ACS157HMSR-02 [INTERSIL]

Radiation Hardened Quad 2-Input Non-Inverting Multiplexer; 抗辐射四2输入非反相多路复用器
ACS157HMSR-02
型号: ACS157HMSR-02
厂家: Intersil    Intersil
描述:

Radiation Hardened Quad 2-Input Non-Inverting Multiplexer
抗辐射四2输入非反相多路复用器

复用器
文件: 总2页 (文件大小:51K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ACS157MS  
Radiation Hardened  
Quad 2-Input Non-Inverting Multiplexer  
December 1997  
Features  
Description  
• QML Qualified Per MIL-PRF-38535 Requirements  
• 1.25Micron Radiation Hardened SOS CMOS  
The Radiation Hardened ACS157MS is a Quad 2-Channel  
Non-Inverting Multiplexer which selects four bits of data from  
one of two sources under the control of a single Select pin.  
The Output Enable input is active LOW and controls all out-  
puts. When E is set HIGH, all outputs are forced LOW,  
regardless of all other input conditions. All inputs are buff-  
ered and the outputs are designed for balanced propagation  
delay and transition times.  
• Radiation Environment  
- Latch-up Free Under any Conditions  
5
- Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 10 RAD(Si)  
-10  
- SEU Immunity. . . . . . . . . . . <1 x 10  
Errors/Bit/Day  
2
- SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm )  
The ACS157MS is fabricated on a CMOS Silicon on Sap-  
phire (SOS) process, which provides an immunity to Single  
Event Latch-up and the capability of highly reliable perfor-  
mance in any radiation environment. These devices offer  
significant power reduction and faster performance when  
compared to ALSTTL types.  
• Input Logic Levels . . . V = (0.3)(Vcc), V = (0.7)(Vcc)  
IL IH  
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA  
• Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA  
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . . 14ns  
Specifications for Rad Hard QML devices are controlled  
by the Defense Supply Center in Columbus (DSCC). The  
SMD numbers listed below must be used when ordering.  
Applications  
• 4-Bit Source Selection  
• Data Routing  
Detailed Electrical Specifications for the ACS157 are  
contained in SMD 5962-98536. A “hot-link” is provided  
on our homepage with instructions for downloading.  
http://www.intersil.com/data/sm/index.htm  
• High Frequency Switching  
Ordering Information  
o
SMD PART NUMBER  
INTERSIL PART NUMBER  
ACS157DMSR-02  
TEMP. RANGE ( C)  
PACKAGE  
16 Ld SBDIP  
CASE OUTLINE  
CDIP2-T16  
CDIP2-T16  
CDFP4-F16  
CDFP4-F16  
N/A  
5962F9853601VEC  
-55 to 125  
N/A  
ACS157D/Sample-02  
ACS157KMSR-02  
25  
-55 to 125  
25  
16 Ld SBDIP  
16 Ld Flatpack  
16 Ld Flatpack  
Die  
5962F9853601VXC  
N/A  
N/A  
ACS157K/Sample-02  
ACS157HMSR-02  
25  
Pinouts  
ACS157 (SBDIP)  
TOP VIEW  
ACS157 (FLATPACK)  
TOP VIEW  
S
1
2
3
4
5
6
7
8
16 VCC  
15 E  
S
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
E
CC  
1I  
0
1
1I  
1I  
0
1
1I  
14 4I  
0
4I  
4I  
0
1
1Y  
13 4I  
1Y  
1
2I  
0
4Y  
2I  
0
12 4Y  
2I  
3I  
3I  
1
0
1
2I  
11 3I  
10 3I  
1
0
1
2Y  
2Y  
GND  
3Y  
9
3Y  
GND  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 4462  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999  
1
ACS157MS  
Die Characteristics  
DIE DIMENSIONS:  
PASSIVATION  
Size: 2390µm x 2390µm (94 mils x 94 mils)  
Thickness: 525µm ±25µm (20.6 mils ±1 mil)  
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)  
Type: Phosphorous Silicon Glass (PSG)  
Thickness: 1.30µm ±0.15µm  
SPECIAL INSTRUCTIONS:  
METALLIZATION: Al  
Metal 1 Thickness: 0.7µm ±0.1µm  
Metal 2 Thickness: 1.0µm ±0.1µm  
Bond V  
CC  
First  
ADDITIONAL INFORMATION:  
5
2
Worst Case Density: <2.0 x 10 A/cm  
Transistor Count: 150  
SUBSTRATE POTENTIAL:  
Unbiased Insulator  
Metallization Mask Layout  
ACS157MS  
1I  
S
V
OE  
0
CC  
1I  
4I  
4I  
1
0
1
1Y  
2I  
2I  
4Y  
0
1
3I  
0
2Y  
GND  
3Y  
3I  
1
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
2

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