ACS147HMSR-03 [INTERSIL]
Radiation Hardened 10-to-4 Line Priority Encoder; 抗辐射10至4线优先编码器型号: | ACS147HMSR-03 |
厂家: | Intersil |
描述: | Radiation Hardened 10-to-4 Line Priority Encoder |
文件: | 总2页 (文件大小:42K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ACS147MS
Data Sheet
July 1999
File Number 4761
Radiation Hardened 10-to-4 Line Priority
Encoder
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
These nine-input priority encoders accept data from nine
active LOW inputs and provide a binary representation on
the four active LOW outputs. A priority is assigned to each
input so that when two or more inputs are simultaneously
active, the input with the highest priority is represented on
the output. Input line I9 has the highest priority.
• Radiation Environment
- Latch-Up Free Under Any Conditions
5
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10 RAD(Si)
-10
- SEU Immunity. . . . . . . . . . . . . <1 x 10
Errors/Bit/Day
2
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm )
These devices provide the 10-to-4-line priority encoding
function by use of the implied decimal “zero”. The “zero” is
encoded when all nine data inputs are HIGH, forcing all four
outputs HIGH.
• Input Logic Levels. . . . V = (0.3)(V ), V = (0.7)(V
IL CC IH
)
CC
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA (Min)
• Quiescent Supply Current . . . . . . . . . . . . . . . 20µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . .17ns (Max)
The ACS147MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment.
Applications
• High Speed Control Circuits
• Sensor Monitoring
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
• Low Power Designs
Detailed Electrical Specifications for the ACS147MS are
contained in SMD 5962-98633. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/spaceselect.htm
Ordering Information
INTERNAL MARKETING
o
ORDERING NUMBER
5962F9863301VCC
NUMBER
TEMP. RANGE ( C)
PACKAGE
16 Ld SBDIP
DESIGNATOR
CDIP2-T16
CDIP2-T16
CDFP4-F16
CDFP4-F16
NA
ACS147DMSR-03
-55 to 125
ACS147D/SAMPLE-03
5962F9863301VXC
ACS147K/SAMPLE-03
5962F9863301V9A
ACS147D/SAMPLE-03
ACS147KMSR-03
25
-55 to 125
25
16 Ld SBDIP
16 Ld Flatpack
16 Ld Flatpack
Die
ACS147K/SAMPLE-03
ACS147HMSR-03
25
Pinouts
ACS147MS
ACS147MS
(SBDIP)
(FLATPACK)
TOP VIEW
TOP VIEW
I4
I5
1
2
3
4
5
6
7
8
16 V
CC
I4
I5
1
2
3
4
5
6
7
8
16
V
CC
15 NC
14 Y3
13 I3
12 I2
11 I1
10 I9
15
14
13
12
11
10
9
NC
Y3
I3
I6
I6
I7
I7
I8
I2
I8
Y2
Y1
GND
I1
Y2
Y1
GND
I9
Y0
9
Y0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
ACS147MS
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm ±25µm (20.6 mils ±1 mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm ±0.15µm
SPECIAL INSTRUCTIONS
METALLIZATION: AI
Bond V
First
ADDITIONAL INFORMATION:
CC
Metal 1 Thickness: 0.7µm ±0.1µm
Metal 2 Thickness: 1.0µm ±0.1µm
5
2
Worst Case Current Density: <2.0 x 10 A/cm
Transistor Count: 233
SUBSTRATE POTENTIAL
Unbiased Insulator
Metallization Mask Layout
ACS147MS
V
I5
I4
CC
(2)
(1)
(16)
NC
(14) Y3
(13) I3
(12) I2
(11) I1
I6 (3)
I7 (4)
I8 (5)
Y2 (6)
(7)
Y1
(8)
(9)
Y0
(10)
I9
GND
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reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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2
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