HCS74KTR [INTERSIL]

Radiation Hardened Dual-D Flip-Flop with Set and Reset; 抗辐射双D触发器具有​​置位和复位
HCS74KTR
型号: HCS74KTR
厂家: Intersil    Intersil
描述:

Radiation Hardened Dual-D Flip-Flop with Set and Reset
抗辐射双D触发器具有​​置位和复位

触发器 逻辑集成电路 CD
文件: 总3页 (文件大小:128K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HCS74T  
Data Sheet  
July 1999  
File Number 4615.1  
Radiation Hardened Dual-D Flip-Flop with  
Set and Reset  
Features  
• QML Class T, Per MIL-PRF-38535  
Intersil’s Satellite Applications FlowTM (SAF) devices are fully  
tested and guaranteed to 100kRAD total dose. These QML  
Class T devices are processed to a standard flow intended  
to meet the cost and shorter lead-time needs of large  
volume satellite manufacturers, while maintaining a high  
level of reliability.  
• Radiation Performance  
5
- Gamma Dose (γ) 1 x 10 RAD(Si)  
- Latch-Up Free Under Any Conditions, SOS Process  
2
- SEP Effective LET No Upsets: >100 MEV-cm /mg  
-9  
- Single Event Upset (SEU) Immunity < 2 x 10  
Errors/Bit-Day (Typ)  
The Intersil HCS74T is a Radiation Hardened Positive Edge  
Triggered Flip-Flop with set and reset.  
• 3 Micron Radiation Hardened SOS CMOS  
• Significant Power Reduction Compared to LSTTL ICs  
• DC Operating Voltage Range: 4.5V to 5.5V  
• Input Logic Levels  
The HCS74T utilizes advanced CMOS/SOS technology to  
achieve high-speed operation. This device is a member of  
radiation hardened, high-speed, CMOS/SOS Logic Family.  
- V = 30% of V  
IL CC  
Max  
Min  
Specifications  
- V = 70% of V  
IH  
CC  
Specifications for Rad Hard QML devices are controlled by  
the Defense Supply Center in Columbus (DSCC). The SMD  
numbers listed below must be used when ordering.  
• Input Current Levels Ii 5µA at V , V  
OL OH  
Pinouts  
Detailed Electrical Specifications for the HCS74T are  
contained in SMD 5962-95782. A “hot-link” is provided from  
our website for downloading.  
HCS74T (SBDIP), CDIP2-T14  
TOP VIEW  
www.intersil.com/spacedefense/newsafclasst.asp  
R1  
D1  
1
2
3
4
5
6
7
14 V  
CC  
13 R2N  
12 D2  
Intersil’s Quality Management Plan (QM Plan), listing all  
Class T screening operations, is also available on our  
website.  
CP1  
S1N  
Q1  
11 CP2  
10 S2N  
www.intersil.com/quality/manuals.asp  
Q1N  
GND  
9
8
Q2  
Ordering Information  
Q2N  
TEMP.  
ORDERING  
INFORMATION  
PART  
NUMBER  
RANGE  
( C)  
o
HCS74T (FLATPACK), CDFP3-F14  
5962R9578201TCC  
5962R9578201TXC  
HCS74DTR  
HCS74KTR  
-55 to 125  
-55 to 125  
TOP VIEW  
R1  
D1  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
V
CC  
R2  
D2  
CP2  
S2  
NOTE: Minimum order quantity for -T is 150 units through  
distribution, or 450 units direct.  
CP1  
S1  
Q1  
Q1  
Q2  
Q2  
GND  
8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999  
1
Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation.  
HCS74T  
Functional Diagram  
S
CL  
4(10)  
2(12)  
P
N
CL  
CL  
D
P
N
CL  
P
N
CL  
CL  
CL  
P
N
Q
CL  
6(8)  
R
1(13)  
Q
5(9)  
CP  
3(11)  
CL  
CL  
TRUTH TABLE  
INPUTS  
OUTPUTS  
SET  
L
RESET  
CP  
X
D
X
X
X
H
L
Q
H
Q
L
H
L
H
X
L
H
L
L
X
H  
H
H†  
L
H
H
H
H
H
L
H
H
L
X
Q0  
Q0  
NOTE: L = Logic Level Low, H = Logic Level High, X = Don’t Care  
= Transition from Low to High Level  
Q0 = The level of Q before the indicated input conditions were established.  
This configuration is non-stable, that is, it will not persist when set and reset inputs return to their inactive (High) level.  
2
HCS74T  
Die Characteristics  
DIE DIMENSIONS:  
PASSIVATION:  
Type: Silox (S O )  
(2261µm x 2235µm x 533µm ±51µm)  
89 x 88 x 21mils ±2mil  
i
2
Thickness: 13kÅ ±2.6kÅ  
METALLIZATION:  
Type: Al Si  
WORST CASE CURRENT DENSITY:  
2
< 2.0e5 A/cm  
Thickness: 11kÅ ±1kÅ  
TRANSISTOR COUNT:  
SUBSTRATE POTENTIAL:  
192  
Unbiased (Silicon on Sapphire)  
PROCESS:  
BACKSIDE FINISH:  
CMOS SOS  
Sapphire  
Metallization Mask Layout  
HCS74T  
D1  
(2)  
R1  
(1)  
V
CC  
(14)  
CP1 (3)  
(13) R2  
(12) D2  
NC  
S1 (4)  
NC  
(11) CP2  
Q1 (5)  
(10) S2  
Q1 (6)  
(7)  
GND  
(8)  
Q2  
(9)  
Q2  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
3

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