ISL12058IBZ [INTERSIL]

Low Cost and Low Power I2C-Bus™ Real Time Clock/Calendar; 低成本和低功耗的I2C总线™实时时钟/日历
ISL12058IBZ
型号: ISL12058IBZ
厂家: Intersil    Intersil
描述:

Low Cost and Low Power I2C-Bus™ Real Time Clock/Calendar
低成本和低功耗的I2C总线™实时时钟/日历

外围集成电路 光电二极管 时钟
文件: 总19页 (文件大小:324K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL12058  
®
2
Low Cost and Low Power I C-Bus™ Real Time Clock/Calendar  
Data Sheet  
June 15, 2009  
FN6756.0  
Low Power and Low Cost RTC with Alarm  
Function  
Features  
• Real Time Clock/Calendar  
The ISL12058 device is a low power real time clock with  
clock/calendar, and alarm function.  
- Tracks Time in Hours, Minutes, and Seconds  
- Day of the Week, Date, Month, and Year  
The oscillator uses an external, low-cost 32.768kHz crystal.  
The real time clock tracks time with separate registers for  
hours, minutes, and seconds. The device has calendar  
registers for date, month, year and day of the week. The  
calendar is accurate through 2099, with automatic leap year  
correction.  
• 4 Selectable Frequency Outputs  
• 2 Alarms  
- Settable to the Second, Minute, Hour, Day of the Week,  
Date, or Month  
2
• I C Interface  
- 400kHz Data Transfer Rate  
• Small Package Options  
Pinouts  
- 8 Ld 2mmx2mm µTDFN Package  
- 8 Ld 3mmx3mm TDFN Package  
- 8 Ld MSOP Package  
ISL12058  
(8 LD SOIC, MSOP)  
TOP VIEW  
- 8 Ld SOIC Package  
X1  
X2  
1
2
3
4
8
7
6
5
V
DD  
- Pb-Free (RoHS Compliant)  
IRQ/F  
SCL  
OUT  
• Low Cost 3V Alternative to ISL1208 and ISL12082  
NC  
Applications  
GND  
SDA  
• Utility Meters  
• HVAC Equipment  
• Audio/Video Components  
• Set-Top Box/Television  
• Modems  
ISL12058  
(8 LD 2x2 µTDFN, 8 LD 3x3 TDFN)  
TOP VIEW  
• Network Routers, Hubs, Switches, Bridges  
• Cellular Infrastructure Equipment  
• Fixed Broadband Wireless Equipment  
• Pagers/PDA  
X1  
V
DD  
1
2
3
4
8
7
6
5
X2  
NC  
IRQ/F  
SCL  
OUT  
GND  
SDA  
• Point Of Sale Equipment  
Test Meters/Fixtures  
• Office Automation (Copiers, Fax)  
• Home Appliances  
• Computer Products  
• Other Industrial/Medical/Automotive  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2009. All Rights Reserved  
1
2
I C-busAll other trademarks mentioned are the property of their respective owners.  
ISL12058  
.
Ordering Information  
PART  
NUMBER  
PART  
MARKING  
V
RANGE  
(V)  
TEMP. RANGE  
(°C)  
PACKAGE  
(Pb-Free)  
PKG.  
DWG. #  
DD  
ISL12058IBZ (Note 1)  
12058 IBZ  
1.4 to 3.6  
1.4 to 3.6  
-40 to +85  
-40 to +85  
8 Ld SOIC  
M8.15  
ISL12058IBZ-T* (Note 1) 12058 IBZ  
8 Ld SOIC (Tape and Reel)  
M8.15  
ISL12058IUZ (Note 1)  
12058  
1.4 to 3.6  
1.4 to 3.6  
1.4 to 3.6  
1.4 to 3.6  
1.4 to 3.6  
-40 to +85  
-40 to +85  
-40 to +85  
-40 to +85  
-40 to +85  
8 Ld MSOP  
M8.118  
M8.118  
L8.3x3I  
L8.3x3I  
L8.2x2  
ISL12058IUZ-T* (Note 1) 12058  
ISL12058IRTZ (Note 1) 2058  
ISL12058IRTZ-T* (Note 1) 2058  
ISL12058IRUZ-T* (Note 2) 058  
8 Ld MSOP (Tape and Reel)  
8 Ld TDFN  
8 Ld TDFN (Tape and Reel)  
8 Ld µTDFN (Tape and Reel)  
*Please refer to TB347 for details on reel specifications.  
NOTES:  
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%  
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).  
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC  
J STD-020.  
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu  
plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free  
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
Block Diagram  
SDA  
SECONDS  
MINUTES  
HOURS  
SDA  
SCL  
BUFFER  
2
I C  
RTC  
CONTROL  
LOGIC  
INTERFACE  
SCL  
BUFFER  
DAY OF WEEK  
DATE  
X1  
X2  
CRYSTAL  
OSCILLATOR  
RTC  
DIVIDER  
MONTH  
YEAR  
V
DD  
POR  
FREQUENCY  
OUT  
ALARM1  
ALARM2  
CONTROL  
REGISTERS  
F
/
OUT  
IRQ  
INTERNAL  
SUPPLY  
FN6756.0  
June 15, 2009  
2
ISL12058  
Pin Descriptions  
PIN  
NUMBER  
SYMBOL  
DESCRIPTION  
1
X1  
The X1 pin is the input of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz  
quartz crystal.  
2
X2  
The X2 pin is the output of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz  
quartz crystal.  
3
4
5
NC  
No Connection. Can be connected to GND or left floating.  
Ground  
GND  
SDA  
Serial Data (SDA) is a bi-directional pin used to transfer serial data into and out of the device. It has an open drain  
output and may be wire OR’ed with other open drain or open collector outputs.  
6
7
SCL  
The Serial Clock (SCL) input is used to clock all serial data into and out of the device.  
IRQ/F  
OUT  
Interrupt Output /Frequency Output is a multi-functional pin that can be used as alarm interrupt or frequency output  
pin. The function is set via the configuration register. This pin is open drain and requires an external pull-up resistor. It  
has a default output of 32.768kHz at power-up.  
8
V
Power supply  
DD  
FN6756.0  
June 15, 2009  
3
ISL12058  
Absolute Maximum Ratings  
Thermal Information  
Voltage on V  
DD  
Pin (respect to GND) . . . . . . . . . . . . . . . -0.2V to 4V  
Thermal Resistance (Typical)  
θ
(°C/W)  
θ
(°C/W)  
JC  
JA  
8 Lead SOIC (Note 3) . . . . . . . . . . . . .  
8 Lead MSOP (Note 3). . . . . . . . . . . . .  
8 Lead µTDFN (Note 3) . . . . . . . . . . . .  
8 Lead TDFN (Notes 4, 5) . . . . . . . . . .  
120  
169  
160  
52  
N/A  
N/A  
N/A  
7
Voltage on IRQ/F  
OUT ,  
SCL and SDA Pins  
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 6V  
Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . -0.2V to 4V  
ESD Rating ((Per MIL-STD-883 Method 3014)  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C  
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below  
http://www.intersil.com/pbfree/Pb-FreeReflow.asp  
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV  
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>350V  
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and  
result in failures not covered by warranty.  
NOTES:  
3. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
4. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See  
JA  
Tech Brief TB379.  
5. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.  
JC  
DC Operating Characteristics – RTC Temperature = -40°C to +85°C unless otherwise stated.  
MIN  
TYP  
MAX  
SYMBOL  
PARAMETER  
Main Power Supply  
CONDITIONS  
(Note 8) (Note 7) (Note 8) UNITS  
NOTES  
V
1.8  
1.4  
3.6  
1.8  
950  
V
DD  
V
Timekeeping Power Supply  
Standby Supply Current  
V
DDT  
I
I
I
V
V
V
V
V
= 3.6V  
600  
500  
400  
350  
15  
nA  
nA  
nA  
nA  
µA  
6, 12  
6, 12  
6
DD1  
DD  
DD  
DD  
DD  
DD  
= 3.0V  
= 1.8V  
= 1.4V  
= 3.6V  
Timekeeping Current  
650  
40  
DD2  
DD3  
2
Supply Current With I C Active at  
Clock Speed of 400kHz  
I
Input Leakage Current on SCL  
I/O Leakage Current on SDA  
-100  
-100  
100  
100  
nA  
nA  
LI  
I
LO  
IRQ/F  
OUT  
V
Output Low Voltage  
V
= 1.8V, I = 3mA  
OL  
0.4  
V
OL  
DD  
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.  
MIN  
(Note 8)  
MAX  
TYP (Note 7) (Note 8) UNITS NOTES  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
SERIAL INTERFACE SPECS  
V
SDA and SCL Input Buffer LOW  
Voltage  
-0.3  
0.3 x V  
5.5  
V
V
IL  
DD  
V
SDA and SCL Input Buffer HIGH  
Voltage  
0.7 x V  
DD  
IH  
Hysteresis SDA and SCL Input Buffer  
Hysteresis  
0.04 x V  
V
DD  
V
Maximum Pull-up Voltage on SDA  
during I C Communication  
V
+ 2  
DD  
V
11  
PULLUP  
2
V
SDA Output Buffer LOW Voltage,  
Sinking 3mA  
V
> 1.8V, V  
DD PULLUP  
= 5.0V  
0
0.4  
V
OL  
Cpin  
SDA and SCL Pin Capacitance  
T
V
= +25°C, f = 1MHz, V  
= 5V,  
DD  
10  
pF  
kHz  
9, 10  
A
= 0V, V = 0V  
OUT  
IN  
f
SCL Frequency  
400  
SCL  
FN6756.0  
June 15, 2009  
4
ISL12058  
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified. (Continued)  
MIN  
MAX  
SYMBOL  
PARAMETER  
Pulse width Suppression Time at Any pulse narrower than the max  
SDA and SCL Inputs spec is suppressed  
SCL Falling Edge to SDA Output SCL falling edge crossing 30% of  
Data Valid , until SDA exits the 30% to  
TEST CONDITIONS  
(Note 8)  
TYP (Note 7) (Note 8) UNITS NOTES  
t
50  
ns  
IN  
t
900  
ns  
11  
AA  
V
DD  
70% of V  
window  
DD  
t
Time the Bus Must be Free Before SDA crossing 70% of V during a  
the Start of a New Transmission  
1300  
ns  
BUF  
DD  
STOP condition, to SDA crossing  
70% of V during the following  
DD  
START condition  
t
Clock LOW Time  
Measured at the 30% of V  
crossing  
1300  
600  
600  
600  
ns  
ns  
ns  
ns  
LOW  
DD  
DD  
t
Clock HIGH Time  
Measured at the 70% of V  
crossing  
HIGH  
t
START Condition Setup Time  
START Condition Hold Time  
SCL rising edge to SDA falling  
edge. Both crossing 70% of V  
SU:STA  
HD:STA  
DD  
From SDA falling edge crossing  
30% of V to SCL falling edge  
t
DD  
crossing 70% of V  
DD  
From SDA exiting the 30% to 70%  
of V window, to SCL rising edge  
t
Input Data Setup Time  
Input Data Hold Time  
100  
0
ns  
ns  
ns  
ns  
ns  
SU:DAT  
HD:DAT  
SU:STO  
HD:STO  
DD  
crossing 30% of V  
DD  
From SCL falling edge crossing  
30% of V to SDA entering the  
t
900  
DD  
30% to 70% of V  
window  
DD  
From SCL rising edge crossing  
70% of V , to SDA rising edge  
t
STOP Condition Setup Time  
STOP Condition Hold Time  
Output Data Hold Time  
600  
600  
0
DD  
crossing 30% of V  
DD  
t
From SDA rising edge to SCL  
falling edge. Both crossing 70% of  
V
DD  
From SCL falling edge crossing  
30% of V , until SDA enters the  
t
DH  
DD  
30% to 70% of V  
window  
DD  
t
SDA and SCL Rise Time  
SDA and SCL Fall Time  
From 30% to 70% of V  
From 70% to 30% of V  
20 + 0.1 x Cb  
300  
300  
400  
ns  
ns  
pF  
kΩ  
9, 10  
9, 10, 11  
9, 10  
R
DD  
DD  
t
20 + 0.1 x Cb  
F
Cb  
Capacitive Loading of SDA or SCL Total on-chip and off-chip  
10  
1
Rpu  
SDA and SCL Bus Pull-Up  
Resistor Off-Chip  
Maximum is determined by t and  
9, 10  
R
t .  
F
For Cb = 400pF, max is about  
2kΩ to~2.5kΩ.  
For Cb = 40pF, max is about 15kΩ  
to ~20kΩ  
NOTES:  
6. IRQ/F  
inactive.  
OUT  
7. Typical values are for T = +25°C and 3.3V supply voltage.  
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by  
characterization and are not production tested.  
9. Limits should be considered typical and are not production tested.  
2
10. These are I C specific parameters and are not production tested, however, they are used to set conditions for testing devices to  
validate specification.  
2
limit but the t and t in the I C parameters are not guaranteed.  
11. Parts will work with SDA pull-up voltage above the V  
12. Specified at +25°C.  
PULLUP  
AA  
F
FN6756.0  
June 15, 2009  
5
ISL12058  
SDA vs SCL Timing  
t
t
t
t
R
F
HIGH  
LOW  
SCL  
t
SU:DAT  
t
t
HD:DAT  
t
SU:STA  
SU:STO  
t
HD:STA  
SDA  
(INPUT TIMING)  
t
t
BUF  
DH  
t
AA  
SDA  
(OUTPUT TIMING)  
Symbol Table  
WAVEFORM  
INPUTS  
OUTPUTS  
Must be steady  
Will be steady  
May change  
from LOW  
to HIGH  
Will change  
from LOW  
to HIGH  
May change  
from HIGH  
to LOW  
Will change  
from HIGH  
to LOW  
Don’t Care:  
Changes Allowed  
Changing:  
State Not Known  
N/A  
Center Line is  
High Impedance  
EQUIVALENT AC OUTPUT LOAD CIRCUIT FOR V  
5.0V  
= 3.0V  
DD  
FOR V = 0.4V  
OL  
1533Ω  
AND I  
OL  
= 3mA  
SDA,  
IRQ/F  
OUT  
100pF  
FIGURE 1. STANDARD OUTPUT LOAD FOR TESTING THE  
DEVICE WITH V  
= 3.0V, V  
= 5.0V  
DD  
PULLUP  
FN6756.0  
June 15, 2009  
6
ISL12058  
Typical Performance Curves Temperature is +25°C unless otherwise specified  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1.0  
0.8  
0.6  
0.4  
0.2  
3.6  
3.0  
1.8  
1.4  
1.4  
1.9  
2.4  
V
2.9  
3.4  
-40  
-20  
0
20  
40  
60  
80  
(V)  
TEMPERATURE (°C)  
DD  
FIGURE 2. I  
DD1  
vs V  
DD  
FIGURE 3. I  
vs TEMPERATURE  
DD1  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
32769.0  
32768.8  
32768.6  
32768.4  
32768.2  
32768.0  
32767.8  
32767.6  
32767.4  
32767.2  
32767.0  
32768Hz  
8192Hz  
4096Hz  
1Hz  
1.4  
1.9  
2.4  
V
2.9  
3.4  
1.4  
1.9  
2.4  
V
2.9  
3.4  
(V)  
(V)  
DD  
DD  
FIGURE 4. I  
DD  
vs V  
vs F  
FIGURE 5. F  
OUT  
vs V  
WITH A TYPICAL 32.768kHZ CRYSTAL  
DD  
DD  
OUT  
Pin Descriptions  
General Description  
The ISL12058 device is a low power real time clock with  
clock/calendar, and alarm.  
X1, X2  
The X1 and X2 pins are the input and output, respectively, of  
an inverting amplifier. An external 32.768kHz quartz crystal  
is used with the ISL12058 to supply a timebase for the real  
time clock. Refer to Figure 6.  
The oscillator uses an external, low-cost 32.768kHz crystal.  
The real time clock tracks time with separate registers for  
hours, minutes, and seconds. The device has calendar  
registers for date, month, year and day of the week. The  
calendar is accurate through 2099, with automatic leap year  
correction.  
The device can also be driven directly from a 32.768kHz  
square wave source with peak to peak voltage from 0V to  
VDD at X1 pin with X2 pin floating.  
The ISL12058's flexible alarm can be set to any  
clock/calendar value for a match. For example, every  
minute, every Tuesday or at 5:23 AM on March 21. The  
alarm status is available by checking the Status Register, or  
the device can be configured to provide a hardware interrupt  
X1  
X2  
via the IRQ/F  
OUT  
pin.  
FIGURE 6. RECOMMENDED CRYSTAL CONNECTION  
FN6756.0  
June 15, 2009  
7
ISL12058  
IRQ/F  
(Interrupt Output/Frequency Output)  
Accuracy of the Real Time Clock  
OUT  
This dual function pin can be used as an interrupt or  
frequency output pin. The IRQ/F mode is selected via  
The accuracy of the Real Time Clock depends on the  
frequency of the quartz crystal that is used as the time base  
for the RTC. Since the resonant frequency of a crystal is  
temperature dependent, the RTC performance will also be  
dependent upon temperature. The frequency deviation of  
the crystal is a function of the turnover temperature of the  
crystal from the crystal’s nominal frequency. For example, a  
~20ppm frequency deviation translates into an accuracy of  
~1 minute per month. These parameters are available from  
the crystal manufacturer.  
OUT  
the IRQE bit of the control register (address 08h). The  
IRQ/F is an open drain output and requires the use of a  
OUT  
pull-up resistor, and it can accept a pull-up voltage up to  
5.5V.  
This pin has a default output of 32.768kHz at power-up.  
Interrupt Mode. The pin provides an interrupt signal  
output. This signal notifies a host processor that an alarm  
has occurred and requests action.  
Alarm Interrupt  
Frequency Output Mode. The pin outputs a clock signal  
which is related to the crystal frequency. The frequency  
output is user selectable and enabled via the I C bus.  
The alarm interrupt mode is enabled by setting IRQE bit to  
‘1’ with Alarm1 enables by setting ALM1E to ‘1’.  
2
The standard alarm allows for alarms of time, date, day of  
the week, month, and year. When a time alarm occurs, the  
Serial Clock (SCL)  
The SCL input is used to clock all serial data into and out of the  
device. The input buffer on this pin is always active (not gated).  
The SCL pin can accept a logic high voltage up to 5.5V.  
IRQ/F  
pin will be pulled low and the alarm interrupt bit  
OUT  
(A1F) will be set to “1”.  
NOTE: The A1F bit can be reset by the user or cleared automatically  
using the Auto Reset mode (see ARST bit, address 07h). Alarm2  
does not have hardware interrupt function.  
Serial Data (SDA)  
SDA is a bi-directional pin used to transfer data into and out  
of the device. It has an open drain output and may be ORed  
with other open drain or open collector outputs. The input  
buffer is always active (not gated) in normal mode.  
Frequency Output Mode  
The ISL12058 has the option to provide a frequency output  
signal using the IRQ/F  
pin. The frequency output mode  
OUT  
An open drain output requires the use of a pull-up resistor,  
and it can accept a pull-up voltage up to 5.5V. The output  
circuitry controls the fall time of the output signal with the use  
of a slope controlled pull-down. The circuit is designed for  
is set by using the FO bits to select 4 possible output  
frequency values from 1Hz to 32.768kHz. The IRQE bit must  
be set to ‘0’ for frequency output.  
2
I C Serial Interface  
2
400kHz I C interface speeds.  
2
The ISL12058 has an I C serial bus interface that provides  
NOTE: Parts will work with SDA pull-up voltage above the V  
PULLUP  
access to the real time clock registers, control and status  
2
limit but the t and t in the I C parameters are not guaranteed.  
AA  
F
2
registers and the alarm registers. The I C serial interface is  
2
V
, GND  
DD  
compatible with other industry I C serial bus protocols using  
a bi-directional data signal (SDA) and a clock signal (SCL).  
Chip power supply and ground pins. The device will have full  
operation with a power supply from 1.8V to 3.6V, and  
timekeeping function with a power supply from 1.4V to 3.6V.  
Register Descriptions  
The registers are accessible following a slave byte of  
“1101111x” and reads or writes to addresses [00h:1Fh]. The  
defined addresses and default values are described in  
Table 1. Address 15h to 1Fh are not used. Reads or writes to  
15h to 1Fh will not affect operation of the device but should  
be avoided. For Page Write and Page Read operation, the  
address will wrap around from address 1Fh to 00h.  
A 0.1µF decoupling capacitor is recommended on the V  
DD  
pin to ground.  
NC (No Connection)  
The NC pin is not connected to the die. The pin can be  
connected to GND or left floating.  
REGISTER ACCESS  
Functional Description  
The contents of the registers can be modified by performing  
a byte or a page write operation directly to any register  
address.  
Real Time Clock Operation  
The Real Time Clock (RTC) uses an external 32.768kHz quartz  
crystal to maintain an accurate internal representation of  
second, minute, hour, day of week, date, month, and year. The  
RTC also has leap-year correction. The RTC also corrects for  
months having fewer than 31 days and has a bit that controls  
24 hour or AM/PM format. When the ISL12058 powers up after  
The registers are divided into 3 sections. These are:  
1. Real Time Clock (7 bytes): Address 00h to 06h.  
2. Control and Status (2 bytes): Address 07h to 08h.  
3. Alarm1 and Alarm2 (9 bytes): Address 0Ch to 14h.  
There are no addresses above 1Fh.  
the loss of V , the clock will not begin incrementing until at  
DD  
least one byte is written to the clock register.  
FN6756.0  
June 15, 2009  
8
ISL12058  
TABLE 1. REGISTER MEMORY MAP  
BIT  
REG  
REG  
ADDR. SECTION  
NAME  
7
0
6
5
SC21  
MN21  
HR21  
DT21  
0
4
SC20  
MN20  
HR20  
DT20  
MO20  
YR20  
0
3
SC13  
MN13  
HR13  
DT13  
MO13  
YR13  
0
2
1
0
RANGE DEFAULT  
00h  
01h  
02h  
SC  
MN  
SC22  
SC12  
MN12  
HR12  
DT12  
MO12  
YR12  
DW12  
A1F  
IRQE  
0
SC11  
MN11  
HR11  
DT11  
MO11  
YR11  
DW11  
A2F  
0
SC10  
MN10  
HR10  
DT10  
MO10  
YR10  
DW10  
PF  
0 to 59  
0 to 59  
0 to 23  
1 to 31  
1 to 12  
0 to 99  
0 to 6  
N/A  
00h  
00h  
00h  
01h  
01h  
00h  
00h  
09h  
18h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
00h  
0
MN22  
HR  
MIL  
0
0
03h  
04h  
05h  
06h  
07h  
08h  
09h  
0Ah  
0Bh  
0Ch  
0Dh  
0Eh  
0Fh  
10h  
11h  
12h  
13h  
14h  
RTC  
DT  
0
MO  
0
0
YR  
YR23  
0
YR22  
YR21  
0
DW  
0
Status  
SR  
ARST  
0
XSTOP  
0
WRTC  
FO1  
0
OSF  
FO0  
0
Control  
INT  
ALM1E  
ALM2E  
0
A1E  
0
N/A  
Not Used  
Not Used  
Not Used  
A1SC  
A1MN  
A1HR  
A1DT  
A1MO  
A1DW  
A2MN  
A2HR  
A2DW/DT  
0
0
0
0
0
N/A  
0
0
0
0
0
0
0
N/A  
0
0
0
0
0
0
0
N/A  
A1M1  
A1M2  
A1M3  
A1M4  
A1M5  
A1M6  
A2M2  
A2M3  
A2M4  
A1SC22 A1SC21 A1SC20 A1SC13 A1SC12 A1SC11 A1SC10 00 to 59  
A1MN22 A1MN21 A1MN20 A1MN13 A1MN12 A1MN11 A1MN10 00 to 59  
A1MIL  
A1HR21 A1HR20 A1HR13 A1HR12 A1HR11 A1HR10 0 to 23  
A1DT21 A1DT20 A1DT13 A1DT12 A1DT11 A1DT10 1 to 31  
Alarm1  
Alarm2  
0
0
0
0
0
A1MO20 A1MO13 A1MO12 A1MO11 A1MO10 1 to 12  
A1DW12 A1DW11 A1DW10 0 to 6  
0
0
A2MN22 A2MN21 A2MN20 A2MN13 A2MN12 A2MN11 A2MN10 00 to 59  
A2MIL A2HR21 A2HR20 A2HR13 A2HR12 A2HR11 A2HR10 0 to 23  
A2DW/DT A2DT21 A2DT20 A2DT13 A2DT12 A2DT11 A2DT10 1 to 31  
A2DW12 A2DW11 A2DW10  
0 to 6  
Address 09h to 0Bh and 15h to 1Fh are not used. Reads or  
writes to these registers will not affect operation of the  
device but should be avoided.  
Real Time Clock Registers  
Addresses [00h to 06h]  
RTC REGISTERS (SC, MN, HR,DW, DT, MO, YR)  
A register can be read by performing a random read at any  
address at any time. This returns the contents of that register  
location. Additional registers are read by performing a  
sequential read. For the RTC registers, the read instruction  
latches all clock registers into a buffer, so an update of the  
clock does not change the time being read. A sequential  
read will not result in the output of data from the memory  
array. At the end of a read, the master supplies a stop  
condition to end the operation and free the bus. After a read  
or write instruction, the address remains at the previous  
address +1 so the user can execute a current address read  
and continue reading the next register.  
These registers depict BCD representations of the time. As  
such, SC (Seconds, address 00h) and MN (Minutes,  
address 01h) range from 0 to 59, HR (Hour, address 02h)  
can either be a 12-hour or 24-hour mode, DT (Date, address  
03h) is 1 to 31, MO (Month, address 04h) is 1 to 12, YR  
(Year, address 06h) is 0 to 99, and DW (Day of the Week,  
address 06h) is 0 to 6.  
The DW register provides a Day of the Week status and uses  
three bits DW2 to DW0 to represent the seven days of the  
week. The counter advances in the cycle 0-1-2-3-4-5-6-0-1-  
2-… The assignment of a numerical value to a specific day  
of the week is arbitrary and may be decided by the system  
software designer. The default value is defined as “0”.  
.
FN6756.0  
June 15, 2009  
9
ISL12058  
24 HOUR TIME  
ALARM2 INTERRUPT BIT (A2F)  
If the MIL bit of the HR register is “1”, the RTC uses a  
24-hour format. If the MIL bit is “0”, the RTC uses a 12-hour  
format and HR21 bit functions as an AM/PM indicator with a  
“1” representing PM. The clock defaults to 12-hour format  
time with HR21 = “0”.  
These bits announce if the Alarm2 matches the real time  
clock. If there is a match, the respective bit is set to “1”. This  
bit is manually reset to “0” by the user. A write to this bit in  
the SR can only set it to “0”, not “1”.  
OSCILLATOR FAIL BIT (OSF)  
If the A1HR and/or A2HR registers are used for alarm  
interrupt, the A1HR and/or A2HR registers must set to the  
same hour format as the HR register. For example, if the HR  
register is set to 24-hour format by setting the MIL bit to “1”,  
then the AxHR register must be set to 24-hour format with  
AxMIL bit set to “1”. If the hour format does not match  
between the HR register and the AxHR register, then the  
alarm interrupt will not trigger.  
Oscillator Fail Indicator bit (OSF). This bit is set to a “1” when  
there is no oscillation on X1 pin. The OSF bit can only be  
reset by having an oscillation on X1 and manually reset to  
“0” to reset it.  
WRITE RTC ENABLE BIT (WRTC)  
The WRTC bit enables or disables write capability into the  
RTC Timing Registers. The factory default setting of this bit  
is “0”. Upon initialization or power-up, the WRTC must be set  
to “1” to enable the RTC. Upon the completion of a valid  
write (STOP), the RTC starts counting. The RTC internal  
1Hz signal is synchronized to the STOP condition during a  
valid write cycle.  
LEAP YEARS  
Leap years add the day February 29 and are defined as those  
years that are divisible by 4. Years divisible by 100 are not leap  
years, unless they are also divisible by 400. This means that  
the year 2000 is a leap year, the year 2100 is not. The  
CRYSTAL OSCILLATOR ENABLE BIT (XSTOP)  
ISL12058 does not correct for the leap year in the year 2100.  
This bit enables/disables the internal crystal oscillator. When  
the XSTOP is set to “1”, the oscillator is disabled. The  
XSTOP bit is set to “0” on power-up for normal operation.  
Control and Status Registers  
Addresses [07h to 0Bh]  
AUTO RESET ENABLE BIT (ARST)  
The Control and Status Registers consist of the Status  
Register, Interrupt Register, and Alarm Registers.  
This bit enables/disables the automatic reset of the A1F and  
A2F status bits only. When ARST bit is set to “1”, these  
status bits are reset to “0” after a valid read of the respective  
status register (with a valid STOP condition). When the  
ARST is cleared to “0”, the user must manually reset the  
A1F and A2F bits.  
Status Register (SR) [Address 07h]  
The Status Register is located in the memory map at  
address 0Bh. This is a volatile register that provides either  
control or status of alarm interrupt and crystal oscillator  
enable. Refer to Table 2.  
Interrupt Control Register (INT) [Address 08h]  
TABLE 2. STATUS REGISTER (SR)  
TABLE 3. INTERRUPT CONTROL REGISTER (INT)  
ADDR  
07h  
7
6
5
0
0
4
3
2
1
0
ADDR  
08h  
Default  
7
0
0
6
ALM1E  
0
5
4
3
2
1
0
0
0
A1E  
0
ARST XSTOP  
WRTC OSF A1F A2F PF  
ALM2E FO1 FO0 IRQE  
Default  
0
0
0
1
0
0
1
0
1
1
0
NOTE: read operation will remain set after the read operation is  
complete.  
ALARM1 INTERRUPT ENABLE BIT (A1E)  
This bit enables the hardware interrupt function of ALARM1  
to IRQ/F pin. When A1E set to ‘1’, IRQE set to ‘1’ and  
POWER FAILURE BIT (PF)  
OUT  
This bit is set to a “1” after a total power failure. This is a read  
only bit that is set by hardware (ISL12058 internally) when  
the device powers up after having lost power to the device.  
On power-up after a total power failure, all registers are set  
to their default states. The first valid write to the RTC section  
after a complete power failure resets the PF bit to “0” (writing  
one RTC register is sufficient).  
ALM1E set to ‘1’, the IRQ/F  
pin will pull low when the  
OUT  
A1F bit is set by the ALARM1 interrupt.  
IRQ/F FUNCTION SELECTION BIT (IRQE)  
OUT  
This bit selects the function of the IRQ/F  
Table 4 for function selection of IRQ/F  
OUT  
pin. Refer to  
OUT  
PIN.  
TABLE 4. FUNCTION SELECTION OF IRQ/F  
A1E AND IRQE BITS  
PIN WITH  
OUT  
ALARM1 INTERRUPT BIT (A1F)  
These bits announce if the Alarm1 matches the real time  
clock. If there is a match, the respective bit is set to “1”. This  
bit is manually reset to “0” by the user. A write to this bit in  
the SR can only set it to “0”, not “1”.  
A1E  
0
IRQE  
IRQ/F FUNCTION  
OUT  
0
1
F
OUT  
0
High Impedance  
FN6756.0  
June 15, 2009  
10  
ISL12058  
TABLE 4. FUNCTION SELECTION OF IRQ/F  
A1E AND IRQE BITS (Continued)  
PIN WITH  
OUT  
TABLE 6. ALARM1 INTERRUPT WITH ENABLE BITS SELECTION  
ALARM1  
Interrupt  
A1E  
1
IRQE  
IRQ/F  
FUNCTION  
A1M1 A1M2 A1M3 A1M4 A1M5 A1M6  
OUT  
0
1
F
0
1
0
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
1
0
Every Second  
Match Second  
Match Minute  
Match Hour  
Match Date  
OUT  
1
Alarm 1 Interrupt  
FREQUENCY OUT CONTROL BITS (FO <1:0>)  
These bits select the output frequency at the IRQ/F  
IRQE must be set to “0” for frequency output at the  
pin.  
OUT  
IRQ/F  
OUT  
pin. Refer to Table 5 for frequency selection.  
Match Month  
Match Day  
TABLE 5. FREQUENCY SELECTION OF IRQ/F  
OUT  
PIN WITH  
FO1 AND FO0 BITS  
Match Second  
and Minute  
FREQUENCY,  
FO1  
FO0  
F
(Hz)  
COMMENT  
OUT  
1
1
0
1
1
1
0
0
0
0
0
0
Match Second  
and Hour  
1
1
0
0
1
0
1
0
32768  
8192  
4096  
1
Free running crystal clock  
Free running crystal clock  
Free running crystal clock  
Sync. at RTC write  
Match Second,  
Minute, and Hour  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
ALARM ENABLE BITS (ALM1E, ALM2E)  
0
0
0
1
1
1
Match Date,  
Month, and Day  
This bit enables/disables the Alarm1 and Alarm2 function.  
1
0
0
1
1
1
Match Second,  
Date, Month, and  
Day  
When the ALM1E bit is set to “1”, the Alarm1 function is  
enabled. When the ALM1E is cleared to “0”, the alarm function  
is disabled. ALM1E bit is set to “0” at power-up.  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
When the ALM2E bit is set to “1”, the Alarm2 function is  
enabled. When the ALM2E is cleared to “0”, the alarm function  
is disabled. ALM2E bit is set to “0” at power-up.  
0
1
1
1
1
1
1
Match MInute,  
Hour, Date,  
Month, and Day  
NOTE: The Alarm1 has hardware function via the IRQ/F  
Alarm2 does not have hardware interrupt function.  
pin.  
OUT  
1
1
1
1
1
Match Second,  
MInute, Hour,  
Date, Month, and  
Day  
Alarm1 Registers  
Addresses [Address 0Ch to 11h]  
The Alarm1 register bytes are set up identical to the RTC  
register bytes, except that the MSB of each byte functions as  
an enable bit (enable = “1”). These enable bits specify which  
alarm registers (seconds, minutes, etc) are used to make the  
comparison. Note that there is no alarm byte for year. When  
all the enable bits are set to “0” with ALM1E set to “1”, the  
Alarm 1 will triggered once a second.  
Following is example of Alarm1 Interrupt.  
Example – A single alarm will occur on January 1 at  
11:30am.  
A. Set Alarm1 registers as follows:  
The Alarm1 function works as a comparison between the  
Alarm1 registers and the RTC registers. As the RTC  
advances, the Alarm1 will be triggered once a match occurs  
between the Alarm1 registers and the RTC registers. Any  
one Alarm1 register, multiple registers, or all registers can be  
enabled for a match.  
To clear an Alarm1, the A1F status bit can be set to “0” with a  
write or use the ARST bit auto reset function.  
FN6756.0  
June 15, 2009  
11  
ISL12058  
TABLE 7. ALARM2 INTERRUPT WITH ENABLE BITS  
SELECTION  
BIT  
ALARM1  
REGISTER 7  
6
0
0
5
0
1
4
0
1
3
2
0
0
1
0
0
0
0
0
HEX  
DESCRIPTION  
A2DW/DT A2M2 A2M3 A2M4  
ALARM2 Interrupt  
Every Minute (Second=00)  
Match Minute  
A1SC  
A1MN  
0
1
0
0
00h Seconds disabled  
0
0
0
0
1
0
0
0
0
1
1
1
1
0
1
0
0
0
1
1
0
1
1
1
0
1
0
0
1
0
0
1
0
1
1
1
0
1
1
0
0
0
1
1
0
1
1
1
0
1
1
1
B0h Minutes set to 30,  
enabled  
A1HR  
A1DT  
A1MO  
A1DW  
1
1
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
91h Hours set to 11,  
enabled  
Match Hour  
Match Date  
81h Date set to 1,  
enabled  
Match Day  
81h Month set to 1,  
enabled  
Match Minute and Hour  
Match Minute and Date  
Match Hour and Date  
Match Minute, Hour, and Date  
Match Minute and Hour  
Match Minute and Day  
Match Hour and Day  
Match Minute, Hour, and Day  
00h Day of week  
disabled  
B. Also the ALME bit must be set as follows:  
BIT  
CONTROL  
REGISTER  
7
6
5
4
3
2
1
0
HEX DESCRIPTION  
INT  
0
1
x
x
x
1
0
1
45h Enable Alarm1,  
and Alarm1  
Interrupt to  
IRQ/F  
OUT  
Following is example of Alarm2 Interrupt.  
xx indicate other control bits and these bit can be set to 0 or  
1.  
Example – A single alarm will occur on every Monday at  
20:00 military time (Monday is when DW = 1).  
After these registers are set, the Alarm1 interrupt will be  
generated when the RTC advances to exactly 11:30am on  
January 1 (after seconds changes from 59 to 00) by setting  
the A1F bit in the status register to “1” and also bringing the  
A. Set Alarm registers as follows:  
BIT  
ALARM2  
REGISTER 7  
6
0
1
5
0
1
4
0
0
3
0
0
2
0
0
1
0
0
0
0
0
HEX  
DESCRIPTION  
IRQ/F  
OUT  
output low.  
A2MN  
A2HR  
0
1
00h Minutes disabled  
Alarm2 Registers  
E0h Hours set to 20,  
enabled  
Addresses [Address 12h to 14h]  
A2DW/DT  
1
1
0
0
0
0
0
1
C1h DaysettoMonday,  
enabled  
The Alarm2 register bytes are set up identical to the RTC  
register bytes except that the MSB of each byte functions as  
an enable bit (enable = “1”). These enable bits specify which  
alarm registers (minutes, hour, and date/day) are used to  
make the comparison. Note that there are no alarm bytes for  
second, month and year. When all the enable bits are set to  
“0” with ALM2E set to “1”, the Alarm2 will triggered once a  
minute when second hits “00”.  
After these registers are set, an alarm will be generated when  
the RTC advances to exactly 20:00 on Monday (after minutes  
changes from 59 to 00) by setting the A2F bit in the status  
register to “1”.  
2
I C Serial Interface  
The ISL12058 supports a bi-directional bus oriented  
protocol. The protocol defines any device that sends data  
onto the bus as a transmitter and the receiving device as the  
receiver. The device controlling the transfer is the master  
and the device being controlled is the slave. The master  
always initiates data transfers and provides the clock for  
both transmit and receive operations. Therefore, the  
ISL12058 operates as a slave device in all applications.  
The Alarm2 function works as a comparison between the  
Alarm2 registers and the RTC registers. As the RTC  
advances, the Alarm2 will be triggered once a match occurs  
between the Alarm2 registers and the RTC registers. Any  
one Alarm2 register, multiple registers, or all registers can be  
enabled for a match.  
To clear an Alarm2, the A2F status bit can be set to “0” with a  
write or use the ARST bit auto reset function.  
2
All communication over the I C interface is conducted by  
sending the MSB of each byte of data first.  
FN6756.0  
June 15, 2009  
12  
ISL12058  
operation or at the end of a write operation to memory only  
Protocol Conventions  
places the device in its standby mode.  
Data states on the SDA line can change only during SCL LOW  
periods. SDA state changes during SCL HIGH are reserved for  
indicating START and STOP conditions (see Figure 7). On  
power-up of the ISL12058, the SDA pin is in the input mode.  
An acknowledge (ACK) is a software convention used to  
indicate a successful data transfer. The transmitting device,  
either master or slave, releases the SDA bus after transmitting  
8 bits. During the ninth clock cycle, the receiver pulls the SDA  
line LOW to acknowledge the reception of the 8 bits of data  
(see Figure 8).  
2
All I C interface operations must begin with a START condition,  
which is a HIGH to LOW transition of SDA while SCL is HIGH.  
The ISL12058 continuously monitors the SDA and SCL lines  
for the START condition and does not respond to any  
command until this condition is met (see Figure 7). A START  
condition is ignored during the power-up sequence.  
The ISL12058 responds with an ACK after recognition of a  
START condition followed by a valid Identification Byte, and  
once again after successful receipt of an Address Byte. The  
ISL12058 also responds with an ACK after receiving a Data  
Byte of a write operation. The master must respond with an  
ACK after receiving a Data Byte of a read operation.  
2
All I C interface operations must be terminated by a STOP  
condition, which is a LOW to HIGH transition of SDA while SCL  
is HIGH (see Figure 7). A STOP condition at the end of a read  
SCL  
SDA  
DATA  
STABLE  
DATA  
CHANGE STABLE  
DATA  
START  
STOP  
FIGURE 7. VALID DATA CHANGES, START, AND STOP CONDITIONS  
SCL FROM  
MASTER  
1
8
9
SDA OUTPUT FROM  
TRANSMITTER  
HIGH IMPEDANCE  
HIGH IMPEDANCE  
SDA OUTPUT FROM  
RECEIVER  
START  
ACK  
FIGURE 8. ACKNOWLEDGE RESPONSE FROM RECEIVER  
FN6756.0  
June 15, 2009  
13  
ISL12058  
R/W BIT = “0”  
SIGNALS FROM  
THE MASTER  
S
T
A
R
T
S
T
O
P
LAST DATA  
BYTE  
IDENTIFICATION  
BYTE  
ADDRESS  
BYTE  
FIRST DATA  
BYTE  
SIGNAL AT SDA  
1 1 0 1 1 1 1 0  
A
C
K
A
C
K
A
C
K
SIGNALS FROM  
THE ISL12058  
A
C
K
A
C
K
FIGURE 9. SEQUENTIAL BYTE WRITE SEQUENCE  
Device Addressing  
Write Operation  
Following a start condition, the master must output a Slave  
Address Byte. The 7 MSBs of the Slave Address Byte are  
the device identifier bits, and the device identifier bits are  
“1101111”.  
A Write operation requires a START condition, followed by a  
valid Identification Byte, a valid Address Byte, a Data Byte,  
and a STOP condition. After each of the three bytes, the  
2
ISL12058 responds with an ACK. At this time, the I C  
interface enters a standby state.  
The last bit of the Slave Address Byte defines a read or write  
operation to be performed. When this R/W bit is a “1”, then a  
read operation is selected. A “0” selects a write operation  
(refer to Figure 10).  
Read Operation  
A Read operation consists of a three byte instruction  
followed by one or more Data Bytes (see Figure 11). The  
master initiates the operation issuing the following  
sequence: a START, the Identification byte with the R/W bit  
set to “0”, an Address Byte, a second START, and a second  
Identification byte with the R/W bit set to “1”. After each of  
the three bytes, the ISL12058 responds with an ACK. Then  
the ISL12058 transmits Data Bytes as long as the master  
responds with an ACK during the SCL cycle following the  
eighth bit of each byte. The master terminates the read  
operation (issuing a STOP condition) following the last bit of  
the last Data Byte (see Figure 11).  
After loading the entire Slave Address Byte from the SDA  
bus, the ISL12058 compares the device identifier bits with  
“1101111”. Upon a correct compare, the device outputs an  
acknowledge on the SDA line.  
Following the Slave Address Byte is a 1 byte register  
address. The register address is supplied by the master  
device. On power-up, the internal address counter is set to  
address 0h, so a current address read of the RTC array  
starts at address 0h. When required, as part of a random  
read, the master must supply the 1 Word Address Bytes as  
shown in Figure 11.  
The Data Bytes are from the memory location indicated by  
an internal pointer. This pointer’s initial value is determined  
by the Address Byte in the Read operation instruction, and  
increments by one during transmission of each Data Byte.  
After reaching the memory location 1Fh, the pointer “rolls  
over” to 00h, and the device continues to output data for  
each ACK received.  
In a random read operation, the slave byte in the “dummy  
write” portion must match the slave byte in the “read”  
section. For a random read of the Clock/Control Registers,  
the slave byte must be “1101111x” in both places.  
SLAVE  
ADDRESS BYTE  
1
1
1
R/W  
1
1
0
1
REGISTER  
ADDRESS  
A7  
D7  
A6  
D6  
A5  
D5  
A4  
D4  
A3  
D3  
A2  
D2  
A1  
D1  
A0  
D0  
DATA BYTE  
FIGURE 10. SLAVE ADDRESS, WORD ADDRESS, AND DATA  
BYTES  
FN6756.0  
June 15, 2009  
14  
ISL12058  
Application Section  
R/W BIT = “1”  
R/W BIT =“0”  
S
T
A
R
S
SIGNALS  
FROM THE  
MASTER  
S
T
O
P
T
A
R
T
IDENTIFICATION  
BYTE WITH  
R/W = 0  
IDENTIFICATION  
BYTE WITH  
A
C
K
A
C
K
ADDRESS  
BYTE  
R/W = 1  
T
SIGNAL AT  
SDA  
1 1 0 1 1 1 1 0  
1 1 0 1 1 1 1  
1
A
C
K
A
C
K
A
C
K
SIGNALS FROM  
THE SLAVE  
FIRST READ  
DATA BYTE  
LAST READ  
DATA BYTE  
FIGURE 11. MULTIPLE BYTES READ SEQUENCE  
Figure 12 shows a suggested layout for the ISL12058 device  
using a surface mount crystal. Two main precautions should  
be followed:  
Oscillator Crystal Requirements  
The ISL12058 uses a standard 32.768kHz crystal. Either  
through hole or surface mount crystals can be used. Table 8  
lists some recommended surface mount crystals and the  
parameters of each. This list is not exhaustive and other  
surface mount devices can be used with the ISL12058 if  
their specifications are very similar to the devices listed.  
The crystal should have a required parallel load capacitance  
of 12.5pF and an equivalent series resistance of less than  
50k. The crystal’s temperature range specification should  
match the application. Many crystals are rated for -10°C to  
+60°C (especially through-hole and tuning fork types), so an  
appropriate crystal should be selected if extended  
1. Do not run the serial bus lines or any high speed logic  
lines in the vicinity of the crystal. These logic level lines  
can induce noise in the oscillator circuit to cause  
misclocking.  
2. Add a ground trace around the crystal with one end  
terminated at the chip ground. This will provide  
termination for emitted noise in the vicinity of the RTC  
device.  
In addition, it is a good idea to avoid a ground plane under  
the X1 and X2 pins and the crystal, as this will affect the load  
capacitance and therefore the oscillator accuracy of the  
temperature range is required.  
circuit. If the IRQ/F  
pin is used as a clock, it should be  
.
OUT  
routed away from the RTC device as well. The traces for the  
pins can be treated as a ground, and should be routed  
TABLE 8. SUGGESTED SURFACE MOUNT CRYSTALS  
MANUFACTURER  
Citizen  
PART NUMBER  
CM200S  
V
DD  
around the crystal.  
MicroCrystal  
Raltron  
MS3V  
RSM-200S  
32S12  
SaRonix  
Ecliptek  
ECPSM29T-32.768K  
ECX-306  
ECS  
Fox  
FSM-327  
Layout Considerations  
The crystal input at X1 has a very high impedance, and  
oscillator circuits operating at low frequencies (such as  
32.768kHz) are known to pick up noise very easily if layout  
precautions are not followed. Most instances of erratic  
clocking or large accuracy errors can be traced to the  
susceptibility of the oscillator circuit to interference from  
adjacent high speed clock or data lines. Careful layout of the  
RTC circuit will avoid noise pickup and insure accurate  
clocking.  
FIGURE 12. SUGGESTED LAYOUT FOR ISL12058 AND  
FN6756.0  
June 15, 2009  
15  
ISL12058  
Mini Small Outline Plastic Packages (MSOP)  
N
M8.118 (JEDEC MO-187AA)  
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE  
INCHES  
MILLIMETERS  
E1  
E
SYMBOL  
MIN  
MAX  
MIN  
0.94  
0.05  
0.75  
0.25  
0.09  
2.95  
2.95  
MAX  
1.10  
0.15  
0.95  
0.36  
0.20  
3.05  
3.05  
NOTES  
A
A1  
A2  
b
0.037  
0.002  
0.030  
0.010  
0.004  
0.116  
0.116  
0.043  
0.006  
0.037  
0.014  
0.008  
0.120  
0.120  
-
-B-  
0.20 (0.008)  
INDEX  
AREA  
1 2  
A
B
C
-
-
TOP VIEW  
4X θ  
9
0.25  
(0.010)  
R1  
c
-
R
GAUGE  
PLANE  
D
3
E1  
e
4
SEATING  
PLANE  
L
0.026 BSC  
0.65 BSC  
-
-C-  
4X θ  
L1  
A
A2  
E
0.187  
0.016  
0.199  
0.028  
4.75  
0.40  
5.05  
0.70  
-
L
6
SEATING  
PLANE  
L1  
N
0.037 REF  
0.95 REF  
-
0.10 (0.004)  
-A-  
C
C
b
8
8
7
-H-  
A1  
e
R
0.003  
0.003  
-
-
0.07  
0.07  
-
-
-
D
0.20 (0.008)  
C
R1  
0
-
o
o
o
o
5
15  
5
15  
-
a
SIDE VIEW  
C
L
o
o
o
o
0
6
0
6
-
α
E
1
-B-  
Rev. 2 01/03  
0.20 (0.008)  
C
D
END VIEW  
NOTES:  
1. These package dimensions are within allowable dimensions of  
JEDEC MO-187BA.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs and are measured at Datum Plane. Mold flash, protrusion  
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.  
4. Dimension “E1” does not include interlead flash or protrusions  
- H -  
and are measured at Datum Plane.  
Interlead flash and  
protrusions shall not exceed 0.15mm (0.006 inch) per side.  
5. Formed leads shall be planar with respect to one another within  
0.10mm (0.004) at seating Plane.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.08mm (0.003 inch) total in excess  
of “b” dimension at maximum material condition. Minimum space  
between protrusion and adjacent lead is 0.07mm (0.0027 inch).  
- B -  
to be determined at Datum plane  
-A -  
10. Datums  
and  
.
- H -  
11. Controlling dimension: MILLIMETER. Converted inch dimen-  
sions are for reference only.  
FN6756.0  
June 15, 2009  
16  
ISL12058  
Package Outline Drawing  
L8.2x2  
8 Lead Ultra Thin Dual Flat No-Lead COL Plastic Package (UTDFN COL)  
Rev 3, 11/07  
2X  
1.5  
2.00  
A
PIN #1 INDEX AREA  
6
6
6X 0.50  
PIN 1  
INDEX AREA  
B
1
4
7X 0.4 ± 0.1  
1X 0.5 ±0.1  
2.00  
(4X)  
0.15  
8
5
0.10 M C A B  
0.25 +0.05 / -0.07  
TOP VIEW  
4
BOTTOM VIEW  
( 8X 0 . 25 )  
SEE DETAIL "X"  
( 1X 0 .70 )  
0 . 55 MAX  
C
0.10  
BASE PLANE  
SEATING PLANE  
C
0.08  
C
( 1 . 8 )  
SIDE VIEW  
0 . 2 REF  
C
( 7X 0 . 60 )  
0 . 00 MIN.  
0 . 05 MAX.  
( 6X 0 . 5 )  
DETAIL "X"  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.  
3.  
Unless otherwise specified, tolerance : Decimal ± 0.05  
4. Dimension b applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
Tiebar shown (if present) is a non-functional feature.  
5.  
6.  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
FN6756.0  
June 15, 2009  
17  
ISL12058  
Package Outline Drawing  
L8.3x3I  
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE  
Rev 1 6/09  
2X 1.950  
3.00  
A
6X 0.65  
B
5
8
(4X)  
0.15  
1.64 +0.10/ - 0.15  
6
PIN 1  
INDEX AREA  
6
PIN #1 INDEX AREA  
4
1
4
8X 0.30  
0.10 M C A B  
8X 0.400 ± 0.10  
TOP VIEW  
2.38  
+0.10/ - 0.15  
BOTTOM VIEW  
SEE DETAIL "X"  
( 2.38 )  
( 1.95)  
C
0.10  
C
Max 0.80  
0.08  
C
SIDE VIEW  
( 8X 0.60)  
(1.64)  
( 2.80 )  
PIN 1  
5
C
0 . 2 REF  
(6x 0.65)  
0 . 00 MIN.  
0 . 05 MAX.  
( 8 X 0.30)  
DETAIL "X"  
TYPICAL RECOMMENDED LAND PATTERN  
NOTES:  
1. Dimensions are in millimeters.  
Dimensions in ( ) for Reference Only.  
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.  
3.  
Unless otherwise specified, tolerance : Decimal ± 0.05  
4. Dimension applies to the metallized terminal and is measured  
between 0.15mm and 0.30mm from the terminal tip.  
Tiebar shown (if present) is a non-functional feature.  
5.  
6.  
The configuration of the pin #1 identifier is optional, but must be  
located within the zone indicated. The pin #1 identifier may be  
either a mold or mark feature.  
FN6756.0  
June 15, 2009  
18  
ISL12058  
Small Outline Plastic Packages (SOIC)  
M8.15 (JEDEC MS-012-AA ISSUE C)  
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE  
N
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0532  
0.0040  
0.013  
0.0688  
0.0098  
0.020  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0075  
0.1890  
0.1497  
0.0098  
0.1968  
0.1574  
-
-A-  
3
h x 45°  
D
4
-C-  
0.050 BSC  
1.27 BSC  
-
α
H
h
0.2284  
0.0099  
0.016  
0.2440  
0.0196  
0.050  
5.80  
0.25  
0.40  
6.20  
0.50  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C
A M B S  
N
α
8
8
7
NOTES:  
0°  
8°  
0°  
8°  
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 1 6/05  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006  
inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch).  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN6756.0  
June 15, 2009  
19  

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