocket Holes
F
7.5 ± 0.1 (0.295)
Distance of Compartment to Sprocket Holes
Distance of Compartment to Compartment
P2
P1
2 ± 0.1 (0.079)
12 ± 0.1 (0.472)
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COMPONENTS
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD
One Time Reflow Soldering is Recommended.
Do not immerse device body in solder paste.
260°C
TP
TP - 5°C
tP
Max Ramp Down Rate
6°C/s
Max Ramp Up Rate
3°C/s
217°C
200°C
TL
TL
Tsmax
150°C
Tsmin
ts Preheat
60s – 120s
25°C
TIME (s)
Time 25°C to Peak Temperature
Profile Details
Conditions
Preheat
- Min Temperature (TSMIN
)
150°C
- Max Temperature (TSMAX
)
200°C
- Time TSMIN to TSMAX (ts)
60s - 120s
Soldering Zone
- Peak Temperature (TP)
260°C
- Time at Peak Temperature
- Liquidous Temperature (TL)
10s max
217°C
- Time within 5°C of Actual Peak Temperature (TP
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
̶
5°C)
30s max
60s - 100s
3°C/s max
6°C/s max
- Ramp Down Rate (TP to TL)
Average Ramp Up Rate (Tsmax to TP)
Time 25°C to Peak Temperature
3°C/s max
8 minutes max
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COMPONENTS
Isocom Components is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing Isocom Components products, to comply with the standards of safety in making
a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such Isocom Components products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that Isocom Components products are used within
specified operating ranges as set forth in the most recent Isocom Components products
specifications.
The Isocom Components products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These Isocom Components
products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss
of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation Instruments, traffic
signal instruments, combustion control instruments, medical Instruments, all types of safety
devices, etc... Unintended Usage of Isocom Components products listed in this document
shall be made at the customer’s own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
The products described in this document are subject to the foreign exchange and foreign trade
laws.
The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by Isocom Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of Isocom
Components or others.
The information contained herein is subject to change without notice.
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