SSL-L10TPB330M [INTERSIL]
ISL8225MEVAL2Z 6-Phase, 90A Evaluation Board Setup Procedure; ISL8225MEVAL2Z 6相， 90A评估板设置步骤
| 型号： | SSL-L10TPB330M |
| 厂家： | 
Intersil |
| 描述： | ISL8225MEVAL2Z 6-Phase, 90A Evaluation Board Setup Procedure |
| 文件： | 总12页 (文件大小：4505K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Application Note 1789
ISL8225MEVAL2Z 6-Phase, 90A Evaluation Board Setup
Procedure
The ISL8225M is a complete, dual step-down switching mode
Recommended Equipment
DC/DC module. The dual outputs can easily be paralleled for
• 0V to 20V power supply with at least 10A source current
single-output, high-current use. It is easy to apply this
capability
high-power, current-sharing DC/DC power module to
• Electronic load capable of sinking current up to 90A
(multiple electronic current loads can be used in parallel to
sink more current)
power-hungry datacom, telecom, and FPGA applications. All
that is needed in order to have a complete, dual 15A design
ready for use are the ISL8225M, a few passive components,
and VOUT setting resistors.
• Digital multimeters (DMMs)
• 100MHz quad-trace oscilloscope
The ease of use virtually eliminates design and manufacturing
risks while dramatically improving time to market. Need more
output current? Simply parallel up to six ISL8225M modules to
scale up to an 180A solution.
Quick Start
The inputs are J3 (VIN) and J4 (GND). The outputs are J1 and
J5 (VOUT), J2 and J6 (GND) and J6 (VOUT2). Please refer to
Figure 1. This 90A evaluation board can be easily modified to
30A (one module) or 60A (two modules) operation.
The ISL8225M has a thermally enhanced, compact QFN
package that operates at full load and over-temperature
without requiring forced-air cooling. Easy access to all pins,
with few external components, reduces PCB design to a
component layer and a simple ground layer.
1. Connect a power supply capable of sourcing at least 10A to
the input (VIN J3 & GND J4) of the ISL8225MEVAL2Z
evaluation board, with a voltage between 4.5V to 20V.
Connect an electronic load or the device to be powered to
the output (VOUT (J1, J5) & GND (J2, J6)) of the board. All
connections, especially the low voltage, high current VOUT
lines, should be able to carry the desired load current and
should be made as short as possible. Duplicated tab
connections on VOUT (J1, J5) and GND (J2, J6) to carry large
current.
The ISL8225MEVAL2Z evaluation board allows for a single
6-phase paralleled output, which delivers high current up to
90A. The input voltage is 4.5V to 20V and the default output
voltage on this board is set at 1.2V. The current level for this
board is 90A with no extra cooling required.
Related Resources
2. Ensure the jumpers for EN2 and EN3 are in the “ON”
position and EN is open. Turn on the power supply. If the
board is working properly, the green LED will illuminate; if
not, the red LED will illuminate (recheck the wire/jumper
See how-to
video at
intersil.com/
evid02
connections in this case). Measure the output voltage, VOUT
,
which should be at 1.2V.
3. The ISL8225MEVAL2Z is manufactured with a VOUT default
value of 1.2V; if different output voltages are desired, board
resistors can be exchanged to provide the desired VOUT. Please
refer to Table 1 on page 2 for R2/R64 resistor values, which
can be used to produce different output voltages.
+
-
+
-
+
LOAD
(0A~90A)
NOTE 1
4.5V TO 20V
V
V
IN
V
V
OUT
-
NOTE:
1. Multiple loads can be paralleled to
reach 90A (i.e. Two 45A loads
paralleled together).
FIGURE 1. ISL8225MEVAL2Z BOARD IMAGE
December 3, 2012
AN1789.0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright Intersil Americas Inc. 2012. All Rights Reserved.
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
Application Note 1789
For 12V VIN and VOUT more than 1.5V, the switching frequency
Evaluation Board Information
will need to be adjusted, as shown in Table 1. The resistor RFSET
can be adjusted for the desired frequency. No frequency
adjustments are necessary for VOUT below 1.5V. For 5V VIN, the
frequency does not need to be adjusted and the module default
frequency can be used at any allowed VOUT. If the output voltage
is set to more than 1.8V, the output current will need to be
derated to allow for safe operation. Please refer to the derating
curves in the ISL8225M datasheet.
The evaluation board size is 150mm x 130mm. It is a 6-layer
board, containing 2-ounce copper on the top and bottom layers
and 1-ounce copper on all internal layers. The board can be used
as a 90A reference design. Refer to the “Layout” section
beginning on page 7. The board is made of FR4 material and all
components, including the solder attachment, are lead-free.
Current Sharing Check
TABLE 1. VALUE OF BOTTOM RESISTOR FOR DIFFERENT OUTPUT
VOLTAGES (R1 = 1k)
The evaluation board allows the user to measure the current
sharing accuracy. Four zero ohm resistors (i.e. R59~R62 for M1
channel 2 in Figure 2) are put serially on each output with two on
each side of the evaluation board. To measure the output current
of each phase, please remove all four resistors and put looped
wires or sensing resistors on correct positions.
VOUT
(V)
R2 /R64
FREQUENCY
(kHz)
RFSET (Ω)
(VIN = 12V)
(Ω)
0.6
0.8
1.0
1.2
1.5
2.5
3.3
5.0
5.5
0/0
Default
Default
Default
Default
Default
650
Default
Default
Default
Default
Default
249k
3010/1500
1500750
1000/500
665/332
316/158
221/110
137/68.1
121/60.4
Although the assembled resistors have zero resistance, there is
still small resistance (< 50mΩ) on each resistor. At large output
current, the efficiency can be decreased by 1~3% due to the
power loss on those zero ohm resistors. The efficiency curves are
shown in Figures 16 and 17 with zero ohm resistors, while
Figures 18 and 19 show the efficiency curves by replacing those
resistors with short copper straps.
800
124k
Thermal Considerations and Current Derating
950
82.5k
For high current applications, board layout is very critical in order
to make the module operate safely and deliver maximum
allowable power. To carry large currents, the board layout needs
to be designed carefully to maximize thermal performance. To
achieve this, select enough trace width, copper weight and the
proper connectors.
950
82.5k
Board Setting
If low current applications are needed, this 90A evaluation board
can be easily programmed to 30A and 60A use.
This evaluation board is designed for running 90A @ 1.2V at
room temperature without additional cooling systems needed.
However, if the output voltage is increased or the board is
operated at elevated temperatures, then the available current is
derated. Refer to the derated current curves in the datasheet to
determine the output current available.
30A Application (1 Module)
EN -- Open, EN2-- OFF, EN3 -- OFF
In this mode, only module 1 is running and modules 2 and 3 are
disabled.
60A Application (2 Modules)
EN -- Open, EN2-- ON, EN3 -- OFF
For layout of designs using the ISL8225M, the thermal
performance can be improved by adhering to the following
design tips:
Or:
1. Use the top and bottom layers to carry the large current.
VOUT1, VOUT2, Phase 1, Phase 2, PGND, VIN1 and VIN2
should have large, solid planes. Place enough thermal vias to
connect the power planes in different layers under and
around the module.
EN -- Open, EN2-- OFF, EN3 -- ON
In this mode, only modules 1 and 2 (or 3) are running and
module 3 (or 2) is disabled.
90A Application (3 Modules)
EN -- Open, EN2-- ON, EN3 -- ON
2. Phase 1 and Phase 2 pads are switching nodes that generate
switching noise. Keep these pads under the module. For
noise-sensitive applications, it is recommended to keep
phase pads only on the top and inner layers of the PCB; do not
place phase pads exposed to the outside on the bottom layer
of the PCB. To improve the thermal performance, the phase
pads can be extended in the inner layer, as shown in Phase 1
and 2 pads on layer 3 (Figure 11) for this 90A evaluation
board. Make sure that layer 2 and layer 4 have the GND layers
to cover the extended areas of phase pads at layer 3 to avoid
noise coupling.
In this mode, all modules are running.
Disable All Modules and Use the EN Pin to
Start the Modules
EN -- Connected
In this mode, all modules are disabled and EN can be used to
control all modules to startup.
AN1789.0
December 3, 2012
2
Application Note 1789
3. To avoid noise coupling, we recommend adding 1nF
Phase-shift Programming
capacitors on all COMP and ISHARE pins of each module for
multiple module operations.
4. Place the modules evenly on the board and leave enough
space between modules. If the board space is limited, try to
put the modules with low power loss closely together (i.e. low
In current sharing mode, the phase-shift is needed to interleave
the different phases to lower the input and output ripples. As
shown in Table 2, there are different sharing modes from
2-phase (180° phase-shift) and 4-phase (90° phase-shift) to
6-phase (60° phase-shift). The master module sends the CLKOUT
signal to the SYNC pin of the second module with the phase-shift
to its own clock signal. Then the second module synchronizes to
the CLKOUT signal of the master module and sends its CLKOUT
signal to the third module’s SYNC pin. The individual 2 phases of
each module are set to be 180° phase-shift by default. This
evaluation board is set to mode 5B with 60° phase-shift between
phases.
VOUT or IOUT) while still separating the module with high power
loss.
5. If the ambient temperature is high or the board space is
limited, airflow is needed to dissipate more heat from the
modules. A heat sink can also be applied to the top side of the
module to further improve the thermal performance (heat
sink recommendation: Aavid Thermalloy, part number
375424B00034G, www.aavid.com).
If the MODE pin is not tied to VCC (5A or 5B), all VMON pins of
different modules can be tied together, except the VMON pin of
the master phase. If mode 7A is needed to allow for 90°
phase-shift, the MODE pin has to tie to VCC. In this case, the
VMON pin of the associated module needs to be separated by
connecting a 1.05kΩ resistor to SGND, as shown in the
ISL8225M datasheet.
Remote Sensing
The ISL8225MEVAL2Z board allows the user to apply the remote
sensing function to loads in order to achieve good output
regulation accuracy. To make use of this function, remove
resistors R7 and R8 and connect the kelvin sensing lines through
the jumper JP4 (RS) to the point of load.
TABLE 2. ISL8225M 3-MODULE BOARD OPERATION MODES
1ST MODULE (I = INPUT; O = OUTPUT; I/O = INPUT AND OUTPUT, BI-DIRECTION)
MODES OF OPERATION
ISHARE (I/O)
REPRESENTS
WHICH
OPERATION OPERATION
MODE
OF 2ND
MODULE
MODE
OF 3RD
MODULE
EN2 EN3 VSEN2- MODE VSEN2+ CLKOUT/REFIN CHANNEL(S) 2ND CHANNELWRT
MODE
5A
(I)
(I)
(I)
(I)
(I)
WRT 1ST (I OR O)
CURRENT
1ST (O)
180°
180°
180°
OUTPUT
2-Phase
6-Phase
4-Phase
12-Phase
0
0
VCC
VCC
VCC
GND
GND
VCC
-
-
60°
60°
90°
Both Channels
Both Channels
Both Channels
-
-
5B
-
5B
1
1
5B
7A
1
0
VCC
5A or 7A
8
Cascaded Module Operation MODEs 5A+5A+7A+5A+5A+5A/7A, No External Clock Required
AN1789.0
December 3, 2012
3
ISL8225MEVAL2Z Board Schematics
R22
0
SYNC
J1
J5
SYNC
IN
VMIONN
SYNC
IN
TP5
VOUT
1.2V @ 90A
C8
TP1
TP7
OUT
VCC1
OUT
VIN
R64
R82
499
1000PF
VOUT
4.5V TO 20V
MODE1
C1
IN
TP3
TP6
E
VOUT
OUT
499
VIN
S1
S1
4.7UF
S1
S1
OUT
VIN
R42
0
J3
E
E
OUT
R62
0
COMP
R59
0
R61
S1
VOUT
R60
0
IN
0
PGND
VIN2
VCC1
R9B
I N
1
VOUT
GND
VSEN2-
VSEN2+
0
26
TP9
IN
10
J4
V1SEN2+
R40
0
GND
25
M1
TP4
GND
TP8
R38
0
TP10
11
12
24
23
E
PGOOD
N/C
ISL8225MIRZ
OUT
PGOOD
E
R53
0
E
R39
0
C12
VCC1
MODE1
R15
DNP
22
21
VSEN1+
VSEN1-
OPEN
R1
1K
IN
IN
R7
0
+
PGND
VIN1
RS
-
S1
S1
VCC1
IN
R2
1K
C35
R8
J2
J6
VCC1
V1SEN2+
R16
DNP
0
IN
IN
COOUMTP
E
GND
0.01UF
R9
0
S1
GND_S1
EGND
OUT
EN/FF
R11
3.32K
ISHARE
OUT
VCC1
S1
SGND1
E
IN
R12
3.32K
E
S1
VMON
R13
DNP
EN
IN
S1
S3
S3
CLKOUT1
SSL_LLXAE3D0125IGC
OUT
S1
S1
IN
PGOOD
Q1
1
S1
2N7002-7-F
E
FIGURE 2. ISL8225MEVAL2Z BOARD SCHEMATIC
ISL8225MEVAL2Z Board Schematics(Continued)
VMON
R54
0
R23
0
R35
0
OUT
IN
CLKOUT1
VMON1
MODE2
OUT
OUT
VCC2
OUT
C2
S2
R43
0
R45
0
S2
4.7UF
OUT
COMP
COMP2
E
OUT
VIN
R67
0
IN
R71
0
S2
R68
E
0
R72
PGND
VIN2
0
R28B
0
I N
1
VSEN2-
VSEN2+
VCC2
26
IN
10
V2SEN2+
M2
E
25
R65
E
0
11
24
23
R69
0
PGOOD
N/C
ISL8225MIRZ
OUT
VCC2
MODE2
PGOOD
R48
DNP
IN
IN
VOUT
OUT
R66
12
C37
0
R70
0
22
21
VSEN1+
VSEN1-
OPEN
R4
R86
S2
PGND
VIN1
DNP
DNP
VCC2
V2SEN2+
R17
DNP
VCC2
R3
DNP
R87
DNP
IN
IN
IN
S2
C47
OUT
E
OUT
COMP2
OPEN
EN/FF
3
E
ON
S2
EN2
2
S2
R52
J8
OUT
ISHARE
OFF
1
0
VMON1
R27
IN
0
S2
S2
S2
GND_S2
EGND
CLKOUT2
OUT
S2
SGND2
E
S2
S2
S2
FIGURE 3. ISL8225MEVAL2Z BOARD SCHEMATIC
ISL8225MEVAL2Z Board Schematics(Continued)
VMON1
R55
0
R33
0
R36
0
OUT
IN
CLKOUT2
MODE3
VMON2
OUT
OUT
OUT
VCC3
C3
S3
COMP2
R44
0
R46
0
S3
4.7UF
IN
COMP3
E
OUT
VIN
R73
0
IN
R77
0
S3
R74
0
E
R78
0
PGND
VIN2
VCCI 3N
R44B
0
1
VSEN2-
VSEN2+
26
IN
10
V3SEN2+
E
M3
25
R75
11
12
24
23
E
PGOOD
N/C
OUT
PGOOD
0
R79
ISL8225MIRZ
VOUT
0
OUT
VCC3
MODE3
R50
R76
IN
IN
DNP
C39
0
R80
22
21
VSEN1+
VSEN1-
0
OPENR29
PGND
VIN1
DNP
S3
S3
VCC3
VCC3
V3SEN2+
R21
DNP
R24
DNP
IN
IN
IN
COMP3
OUT
E
E
S3
ISHARE
R81
0
ON
OFF
OUT
EN/FF
2
CLKOUT3
1
3
CLKOUT3
OUT
TP2
IN
J7
VMON2
S3
IN
EN3
S3
S3
TP11
S3
CLKOUT3
OUT
S3
GND_S3
EGND
S3
S3
S3
E
FIGURE 4. ISL8225MEVAL2Z BOARD SCHEMATIC
Application Note 1789
Layout
OFF
ON
FIGURE 5. TOP ASSEMBLY
FIGURE 6. TOP SILK SCREEN
FIGURE 7. TOP LAYER COMPONENT SIDE
FIGURE 8. LAYER 2
AN1789.0
December 3, 2012
7
Application Note 1789
Layout (Continued)
FIGURE 9. LAYER 3
FIGURE 10. LAYER 4
FIGURE 11. LAYER 5
FIGURE 12. BOTTOM LAYER SOLDER SIDE
AN1789.0
December 3, 2012
8
Application Note 1789
Layout (Continued)
FIGURE 13. BOTTOM SILK SCREEN
FIGURE 14. BOTTOM SILK SCREEN MIRRORED
FIGURE 15. BOTTOM ASSEMBLY
AN1789.0
December 3, 2012
9
Bill of Materials
PACKAGE
TYPE
PART NUMBER
10TPB330M
REF DES
QTY. VALUE TOL. VOLTAGE POWER
JEDEC TYPE
CAP_7343_149
MANUFACTURER
DESCRIPTION
C04, C08, C016,
C024, C08A
5
330µF 20%
10V
SMD
SANYO-POSCAP Standard solid electrolytic chip tantalum
SMD capacitor
131-4353-00
2N7002-7-F
5002
TP1
Q1
1
1
CONN
SOT23
THOLE
TEK131-4353-00
SOT23
Tektronix
Fairchild
Keystone
Scope probe test point PCB mount
N-Channel EMF effect transistor (Pb-free)
TP2-TP11
10
MTP500X
Miniature white test point 0.100 pad
0.040 Thole
ECA-1VM471
CINA, CINB
C1-C3
2
3
7
470µF 20%
4.7µF 10%
47µF 10%
35V
16V
10V
RADIAL CAPR_708X1398_300_P
Panasonic
Murata
Radial capacitor Pb-free
Ceramic capacitor
GRM21BR71C475KA73L
GRM32ER70A476K
805
CAP_0805
CAP_1210
C0, C02, C05,
C010, C013, C014,
C018
1210
Murata
Ceramic chip capacitor
GRM32ER71E226KE15L
H1045-00101-50V10
CIN1-CIN12
12
6
22µF 10%
100pF 10%
25V
50V
1210
603
CAP_1210
CAP_0603
Murata
Generic
Ceramic chip capacitor
Multilayer capacitor
C6, C7, C13, C14,
C20, C21
H1045-00102-16V10
H1045-00102-50V10
C8
1
1000pF 10%
16V
50V
603
603
CAP_0603
CAP_0603
Generic
Generic
Multilayer capacitor
Multilayer capacitor
C4, C5, C9, C11,
C16-C19, C23-C31,
C40
18 1000pF 10%
H1045-00103-50V10
H1045-OPEN
C35
1
0.01µF 10%
OPEN 5%
50V
603
603
CAP_0603
CAP_0603
Generic
Generic
Multilayer capacitor
Multilayer capacitor
C10, C12, C15,
C22, C32-C34,C36,
C37, C39, C42,
C44, C47
13
OPEN
H1082-OPEN
C01, C03, C06,
C07, C09, C011,
C012, C015, C017,
C019, C021, C023
12
26
OPEN 10%
OPEN
1210
603
CAP_1210
RES_0603
Generic
Generic
Ceramic chip capacitor
H2505-DNP-DNP-1
R3, R4, R13-R17,
R20, R21,R24,
R25, R28-R31,
R37, R48, R50,
R51, R56-R58,
R86, R87, R10B,
RFSET
DNP
1%
DNP
Metal film chip resistor (do not populate)
Bill of Materials(Continued)
PACKAGE
TYPE
PART NUMBER
REF DES
QTY. VALUE TOL. VOLTAGE POWER
JEDEC TYPE
RES_0603
MANUFACTURER
Generic
DESCRIPTION
Thick film chip resistor
H2511-00R00-1/16W1
R7-R10, R18, R19, 29
R22, R23, R26,
R27, R33, R35,
R36, R42-R47,
R49, R52, R54,
R55, R81, R9B,
R20B, R28B,R37B,
R44B
0Ω
1%
1/16W
603
H2511-01001-1/16W1
H2511-03321-1/16W1
H2511-04990-1/16W1
H2520-00R00-1/2W5
R1, R2, R6
R11, R12
R64, R82
3
2
1kΩ
1%
1/16W
1/16W
1/16W
1/2W
603
603
RES_0603
RES_0603
RES_0603
RES_2010
Generic
Generic
Generic
Generic
Thick film chip resistor
Thick film chip resistor
Thick film chip resistor
Thick film chip resistor
3.32kΩ 1%
2
499Ω
0Ω
1%
5%
603
R38-R40, R53,
24
2010
R59-R62, R65-R80
ISL8225MIRZ
JUMPER-3-100
JUMPER2_100
KPA8CTP
M1-M3
J7, J8
JP4, JP8
J1-J6
3
2
2
6
1
1
QFN
THOLE
THOLE
CONN
603
QFN26_670X670_ISL8225M Intersil
Dual 15A DC/DC power module
Three pin jumper
JUMPER-3
JUMPER-1
KPA8CTP
Generic
Generic
Burndy
ROHM
Two pin jumper
Wire connector lug
MCR03EZPFX3001
SSL-LXA3025IGC
R5
3kΩ
1%
1/10W
RES_0603
LED_3X2_5MM
Metal film chip resistor
LED1
SMD
Lumex
3mmx2.5mm surface mount red/green
LED
NOTE:
2. Resistance accuracy of the feedback resistor divider R1/R2 can affect the output voltage accuracy. Please use high accuracy resistance (i.e. 0.5% or 0.1%) to meet the output accuracy requirement.
Application Note 1789
ISL8225MEVAL2Z Efficiency Curves Test conditions at +25°C and no air flow.
Efficiency Curves with Zero-ohm Resistance on the Output
95
85
75
65
55
100
2.5V
2.5V
OUT
3.3V
OUT
OUT
3.3V
OUT
90
1.5V
OUT
1.5V
OUT
1.2V
OUT
1.2V
OUT
1V
OUT
80
1V
OUT
70
60
0
10
20
30
40
50
60
70
80
90 100
0
10
20
30
40
50
60
70
80
90 100
LOAD CURRENT (A)
LOAD CURRENT (A)
FIGURE 16. EFFICIENCY CURVES FOR 12V INPUT
FIGURE 17. EFFICIENCY CURVES FOR 5V INPUT
Efficiency Curves by Replacing Zero-ohm Resistance with Thick Copper Strap
95
85
75
65
55
100
2.5V
OUT
2.5V
OUT
3.3V
OUT
90
1.5V
OUT
1.5V
OUT
1.2V
OUT
1.2V
OUT
1V
OUT
1V
80
OUT
70
60
0
10
20
30
40
50
60
70
80
90 100
0
10
20
30
40
50
60
70
80
90 100
LOAD CURRENT (A)
LOAD CURRENT (A)
FIGURE 18. EFFICIENCY CURVES FOR 12V INPUT
FIGURE 19. EFFICIENCY CURVES FOR 5V INPUT
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the Application Note or Technical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
AN1789.0
December 3, 2012
12
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