ISL81485IUZ [INTERSIL]

5V, 30Mbps, RS-485/RS-422 Transceiver; 5V , 30Mbps的, RS - 485 / RS - 422收发器
ISL81485IUZ
型号: ISL81485IUZ
厂家: Intersil    Intersil
描述:

5V, 30Mbps, RS-485/RS-422 Transceiver
5V , 30Mbps的, RS - 485 / RS - 422收发器

驱动器 接口集成电路 光电二极管 信息通信管理
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ISL81485  
®
Data Sheet  
July 2004  
FN6061.1  
5V, 30Mbps, RS-485/RS-422 Transceiver  
Features  
The Intersil ISL81485 is a BiCMOS, 5V powered, single  
transceiver that meets both the RS-485 and RS-422  
standards for balanced communication, and features a larger  
output voltage and higher data rate to benefit high speed  
applications.  
• Specified for 10% Tolerance Supplies  
• High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 30Mbps  
• Large Differential Output Voltage . . . . 2.0V(min.) into 54  
• Drop-In Replacement for the ADM1485  
Unlike competitive devices, this Intersil transceiver is  
specified for 10% tolerance supplies (4.5V to 5.5V), and it  
delivers a much larger worst case differential output voltage  
(2.0V compared to the typical 1.5V) over the full supply  
range. The increased output voltage translates into longer  
reach, or better data integrity, at the 30Mbps data rate.  
• One Unit Load Allows up to 32 Devices on the Bus  
• Low Quiescent Current . . . . . . . . . . . . . . . . . . . . . 800µA  
• -7V to +12V Common Mode Input Voltage Range  
• Three State Rx and Tx Outputs  
• 15ns (Max) Propagation Delays, 5ns (Max) Skew  
• Operates from a Single +5V Supply (10% Tolerance)  
This device presents a “1 unit load” to the RS-485 bus, which  
allows up to 32 transceivers on the network.  
• Current Limiting and Thermal Shutdown for driver  
Overload Protection  
Receiver (Rx) inputs feature a “fail-safe if open” design,  
which ensures a logic high Rx output if Rx inputs are  
floating.  
Pb-free available  
Driver (Tx) outputs are short circuit protected, even for  
voltages exceeding the power supply voltage. Additionally,  
on-chip thermal shutdown circuitry disables the Tx outputs to  
prevent damage if power dissipation becomes excessive.  
Applications  
• SCSI “Fast 20” Drivers and Receivers  
• Factory Automation  
• Field Bus Networks  
Ordering Information  
• Security Networks  
PART NO.  
(BRAND)  
TEMP.  
RANGE ( C)  
PKG.  
DWG. #  
o
PACKAGE  
8 Ld SOIC  
• Building Environmental Control Systems  
• Industrial/Process Control Networks  
ISL81485IB  
(81485IB)  
-40 to 85  
M8.15  
M8.15  
ISL81485IBZ  
(81485IB) (See Note)  
-40 to 85  
8 Ld SOIC  
(Pb-free)  
Pinout  
ISL81485 (SOIC, MSOP)  
ISL81485IU (1485)  
-40 to 85  
-40 to 85  
8 Ld MSOP  
M8.118  
M8.118  
TOP VIEW  
ISL81485IUZ (1485)  
(See Note)  
8 Ld MSOP  
(Pb-free)  
RO  
RE  
DE  
DI  
1
2
3
4
8
7
6
5
V
CC  
R
D
*Add “-T” suffix to part number for tape and reel packaging.  
B / Z  
A / Y  
GND  
NOTE: Intersil Pb-free products employ special Pb-free material  
sets; molding compounds/die attach materials and 100% matte tin  
plate termination finish, which is compatible with both SnPb and  
Pb-free soldering operations. Intersil Pb-free products are MSL  
classified at Pb-free peak reflow temperatures that meet or exceed  
the Pb-free requirements of IPC/JEDEC J Std-020B.  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved  
All other trademarks mentioned are the property of their respective owners.  
ISL81485  
Truth Table  
Truth Table  
TRANSMITTING  
RECEIVING  
INPUTS  
OUTPUTS  
INPUTS  
OUTPUT  
RE  
X
DE  
1
DI  
1
B / Z  
A / Y  
RE  
0
DE  
0
A-B  
+0.2V  
-0.2V  
Inputs Open  
X
RO  
0
1
1
0
1
X
1
0
0
0
0
1
X
0
X
High-Z  
High-Z  
0
0
1
X
High-Z  
Pin Descriptions  
PIN  
FUNCTION  
RO  
RE  
Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating).  
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.  
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.  
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.  
Ground connection.  
DE  
DI  
GND  
A/Y  
B/Z  
RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1.  
RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1.  
System power supply input (4.5V to 5.5V).  
V
CC  
Typical Operating Circuit  
ISL81485  
+5v  
+5v  
+
+
0.1µF  
0.1µF  
8
8
V
V
CC  
CC  
RO  
1
2
4
DI  
R
D
RE  
DE  
R
T
R
T
3
2
7
6
7
6
B / Z  
A / Y  
DE  
RE  
B / Z  
A / Y  
3
4
DI  
1
RO  
R
D
GND  
5
GND  
5
2
ISL81485  
Absolute Maximum Ratings  
Thermal Information  
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V  
Thermal Resistance (Typical, Note 1)  
θJA ( C/W)  
CC  
Input Voltages  
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .  
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C  
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C  
105  
140  
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Input / Output Voltages  
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V  
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V  
Short Circuit Duration  
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous  
o
o
o
o
+0.5V)  
CC  
(Lead Tips Only)  
Operating Conditions  
Temperature Range  
ISL81485IX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
o
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V  
= 5V, T = 25 C,  
CC  
CC  
A
Note 2  
TEMP  
o
PARAMETER  
SYMBOL  
TEST CONDITIONS  
( C)  
MIN  
TYP  
MAX UNITS  
DC CHARACTERISTICS  
Driver Differential V  
(no load)  
V
V
Full  
Full  
Full  
Full  
Full  
-
2.5  
2
-
3
V
V
V
V
V
V
OUT  
OUT  
OD1  
OD2  
CC  
-
Driver Differential V  
(with load)  
R = 50(RS-422) (Figure 1A)  
R = 27(RS-485) (Figure 1A)  
2.5  
-
5
-
R
= 60, -7V V  
12V (Figure 1B)  
CM  
1.5  
-
D
Change in Magnitude of Driver  
Differential V for  
V  
R = 27or 50(Figure 1A)  
0.01  
0.2  
OD  
OUT  
Complementary Output States  
Driver Common-Mode V  
V
R = 27or 50(Figure 1A)  
R = 27or 50(Figure 1A)  
Full  
Full  
-
-
-
3
V
V
OUT  
Change in Magnitude of Driver  
Common-Mode V for  
OC  
V  
0.01  
0.2  
OC  
OUT  
Complementary Output States  
Logic Input High Voltage  
Logic Input Low Voltage  
Logic Input Current  
V
DE, DI, RE  
DE, DI, RE  
DE, DI, RE  
Full  
Full  
Full  
Full  
Full  
Full  
2
-
-
-
-
-
-
-
-
0.8  
1
V
V
IH  
V
IL  
I
-1  
µA  
mA  
mA  
V
IN1  
Input Current (A/Y, B/Z) (Note 5)  
I
DE = 0V, V  
4.5 to 5.5V  
= 0V or  
V
V
= 12V  
= -7V  
-
1
IN2  
CC  
IN  
IN  
-0.8  
-0.2  
-
Receiver Differential Threshold  
Voltage  
V
-7V V  
12V  
0.2  
TH  
CM  
Receiver Input Hysteresis  
V  
V
= 0V  
25  
-
4
-
40  
-
-
-
mV  
V
TH  
CM  
Receiver Output High Voltage  
Receiver Output Low Voltage  
V
I
I
= -4mA, V = 200mV  
ID  
Full  
Full  
Full  
OH  
O
O
V
= -4mA, V = 200mV  
ID  
-
0.4  
±1  
V
OL  
Three-State (high impedance)  
Receiver Output Current  
I
0.4V V 2.4V  
-
-
µA  
OZR  
O
Receiver Input Resistance  
R
-7V V  
12V  
Full  
Full  
Full  
Full  
12  
-
-
1
-
kΩ  
mA  
mA  
mA  
IN  
CM  
No-Load Supply Current, Note 3  
I
DI, RE = 0V or V  
DE = V  
2.2  
1
CC  
CC  
CC  
DE = 0V  
DE = V , -7V V or V 12V (Note 4)  
-
0.8  
-
Driver Short-Circuit Current,  
I
60  
250  
OSD1  
CC  
Y
Z
V
= High or Low  
O
3
ISL81485  
o
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V  
= 5V, T = 25 C,  
A
CC  
CC  
Note 2 (Continued)  
TEMP  
o
PARAMETER  
SYMBOL  
TEST CONDITIONS  
( C)  
MIN  
TYP  
MAX UNITS  
Receiver Short-Circuit Current  
SWITCHING CHARACTERISTICS  
Driver Input to Output Prop Delay  
Driver Prop Delay Skew  
I
0V V V  
CC  
Full  
7
-
85  
mA  
OSR  
O
t
, t  
PLH PHL  
R
R
R
C
C
= 54, C = 100pF (Figure 2)  
Full  
Full  
Full  
Full  
Full  
Full  
2
-
9
1
5
9
9
1
15  
5
ns  
ns  
ns  
ns  
ns  
ns  
DIFF  
DIFF  
DIFF  
L
t
= 54, C = 100pF (Figure 2)  
L
SKEW  
t , t  
Driver Differential Rise or Fall Time  
Driver Enable to Output High  
Driver Enable to Output Low  
Matched Enable Switching  
= 54, C = 100pF (Figure 2)  
-
15  
25  
25  
3
R
F
L
t
= 50pF, SW = GND (Figure 3)  
-
ZH  
L
L
t
= 50pF, SW = V  
(Figure 3)  
CC  
-
ZL  
t  
(Figure 3)  
-
EN  
|t  
- t  
| or |t  
- t |  
AZH BZL  
BZH AZL  
Driver Disable from Output High  
Driver Disable from Output Low  
Matched Disable Switching  
t
C
C
= 50pF, SW = GND (Figure 3)  
Full  
Full  
Full  
-
-
-
9
9
2
25  
25  
5
ns  
ns  
ns  
HZ  
L
t
= 50pF, SW = V  
(Figure 3)  
CC  
LZ  
L
t  
(Figure 3)  
DIS  
|t  
- t  
AHZ BLZ  
| or |t  
- t |  
BHZ ALZ  
Driver Maximum Data Rate  
f
|V | 1.5V (Figure 4)  
Full  
Full  
30  
8
-
-
Mbps  
ns  
MAXD  
OD  
Receiver Input to Output Prop  
Delay  
t
, t  
PLH PHL  
(Figure 5)  
17  
30  
Receiver Prop Delay Skew  
t
(Figure 5)  
Full  
-
1
5
ns  
SKD  
| t  
- t |  
PLH PHL  
Receiver Enable to Output High  
Receiver Enable to Output Low  
Receiver Disable from Output High  
Receiver Disable from Output Low  
Receiver Maximum Data Rate  
NOTES:  
t
C
C
C
C
C
= 15pF, SW = GND (Figure 6)  
Full  
Full  
Full  
Full  
Full  
-
-
7
7
7
7
-
20  
20  
20  
20  
-
ns  
ns  
ZH  
L
L
L
L
L
t
= 15pF, SW = V  
(Figure 6)  
ZL  
CC  
= 15pF, SW = GND (Figure 6)  
= 15pF, SW = V (Figure 6)  
t
-
ns  
HZ  
t
-
ns  
LZ  
CC  
= 15pF, V 1.5V, RO t and t 20ns  
f
30  
Mbps  
MAXR  
ID  
H
L
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless  
otherwise specified.  
3. Supply current specification is valid for loaded drivers when DE = 0V.  
4. Applies to peak current. See “Typical Performance Curves” for more information.  
5. Devices meeting these limits are denoted as “1 unit load (UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus, so a  
1UL transceiver permits > 32 devices on the bus.  
Test Circuits and Waveforms  
R
375Ω  
DE  
DI  
DE  
DI  
V
V
CC  
CC  
Z
Y
Z
Y
V
CM  
R
= 60Ω  
V
V
OD  
D
D
D
OD  
-7V to +12V  
V
R
375Ω  
OC  
FIGURE 1B. V  
OD  
WITH COMMON MODE LOAD  
FIGURE 1A. V  
OD  
AND V  
OC  
FIGURE 1. DC DRIVER TEST CIRCUITS  
4
ISL81485  
Test Circuits and Waveforms (Continued)  
3V  
0V  
DI  
1.5V  
PLH  
1.5V  
PHL  
t
t
t
V
OH  
C
= 100pF  
50%  
50%  
50%  
L
OUT (Y)  
OUT (Z)  
DE  
DI  
V
V
OL  
CC  
Z
Y
t
R
PHL  
PLH  
DIFF  
D
V
C
= 100pF  
OH  
L
50%  
90%  
SIGNAL  
GENERATOR  
V
OL  
+V  
OD  
90%  
10%  
DIFF OUT (Y - Z)  
10%  
-V  
OD  
t
t
R
F
SKEW = |CROSSING PT. OF Y& Z- CROSSING PT. OF Y& Z|  
FIGURE 2A. TEST CIRCUIT  
FIGURE 2B. MEASUREMENT POINTS  
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES  
DE  
DI  
3V  
0V  
Z
Y
110Ω  
DE  
1.5V  
1.5V  
HZ  
V
CC  
D
GND  
SW  
SIGNAL  
GENERATOR  
C
t
ZH  
L
t
OUTPUT HIGH  
2.3V  
V
OH  
V
- 0.5V  
OH  
OUT (Y, Z)  
OUT (Y, Z)  
0V  
PARAMETER OUTPUT  
RE  
DI  
SW  
C
L
(pF)  
t
Y / Z  
Y / Z  
Y / Z  
Y / Z  
X
X
X
X
1 / 0  
0 / 1  
1 / 0  
0 / 1  
GND  
50  
50  
50  
50  
t
HZ  
ZL  
t
LZ  
t
V
V
LZ  
CC  
CC  
t
GND  
2.3V  
ZH  
V
+ 0.5V  
V
OL  
OL  
t
V
CC  
ZL  
OUTPUT LOW  
FIGURE 3A. TEST CIRCUIT  
FIGURE 3B. MEASUREMENT POINTS  
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES  
C
= 100pF  
= 100pF  
L
DE  
DI  
V
CC  
3V  
0V  
Z
Y
DI  
R
DIFF  
D
C
L
SIGNAL  
GENERATOR  
+V  
OD  
DIFF OUT (Y - Z)  
0V  
-V  
OD  
FIGURE 4A. TEST CIRCUIT  
FIGURE 4B. MEASUREMENT POINTS  
FIGURE 4. DRIVER DATA RATE  
5
ISL81485  
Test Circuits and Waveforms (Continued)  
RE  
3V  
0V  
15pF  
A
B
1.5V  
PLH  
1.5V  
PHL  
+1.5V  
RO  
R
A
t
t
V
SIGNAL  
GENERATOR  
CC  
50%  
50%  
RO  
0V  
FIGURE 5A. TEST CIRCUIT  
FIGURE 5B. MEASUREMENT POINTS  
FIGURE 5. RECEIVER PROPAGATION DELAY  
3V  
RE  
RE  
1.5V  
1.5V  
HZ  
B
1kΩ  
V
CC  
RO  
R
0V  
GND  
SW  
SIGNAL  
GENERATOR  
t
A
ZH  
t
15pF  
OUTPUT HIGH  
1.5V  
V
OH  
V
- 0.5V  
OH  
RO  
RO  
0V  
PARAMETER  
DE  
0
A
SW  
GND  
t
ZL  
t
LZ  
t
+1.5V  
-1.5V  
+1.5V  
-1.5V  
HZ  
V
CC  
t
0
V
CC  
LZ  
1.5V  
t
0
GND  
ZH  
V
+ 0.5V  
OL  
V
OL  
t
0
V
OUTPUT LOW  
ZL  
CC  
FIGURE 6A. TEST CIRCUIT  
FIGURE 6B. MEASUREMENT POINTS  
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES  
Receiver Features  
Application Information  
This device utilizes a differential input receiver for maximum  
noise immunity and common mode rejection. Input sensitivity  
is ±200mV, as required by the RS422 and RS-485  
specifications.  
RS-485 and RS-422 are differential (balanced) data  
transmission standards for use in long haul or noisy  
environments. RS-422 is a subset of RS-485, so RS-485  
transceivers are also RS-422 compliant. RS-422 is a point-  
to-multipoint (multidrop) standard, which allows only one  
driver and up to 10 (assuming one unit load devices)  
receivers on each bus. RS-485 is a true multipoint standard,  
which allows up to 32 one unit load devices (any  
combination of drivers and receivers) on each bus. To allow  
for multipoint operation, the RS-485 spec requires that  
drivers must handle bus contention without sustaining any  
damage.  
Receiver input resistance surpasses the RS-422 spec of  
4k, and meets the RS-485 “Unit Load” requirement of 12kΩ  
minimum, thereby allowing up to 32 devices on a bus.  
Receiver inputs function with common mode voltages as  
great as 7V outside the power supplies (i.e., +12V and -7V),  
making them ideal for long networks, or industrial  
applications, where induced voltages are a definite concern.  
The receiver includes a “fail-safe if open” function that  
guarantees a high level receiver output if the receiver inputs  
are unconnected (floating).  
Another important advantage of RS-485 is the extended  
common mode range (CMR), which specifies that the driver  
outputs and receiver inputs withstand signals that range from  
+12V to -7V. RS-422 and RS-485 are intended for runs as  
long as 4000’, so the wide CMR is necessary to handle  
ground potential differences, as well as voltages induced in  
the cable by external fields.  
The receiver easily meets the data rate supported by the  
driver, and receiver outputs are three-statable via the active  
low RE input.  
6
ISL81485  
Proper termination is imperative, when using a 30Mbps  
Driver Features  
device, to minimize reflections. In point-to-point, or point-to-  
multipoint (single driver on bus) networks, the main cable  
should be terminated in its characteristic impedance  
(typically 120) at the end farthest from the driver. In multi-  
receiver applications, stubs connecting receivers to the main  
cable should be kept as short as possible. Multipoint (multi-  
driver) systems require that the main cable be terminated in  
its characteristic impedance at both ends. Stubs connecting  
a transceiver to the main cable should be kept as short as  
possible.  
The RS-485, RS-422 driver is a differential output device that  
delivers at least 2V across a 54load (RS-485), and at least  
2.5V across a 100load (RS-422) even with V  
= 4.5V.  
CC  
The drivers feature low propagation delay skew to maximize  
bit width, and to minimize EMI.  
The driver is three-statable via the active high DE input.  
Outputs of the driver are not slew rate limited, so faster  
output transition times allow data rates of at least 30Mbps.  
Data Rate, Cables, and Terminations  
Built-In Driver Overload Protection  
RS-485/RS-422 are intended for network lengths up to  
4000’, but the maximum system data rate decreases as the  
transmission length increases. Devices operating at 30Mbps  
usually are limited to lengths of a couple hundred feet, but  
the larger differential output voltage of this transceiver allows  
that distance to be pushed past 350’. Figure 7 illustrates the  
30Mbps performance of the ISL81485 driving 350’ of CAT5  
cable, terminated in 120at both the driver and receiver  
ends. As shown, the differential signal (A-B) delivered to the  
receiver inputs at the end of the cable is still greater than  
1.5V (i.e., 7.5 times the required Rx sensitivity). Thus, even  
longer cables can be driven if lower noise margins are  
acceptable.  
As stated previously, the RS-485 spec requires that drivers  
survive worst case bus contentions undamaged. The  
ISL81485 meets this requirement via driver output short  
circuit current limits, and on-chip thermal shutdown circuitry.  
The driver output stages incorporate short circuit current  
limiting circuitry which ensures that the output current never  
exceeds the RS-485 spec, even at the common mode  
voltage range extremes.  
In the event of a major short circuit condition, the device also  
includes a thermal shutdown feature that disables the drivers  
whenever the die temperature becomes excessive. This  
eliminates the power dissipation, allowing the die to cool.  
The drivers automatically reenable after the die temperature  
drops about 15 degrees. If the contention persists, the  
thermal shutdown/reenable cycle repeats until the fault is  
cleared. Receivers stay operational during thermal  
shutdown.  
Twisted pair is the cable of choice for RS-485, RS-422  
networks. Twisted pair cables tend to pick up noise and other  
electromagnetically induced voltages as common mode  
signals, which are effectively rejected by the differential  
receivers in these ICs.  
o
Typical Performance Curves V = 5V, T = 25 C; Unless Otherwise Specified  
CC  
A
160  
140  
120  
100  
80  
DI = 30Mbps  
5
0
Y OR Z = LOW  
5
0
60  
RO  
40  
20  
0
DRIVER+CABLE DELAY (~490ns)  
-20  
-40  
3
1.5  
0
Y OR Z = HIGH  
-60  
-80  
A - B  
-100  
-120  
-140  
-1.5  
-3  
-160  
-7 -6  
-4  
-2  
0
2
4
6
8
10  
12  
TIME (20ns/DIV)  
OUTPUT VOLTAGE (V)  
FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING  
350 FEET (107 METERS) OF CAT5 CABLE  
(DOUBLE TERMINATED WITH 120)  
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT  
VOLTAGE  
7
ISL81485  
o
Typical Performance Curves V = 5V, T = 25 C; Unless Otherwise Specified (Continued)  
CC  
A
4
3.8  
3.6  
3.4  
3.2  
3
120  
100  
80  
60  
40  
20  
0
R
= 100Ω  
DIFF  
R
= 54Ω  
DIFF  
2.8  
0
1
2
3
4
5
-40  
0
50  
85  
-25  
25  
75  
o
DIFFERENTIAL OUTPUT VOLTAGE (V)  
TEMPERATURE ( C)  
FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL  
OUTPUT VOLTAGE  
FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs  
TEMPERATURE  
12  
3
R
= 54Ω  
DIFF  
R
= 54Ω  
DIFF  
2.5  
2
11  
10  
9
|t | = PW Distortion  
- t  
PHL(Y or Z) PLH(Y or Z)  
t
PLHZ  
t
PLHY  
1.5  
1
|t  
- t  
| or |t  
- t  
|
PHLY PLHZ  
PLHY PHLZ  
t
PHLY  
t
PHLZ  
8
0.5  
7
-40  
0
-40  
0
50  
85  
-25  
25  
75  
0
50  
85  
-25  
25  
o
75  
o
TEMPERATURE ( C)  
TEMPERATURE ( C)  
FIGURE 11. DRIVER PROPAGATION DELAY vs  
TEMPERATURE  
FIGURE 12. DRIVER SKEW AND PULSE DISTORTION vs  
TEMPERATURE  
R
= 54, C = 15pF  
L
R
= 54, C = 15pF  
DIFF  
DIFF  
L
5
0
5
0
DI  
DI  
5
0
5
0
RO  
RO  
5
5
4
3
2
1
0
4
3
2
1
0
B/Z  
A/Y  
A/Y  
B/Z  
TIME (10ns/DIV)  
TIME (10ns/DIV)  
FIGURE 13. DRIVER AND RECEIVER WAVEFORMS,  
LOW TO HIGH  
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,  
HIGH TO LOW  
8
ISL81485  
o
Typical Performance Curves V = 5V, T = 25 C; Unless Otherwise Specified (Continued)  
CC  
A
950  
900  
850  
800  
750  
700  
DE = V , RE = X  
CC  
DE = GND, RE = X  
-40  
0
50  
85  
-25  
25  
o
75  
TEMPERATURE ( C)  
FIGURE 15. SUPPLY CURRENT vs TEMPERATURE  
Die Characteristics  
SUBSTRATE POTENTIAL (POWERED UP):  
GND  
TRANSISTOR COUNT:  
528  
PROCESS:  
Si Gate BiCMOS  
9
ISL81485  
Mini Small Outline Plastic Packages (MSOP)  
N
M8.118 (JEDEC MO-187AA)  
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE  
INCHES  
MILLIMETERS  
E1  
E
SYMBOL  
MIN  
MAX  
MIN  
0.94  
0.05  
0.75  
0.25  
0.09  
2.95  
2.95  
MAX  
1.10  
0.15  
0.95  
0.36  
0.20  
3.05  
3.05  
NOTES  
A
A1  
A2  
b
0.037  
0.002  
0.030  
0.010  
0.004  
0.116  
0.116  
0.043  
0.006  
0.037  
0.014  
0.008  
0.120  
0.120  
-
-B-  
0.20 (0.008)  
INDEX  
AREA  
1 2  
A
B
C
-
-
TOP VIEW  
4X θ  
9
0.25  
(0.010)  
R1  
c
-
R
GAUGE  
PLANE  
D
3
E1  
e
4
SEATING  
PLANE  
L
0.026 BSC  
0.65 BSC  
-
-C-  
4X θ  
L1  
A
A2  
E
0.187  
0.016  
0.199  
0.028  
4.75  
0.40  
5.05  
0.70  
-
L
6
SEATING  
PLANE  
L1  
N
0.037 REF  
0.95 REF  
-
0.10 (0.004)  
-A-  
C
C
b
8
8
7
-H-  
A1  
e
R
0.003  
0.003  
-
-
0.07  
0.07  
-
-
-
D
0.20 (0.008)  
C
R1  
0
-
o
o
o
o
5
15  
5
15  
-
a
SIDE VIEW  
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-  
Rev. 2 01/03  
0.20 (0.008)  
C
D
END VIEW  
NOTES:  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-187BA.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs and are measured at Datum Plane. Mold flash, protrusion  
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions  
- H -  
and are measured at Datum Plane.  
Interlead flash and  
protrusions shall not exceed 0.15mm (0.006 inch) per side.  
5. Formed leads shall be planar with respect to one another within  
0.10mm (0.004) at seating Plane.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
- B -  
to be determined at Datum plane  
-A -  
10. Datums  
and  
.
- H -  
11. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
10  
ISL81485  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC  
PACKAGE  
N
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
E
INCHES  
MILLIMETERS  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
1
2
3
L
-
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
o
h x 45  
D
3
4
-C-  
α
µ
0.050 BSC  
1.27 BSC  
-
e
A1  
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
C
B
0.10(0.004)  
5
0.25(0.010) M  
C A M B S  
L
6
N
α
8
8
7
NOTES:  
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
11  

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