ISL32614EFHZ-T [INTERSIL]
±16.5kV ESD Protected, +125°C, 1.8V to 3.6V, Low Power, SOT-23, RS-485/RS-422 Transmitters; ± 16.5kV ESD保护, + 125°C , 1.8V至3.6V ,低功耗, SOT -23 , RS - 485 / RS - 422发射器型号: | ISL32614EFHZ-T |
厂家: | Intersil |
描述: | ±16.5kV ESD Protected, +125°C, 1.8V to 3.6V, Low Power, SOT-23, RS-485/RS-422 Transmitters |
文件: | 总11页 (文件大小:541K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
±16.5kV ESD Protected, +125°C, 1.8V to 3.6V,
Low Power, SOT-23, RS-485/RS-422 Transmitters
ISL32613E, ISL32614E
Features
The Intersil ISL32613E and ISL32614E are ±16.5kV HBM ESD
Protected (7kV IEC61000 contact), 1.8V powered, single
transmitters for differential communication. These drivers
have very low bus currents (±40µA), so they present less than
a “1/8 unit load” to the bus. This allows more than 256
transmitters on the network, without violating the RS-485
specification’s 32 unit load maximum and without using
repeaters.
• Wide Supply Voltage Range . . . . . . . . . . . . . . . . . 1.8V to 3.6V
• Low Quiescent Supply Current . . . . . . . . . . . . . . . 80µA (Max)
- Very Low Shutdown Supply Current. . . . . . . . . . 2µA (Max)
• High ESD Protection on RS-485 Outputs . . . . ±16.5kV HBM
- Class 3 ESD Level on All Other Pins. . . . . . . . . . >8kV HBM
• Specified for +125°C Operation
• Hot Plug - Tx Outputs Remain Three-state During Power-up
• Low Tx Leakage Allows >256 Devices on the Bus
• Slew Rate Limited for Data Rates Up to 256kbps
Hot Plug circuitry ensures that the Tx outputs remain in a high
impedance state while the power supply stabilizes.
Both ICs utilize slew rate limited drivers, which reduce EMI and
minimize reflections from improperly terminated transmission
lines or unterminated stubs in multidrop and multipoint
applications. The ISL32613E is more slew rate limited for data
rates up to 128kbps, while the less limited ISL32614E is
useful for data rates up to 256kbps.
• Current Limiting and Thermal Shutdown for Driver Overload
Protection
• 5V Tolerant Logic Inputs
• Pb-Free (RoHS Compliant)
For companion low power single RS-485 receivers, please see
the ISL32610E data sheet.
Applications
• Industrial/Process Control Networks
• Space-constrained Systems
• Factory Automation
• Building Environmental Control/Lighting Systems
R
= ∞, C = 50pF
D
D
Truth Table
10m
1m
TRANSMITTING
INPUTS
DE (Note 9)
OUTPUTS
DYNAMIC (128kbps)
DI
1
Z
Y
1
0
1
1
0
STATIC
1
0
100µ
10µ
0
X
High-Z *
High-Z *
NOTE: *Shutdown Mode
1.8 2.0
2.2
2.4
2.6
2.8
(V)
3.0
3.2
3.4
3.6
V
CC
FIGURE 1. V 1.8V TO 3.6V
CC
ISL32613E with V = 1.8V Reduces Operating I by a Factor
CC CC
of 177 Compared with I at V = 3.6V
CC
CC
August 30, 2011
FN7906.0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2011. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
ISL32613E, ISL32614E
Pin Descriptions
Pin Configuration
ISL32613E, ISL32614E
SOT-23
SYMBOL
FUNCTION
(6 LD SOT-23)
TOP VIEW
1
DI
Driver input. A low on DI forces output Y low and
output Z high. Similarly, a high on DI forces
output Y high and output Z low.
DI
1
2
3
6
5
4
Y
2
3
V
System power supply input (1.8V to 3.6V).
CC
V
D
GND
Z
CC
DE
Driver output enable. The driver outputs, Y and
Z, are enabled by bringing DE high, and are high
impedance when DE is low. If the driver enable
DE
function is not needed, connect DE to V
CC
through a 1kΩ to 2kΩ resistor.
4
Z
±16.5kV HBM, ±7kV IEC61000 (contact
method) ESD Protected inverting differential
transmitter output.
5
6
GND
Y
Ground connection.
±16.5kV HBM, ±7kV IEC61000 (contact
method) ESD Protected noninverting
differential transmitter output.
TABLE 1. SUMMARY OF FEATURES AT V = 1.8V
CC
DATA RATE SLEW-RATE
HOT
PLUG?
TX ENABLE?
(Note 9)
MAXIMUM QUIESCENT
(µA)
LOW POWER
SHUTDOWN?
PIN
COUNT
PART NUMBER
ISL32613E
FUNCTION
1 Tx
(kbps)
LIMITED?
I
CC
80
80
128
Yes
Yes
Yes
Yes
Yes
Yes
Yes
6 Ld SOT
6 Ld SOT
ISL32614E
1 Tx
256
Yes
Ordering Information
PART
PACKAGE
PART NUMBER
(Notes 1, 2)
MARKING
(Note 4)
(Tape and Reel)
(Pb-Free)
TEMP. RANGE (°C)
PKG. DWG. #
P6.064
P6.064
ISL32613EFHZ-T
ISL32614EFHZ-T
NOTES:
613F
614F
-40 to +125
-40 to +125
6 Ld SOT-23
6 Ld SOT-23
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32613E, ISL32614E. For more information on MSL please see
techbrief TB363.
4. SOT-23 “PART MARKING” is branded on the bottom side.
FN7906.0
August 30, 2011
2
ISL32613E, ISL32614E
Typical Operating Circuits
NETWORK WITH ENABLES
+1.8V
+1.8V
2
+
+
0.1µF
0.1µF
1
V
V
CC
CC
3
5
RO
RE
DI
1
R
D
B
A
4
6
4
6
Z
Y
DE 3
ISL32611E
ISL3261XE
GND
2
GND
5
NETWORK WITHOUT ENABLES
+1.8V
1
+1.8V
1kΩ TO 2kΩ (Note 9)
+
+
0.1µF
0.1µF
2
3
V
DE
V
CC
CC
3
RO
DI
1
R
D
B
4
5
4
Z
Y
A
6
ISL3261XE
ISL32610E
GND
2
GND
5
FN7906.0
August 30, 2011
3
ISL32613E, ISL32614E
Absolute Maximum Ratings
Thermal Information
V
to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Thermal Resistance (Typical)
6 Ld SOT-23 Package (Notes 5, 6). . . . . . . .
θJA (°C/W) θJC (°C/W)
177 95
CC
Input Voltages
DI, DE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Y, Z (V = 0V or ≥ 2.7V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
CC
Y, Z (V = 1.8V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +3V
CC
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . see “Electrical Specifications”
Latch-up (per JESD78, Level 2, Class A). . . . . . . . . . . . . . . . . . . . . . +125°C
Recommended Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V
Common Mode Range; V = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2V
CC
V
≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V
CC
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
R ; V = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥10kΩ
D
CC
≥ 2.7V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≥60Ω
V
CC
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
6. For θ , the “case temp” location is taken at the package top center.
JC
Electrical Specifications
V
= 1.8V; typicals are at T = +25°C; unless otherwise specified. Boldface limits apply over the operating
A
CC
temperature range, -40°C to +125°C. (Note 7)
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 10) TYP (Note 10) UNITS
DC CHARACTERISTICS
Driver Differential V
OUT
V
R
R
= 100Ω (Figure 2)
V
V
= 1.8V
Full
Full
Full
Full
Full
0.8
2
0.92
-
-
-
V
V
V
V
V
OD
L
L
CC
≥ 3.15V
-
CC
= 54Ω (Figure 2), V ≥ 3V
CC
1.5
1.1
-
-
No Load
= 100Ω (Figure 2)
1.45
0.01
V
CC
Change in Magnitude of Driver
Differential V for Complementary
ΔV
R
0.2
OD
L
OUT
Output States
Driver Common-Mode V
OUT
V
R = 100Ω (Figure 2)
Full
Full
-
-
1.1
1.4
0.2
V
V
0C
L
Change in Magnitude of Driver
Common-Mode V for
ΔV
R = 100Ω (Figure 2)
0.01
OC
L
OUT
Complementary Output States
Logic Input High Voltage (DI, DE)
V
V
V
= 1.8V
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
1.26
-
-
-
V
V
IH
CC
2.7V ≤ V ≤ 3.6V
2.2
-
CC
= 1.8V
CC
Logic Input Low Voltage (DI, DE)
Logic Input Current
V
-
-
0.4
0.8
2
V
IL
2.7V ≤ V ≤ 3.6V
-
-
-
V
CC
I
I
DI = DE = 0V or V (Note 9)
-2
µA
µA
µA
µA
mA
mA
IN
CC
Output Leakage Current
(Y, Z, Note 9)
DE = 0V,
V
= 7V at V = 1.8V
CC
-
0.1
0.1
-8
30
40
-
OZ
O
O
O
V
= 0V or 1.8V, or 3.6V
CC
V
V
= 12V at V = 3.6V
CC
-
= -7V
-40
Driver Short-Circuit Current,
I
V
V
= 1.8V, DE = V , -2V ≤ V ≤ 2V
CC
-
-
-
±250
-
OS
CC
O
V
= High or Low (Note 8)
O
≥ 2.7V, DE = V , -7V ≤ V ≤ 12V
CC
±150
CC
O
FN7906.0
August 30, 2011
4
ISL32613E, ISL32614E
Electrical Specifications
V
= 1.8V; typicals are at T = +25°C; unless otherwise specified. Boldface limits apply over the operating
A
CC
temperature range, -40°C to +125°C. (Note 7) (Continued)
TEMP
MIN
MAX
PARAMETER
SUPPLY CURRENT
SYMBOL
TEST CONDITIONS
(°C) (Note 10) TYP (Note 10) UNITS
No-Load Supply Current
I
I
DE = V = 1.8V, DI = 0V or V
CC CC
Full
Full
Full
-
-
-
20
80
150
2
µA
µA
µA
CC
DE = V , 2.7V ≤ V ≤ 3.6V, DI = 0V or V
CC CC CC
100
0.01
Shutdown Supply Current
ESD PERFORMANCE
RS-485 Pins (Y, Z)
1.8V ≤ V ≤ 3.6V, DE = 0V, DI = 0V or V
CC CC
SHDN
Human Body Model, from bus pins to GND
IEC61000 Contact, from bus pins to GND
HBM, per MIL-STD-883 Method 3015
Machine Model
25
25
25
25
-
-
-
-
±16.5
±7
-
-
-
-
kV
kV
kV
V
All Pins
±8
±400
DRIVER SWITCHING CHARACTERISTICS (ISL32613E, 128kbps Version)
Maximum Data Rate
f
t
t
V
= 1.8V
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
128
-
-
kbps
kbps
ns
MAX
CC
3V ≤ V ≤ 3.6V
256
-
-
CC
= 1.8V
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
C
C
C
= 50pF (Figure 3)
= 50pF (Figure 3)
= 50pF (Figure 3)
V
-
1700
1100
30
2600
1500
200
30
DD
D
D
D
CC
3V ≤ V ≤ 3.6V
-
ns
CC
= 1.8V
V
-
ns
DSK
CC
3V ≤ V ≤ 3.6V
-
2
ns
CC
= 1.8V
t , t
V
-
1600
960
460
460
60
2600
1500
800
800
250
250
ns
R
F
CC
3V ≤ V ≤ 3.6V
400
ns
CC
= 500Ω, C = 50pF, SW = GND (Figure 4)
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
t
t
t
t
R
R
R
R
-
-
-
-
ns
ZH
ZL
HZ
LZ
L
L
L
L
L
= 500Ω, C = 50pF, SW = V (Figure 4)
CC
ns
L
= 500Ω, C = 50pF, SW = GND (Figure 4)
ns
L
= 500Ω, C = 50pF, SW = V (Figure 4)
CC
60
ns
L
DRIVER SWITCHING CHARACTERISTICS (ISL32614E, 256kbps Version)
Maximum Data Rate
f
t
t
R
= ∞, C = 50pF
V
= 1.8V
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
256
-
-
kbps
kbps
ns
MAX
D
D
CC
3V ≤ V ≤ 3.6V
500
-
-
CC
= 1.8V
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
R
= ∞, C = 50pF
V
-
700
350
30
2000
500
200
30
DD
D
D
CC
(Figure 3)
3V ≤ V ≤ 3.6V
-
ns
CC
= 1.8V
R
= ∞, C = 50pF
V
-
ns
DSK
D
D
CC
(Figure 3)
3V ≤ V ≤ 3.6V
-
2
ns
CC
= 1.8V
t , t
R
= ∞, C = 50pF
V
-
1700
350
460
460
60
2600
800
800
800
250
250
ns
R
F
D
D
CC
(Figure 3)
3V ≤ V ≤ 3.6V
200
ns
CC
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
NOTES:
t
t
t
t
R
R
R
R
= 500Ω, C = 50pF, SW = GND (Figure 4)
-
-
-
-
ns
ZH
ZL
HZ
LZ
L
L
L
L
L
= 500Ω, C = 50pF, SW = V (Figure 4)
CC
ns
L
= 500Ω, C = 50pF, SW = GND (Figure 4)
ns
L
= 500Ω, C = 50pF, SW = V (Figure 4)
CC
60
ns
L
7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified.
8. Applies to peak current. See “Typical Performance Curves” on page 8 for more information.
9. If the Driver Enable function is not needed, connect DE to V through a 1kΩ to 2kΩ resistor.
CC
10. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design.
FN7906.0
August 30, 2011
5
ISL32613E, ISL32614E
Test Circuits and Waveforms
R /2
L
DE
DI
V
CC
Z
Y
V
D
OD
R /2
L
V
OC
FIGURE 2. DC DRIVER TEST CIRCUITS
V
CC
DI
50%
SD1
50%
SD2
0V
t
t
DE
DI
V
CC
V
V
OH
OUT (Z)
Z
Y
50%
50%
R
C
D
D
D
OUT (Y)
OL
t
t
DDHL
DDLH
SIGNAL
GENERATOR
+V
OD
90%
50%
10%
90%
50%
10%
DIFF OUT (Y - Z)
-V
OD
t
t
R
F
t
= |t
- t
SD1(Y) SD2(Y)
| OR |t
- t
|
t
= |t
DSK
- t |
DDLH DDHL
SSK
SD1(Z) SD2(Z)
FIGURE 3A. TEST CIRCUIT
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
DI
V
CC
Z
Y
DE
500Ω
50%
50%
HZ
V
CC
D
0V
GND
SW
SIGNAL
GENERATOR
50pF
t
t
t
t
ZH
ZL
OUTPUT HIGH
50%
V
OH
V
OH
- 0.25V
OUT (Y, Z)
OUT (Y, Z)
0V
PARAMETER
OUTPUT
Y/Z
DI
SW
GND
t
1/0
0/1
1/0
0/1
LZ
HZ
V
V
CC
OL
t
Y/Z
V
LZ
CC
50%
t
Y/Z
GND
V
OL
+ 0.25V
ZH
OUTPUT LOW
t
Y/Z
V
CC
ZL
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER ENABLE AND DISABLE TIMES
FN7906.0
August 30, 2011
6
ISL32613E, ISL32614E
Application Information
Driver Features
ESD Protection
These transmitters are differential output devices that operate
All pins on these devices include class 3 (8kV) Human Body
Model (HBM) ESD protection structures, but the driver outputs
incorporate advanced structures that allow them to survive ESD
events in excess of ±16.5kV HBM and ±7kV to the IEC61000
contact test method. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect to an
exposed port on the exterior of the finished product. Simply
touching the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether it is powered up or not,
and without degrading the common mode range. This built-in
ESD protection eliminates the need for board-level protection
structures (e.g., transient suppression diodes) and the
with V as low as 1.8V, and up to 3.6V. Devices are RS-485
CC
compliant with V ≥ 3V, but significant power savings are
CC
obtained by operating at V = 1.8V.
CC
The transmitter outputs are tri-statable via the active high DE
input. If the Tx enable function is not needed, tie DE to V
CC
through a 1kΩ to 2kΩ resistor. Outputs are slew rate limited to
minimize EMI, and to reduce reflections in unterminated or
improperly terminated networks.
1.8V Operation
The ISL32613E and ISL32614E operate with V as low as 1.8V.
CC
When coupled with the ISL32610E or ISL32611E 1.8V receivers,
they provide a differential communication link optimized for very
low power, and for slow data rates. Figures 7 and 8 illustrate the
static and dynamic power savings from using these transmitters
associated, undesirable capacitive load they present.
Driver Overload Protection
The driver output stages incorporate short-circuit, current-limiting
circuitry, which ensures that the output current never exceeds the
at low supply voltages. With V = 1.8V rather than 3.3V, using
CC
the ISL32613E at 128kbps reduces the operating supply current
from 9.9mA to 56µA (a factor of 177)!
RS-485 specification over a ±2V (-7V to +12V for V ≥ 2.7V)
CC
common mode voltage range.
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD or parasitic diodes to
In the event of a major short-circuit condition, the device also
includes a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This eliminates
power dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops by about
+20°C. If the condition persists, the thermal shutdown/re-enable
cycle repeats until the fault is cleared.
V
, so they withstand input voltages exceeding 5.5V, regardless
CC
of the V voltage.
CC
Hot Plug Function
When a piece of equipment powers up, there is a period of time
during which the processor or ASIC driving the RS-485 control
line (DE) is unable to ensure that the RS-485 Tx outputs are kept
disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, these transmitters incorporate a “Hot Plug”
Low Power Shutdown Mode
This BiCMOS transmitter uses a fraction of the power required by
its bipolar counterparts, but it also includes a shutdown feature
that reduces the already low quiescent I to a 10nA trickle. This
CC
device enters shutdown whenever the driver disables (DE = GND).
function. During power-up, circuitry monitoring V ensures that the
CC
Tx outputs remain disabled for a period of time, regardless of the
state of DE. This gives the processor/ASIC a chance to stabilize and
drive the control lines to the proper states.
FN7906.0
August 30, 2011
7
ISL32613E, ISL32614E
Typical Performance Curves
V
= 1.8V, T = +25°C; Unless Otherwise Specified.
A
CC
18
16
14
12
10
8
60
50
40
30
20
10
0
DE = V
CC
+25°C
+85°C
R
= 120Ω
D
6
4
+125°C
+25°C
1.0
R
= 1kΩ
D
2
0
-40
-15
10
35
60
85
110 125
0
0.2
0.4
0.6
0.8
1.2
1.4
1.6
1.8
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 5. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 6. STATIC SUPPLY CURRENT vs TEMPERATURE
10m
R
= ∞, C = 50pF
R = ∞, C = 50pF
D D
D
D
10m
1m
256kbps
128kbps
128kbps
1m
100µ
10µ
56kbps
56kbps
9.6kbps
9.6kbps
100µ
10µ
1.8
2
2.2
2.4
2.6
2.8
(V)
3
3.2
3.4
3.6
1.8
2
2.2
2.4
2.6
2.8
(V)
3
3.2
3.4
3.6
V
V
CC
CC
FIGURE 7. ISL32613E DYNAMIC SUPPLY CURRENT vs SUPPLY
VOLTAGE AT DIFFERENT DATA RATES
FIGURE 8. ISL32614E DYNAMIC SUPPLY CURRENT vs SUPPLY
VOLTAGE AT DIFFERENT DATA RATES
100
80
-40°C
+25°C
60
+125°C
40
20
Y OR Z = LOW
0
+125°C
-40°C
Y OR Z = HIGH
-1.5 -1.0
-20
-2.0
-0.5
0
0.5
1.0
1.5
2.0
OUTPUT VOLTAGE (V)
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE
FN7906.0
August 30, 2011
8
ISL32613E, ISL32614E
Typical Performance Curves
V
= 1.8V, T = +25°C; Unless Otherwise Specified. (Continued)
CC A
R
= 10kΩ, C = 50pF
D
R
= 10kΩ, C = 50pF
D
D
D
2
0
2
0
DI
DI
1.5
1
1.5
1
0.5
0
0.5
0
Y - Z
Y - Z
-0.5
-1
-0.5
-1
-1.5
-1.5
TIME (1µs/DIV)
TIME (1µs/DIV)
FIGURE 11. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW
FIGURE 10. ISL32613E DRIVER WAVEFORMS, LOW TO HIGH
R
= 10kΩ, C = 50pF
R = 10kΩ, C = 50pF
D D
D
D
2
0
2
0
DI
DI
1.5
1
1.5
1
0.5
0
0.5
0
Y - Z
Y - Z
-0.5
-1
-0.5
-1
-1.5
-1.5
TIME (400ns/DIV)
TIME (400ns/DIV)
FIGURE 12. ISL32614E DRIVER WAVEFORMS, LOW TO HIGH
FIGURE 13. ISL32614E DRIVER WAVEFORMS, HIGH TO LOW
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
PROCESS:
Si Gate BiCMOS
FN7906.0
August 30, 2011
9
ISL32613E, ISL32614E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to
make sure you have the latest revision.
DATE
REVISION
FN7906.0
CHANGE
August 30, 2011
Initial Release
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL32613E, ISL32614E
To report errors or suggestions for this datasheet, please go to: ww‘‘‘‘w.intersil.com/askourstaff
FITs are available from our website at: http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7906.0
August 30, 2011
10
ISL32613E, ISL32614E
Package Outline Drawing
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 4, 2/10
0-8°
0.08-0.22
1.90
0.95
D
A
6
5
4
1.60 +0.15/-0.10
3
2.80
3
(0.60)
PIN 1
INDEX AREA
1
2
3
0.20
2x
C
SEE DETAIL X
END VIEW
B
0.40 ±0.10
0.20 M
3
A-B
C
D
TOP VIEW
10° TYP
(2 PLCS)
3
2.90 ±0.10
(0.25)
GAUGE
PLANE
1.45 MAX
1.15 +0.15/-0.25
C
0.10
C
SEATING PLANE
0.00-0.15
0.45±0.1
4
SIDE VIEW
DETAIL "X"
(0.95)
(0.60)
(1.20)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
(2.40)
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. Dimension is exclusive of mold flash, protrusions or gate burrs.
4. Foot length is measured at reference to gauge plane.
Package conforms to JEDEC MO-178AB.
5.
TYPICAL RECOMMENDED LAND PATTERN
FN7906.0
August 30, 2011
11
相关型号:
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