ISL12025IVZ [INTERSIL]
Real-Time Clock/Calendar with EEPROM; 实时时钟/日历与EEPROM型号: | ISL12025IVZ |
厂家: | Intersil |
描述: | Real-Time Clock/Calendar with EEPROM |
文件: | 总27页 (文件大小:402K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISL12025
®
New Features
October 18, 2006
Data Sheet
FN6371.1
Real-Time Clock/Calendar with EEPROM
Features
The ISL12025 device is a low power real-time clock with
timing and crystal compensation, clock/calender, 64-bit
unique ID, power-fail indicator, two periodic or polled alarms,
intelligent battery backup switching, CPU Supervisor and
integrated 512 x 8-bit EEPROM, in a 16 Bytes per page
format.
• Real-Time Clock/Calendar
- Tracks Time in Hours, Minutes, and Seconds
- Day of the Week, Day, Month, and Year
• 64-bit Unique ID
• Two Non-Volatile Alarms
- Settable on the Second, Minute, Hour, Day of the Week,
Day, or Month
The oscillator uses an external, low-cost 32.768kHz crystal.
The real-time clock tracks time with separate registers for
hours, minutes, and seconds. The device has calendar
registers for date, month, year and day of the week. The
calendar is accurate through 2099, with automatic leap year
correction.
- Repeat Mode (periodic interrupts)
• Automatic Backup to Battery or SuperCap
• On-Chip Oscillator Compensation
- Internal Feedback Resistor and Compensation
Capacitors
Ordering Information
- 64 Position Digitally Controlled Trim Capacitor
PART
NUMBER
(Note)
TEMP.
RANGE PACKAGE DWG.
(°C) (Pb-Free)
PKG.
- 6 Digital Frequency Adjustment Settings to ±30ppm
PART
MARKING VOLTAGE
V
RESET
• 512 x 8 Bits of EEPROM
#
- 16-Bytes Page Write Mode (32 total pages)
- 8 Modes of Block Lock™ Protection
- Single Byte Write Capability
ISL12025IBZ 12025IBZ
ISL12025IVZ 2025IVZ
2.63V
2.63V
-40 to +85 8 Ld SOIC M8.15
-40 to +85 8 Ld TSSOP M8.173
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
• High Reliability
- Data Retention: 50 years
- Endurance: 2,000,000 Cycles Per Byte
2
• I C* Interface
- 400kHz Data Transfer Rate
Add “-T” suffix for tape and reel.
• 800nA Battery Supply Current
Pinouts
• Package Options
- 8 Ld SOIC and 8 Ld TSSOP Packages
ISL12025
(8 LD SOIC)
TOP VIEW
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
V
V
X1
X2
DD
1
2
8
7
6
5
BAT
• Utility Meters
SCL
SDA
RESET
GND
• Audio/Video Components
• Modems
3
4
• Network Routers, Hubs, Switches, Bridges
• Cellular Infrastructure Equipment
• Fixed Broadband Wireless Equipment
• Pagers/PDA
ISL12025
(8 LD TSSOP)
TOP VIEW
V
BAT
SCL
1
2
8
7
6
5
• POS Equipment
V
SDA
DD
X1
X2
• Test Meters/Fixtures
GND
3
4
RESET
• Office Automation (Copiers, Fax)
• Home Appliances
• Computer Products
• Other Industrial/Medical/Automotive
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
1
2
*I C is a Trademark of Philips. Copyright Intersil Americas Inc. 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL12025
Block Diagram
OSC Compensation
Frequency
X1
X2
Timer
Calendar
Logic
Battery
Switch
Circuitry
Time
V
V
DD
1Hz
Oscillator
32.768kHz
Keeping
Registers
(SRAM)
Divider
BAT
Status
Control/
Registers
(EEPROM)
Control
Decode
Logic
Compare
Serial
Interface
Decoder
Registers
SCL
SDA
Alarm
(SRAM)
Alarm Regs
(EEPROM)
8
4k
EEPROM
ARRAY
Watchdog
Timer
Low Voltage
Reset
RESET
Pin Descriptions
PIN NUMBER
SOIC
TSSOP
SYMBOL
BRIEF DESCRIPTION
1
3
X1
The X1 pin is the input of an inverting amplifier and is intended to be connected to one pin of an external
32.768kHz quartz crystal. X1 can also be driven directly from a 32.768kHz source.
2
3
4
5
X2
The X2 pin is the output of an inverting amplifier and is intended to be connected to one pin of an external
32.768kHz quartz crystal.
RESET
RESET. This is a reset signal output. This signal notifies a host processor that the “watchdog” time period
has expired or that the voltage has dropped below a fixed V
threshold. It is an open drain active LOW
TRIP
output. Recommended value for the pull-up resistor is 5kΩ, If unused, connect to ground.
4
5
6
7
GND
SDA
Ground.
Serial Data (SDA) is a bidirectional pin used to transfer serial data into and out of the device. It has an
open drain output and may be wire OR’ed with other open drain or open collector outputs.
6
7
8
8
1
2
SCL
The Serial Clock (SCL) input is used to clock all serial data into and out of the device. The input buffer on
this pin is always active (not gated).
V
This input provides a backup supply voltage to the device. V
supplies power to the device in the event
BAT
BAT
that the V
supply fails. This pin should be tied to ground if not used.
DD
V
Power Supply.
DD
FN6371.1
October 18, 2006
2
ISL12025
Absolute Maximum Ratings
Thermal Information
Voltage on V , V
, SCL, SDA, and RESET pins
Thermal Resistance (Note 2)
θ
(°C/W)
DD BAT
JA
(respect to ground). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on X1 and X2 pins
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . .
120
140
(respect to ground). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V
Latchup (Note 1) . . . . . . . . . . . . . . . . . . . Class II, Level B @ +85°C
ESD Rating (MIL-STD-883, Method 3014) . . . . . . . . . . . . . . .>±2kV
ESD Rating (Machine Model) . . . . . . . . . . . . . . . . . . . . . . . . .>175V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C
*CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: Using a max positive pulse of 8.35V on all pins except X1 and
X2, Using a max positive pulse of 2.75V on X1 and X2, and using a max negative pulse of -1V for all pins.
2. θJ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
A
DC Electrical Specifications Unless otherwise noted, V = +2.7V to +5.5V, T = -40°C to +85°C, Typical values are at T = +25°C
DD
A
A
and V
= 3.3V
DD
SYMBOL
PARAMETER
Main Power Supply
Backup Power Supply
CONDITIONS
MIN
2.7
TYP
MAX
5.5
UNIT
V
V
DD
V
1.8
5.5
V
BAT
Electrical Specifications
SYMBOL
PARAMETER
CONDITIONS
= 2.7V
MIN
TYP
MAX
UNIT
NOTES
2
I
I
I
Supply Current with I C Active
V
500
800
2.5
µA
µA
mA
mA
µA
µA
nA
3, 4, 5
DD1
DD2
DD3
DD
DD
DD
DD
DD
DD
BAT
V
= 5.5V
Supply Current for Non-Volatile
Programming
V
V
V
V
= 2.7V
= 5.5V
3, 4, 5
, 3
3.5
Supply Current for Main
Timekeeping (Low Power Mode)
= V
= V
= V
= V
= 2.7V
= 5.5V
10
5
SDA
SDA
SCL
SCL
20
I
Battery Supply Current
V
V
= 1.8V,
SDA
800
850
1000
3, 6, 7
BAT
= V
= V
= 0V
DD
SCL
SCL
V
V
= 3.0V,
1200
nA
BAT
DD
= V
= V
= 0V
SDA
I
Battery Input Leakage
V
= 5.5V, V = 1.8V
BAT
-100
1.8
100
2.6
nA
V
BATLKG
DD
V
V
Mode Threshold
Hysteresis
2.2
30
50
7
TRIP
BAT
V
V
mV
mV
V/ms
7, 10
7, 10
8
TRIPHYS TRIP
V
V
V
Hysteresis
BAT
BATHYS
V
Negative Slew rate
DD
10
DD SR-
RESET OUTPUT
V
Output Low Voltage
V
= 5.5V
0.4
0.4
400
V
V
OL
DD
= 3mA
I
OL
V
= 2.7V
DD
= 1mA
I
OL
I
Output Leakage Current
V
V
= 5.5V
100
nA
LO
DD
= 5.5V
OUT
FN6371.1
October 18, 2006
3
ISL12025
Watchdog Timer/Low Voltage Reset Parameters
TYP
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 5)
MAX
UNITS
ns
NOTES
t
V
Detect to RESET LOW
DD
500
250
9
RPD
t
Power-up Reset Time-Out Delay
100
1.0
400
ms
PURST
V
Minimum V
Output
for Valid RESET
DD
V
RVALID
V
ISL12025-4.5A Reset Voltage
Level
4.59
4.64
4.69
V
RESET
ISL12025 Reset Voltage Level
ISL12025-3 Reset Voltage Level
4.33
3.04
2.87
4.38
3.09
2.92
4.43
3.14
2.97
V
V
V
ISL12025-2.7A Reset Voltage
Level
ISL12025-2.7 Reset Voltage Level
Watchdog Timer Period
2.58
1.70
725
225
225
2.63
1.75
750
250
250
2.68
1.801
775
V
s
t
32.768kHz crystal between X1 and
X2
WDO
ms
ms
ms
275
t
Watchdog Timer Reset Time-Out 32.768kHz crystal between X1 and
275
RST
Delay
X2
2
t
I C Interface Minimum Restart
1.2
μs
RSP
Time
EEPROM SPECIFICATIONS
EEPROM Endurance
2,000,000
50
Cycles
Years
EEPROM Retention
Temperature ≤75°C
2
Serial Interface (I C) Specifications
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
V
SDA, and SCL Input Buffer LOW
Voltage
SBIB = 1 (Under V
mode)
mode)
mode)
-0.3
0.3 x V
DD
V
IL
DD
DD
DD
V
SDA, and SCL Input Buffer HIGH SBIB = 1 (Under V
Voltage
0.7 x V
V + 0.3
DD
V
V
IH
DD
Hysteresis SDA and SCL Input Buffer
Hysteresis
SBIB = 1 (Under V
0.05 x V
DD
V
I
SDA Output Buffer LOW Voltage
Input Leakage Current on SCL
I/O Leakage Current on SDA
I
= 4mA
= 5.5V
= 5.5V
0
0.4
V
OL
OL
V
V
0.1
0.1
10
10
μA
μA
LI
IN
IN
I
LO
TIMING CHARACTERISTICS
SCL Frequency
Pulse Width Suppression Time at Any pulse narrower than the max
f
400
50
kHz
ns
SCL
t
IN
SDA and SCL Inputs spec is suppressed.
t
SCL Falling Edge to SDA Output SCL falling edge crossing 30% of
Data Valid , until SDA exits the 30% to
900
ns
ns
AA
V
DD
70% of V
window.
DD
t
Time the Bus Must Be Free before SDA crossing 70% of V
the Start of a New Transmission
during a
1300
BUF
DD
STOP condition, to SDA crossing
70% of V during the following
DD
START condition.
FN6371.1
October 18, 2006
4
ISL12025
2
Serial Interface (I C) Specifications (Continued)
SYMBOL
PARAMETER
Clock LOW Time
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
t
Measured at the 30% of V
crossing.
1300
ns
LOW
DD
DD
t
Clock HIGH Time
Measured at the 70% of V
crossing.
600
600
600
ns
ns
ns
HIGH
t
START Condition Setup Time
START Condition Hold Time
SCL rising edge to SDA falling
edge. Both crossing 70% of V
SU:STA
HD:STA
.
DD
From SDA falling edge crossing
30% of V to SCL falling edge
t
t
DD
crossing 70% of V
.
DD
From SDA exiting the 30% to 70%
of V window, to SCL rising edge
Input Data Setup Time
Input Data Hold Time
100
0
ns
ns
ns
ns
ns
SU:DAT
HD:DAT
SU:STO
HD:STO
DD
crossing 30% of V
.
DD
From SCL falling edge crossing
70% of V to SDA entering the
t
DD
30% to 70% of V
window.
DD
From SCL rising edge crossing
70% of V , to SDA rising edge
t
STOP Condition Setup Time
600
600
0
DD
crossing 30% of V
.
DD
t
STOP Condition Hold Time for
Read, or Volatile Only Write
From SDA rising edge to SCL
falling edge. Both crossing 70% of
V
.
DD
From SCL falling edge crossing
30% of V , until SDA enters the
t
Output Data Hold Time
DH
DD
30% to 70% of V
window.
DD
t
SDA and SCL Rise Time
SDA and SCL Fall Time
From 30% to 70% of V
20 +
0.1 x Cb
250
250
ns
ns
R
DD
t
From 70% to 30% of V
20 +
F
DD
0.1 x Cb
Cb
Capacitive loading of SDA or SCL Total on-chip and off-chip
SDA, and SCL Pin Capacitance
10
400
10
pF
pF
ms
Cpin
t
Non-Volatile Write Cycle Time
12
20
10
WC
NOTES:
3. RESET Inactive (no reset).
4. V = V x 0.1, V = V
x 0.9, f = 400kHz.
SCL
IL IH
DD
DD
5. V
= 2.63V (VDD must be greater than V
), V
= 0V.
BAT
RESET
RESET
6. Bit BSW = 0 (Standard Mode), V
7. Specified at +25°C.
≥1.8V.
BAT
8. In order to ensure proper timekeeping, the V
9. Parameter is not 100% tested.
specification must be followed.
DD SR-
10. t
is the minimum cycle time to be allowed for any non-volatile Write by the user (it is the time from valid STOP condition at the end of Write
WC
sequence of a serial interface Write operation) to the end of the self-timed internal non-volatile write cycle.
FN6371.1
October 18, 2006
5
ISL12025
Timing Diagrams
t
t
t
t
R
F
HIGH
LOW
t
HD:STO
SCL
t
SU:DAT
t
t
HD:DAT
t
SU:STA
SU:STO
t
HD:STA
SDA
(INPUT TIMING)
t
t
BUF
DH
t
AA
SDA
(OUTPUT TIMING)
FIGURE 1. BUS TIMING
SCL
SDA
8TH BIT OF LAST BYTE
ACK
t
WC
STOP
START
CONDITION
CONDITION
FIGURE 2. WRITE CYCLE TIMING
t
t
>t
RSP
RSP WDO
t
RST
t
>t
RSP WDO
t
RST
t
<t
RSP WDO
SCL
SDA
RESET
START
STOP START
NOTE: ALL INPUTS ARE IGNORED DURING THE ACTIVE RESET PERIOD (t
).
RST
FIGURE 3. WATCHDOG TIMING
V
RESET
V
DD
t
t
PURST
PURST
t
RPD
t
F
t
R
RESET
V
RVALID
FIGURE 4. RESET TIMING
FN6371.1
October 18, 2006
6
ISL12025
Typical Performance Curves Temperature is +25°C unless otherwise specified
0.90
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
BSW = 0 or 1
SCL,SDA pullups = 0V
SCL,SDA pullups = 0V
BSW = 0 or 1
SCL,SDA pullups = Vbat
BSW = 0 or 1
1.8
2.3
2.8
3.3
3.8
4.3
4.8
5.3
1.80
2.30
2.80
3.30
3.80
4.30
4.80
5.30
Vbat (V)
Vbat(V)
FIGURE 5. I
vs V
SBIB = 0
FIGURE 6. I
vs V
SBIB = 1
BAT,
BAT
BAT,
BAT
5.00
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
Vdd=5.5V
Vbat = 3.0V
Vdd=3.3V
-45 -35 -25 -15
-5
5
15
25
35
45
55
65
75
85
-45 -35 -25 -15
-5
5
15
25
35
45
55
65
75
85
Temperature
Temperature
FIGURE 7. I
vs TEMPERATURE
FIGURE 8. I
vs TEMPERATURE
BAT
DD3
80
60
40
20
0
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
-20
-40
-32 -28 -24 -20 -16 -12 -8 -4
0
4
8
12 16 20 24 28
1.8
2.3
2.8
3.3
3.8
4.3
4.8
5.3
ATR setting
Vdd (V)
FIGURE 10. ΔF
vs ATR SETTING
FIGURE 9. I
DD3
vs V
DD
OUT
FN6371.1
October 18, 2006
7
ISL12025
Serial Data (SDA)
Description
SDA is a bidirectional pin used to transfer data into and out
of the device. It has an open drain output and may be wire
ORed with other open drain or open collector outputs. The
input buffer is always active (not gated).
The ISL12025 device is a Real-Time Clock with
clock/calendar, two polled alarms with integrated 512x8
EEPROM configured in 16 Bytes per page format, oscillator
compensation, CPU Supervisor (Power-on Reset, Low
Voltage Sensing and Watchdog Timer) and battery backup
switch.
This open drain output requires the use of a pull-up resistor.
The pull-up resistor on this pin must use the same voltage
source as V . The output circuitry controls the fall time of
The oscillator uses an external, low-cost 32.768kHz crystal.
All compensation and trim components are integrated on the
chip. This eliminates several external discrete components
and a trim capacitor, saving board area and component cost.
DD
the output signal with the use of a slope-controlled pull-
2
down. The circuit is designed for 400kHz I C interface
speed.
V
The Real-Time Clock keeps track of time with separate
registers for Hours, Minutes, Seconds. The Calendar has
separate registers for Date, Month, Year and Day-of-week.
The calendar is correct through 2099, with automatic leap
year correction.
BAT
This input provides a backup supply voltage to the device.
V
supplies power to the device in the event the V
BAT
DD
supply fails. This pin can be connected to a battery, a
SuperCap or tied to ground if not used.
The 64-bit unique ID is a random numbers programmed,
verified and Locked at the factory and it is only accessible for
reading and cannot be altered by the customer.
RESET
The RESET signal output can be used to notify a host
processor that the watchdog timer has expired or the V
DD
voltage supply has dipped below the V
threshold. It is
The Dual Alarms can be set to any Clock/Calendar value for
a match. For instance, every minute, every Tuesday, or 5:23
AM on March 21. The alarms can be polled in the Status
Register. There is a repeat mode for the alarms allowing a
periodic interrupt.
RESET
an open drain, active LOW output. Recommended value for
the pull-up resistor is 10kΩ. If unused it can be tied to
ground.
X1, X2
The ISL12025 device integrates CPU Supervisory functions
(POR, WDT) and Battery Switch. There is Power-On-Reset
(RESET) output with 250ms delay from power-on. It will also
The X1 and X2 pins are the input and output, respectively, of
an inverting amplifier. An external 32.768kHz quartz crystal
is used with the ISL12025 to supply a timebase for the
real-time clock. Internal compensation circuitry provides high
accuracy over the operating temperature range from
-40°C to +85°C. This oscillator compensation network can
be used to calibrate the crystal timing accuracy over
temperature either during manufacturing or with an external
temperature sensor and microcontroller for active
assert RESET when V
goes below the specified
DD
threshold is selectable via
threshold. The V
trip
VTS2/VTS1/VTS0 registers to five (5) preselected levels.
There is WatchDog Timer (WDT) with 3 selectable time-out
periods (0.25s, 0.75s and 1.75s) and disabled setting. The
WatchDog Timer activates the RESET pin when it expires.
compensation. X2 is intended to drive a crystal only, and
should not drive any external circuit (Figure 11).
The device offers a backup power input pin. This V
pin
BAT
allows the device to be backed up by battery or SuperCap.
The entire ISL12025 device is fully operational from 2.7 to
5.5V and the clock/calendar portion of the ISL12025 device
remains fully operational down to 1.8V (Standby Power
Mode).
NO EXTERNAL COMPENSATION RESISTORS OR
CAPACITORS ARE NEEDED OR ARE RECOMMENDED
TO BE CONNECTED TO THE X1 AND X2 PINS.
The ISL12025 device provides 4k bits of EEPROM with eight
modes of BlockLock™ control. The BlockLock allows a safe,
secure memory for critical user and configuration data, while
allowing a large user storage area.
X1
X2
FIGURE 11. RECOMMENDED CRYSTAL CONNECTION
Pin Descriptions
Real-Time Clock Operation
Serial Clock (SCL)
The Real-Time Clock (RTC) uses an external 32.768kHz
quartz crystal to maintain an accurate internal representation
of the second, minute, hour, day, date, month, and year. The
RTC has leap-year correction. The clock also corrects for
months having fewer than 31 days and has a bit that controls
The SCL input is used to clock all data into and out of the
device. The input buffer on this pin is always active (not
gated). The pull-up resistor on this pin must use the same
voltage source as V
.
DD
FN6371.1
October 18, 2006
8
ISL12025
24 hour or AM/PM format. When the ISL12025 powers up
after the loss of both V and V , the clock will not
operate until at least one byte is written to the clock register.
addresses from 0000h to 003Fh. The defined addresses are
described in the Table 2. Writing to and reading from the
undefined addresses are not recommended.
DD
BAT
Reading the Real-Time Clock
CCR Access
The RTC is read by initiating a Read command and
specifying the address corresponding to the register of the
Real-Time Clock. The RTC Registers can then be read in a
Sequential Read Mode. Since the clock runs continuously
and read takes a finite amount of time, there is a possibility
that the clock could change during the course of a read
operation. In this device, the time is latched by the read
command (falling edge of the clock on the ACK bit prior to
RTC data output) into a separate latch to avoid time changes
during the read operation. The clock continues to run.
Alarms occurring during a read are unaffected by the read
operation.
The contents of the CCR can be modified by performing a
byte or a page write operation directly to any address in the
CCR. Prior to writing to the CCR (except the status register),
however, the WEL and RWEL bits must be set using a three
step process (see “Writing to the Clock/Control Registers” on
page 13.)
The CCR is divided into 6 sections. These are:
1. Alarm 0 (8 bytes; non-volatile)
2. Alarm 1 (8 bytes; non-volatile)
3. Control (5 bytes; non-volatile)
4. Unique ID (8 bytes, non-volatile)
5. Real-Time Clock (8 bytes; volatile)
6. Status (1 byte; volatile)
Writing to the Real-Time Clock
The time and date may be set by writing to the RTC
registers. RTC Register should be written ONLY with Page
Write. To avoid changing the current time by an uncompleted
write operation, write to the all 8 bytes in one write operation.
When writing the RTC registers, the new time value is
loaded into a separate buffer at the falling edge of the clock
during the Acknowledge. This new RTC value is loaded into
the RTC Register by a stop bit at the end of a valid write
sequence. An invalid write operation aborts the time update
procedure and the contents of the buffer are discarded. After
a valid write operation, the RTC will reflect the newly loaded
data beginning with the next “one second” clock cycle after
the stop bit is written. The RTC continues to update the time
while an RTC register write is in progress and the RTC
continues to run during any non-volatile write sequences.
Each register is read and written through buffers. The non-
volatile portion (or the counter portion of the RTC) is updated
only if RWEL is set and only after a valid write operation and
stop bit. A sequential read or page write operation provides
access to the contents of only one section of the CCR per
operation. Access to another section requires a new
operation. A read or write can begin at any address in the
CCR.
It is not necessary to set the RWEL bit prior to writing the
status register. Section 5 (status register) supports a single
byte read or write only. Continued reads or writes from this
section terminates the operation.
The state of the CCR can be read by performing a random
read at any address in the CCR at any time. This returns the
contents of that register location. Additional registers are
read by performing a sequential read. The read instruction
latches all Clock registers into a buffer, so an update of the
clock does not change the time being read. A sequential
read of the CCR will not result in the output of data from the
memory array. At the end of a read, the master supplies a
stop condition to end the operation and free the bus. After a
read of the CCR, the address remains at the previous
address +1 so the user can execute a current address read
of the CCR and continue reading the next Register.
Accuracy of the Real-Time Clock
The accuracy of the Real-Time Clock depends on the
accuracy of the quartz crystal that is used as the time base
for the RTC. Since the resonant frequency of a crystal is
temperature dependent, the RTC performance will also be
dependent upon temperature. The frequency deviation of
the crystal is a function of the turnover temperature of the
crystal from the crystal’s nominal frequency. For example, a
>20ppm frequency deviation translates into an accuracy of
>1 minute per month. These parameters are available from
the crystal manufacturer. Intersil’s RTC family provides
on-chip crystal compensation networks to adjust
Real-Time Clock Registers (Volatile)
load-capacitance to tune oscillator frequency from -34ppm to
+80ppm when using a 12.5pF load crystal. For more detailed
information see the “Application Section” on page 21.
SC, MN, HR, DT, MO, YR: Clock/Calendar Registers
These registers depict BCD representations of the time. As
such, SC (Seconds) and MN (Minutes) range from 00 to 59,
HR (Hour) is 1 to 12 with an AM or PM indicator (H21 bit) or
0 to 23 (with MIL = 1), DT (Date) is 1 to 31, MO (Month) is 1
to 12, YR (Year) is 0 to 99.
Clock/Control Registers (CCR)
The Control/Clock Registers are located in an area separate
from the EEPROM array and are only accessible following a
slave byte of “1101111x” and reads or writes to addresses
[0000h:003Fh]. The clock/control memory map has memory
FN6371.1
October 18, 2006
9
ISL12025
DW: Day of the Week Register
OSCF: Oscillator Fail Indicator
This register provides a Day of the Week status and uses
three bits DY2 to DY0 to represent the seven days of the
week. The counter advances in the cycle
This bit is set to “1” if the oscillator is not operating. The bit is
set to “0” only if the oscillator is functioning. This bit is read
only, and is set/reset by hardware.
0-1-2-3-4-5-6-0-1-2-… The assignment of a numerical value
to a specific day of the week is arbitrary and may be decided
by the system software designer. The default value is
defined as ‘0’.
RWEL: Register Write Enable Latch
This bit is a volatile latch that powers up in the LOW
(disabled) state. The RWEL bit must be set to “1” prior to any
writes to the Clock/Control Registers. Writes to RWEL bit do
not cause a non-volatile write cycle, so the device is ready
for the next operation immediately after the stop condition. A
write to the CCR requires both the RWEL and WEL bits to be
set in a specific sequence.
Y2K: Year 2000 Register
Can have value 19 or 20. As of the date of the introduction of
this device, there would be no real use for the value 19 in a
true real-time clock, however.
24 Hour Time
WEL: Write Enable Latch
If the MIL bit of the HR register is 1, the RTC uses a 24-hour
format. If the MIL bit is 0, the RTC uses a 12-hour format and
H21 bit functions as an AM/PM indicator with a ‘1’,
representing PM. The clock defaults to standard time with
H21 = 0.
The WEL bit controls the access to the CCR during a write
operation. This bit is a volatile latch that powers up in the
LOW (disabled) state. While the WEL bit is LOW, writes to
the CCR address will be ignored, although acknowledgment
is still issued. The WEL bit is set by writing a “1” to the WEL
bit and zeroes to the other bits of the Status Register. Once
set, WEL remains set until either reset to 0 (by writing a “0”
to the WEL bit and zeroes to the other bits of the Status
Register) or until the part powers up again. Writes to WEL bit
do not cause a non-volatile write cycle, so the device is
ready for the next operation immediately after the stop
condition.
Leap Years
Leap years add the day February 29 and are defined as
those years that are divisible by 4.
Status Register (SR) (Volatile)
The Status Register is located in the CCR memory map at
address 003Fh. This is a volatile register only and is used to
control the WEL and RWEL write enable latches, read power
status and two alarm bits. This register is separate from both
the array and the Clock/Control Registers (CCR).
RTCF: Real-Time Clock Fail Bit
This bit is set to a ‘1’ after a total power failure. This is a read
only bit that is set internally when the device powers up after
having lost all power to the device (both V
and V
or V
BAT
= 0V).
is applied
DD
BAT
TABLE 1. STATUS REGISTER (SR)
The bit is set regardless of whether V
DD
ADDR
003Fh BAT AL1 AL0 OSCF
Default
7
6
5
4
3
0
0
2
1
0
first. The loss of only one of the supplies does not result in
setting the RTCF bit. The first valid write to the RTC after a
complete power failure (writing one byte is sufficient) resets
the RTCF bit to ‘0’.
RWEL WEL RTCF
0
0
0
0
0
0
1
Unused Bits:
BAT: Battery Supply
This bit set to “1” indicates that the device is operating from
, not V . It is a read-only bit and is set/reset by
Bit 3 in the SR is not used, but must be zero. The Data Byte
output during a SR read will contain a zero in this bit
location.
V
BAT DD
hardware (ISL12025 internally). Once the device begins
operating from V , the device sets this bit to “0”.
DD
AL1, AL0: Alarm Bits
These bits announce if either alarm 0 or alarm 1 match the
real-time clock. If there is a match, the respective bit is set to
‘1’. The falling edge of the last data bit in a SR Read
operation resets the flags. Note: Only the AL bits that are set
when an SR read starts will be reset. An alarm bit that is set
by an alarm occurring during an SR read operation will
remain set after the read operation is complete.
FN6371.1
October 18, 2006
10
ISL12025
TABLE 2. CLOCK/CONTROL MEMORY MAP
(Shaded cells indicate that NO other value is to be written to that bit. X indicates the bits are set according to the product variation
(see device ordering information). * indicates set at the factory, read-only)
BIT
REG
ADDR.
TYPE
NAME
7
6
5
4
3
2
1
0
RANGE
003F
0037
0036
0035
0034
0033
0032
0031
0030
0027
0026
0025
0024
0023
0022
0021
0020
0014
0013
0012
0011
0010
Status
SR
Y2K
DW
YR
BAT
0
AL1
0
AL0
Y2K21
0
OSCF
Y2K20
0
0
Y2K13
0
RWEL
0
WEL
0
RTCF
Y2K10
DY0
Y10
01h
20h
00h
00h
00h
01h
00h
00h
00h
*
RTC
(SRAM)
19/20
0-6
0
0
DY2
Y12
G12
D12
H12
M12
S12
ID72
ID62
ID52
ID42
ID32
ID22
ID12
ID02
VTS2
DTR2
ATR2
0
DY1
Y11
G11
D11
H11
M11
S11
ID71
ID61
ID51
ID41
ID31
ID21
ID11
ID01
VTS1
DTR1
ATR1
0
Y23
0
Y22
0
Y21
0
Y20
G20
D20
H20
M20
S20
ID74
ID64
ID54
ID44
ID34
ID24
ID14
ID04
0
Y13
G13
D13
H13
M13
S13
ID73
ID63
ID53
ID43
ID33
ID23
ID13
ID03
0
0-99
1-12
1-31
0-23
0-59
0-59
MO
DT
G10
D10
0
0
D21
H21
M21
S21
ID75
ID65
ID55
ID45
ID35
ID25
ID15
ID05
0
HR
MIL
0
0
H10
MN
SC
M22
S22
ID76
ID66
ID56
ID46
ID36
ID26
ID16
ID06
BSW
0
M10
S10
0
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
PWR
DTR
ATR
INT
BL
ID77
ID67
ID57
ID47
ID37
ID27
ID17
ID07
SBIB
0
ID70
ID60
ID50
ID40
ID30
ID20
ID10
ID00
VTS0
DTR0
ATR0
0
*
*
Device ID
*
*
*
*
*
Control
(EEPROM)
4Xh
00h
00h
00h
18h
0
0
0
0
0
ATR5
AL0E
BP0
ATR4
0
ATR3
0
IM
AL1E
BP1
BP2
WD1
WD0
0
0
0
000F
000E
000D
000C
000B
000A
0009
0008
0007
0006
0005
0004
0003
0002
0001
0000
Alarm1
(EEPROM)
Y2K1
0
0
0
A1Y2K21 A1Y2K20 A1Y2K13
0
0
A1Y2K10
DY0
19/20
0-6
20h
00h
DWA1 EDW1
YRA1
0
0
0
DY2
DY1
Unused - Default = RTC Year value (No EEPROM) - Future expansion
MOA1
DTA1
HRA1
MNA1
SCA1
Y2K0
EMO1
EDT1
EHR1
EMN1
ESC1
0
0
0
A1G20
A1D20
A1H20
A1M20
A1S20
A1G13
A1D13
A1H13
A1M13
A1S13
A1G12
A1D12
A1H12
A1M12
A1S12
0
A1G11
A1D11
A1H11
A1M11
A1S11
0
A1G10
A1D10
A1H10
A1M10
A1S10
A0Y2K10
DY0
1-12
1-31
0-23
0-59
0-59
19/20
0-6
00h
00h
00h
00h
00h
20h
00h
0
A1D21
A1H21
A1M21
A1S21
0
A1M22
A1S22
0
Alarm0
(EEPROM)
A0Y2K21 A0Y2K20 A0Y2K13
DWA0 EDW0
YRA0
0
0
0
0
DY2
DY1
Unused - Default = RTC Year value (No EEPROM) - Future expansion
MOA0
DTA0
HRA0
MNA0
SCA0
EMO0
EDT0
EHR0
EMN0
ESC0
0
0
0
A0G20
A0D20
A0H20
A0M20
A0S20
A0G13
A0D13
A0H13
A0M13
A0S13
A0G12
A0D12
A0H12
A0M12
A0S12
A0G11
A0D11
A0H11
A0M11
A0S11
A0G10
A0D10
A0H10
A0M10
A0S10
1-12
1-31
0-23
0-59
0-59
00h
00h
00h
00h
00h
A0D21
A0H21
A0M21
A0S21
0
A0M22
A0S22
FN6371.1
October 18, 2006
11
ISL12025
frequency compensation of the RTC. Each bit has a different
Alarm Registers (Non-Volatile)
weight for capacitance adjustment. For example, using a
Citizen CFS-206 crystal with different ATR bit combinations
provides an estimated ppm adjustment range from -34ppm
to +80ppm to the nominal frequency compensation.
Alarm0 and Alarm1
The alarm register bytes are set up identical to the RTC
register bytes, except that the MSB of each byte functions as
an enable bit (enable = “1”). These enable bits specify which
alarm registers (seconds, minutes, etc.) are used to make
the comparison. Note that there is no alarm byte for year.
X1
The alarm function works as a comparison between the
alarm registers and the RTC registers. As the RTC
C
X1
CRYSTAL
OSCILLATOR
advances, the alarm will be triggered once a match occurs
between the alarm registers and the RTC registers. Any one
alarm register, multiple registers, or all registers can be
enabled for a match. See “Device Operation” on page 13
and “Application Section” on page 21 for more information.
X2
C
X2
FIGURE 12. DIAGRAM OF ATR
Control Registers (Non-Volatile)
The Control Bits and Registers described under this section
are non-volatile.
The effective on-chip series load capacitance, C
,
LOAD
ranges from 4.5pF to 20.25pF with a mid-scale value of
12.5pF (default). C is changed via two digitally
LOAD
BL Register
controlled capacitors, C and C , connected from the X1
X1 X2
and X2 pins to ground (see Figure 12). The value of C and
X1
BP2, BP1, BP0 - Block Protect Bits
C
is given by the following formula:
X2
The Block Protect Bits, BP2, BP1 and BP0, determine which
blocks of the array are write protected. A write to a protected
block of memory is ignored. The block protect bits will
prevent write operations to one of eight segments of the
array. The partitions are described in Table 3.
C
= (16 ⋅ b5 + 8 ⋅ b4 + 4 ⋅ b3 + 2 ⋅ b2 + 1 ⋅ b1 + 0.5 ⋅ b0 + 9)pF
X
(EQ. 1)
The effective series load capacitance is the combination of
C
and C :
X2
TABLE 3.
X1
1
PROTECTED ADDRESSES
----------------------------------
C
=
LOAD
1
1
⎛
⎞
ISL12025
ARRAY LOCK
None
---------- ----------
+
⎝
⎠
(EQ. 2)
pF
C
C
X2
X1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
None (Default)
16 ⋅ b5 + 8 ⋅ b4 + 4 ⋅ b3 + 2 ⋅ b2 + 1 ⋅ b1 + 0.5 ⋅ b0 + 9
⎛
⎝
⎞
⎠
-----------------------------------------------------------------------------------------------------------------------------
180 – 1FF
Upper 1/4
C
=
h
h
h
h
h
h
LOAD
2
100 – 1FF
Upper 1/2
h
For example:
000 – 1FF
Full Array
h
C
C
C
(ATR = 00000) = 12.5pF,
(ATR = 100000) = 4.5pF, and
(ATR = 011111) = 20.25pF.
LOAD
LOAD
LOAD
000 – 03F
h
First 4 Pages
First 8 Pages
First 16 Pages
Full Array
000 – 07F
h
000 – 0FF
h
h
The entire range for the series combination of load
capacitance goes from 4.5pF to 20.25pF in 0.25pF steps.
Note that these are typical values.
000 – 1FF
h
h
Oscillator Compensation Registers
There are two trimming options.
DTR Register - DTR2, DTR1, DTR0: Digital
Trimming Register
- ATR. Analog Trimming Register
The digital trimming Bits DTR2, DTR1 and DTR0 adjust the
number of counts per second and average the ppm error to
achieve better accuracy.
- DTR. Digital Trimming Register
These registers are non-volatile. The combination of analog
and digital trimming can give up to -64ppm to +110ppm of
total adjustment.
DTR2 is a sign bit, where:
DTR2 = 0 means frequency compensation is >0.
DTR2 = 1 means frequency compensation is <0.
ATR Register - ATR5, ATR4, ATR3, ATR2, ATR1,
ATR0: Analog Trimming Register
DTR1 and DTR0 are scale bits. DTR1 gives 10ppm
adjustment and DTR0 gives 20ppm adjustment.
Six analog trimming bits, ATR0 to ATR5, are provided in
order to adjust the on-chip load capacitance value for
FN6371.1
October 18, 2006
12
ISL12025
A range from -30ppm to +30ppm can be represented by
using the three bits previously explained.
TABLE 5.
VTS0
VTS2
VTS1
V
RESET
TABLE 4. DIGITAL TRIMMING REGISTERS
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
4.64V
4.38V
3.09V
2.92V
2.63V
DTR REGISTER
ESTIMATED FREQUENCY
DTR2
DTR1
DTR0
PPM
0
0
0
0
1
1
1
1
0
1
0
1
0
1
0
1
0
0
1
1
0
0
1
1
0
+10
+20
+30
0
Unique ID Registers
There are eight register bytes for storing the device ID.
(Address 0020h to 0027h). Each device contains these
bytes to provide a unique 64-bit ID programmed and tested
in the factory before shipment. These registers are read-
only, intended for serialization of end equipment, and cannot
be changed or overwritten.
-10
-20
-30
Device Operation
PWR Register: SBIB, BSW, VTS2, VTS1, VTS0
SBIB: Serial Bus Interface (Enable)
Writing to the Clock/Control Registers
Changing any of the bits of the clock/control registers
requires the following steps:
The serial bus can be disabled in Battery Backup Mode by
setting this bit to “1”. This will minimize power drain on the
battery. The Serial Interface can be enabled in Battery
Backup Mode by setting this bit to “0” (default is “0”). See
“Power Control Operation” on page 14.
1. Write a 02h to the Status Register to set the Write Enable
Latch (WEL). This is a volatile operation, so there is no
delay after the write. (Operation preceded by a start and
ended with a stop).
BSW: Power Control Bit
2. Write a 06h to the Status Register to set both the Register
Write Enable Latch (RWEL) and the WEL bit. This is also
a volatile cycle. The zeros in the data byte are required.
(Operation proceeded by a start and ended with a stop).
The Power Control bit, BSW, determines the conditions for
switching between V
options.
and Back Up Battery. There are two
DD
Option 1. Standard: Set “BSW = 0”
Write all eight bytes to the RTC registers, or one byte to the
SR, or one to five bytes to the control registers. This
Option 2. Legacy /Default Mode: Set “BSW = 1”
See “Power Control Operation” on page 14 for more details.
sequence starts with a start bit, requires a slave byte of
“11011110” and an address within the CCR and is terminated
by a stop bit. A write to the EEPROM registers in the CCR
will initiate a non-volatile write cycle and will take up to 20ms
to complete. A write to the RTC registers (SRAM) will require
2
Also see “I C Communications During Battery Backup and
LVR Operation” on page 23 for important details.
VTS2, VTS1, VTS0: V
Select Bits
RESET
The ISL12025 is shipped with a default V
much shorter cycle time (t = t
). Writes to undefined areas
BUF
threshold
DD
) per the ordering information table. This register is
have no effect. The RWEL bit is reset by the completion of a
write to the CCR, so the sequence must be repeated to
again initiate another change to the CCR contents. If the
sequence is not completed for any reason (by sending an
incorrect number of bits or sending a start instead of a stop,
for example) the RWEL bit is not reset and the device
remains in an active mode. Writing all zeros to the status
register resets both the WEL and RWEL bits. A read
operation occurring between any of the previous operations
will not interrupt the register write operation.
(V
RESET
a non-volatile with no protection, therefore any writes to this
location can change the default value from that marked on
the package. If not changed with a non-volatile write, this
value will not change over normal operating and storage
conditions. However, ISL12025 has four (4) additional
selectable levels to fit the customers application. Levels are:
4.64V (default), 4.38V, 3.09V, 2.92V and 2.63V. The V
RESET
selection is via 3 bits (VTS2, VTS1 and VTS0). See Table 5.
Care should be taken when changing the V select
RESET
Alarm Operation
bits. If the V
voltage selected is higher than V , then
RESET
the device will go into RESET and unless V
DD
is increased,
Since the alarm works as a comparison between the alarm
registers and the RTC registers, it is ideal for notifying a host
processor of a particular time event and trigger some action
as a result. The host can be notified by polling the Status
Register (SR) Alarm bits. These two volatile bits (AL1 for
DD
the device will no longer be able to communicate using the
2
I C bus.
FN6371.1
October 18, 2006
13
ISL12025
Alarm 1 and AL0 for Alarm 0), indicate if an alarm has
happened. The AL1 and AL0 bits in the status register are
reset by the falling edge of the eighth clock of status register
read.
2. Other nonvolatile writes: It is possible to do writes of
less than an entire page, but the final byte must always
be addresses 0000h through 0004h or 0008h though
000Ch to trigger a nonvolatile write. Writing to those
blocks of 5 bytes sequentially, or individually, will trigger a
nonvolatile write. If the DWA0 or DWA1 registers need to
be set, then enough bytes will need to be written to
overlap with the other Alarm register and trigger the
nonvolatile write. For Example, if the DWA0 register is
being set, then the code can start with a multiple byte
write beginning at address 0006h, and then write 3 bytes
ending with the SCA1 register as follows:
There are two alarm operation modes: Single Event and
periodic Interrupt Mode:
1. Single Event Mode is enabled by setting the AL0E or
AL1E bit to “1”, the IM bit to “0”, and disabling the
frequency output. This mode permits a one-time match
between the alarm registers and the RTC registers. Once
this match occurs, the AL0 or AL1 bit is set to “1”. Once
the AL0 or AL1 bit is read, this will automatically resets it.
Both Alarm registers can be set at the same time to
trigger alarms. Polling the SR will reveal which alarm has
been set.
Addr Name
0006h DWA0
0007h Y2K0
0008h SCA1
2. Interrupt Mode (or “Pulsed Interrupt Mode” or PIM) is
enabled by setting the AL0E or AL1E bit to “1” the IM bit
to “1”, and disabling the frequency output. If both AL0E
and AL1E bits are set to 1, then only the AL0E PIM alarm
will function (AL0E overrides AL1E). This means that
once the Interrupt Mode alarm is set, it will continue to
alarm for each occurring match of the alarm and present
time. This mode is convenient for hourly or daily
hardware interrupts in microcontroller applications such
as security cameras or utility meter reading. Interrupt
Mode CANNOT be used for general periodic alarms,
however, since a specific time period cannot be
If the Alarm1 is used, SCA1 would need to have the correct
data written.
Power Control Operation
The power control circuit accepts a V
and a V input.
BAT
DD
Many types of batteries can be used with Intersil RTC
products. For example, 3.0V or 3.6V Lithium batteries are
appropriate, and battery sizes are available that can power
an Intersil RTC device for up to 10 years. Another option is
to use a SuperCap for applications where V
is interrupted
DD
for up to a month. See the “Application Section” on page 21
for more information.
programmed for interrupt, only matches to a specific time
of day. The Interrupt Mode is only stopped by disabling
the IM bit or the Alarm Enable bits.
There are two options for setting the change-over conditions
from V
to Battery Backup Mode. The BSW bit in the PWR
DD
Writing to the Alarm Registers
register controls this operation.
The Alarm Registers are non-volatile but require special
attention to insure a proper non-volatile write takes place.
Specifically, byte writes to individual registers are good for all
but registers 0006h and 0000Eh, which are the DWA0 and
DWA1 registers, respectively. Those registers will require a
special page write for nonvolatile storage. The
- Option 1 - Standard Mode
- Option 2 - Legacy Mode (Default)
2
Note that the I C bus may or may not be operational during
battery backup, which is controlled by the SBIB bit. See
“Backup Battery Operation” on page 22 for information.
recommended page write sequences are as follows:
Note that switching to battery backup initiates a
three-second timeout period, during which the device will
1. 16-byte page writes: The best way to write or update the
Alarm Registers is to perform a 16-byte write beginning at
address 0001h (MNA0) and wrapping around and ending
at address 0000h (SCA0). This will insure that non-
volatile storage takes place. This means that the code
must be designed so that the Alarm0 data is written
starting with Minutes register, and then all the Alarm1
data, with the last byte being the Alarm0 Seconds (the
page ends at the Alarm1 Y2k register and then wraps
around to address 0000h).
stay in Battery Backup Mode even if the V
resumes
DD
normal power. The three-second delay is intended to lock
out any power-up glitches that could cause communications
errors. Also note that very fast (<10µs) power ramp rates will
bypass this delay, so it is important to filter V
well.
DD
OPTION 1- STANDARD (POWER CONTROL) MODE
In the Standard Mode, the supply will switch over to the
battery when V
lower. In this mode, accidental operation from the battery is
drops below V
or V , whichever is
TRIP
BAT
DD
Alternatively, the 16-byte page write could start with
address 0009h, wrap around and finish with address
0008h. Note that any page write ending at address
0007h or 000Fh (the highest byte in each Alarm) will not
trigger a nonvolatile write, so wrapping around or
overlapping to the following Alarm's Seconds register is
advised.
prevented since the battery backup input will only be used
when the V
supply is shut off.
DD
To select Option 1, BSW bit in the Power Register must be
set to “BSW = 0”. A description of power switchover follows.
FN6371.1
October 18, 2006
14
ISL12025
whichever is the higher voltage. Care should be taken when
changing from Normal to Legacy Mode. If the V voltage is
Standard Mode Power Switchover
• Normal Operating Mode (V ) to Battery Backup Mode
BAT
DD
higher than V , then the device will enter battery back up
DD
(V
)
BAT
and unless the battery is disconnected or the voltage
To transition from the V
following conditions must be met:
to V mode, both of the
BAT
decreases, the device will no longer operate from V
.
DD
DD
To select the Option 2, BSW bit in the Power Register must
be set to “BSW = 1”.
- Condition 1:
V
< V - V
BAT BATHYS
DD
where V
• Normal Mode (V ) to Battery Backup Mode (V
DD
)
≈ 50mV
BAT
BATHYS
- Condition 2:
To transition from the V
DD
to V
BAT
mode, the following
V
< V
DD
TRIP
TRIP
conditions must be met:
where V
≈ 2.2V
V
< V - V
DD
BAT BATHYS
• Battery Backup Mode (V
BAT
) to Normal Mode (V
)
DD
• Battery Backup Mode (V
) to Normal Mode (V )
DD
BAT
The ISL12025 device will switch from the V
to V
BAT
DD
mode when one of the following conditions occurs:
The device will switch from the V
the following condition occurs:
to V mode when
DD
BAT
- Condition 1:
V
> V + V
BAT BATHYS
V
> V
BAT
+V
BATHYS
DD
where V
DD
≈ 50mV
BATHYS
- Condition 2:
The Legacy Mode power control conditions are illustrated in
Figure 15 below.
V
> V
+ V
DD
where V
TRIP TRIPHYS
≈ 30mV
TRIPHYS
V
DD
VOLTAGE
There are two discrete situations that are possible when
using Standard Mode: V < V and V >V .
TRIP
ON
V
BAT
TRIP
BAT
BAT
IN
These two power control situations are illustrated in
OFF
Figures 13 and 14.
BATTERY BACKUP
MODE
FIGURE 15. BATTERY SWITCHOVER IN LEGACY MODE
V
DD
Power-On Reset
V
TRIP
2.2V
1.8V
Application of power to the ISL12025 activates a
Power-On-Reset Circuit that pulls the RESET pin active.
This signal provides several benefits.
V
BAT
V
+ V
BATHYS
BAT
V
- V
BATHYS
BAT
- It prevents the system microprocessor from starting to
operate with insufficient voltage.
FIGURE 13. BATTERY SWITCHOVER WHEN V
< V
TRIP
BAT
- It prevents the processor from operating prior to
stabilization of the oscillator.
- It allows time for an FPGA to download its configuration
prior to initialization of the circuit.
BATTERY BACKUP
MODE
- It prevents communication to the EEPROM, greatly
reducing the likelihood of data corruption on power-up.
V
DD
V
BAT
3.0V
2.2V
When V
DD
exceeds the device V threshold value for
RESET
V
typically 250ms the circuit releases RESET, allowing the
system to begin operation. Recommended slew rate is
between 0.2V/ms and 50V/ms.
TRIP
V
V
+ V
TRIPHYS
TRIP
TRIP
Watchdog Timer Operation
The watchdog timer timeout period is selectable. By writing a
value to WD1 and WD0, the watchdog timer can be set to 3
different time out periods or off. When the Watchdog timer is
set to off, the watchdog circuit is configured for low power
operation. See Table 6.
FIGURE 14. BATTERY SWITCHOVER WHEN V
> V
TRIP
BAT
OPTION 2 - LEGACY (POWER CONTROL) MODE
(DEFAULT)
The Legacy Mode follows conditions set in X1226 products.
In this mode, switching from V to V is simply done by
DD BAT
comparing the voltages and the device operates from
FN6371.1
October 18, 2006
15
ISL12025
Clock and Data
TABLE 6.
Data states on the SDA line can change only during SCL
LOW. SDA state changes during SCL HIGH are reserved for
indicating start and stop conditions. See Figure 16.
WD1
WD0
DURATION
1
1
0
0
1
0
1
0
disabled
250ms
750ms
1.75s
Start Condition
All commands are preceded by the start condition, which is a
HIGH to LOW transition of SDA when SCL is HIGH. The
device continuously monitors the SDA and SCL lines for the
start condition and will not respond to any command until
this condition has been met. See Figure 17.
Watchdog Timer Restart
The Watchdog Timer is started by a falling edge of SDA
when the SCL line is high (START condition). The start
signal restarts the watchdog timer counter, resetting the
period of the counter back to the maximum. If another
START fails to be detected prior to the watchdog timer
expiration, then the RESET pin becomes active for one reset
time out period. In the event that the start signal occurs
during a reset time out period, the start will have no effect.
When using a single START to refresh watchdog timer, a
STOP condition should be followed to reset the device back
to Standby Power Mode. See Figure 3.
Stop Condition
All communications must be terminated by a stop condition,
which is a LOW to HIGH transition of SDA when SCL is
HIGH. The stop condition is also used to place the device
into the Standby Power Mode after a read sequence. A stop
condition can only be issued after the transmitting device
has released the bus. See Figure 17.
Acknowledge
Acknowledge is a software convention used to indicate
successful data transfer. The transmitting device, either
master or slave, will release the bus after transmitting eight
bits. During the ninth clock cycle, the receiver will pull the
SDA line LOW to acknowledge that it received the eight bits of
data. See Figure 18.
Low Voltage Reset (LVR) Operation
When a power failure occurs, a voltage comparator
compares the level of the V
line versus a preset threshold
DD
), then generates a RESET pulse if it is
voltage (V
RESET
below V
. The reset pulse will timeout 250ms after the
RESET
V
V
line rises above V
. If the V remains below
DD
DD
RESET
, then the RESET output will remain asserted low.
The device will respond with an acknowledge after
recognition of a start condition and if the correct Device
Identifier and Select bits are contained in the Slave Address
Byte. If a write operation is selected, the device will respond
with an acknowledge after the receipt of each subsequent
eight bit word. The device will not acknowledge if the slave
address byte is incorrect.
RESET
Power-up and power-down waveforms are shown in
Figure 4. The LVR circuit is to be designed so the RESET
signal is valid down to V
DD
= 1.0V.
When the LVR signal is active, unless the part has been
switched into the Battery Backup Mode, the completion of an
in-progress non-volatile write cycle is unaffected, allowing a
non-volatile write to continue as long as possible (down to
the Reset Valid Voltage). The LVR signal, when active, will
terminate any in-progress communications to the device and
prevents new commands from disrupting any current write
In the read mode, the device will transmit eight bits of data,
release the SDA line, then monitor the line for an
acknowledge. If an acknowledge is detected and no stop
condition is generated by the master, the device will continue
to transmit data. The device will terminate further data
transmissions if an acknowledge is not detected. The master
must then issue a stop condition to return the device to
Standby Power Mode and place the device into a known
state.
2
operations. See “I C Communications During Battery
Backup and LVR Operation” on page 23.
Serial Communication
Interface Conventions
2
The device supports the I C Protocol.
SCL
SDA
DATA STABLE
DATA CHANGE
DATA STABLE
FIGURE 16. VALID DATA CHANGES ON THE SDA BUS
FN6371.1
October 18, 2006
16
ISL12025
SCL
SDA
START
STOP
FIGURE 17. VALID START AND STOP CONDITIONS
SCL FROM
MASTER
1
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
START
ACKNOWLEDGE
FIGURE 18. ACKNOWLEDGE RESPONSE FROM RECEIVER
DEVICE IDENTIFIER
SLAVE ADDRESS BYTE
BYTE 0
ARRAY
CCR
1
1
0
1
1
0
0
1
1
1
1
0
R/W
A8
WORD ADDRESS 1
BYTE 1
0
0
0
0
0
0
WORD ADDRESS 0
BYTE 2
A7
D7
A6
D6
A5
D5
A4
D4
A3
D3
A2
D2
A1
D1
A0
D0
DATA BYTE
BYTE 3
FIGURE 19. SLAVE ADDRESS, WORD ADDRESS, AND DATA BYTES (64 BYTE PAGES)
Bit 3 through Bit 1 of the slave byte specify the device select
bits. These are set to ‘111’.
Device Addressing
Following a start condition, the master must output a Slave
Address Byte. The first four bits of the Slave Address Byte
specify access to either the EEPROM array or to the CCR.
Slave bits ‘1010’ access the EEPROM array. Slave bits
‘1101’ access the CCR.
The last bit of the Slave Address Byte defines the operation
to be performed. When this R/W bit is a one, then a read
operation is selected. A zero selects a write operation. See
Figure 19.
When shipped from the factory, EEPROM array is
UNDEFINED, and should be programmed by the customer
to a known state.
After loading the entire Slave Address Byte from the SDA
bus, the ISL12025 compares the device identifier and device
select bits with ‘1010111’ or ‘1101111’. Upon a correct
FN6371.1
October 18, 2006
17
ISL12025
compare, the device outputs an acknowledge on the SDA
line.
or page writes to trigger nonvolatile writes. See the Device
Operation section for more information.
Following the Slave Byte is a two byte word address. The
word address is either supplied by the master device or
obtained from an internal counter. On power-up the internal
address counter is set to address 0h, so a current address
read of the EEPROM array starts at address 0. When
required, as part of a random read, the master must supply
the 2 Word Address Bytes as shown in Figure 19.
Page Write
The ISL12025 has a page write operation. It is initiated in the
same manner as the byte write operation; but instead of
terminating the write cycle after the first data byte is
transferred, the master can transmit up to 15 more bytes to
the memory array and up to 7 more bytes to the clock/control
registers. The RTC registers require a page write (8 bytes),
individual register writes are not allowed. (Note: Prior to
writing to the CCR, the master must write a 02h, then 06h to
the status register in two preceding operations to enable the
write operation. See “Writing to the Clock/Control Registers”
on page 13.)
In a random read operation, the slave byte in the “dummy
write” portion must match the slave byte in the “read”
section. That is if the random read is from the array the slave
byte must be 1010111x in both instances. Similarly, for a
random read of the Clock/Control Registers, the slave byte
must be 1101111x in both places.
After the receipt of each byte, the ISL12025 responds with
an acknowledge, and the address is internally incremented
by one. The address pointer remains at the last address byte
written. When the counter reaches the end of the page, it
“rolls over” and goes back to the first address on the same
page. This means that the master can write 16 bytes to a
memory array page or 8 bytes to a CCR section starting at
any location on that page. For example, if the master begins
writing at location 10 of the memory and loads 15 bytes, then
the first 6 bytes are written to addresses 10 through 15, and
the last 6 bytes are written to columns 0 through 5.
Afterwards, the address counter would point to location 6 on
the page that was just written. If the master supplies more
than the maximum bytes in a page, then the previously
loaded data is over-written by the new data, one byte at a
time. See Figure 21.The master terminates the Data Byte
loading by issuing a stop condition, which causes the
ISL12025 to begin the non-volatile write cycle. As with the
byte write operation, all inputs are disabled until completion
of the internal write cycle. See Figure 22 for the address,
acknowledge, and data transfer sequence.
Write Operations
Byte Write
For a write operation, the device requires the Slave Address
Byte and the Word Address Bytes. This gives the master
access to any one of the words in the array or CCR.
(Note: Prior to writing to the CCR, the master must write a
02h, then 06h to the status register in two preceding
operations to enable the write operation. See “Writing to the
Clock/Control Registers” on page 13.) Upon receipt of each
address byte, the ISL12025 responds with an acknowledge.
After receiving both address bytes the ISL12025 awaits the
eight bits of data. After receiving the 8 data bits, the
ISL12025 again responds with an acknowledge. The master
then terminates the transfer by generating a stop condition.
The ISL12025 then begins an internal write cycle of the data
to the non-volatile memory. During the internal write cycle,
the device inputs are disabled, so the device will not respond
to any requests from the master. The SDA output is at high
impedance. See Figure 20.
Stops and Write Modes
A write to a protected block of memory is ignored, but will still
receive an acknowledge. At the end of the write command,
the ISL12025 will not initiate an internal write cycle, and will
continue to ACK commands.
Stop conditions that terminate write operations must be sent
by the master after sending at least 1 full data byte and its
associated ACK signal. If a stop is issued in the middle of a
data byte, or before 1 full data byte + ACK is sent, then the
ISL12025 resets itself without performing the write. The
contents of the array are not affected.
Byte writes to all of the nonvolatile registers are allowed,
except the DWAn registers which require multiple byte writes
S
T
A
R
T
SIGNALS FROM
THE MASTER
S
T
WORD
ADDRESS 1
WORD
ADDRESS 0
SLAVE
ADDRESS
O
DATA
P
SDA BUS
1
1 1 1 0
0 0 0 0 0 0 0
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS FROM
THE SLAVE
FIGURE 20. BYTE WRITE SEQUENCE
FN6371.1
October 18, 2006
18
ISL12025
6 BYTES
6 BYTES
ADDRESS
10
ADDRESS = 5
ADDRESS
15
ADDRESS POINTER ENDS
AT ADDR = 5
FIGURE 21. WRITING 12 BYTES TO A 16-BYTE MEMORY PAGE STARTING AT ADDRESS 10
1 ≤ n ≤ 16 for EEPROM array
1 ≤ n ≤ 8 for CCR
S
T
A
R
T
SIGNALS FROM
THE MASTER
S
T
O
P
WORD
ADDRESS 1
SLAVE
ADDRESS
WORD
ADDRESS 0
DATA
(1)
DATA
(n)
SDA BUS
1
1 1 1 0
0 0 0 0 0 0 0
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS FROM
THE SLAVE
FIGURE 22. PAGE WRITE SEQUENCE
acknowledge, then transmits eight data bits. The master
terminates the read operation by not responding with an
acknowledge during the ninth clock and issuing a stop
condition. See Figure 23 for the address, acknowledge, and
data transfer sequence.
Acknowledge Polling
Disabling of the inputs during non-volatile write cycles can
be used to take advantage of the typical 5ms write cycle
time. Once the stop condition is issued to indicate the end of
the master’s byte load operation, the ISL12025 initiates the
internal non-volatile write cycle. Acknowledge polling can
begin immediately. To do this, the master issues a start
condition followed by the Memory Array Slave Address Byte
for a write or read operation (AEh or AFh). If the ISL12025 is
still busy with the non-volatile write cycle, then no ACK will
be returned. When the ISL12025 has completed the write
operation, an ACK is returned and the host can proceed with
the read or write operation. See the flow chart in
S
S
T
O
P
T
A
R
T
SIGNALS FROM
THE MASTER
SLAVE
ADDRESS
SDA BUS
1
1 1 1 1
A
C
K
SIGNALS FROM
THE SLAVE
DATA
Figure 24. Note: Do not use the CCR Slave byte (DEh or
DFh) for Acknowledge Polling.
FIGURE 23. CURRENT ADDRESS READ SEQUENCE
Read Operations
There are three basic read operations: Current Address
Read, Random Read, and Sequential Read.
Current Address Read
Internally the ISL12025 contains an address counter that
maintains the address of the last word read incremented by
one. Therefore, if the last read was to address n, the next
read operation would access data from address n+1. On
power-up, the sixteen bit address is initialized to 0h. In this
way, a current address read immediately after the power-on
reset can download the entire contents of memory starting at
the first location. Upon receipt of the Slave Address Byte
with the R/W bit set to one, the ISL12025 issues an
FN6371.1
October 18, 2006
19
ISL12025
Byte with the R/W bit set to zero, the master must first
perform a “dummy” write operation.
Byte load completed
by issuing STOP.
Enter ACK Polling
The master issues the start condition and the slave address
byte, receives an acknowledge, then issues the word
address bytes. After acknowledging receipt of each word
address byte, the master immediately issues another start
condition and the slave address byte with the R/W bit set to
one. This is followed by an acknowledge from the device and
then by the eight bit data word. The master terminates the
read operation by not responding with an acknowledge and
then issuing a stop condition. See Figure 25 for the address,
acknowledge, and data transfer sequence.
Issue START
Issue Memory Array Slave
Address Byte
AFh (Read) or AEh (Write)
Issue STOP
NO
NO
ACK
returned?
In a similar operation called “Set Current Address,” the
device sets the address if a stop is issued instead of the
second start shown in Figure 25. The ISL12025 then goes
into Standby Power Mode after the stop and all bus activity
will be ignored until a start is detected. This operation loads
the new address into the address counter. The next Current
Address Read operation will read from the newly loaded
address. This operation could be useful if the master knows
the next address it needs to read, but is not ready for the
data.
YES
Non-volatile write
cycle complete. Continue
command sequence?
Issue STOP
YES
Continue normal
Read or Write
command
Sequential Read
sequence
Sequential reads can be initiated as either a current address
read or random address read. The first data byte is
transmitted as with the other modes; however, the master
now responds with an acknowledge, indicating it requires
additional data. The device continues to output data for each
acknowledge received. The master terminates the read
operation by not responding with an acknowledge and then
issuing a stop condition.
PROCEED
FIGURE 24. ACKNOWLEDGE POLLING SEQUENCE
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care.” To terminate a read operation,
the master must either issue a stop condition during the
ninth cycle or hold SDA HIGH during the ninth clock cycle
and then issue a stop condition.
The data output is sequential, with the data from address n
followed by the data from address n + 1. The address
counter for read operations increments through all page and
column addresses, allowing the entire memory contents to
be serially read during one operation. At the end of the
address space the counter “rolls over” to the start of the
address space and the ISL12025 continues to output data
for each acknowledge received. See Figure 26 for the
acknowledge and data transfer sequence.
Random Read
Random read operations allow the master to access any
location in the ISL12025. Prior to issuing the Slave Address
S
T
A
R
T
S
T
A
R
T
S
T
O
P
SIGNALS FROM
THE MASTER
SLAVE
ADDRESS
WORD
ADDRESS 0
SLAVE
ADDRESS
WORD
ADDRESS 1
SDA BUS
1
1 1 1 1
1
1 1 1 0
0 0 0 0 0 0 0
A
C
K
A
C
K
A
C
K
A
C
K
SIGNALS FROM
THE SLAVE
DATA
FIGURE 25. RANDOM ADDRESS READ SEQUENCE
FN6371.1
October 18, 2006
20
ISL12025
S
T
O
P
SLAVE
ADDRESS
A
C
K
A
C
K
A
C
K
SIGNALS FROM
THE MASTER
SDA BUS
1
A
C
K
SIGNALS FROM
THE SLAVE
DATA
(1)
DATA
(2)
DATA
(n-1)
DATA
(n)
(n is any integer greater than 1)
FIGURE 26. SEQUENTIAL READ SEQUENCE
-40 and +85°C. It is possible to address this variable drift by
adjusting the load capacitance of the crystal, which will result
in predictable change to the crystal frequency. The Intersil
RTC family allows this adjustment over temperature since
the devices include on-chip load capacitor trimming. This
control is handled by the Analog Trimming Register, or ATR,
which has 6 bits of control. The load capacitance range
covered by the ATR circuit is approximately 3.25pF to
18.75pF, in 0.25pF increments. Note that actual capacitance
would also include about 2pF of package related
Application Section
Crystal Oscillator and Temperature Compensation
Intersil has now integrated the oscillator compensation
circuity on-chip, to eliminate the need for external
components and adjust for crystal drift over temperature and
enable very high accuracy time keeping (<5ppm drift).
The Intersil RTC family uses an oscillator circuit with on-chip
crystal compensation network, including adjustable
load-capacitance. The only external component required is
the crystal. The compensation network is optimized for
operation with certain crystal parameters which are common
in many of the surface mount or tuning-fork crystals available
today. Table 7 summarizes these parameters.
capacitance. In-circuit tests with commercially available
crystals demonstrate that this range of capacitance allows
frequency control from +116ppm to -37ppm, using a 12.5pF
load crystal.
In addition to the analog compensation afforded by the
adjustable load capacitance, a digital compensation feature
is available for the Intersil RTC family. There are three bits
known as the Digital Trimming Register or DTR, and they
operate by adding or skipping pulses in the clock signal. The
range provided is ±30ppm in increments of 10ppm. The
default setting is 0ppm. The DTR control can be used for
coarse adjustments of frequency drift over temperature or for
crystal initial accuracy correction.
Table 8 contains some crystal manufacturers and part
numbers that meet the requirements for the Intersil RTC
products.
The turnover temperature in Table 7 describes the
temperature where the apex of the of the drift vs.
temperature curve occurs. This curve is parabolic with the
2
drift increasing as (T-T0) . For an Epson MC-405 device, for
example, the turnover temperature is typically +25°C, and a
peak drift of >110ppm occurs at the temperature extremes of
TABLE 7. CRYSTAL PARAMETERS REQUIRED FOR INTERSIL RTC’S
PARAMETER
MIN
TYP
MAX
UNITS
kHz
ppm
°C
NOTES
Frequency
32.768
Frequency Tolerance
±100
30
Down to 20ppm if desired
Turnover Temperature
20
25
Typically the value used for most crystals
Operating Temperature Range
Parallel Load Capacitance
Equivalent Series Resistance
-40
85
°C
12.5
pF
50
kΩ
For best oscillator performance
FN6371.1
October 18, 2006
21
ISL12025
TABLE 8. CRYSTAL MANUFACTURERS
MANUFACTURER
Citizen
PART NUMBER
TEMP RANGE
-40 to +85°C
-40 to +85°C
-40 to +85°C
-40 to +85°C
-10 to +60°C
-10 to +60°C
-40 to +85°C
+25°C FREQUENCY TOLERANCE
CM201, CM202, CM200S
MC-405, MC-406
RSM-200S-A or B
32S12A or B
±20ppm
±20ppm
±20ppm
±20ppm
±20ppm
±20ppm
±20ppm
Epson
Raltron
SaRonix
Ecliptek
ECS
ECPSM29T-32.768K
ECX-306/ECX-306I
FSM-327
Fox
A final application for the ATR control is in-circuit calibration
for high accuracy applications, along with a temperature
sensor chip. Once the RTC circuit is powered up with battery
backup, and frequency drift is measured. The ATR control is
then adjusted to a setting which minimizes drift. Once
adjusted at a particular temperature, it is possible to adjust at
other discrete temperatures for minimal overall drift, and
store the resulting settings in the EEPROM. Extremely low
overall temperature drift is possible with this method. The
Intersil evaluation board contains the circuitry necessary to
implement this control.
The X1 and X2 connections to the crystal are to be kept as
short as possible. A thick ground trace around the crystal is
advised to minimize noise intrusion, but ground near the X1
and X2 pins should be avoided as it will add to the load
capacitance at those pins. Keep in mind these guidelines for
other PCB layers in the vicinity of the RTC device. A small
decoupling capacitor at the V
pin of the chip is mandatory,
DD
with a solid connection to ground (Figure 27).
Oscillator Measurements
When a proper crystal is selected and the layout guidelines
above are observed, the oscillator should start up in most
circuits in less than one second. Some circuits may take
slightly longer, but startup should definitely occur in less than
5s. When testing RTC circuits, the most common impulse is
to apply a scope probe to the circuit at the X2 pin (oscillator
output) and observe the waveform. DO NOT DO THIS!
Although in some cases you may see a usable waveform,
due to the parasitics (usually 10pF to ground) applied with
the scope probe, there will be no useful information in that
waveform other than the fact that the circuit is oscillating.
The X2 output is sensitive to capacitive impedance so the
voltage levels and the frequency will be affected by the
parasitic elements in the scope probe. Applying a scope
probe can possibly cause a faulty oscillator to start up, hiding
other issues (although in the Intersil RTC’s, the internal
circuitry assures startup when using the proper crystal and
layout).
For more detailed operation, see Intersil’s application note
AN154 on Intersil’s website at www.intersil.com.
Layout Considerations
The crystal input at X1 has a very high impedance and will
pick up high frequency signals from other circuits on the
board. Since the X2 pin is tied to the other side of the crystal,
it is also a sensitive node. These signals can couple into the
oscillator circuit and produce double clocking or
mis-clocking, seriously affecting the accuracy of the RTC.
Care needs to be taken in layout of the RTC circuit to avoid
noise pickup. Figure 27 shows a suggested layout for the
ISL12025 or ISL12027 devices.
The best way to analyze the RTC circuit is to power it up and
read the real-time clock as time advances. Alternatively the
frequency can be checked by setting an alarm for each
minute. Using the pulse interrupt mode setting, the once-per-
minute interrupt functions as an indication of proper
oscillation.
Backup Battery Operation
Many types of batteries can be used with the Intersil RTC
products. 3.0V or 3.6V Lithium batteries are appropriate, and
sizes are available that can power a Intersil RTC device for
up to 10 years. Another option is to use a supercapacitor for
applications where V
may disappear intermittently for
DD
short periods of time. Depending on the value of
FIGURE 27. SUGGESTED LAYOUT FOR INTERSIL RTC IN SO-8
supercapacitor used, backup time can last from a few days
FN6371.1
October 18, 2006
22
ISL12025
to two weeks (with >1F). A simple silicon or Schottky barrier
diode can be used in series with V to charge the
Mode. In actuality the V
switching to battery backup, which will disable I C
ANYTIME the device goes into Battery Backup Mode.
will go below V
before
RESET
DD
2
DD
supercapacitor, which is connected to the V
pin. Try to
BAT
2
Regardless of the battery voltage, the I C will work down
use Schottky diodes with very low leakages, <1µA desirable.
Do not use the diode to charge a battery (especially lithium
batteries!).
to the V
voltage (see Figure 29).
RESET
• Mode B - In this mode the selection bits indicate
switchover to battery backup at V <V
communications in battery backup. In order to
communicate in Battery Backup Mode, the V
voltage must be less than the V
2
, and I C
DD BAT
There are two possible modes for battery backup operation,
Standard and Legacy Mode. In Standard Mode, there are no
operational concerns when switching over to battery backup
since all other devices functions are disabled. Battery drain
RESET
voltage AND V
BAT
DD
2
must be greater than V
bus pins must go to V
. Also, pull-ups on the I C
to communicate. This mode is
RESET
BAT
is minimal in Standard Mode, and return to Normal V
DD
powered operations predictable. In Legacy modes, the V
the same as the normal operating mode of the X1227
device
BAT
pin can power the chip if the voltage is above V
and
DD
V
. This makes it possible to generate alarms and
TRIP
• Mode C - In this mode the selection bits indicate a low
communicate with the device under battery backup, but the
supply current drain is much higher than the Standard Mode
and backup time is reduced. During initial power-up, the
default mode is the Legacy Mode.
V
switchover combined with no communications in
DD
battery backup. Operation is actually identical to Mode A
2
with I C communications down to V
communications (see Figure 28).
= V
, then no
DD
RESET
• Mode D - In this mode the selection bits indicate
switchover to battery backup at V < V
2
2
I C Communications During Battery Backup and
, and no I C
DD
BAT
LVR Operation
communications in battery backup. This mode is unique in
2
that there is I C communication as long as V
is higher
Operation in Battery Backup Mode and LVR is affected by
the BSW and SBIB bits as described previously. These bits
allow flexible operation of the serial bus and EEPROM in
Battery Backup Mode, but certain operational details need to
be clear before utilizing the different modes. The most
DD
, whichever is greater. This mode is
than V
or V
RESET
BAT
2
the safest for guaranteeing I C communications only
when there is a Valid V
(see Figure 29).
DD
significant detail is that once V
2
goes below V , then
I C communications cease regardless of whether the device
DD
RESET
V
V
BAT
2.7V TO 5.5V
DD
2
is programmed for I C operation in Battery Backup Mode.
SUPERCAPACITOR
V
Table 9 describes four different modes possible with using
the BSW and SBIB bits, and how they are affect LVR and
battery backup operation.
SS
• Mode A - In this mode selection bits indicate a low V
switchover combined with I C operation in Battery Backup
DD
FIGURE 28. SUPERCAPACITOR CHARGING CIRCUIT
2
.
2
TABLE 9. I C, LV RESET, AND BATTERY BACKUP OPERATION SUMMARY (Shaded Row is same as X1227 operation)
2
VBAT
SWITCHOVER
VOLTAGE
I C ACTIVE IN
BATTERY
BACKUP?
BSW
BIT
EEPROMWRITE/READ
IN BATTERY BACKUP?
MODE
SBIB BIT
NOTES
Operation of I C bus down to
2
A
0
0
1
0
1
Standard Mode,
NO
NO
YES
NO
V
= 2.2V typ
V
= V
, then below that no
TRIP
DD
RESET
communications. Battery switchover at
V
.
TRIP
2
B
0
1
1
Legacy Mode,
< V
YES, only if
Operation of I C bus into Battery Backup
Mode, but only for
(X1227
Mode)
V
V
>V
DD
BAT
BAT RESET
V
> V
> V
.
BAT
DD
RESET
Bus must have pullups to V
.
BAT
2
C
Standard Mode,
= 2.2V typ
NO
NO
Operation of I C bus down to
V
V
= V
, then below that no
RESET
TRIP
DD
communications. Battery switchover at
V
.
TRIP
2
D
Legacy Mode,
< V
NO
Operation of I C bus down to V
or
RESET
V
V
, whichever is higher.
BAT
DD
BAT
.
FN6371.1
October 18, 2006
23
ISL12025
V
(3.0V)
BAT
(2.63V)
V
DD
V
RESET
V
TRIP
(2.2V)
tPURST
RESET
2
I C BUS ACTIVE
I
(BATTERY BACKUP MODE)
BAT
(VDD POWER, V
NOT CONNECTED)
BAT
FIGURE 29. EXAMPLE RESET OPERATION IN MODE A OR C
V
(3.0V)
BAT
V
DD
V
(2.63V)
RESET
V
TRIP
(2.2V)
tPURST
RESET
2
I C BUS ACTIVE
I
(BATTERY BACKUP MODE)
BAT
FIGURE 30. RESET OPERATION IN MODE D
FN6371.1
October 18, 2006
24
ISL12025
After these registers are set, an alarm will be generated when
Alarm Operation Examples
the RTC advances to exactly 11:30am on January 1 (after
seconds change from 59 to 00) by setting the AL0 bit in the
status register to “1”.
Below are examples of both Single Event and periodic
Interrupt Mode alarms.
Example 1 – Alarm 0 set with single interrupt (IM = “0”)
A single alarm will occur on January 1 at 11:30am.
A. Set Alarm0 registers as follows:
Example 2 – Pulsed interrupt once per minute (IM = “1”)
Interrupts at one minute intervals when the seconds register
is at 30s.
A. Set Alarm0 registers as follows:
BIT
ALARM0
REGISTER 7
6
0
0
5
0
1
4
0
1
3
0
0
2
0
0
1
0
0
0
0
0
HEX
DESCRIPTION
BIT
ALARM0
REGISTER 7
SCA0
MNA0
0
1
00h Seconds disabled
6
5
4
3
2
1
0 HEX
DESCRIPTION
B0h Minutes set to 30,
enabled
SCA0
1
0
1
1
0
0
0
0
B0h Seconds set to 30,
enabled
HRA0
DTA0
MOA0
DWA0
1
1
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
91h Hours set to 11,
enabled
MNA0
HRA0
DTA0
MOA0
DWA0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
00h Minutes disabled
00h Hours disabled
00h Date disabled
81h Date set to 1,
enabled
81h Month set to 1,
enabled
00h Month disabled
00h Day of week disabled
00h Day of week
disabled
B. Set the Interrupt register as follows:
B. Also, the AL0E bit must be set as follows:
BIT
CONTROL
REGISTER 7
6
5
4
3
2
1
0 HEX
DESCRIPTION
BIT
CONTROL
REGISTER
INT
1
0
1
0
0
0
0
0
x0h Enable Alarm and Int
Mode
7
6
5
4
3
2
1
0
HEX DESCRIPTION
INT
0
0
1
0
0
0
0
0
x0h Enable Alarm
Note that the status register AL0 bit will be set each time the
alarm is triggered, but does not need to be read or cleared.
FN6371.1
October 18, 2006
25
ISL12025
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
NOTES
-B-
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
0.0688
0.0098
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0075
0.1890
0.1497
0.0098
0.1968
0.1574
-
-A-
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
α
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
α
8
8
7
NOTES:
0°
8°
0°
8°
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN6371.1
October 18, 2006
26
ISL12025
Thin Shrink Small Outline Plastic Packages (TSSOP)
M8.173
N
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
E
E1
-B-
INCHES
MIN
MILLIMETERS
GAUGE
PLANE
SYMBOL
MAX
0.047
0.006
0.051
0.0118
0.0079
0.120
0.177
MIN
-
MAX
1.20
0.15
1.05
0.30
0.20
3.05
4.50
NOTES
A
A1
A2
b
-
-
1
2
3
0.002
0.031
0.0075
0.0035
0.116
0.169
0.05
0.80
0.19
0.09
2.95
4.30
-
L
0.25
0.010
-
0.05(0.002)
SEATING PLANE
A
9
-A-
D
c
-
D
3
-C-
α
E1
e
4
A2
e
A1
0.026 BSC
0.65 BSC
-
c
b
0.10(0.004)
E
0.246
0.256
6.25
0.45
6.50
0.75
-
0.10(0.004) M
C
A M B S
L
0.0177
0.0295
6
N
8
8
7
NOTES:
o
o
o
o
0
8
0
8
-
α
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
Rev. 1 12/00
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6371.1
October 18, 2006
27
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