HS-2600RH [INTERSIL]
Radiation Hardened Wideband, High Impedance Operational Amplifier; 抗辐射宽带,高阻抗运算放大器型号: | HS-2600RH |
厂家: | Intersil |
描述: | Radiation Hardened Wideband, High Impedance Operational Amplifier |
文件: | 总5页 (文件大小:90K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HS-2600RH
Data Sheet
August 1999
File Number 3650.1
Radiation Hardened Wideband, High
Impedance Operational Amplifier
Features
• Electrically Screened to SMD # 5962-95671
HS-2600RH is a radiation hardened internally compensated
bipolar operational amplifier that features very high input
impedance coupled with wideband AC performance. The
• QML Qualified per MIL-PRF-38535 Requirements
• High Input Impedance . . . . . . . . . . . . . . . . . 100MΩ (Min)
500MΩ (Typ)
high resistance of the input stage is complemented by low
o
offset voltage (4mV
at 25 C for HS-2600RH) and low
o
• High Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . 3V/µs (Min)
7V/µs (Typ)
max
bias and offset current (10nA max at 25 C for HS-2600RH)
to facilitate accurate signal processing. Offset voltage can be
reduced further by means of an external nulling
potentiometer. The 4V/µs minimum slew rate at 25 C and
the minimum open loop gain of 100kV/V at 25 C enables the
• Low Input Bias Current. . . . . . . . . . . . . . . . . . 10nA (Max)
1nA (Typ)
o
o
• Low Input Offset Current (HS-2600RH) . . . . . . 4mV (Max)
• Wide Unity Gain Bandwidth . . . . . . . . . . . . . .12MHz (Typ)
• Output Short Circuit Protection
HS-2600RH to perform high gain amplification of fast,
wideband signals. These dynamic characteristics, coupled
with fast settling times, make these amplifiers ideally suited
to pulse amplification designs as well as high frequency or
video applications. The frequency response of the amplifier
can be tailored to exact design requirements by means of an
external bandwidth control capacitor. Other high
performance designs such as high gain, low distortion audio
amplifiers, high-Q and wideband active filters and high
speed comparators, are excellent uses of this part.
• Total Gamma Dose. . . . . . . . . . . . . . . . . . . . . 10kRAD(Si)
Applications
• Video Amplifier
• Pulse Amplifier
• High-Q Active Filters
• High Speed Comparators
• Low Distortion Oscillators
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-95671. A “hot-link” is provided
on our homepage for downloading.
Pinout
HS7-2600RH (CERDIP) GDIP1-T8
OR
www.intersil.com/spacedefense/space.asp
HS7B-2600RH (SBDIP) CDIP2-T8
TOP VIEW
Ordering Information
BAL
-IN
+IN
V-
1
2
3
4
8
7
6
5
COMP
V+
INTERNAL
MKT. NUMBER
TEMP. RANGE
o
ORDERING NUMBER
5962D9567101VPA
5962D9567101VPC
( C)
–
+
HS7-2600RH-Q
HS7B-2600RH-Q
-55 to 125
-55 to 125
OUT
BAL
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
HS-2600RH
Test Circuit
† INCLUDES STRAY
AC
OUT
V1
+V
CAPACITANCES
CC
-1/10
0.1
2
1
2K
100pF†
100K
1 OPEN
S3A
S7
3
FOR LOOP STABILITY,
USE MIN VALUE CAPACITOR
TO PREVENT OSCILLATION
OPEN
1
2
BAL
ADJ
2
50K
S1
1
2
500K
V2
S5A
1
OPEN 2
DUT
-
1
1
1
S5B
+
S9
2
OPEN
S6
1
1
S2
+
+
S8
2
1
3
OPEN
OPEN 2
BUFFER
2
100K
2
S3B
1
2K
10K
OPEN
V
AC
-V
EE
0.1
1
100
100
x 2
E
OUT
5K
2
S4
1
ALL RESISTORS = ±1% (Ω)
50K
ALL CAPACITORS = ±10% (µF)
NOTE: For Detailed Information, Refer to HS-2600RH Test Technical Brief.
Test Waveforms
SIMPLIFIED TEST CIRCUIT
V
AC
+
-
V
OUT
2kΩ
100pF
SLEW RATE WAVEFORMS
+5.0V
75%
+5.0V
75%
+5.0V
-5.0V
+5.0V
-5.0V
INPUT
OUTPUT
∆V
∆V
25%
-5.0V
25%
-5.0V
+SL
-SL
∆V
∆T
SR =
∆T
∆T
OVERSHOOT, RISE AND FALL TIME WAVE FORMS
V
= +200mV
FINAL
V
PEAK
90%
0V
10%
+200mV
0V
OUTPUT
INPUT
10%
0V
90%
0V
-200mV
-200mV
t ,+OS
t ,-OS
r
f
V
PEAK
t
t
f
r
NOTE: Measured on both positive and negative transitions. Capacitance at compensation pin should be minimized.
2
HS-2600RH
Burn-In Circuit
HS-2600RH CERDIP
1
2
3
4
8
7
V+
R
1
C
C
1
+
3
D
1
6
V-
5
D
C
2
2
NOTES:
1. R = 1MΩ, ±5%, 1/4W (Min)
1
2. C = C = 0.01µF/Socket (Min) or 0.1µF/Row (Min)
1
2
3. C = 0.01µF/Socket (10%)
3
4. D = D = IN4002 or Equivalent/Board
1
2
5. | (V+) - (V-) | = 30V
Irradiation Circuit
C
1
2
3
4
8
7
6
5
C
V
1
R
V
2
C
GND
NOTES:
6. V = +15V ±10%
1
7. V = -15V ±10%
2
8. R = 1MΩ ±5%
9. C = 0.1µF ±10%
3
HS-2600RH
Schematic Diagram
COMPENSATION
V+
R1
R2
4.18K
R3
1.56K
R4
R5
R6
30
C4
4pF
1K
1.56K
600
BAL
C3
16pF
BAL
C2
9pF
Q60
Q1
Q39
Q61
Q40
Q2
Q41
Q3
Q4
Q38
Q42
Q59
Q37
Q5
Q58
Q6
Q7
Q9
Q36
Q32
Q35
Q33
Q31
Q28
Q30
Q29
Q43
Q44
+INPUT
Q57
Q11
Q8
R18
30
Q56
Q55 Q54
Q10
Q17
Q18
Q26
Q25
OUT
Q13
Q16
Q12
R17
30
Q53
Q45
Q24
Q27
Q15
Q47
Q46
R7
Q52
R11
4.0K
1.35
Q19
R19
2.5K
Q22
Q21
Q23
Q48
RP1
R8
1K
Q50
Q49
Q51
R9
4.5K
Q20
R12
1.6K
R13
1.6K
R14
2.1K
R15
800
R16
30
R10
2.0K
C1
16pF
V-
-INPUT
4
HS-2600RH
Die Characteristics
DIE DIMENSIONS:
ASSEMBLY RELATED INFORMATION:
69 mils x 56 mils x 19 mils ±1 mils
1750µm x 1420µm x 483µm ±25.4µm
Substrate Potential (Powered Up):
Unbiased
INTERFACE MATERIALS:
Glassivation:
ADDITIONAL INFORMATION:
Worst Case Current Density:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1.5kÅ
5
2
<2 x 10 A/cm
Transistor Count:
Top Metallization:
140
Type: Al, 1% Cu
Thickness: 16kÅ ±2kÅ
Substrate:
Linear Bipolar DI
Backside Finish:
Silicon
HS-2600RH
Metallization Mask Layout
+IN
-IN
BAL
V-
COMP
V+
BAL
OUT
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
5
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