ACS147HMSR-03 [INTERSIL]

Radiation Hardened 10-to-4 Line Priority Encoder; 抗辐射10至4线优先编码器
ACS147HMSR-03
型号: ACS147HMSR-03
厂家: Intersil    Intersil
描述:

Radiation Hardened 10-to-4 Line Priority Encoder
抗辐射10至4线优先编码器

编码器
文件: 总2页 (文件大小:42K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ACS147MS  
Data Sheet  
July 1999  
File Number 4761  
Radiation Hardened 10-to-4 Line Priority  
Encoder  
Features  
• QML Qualified Per MIL-PRF-38535 Requirements  
• 1.25 Micron Radiation Hardened SOS CMOS  
These nine-input priority encoders accept data from nine  
active LOW inputs and provide a binary representation on  
the four active LOW outputs. A priority is assigned to each  
input so that when two or more inputs are simultaneously  
active, the input with the highest priority is represented on  
the output. Input line I9 has the highest priority.  
• Radiation Environment  
- Latch-Up Free Under Any Conditions  
5
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10 RAD(Si)  
-10  
- SEU Immunity. . . . . . . . . . . . . <1 x 10  
Errors/Bit/Day  
2
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm )  
These devices provide the 10-to-4-line priority encoding  
function by use of the implied decimal “zero”. The “zero” is  
encoded when all nine data inputs are HIGH, forcing all four  
outputs HIGH.  
• Input Logic Levels. . . . V = (0.3)(V ), V = (0.7)(V  
IL CC IH  
)
CC  
• Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA (Min)  
• Quiescent Supply Current . . . . . . . . . . . . . . . 20µA (Max)  
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . .17ns (Max)  
The ACS147MS is fabricated on a CMOS Silicon on  
Sapphire (SOS) process, which provides an immunity to  
Single Event Latch-up and the capability of highly reliable  
performance in any radiation environment.  
Applications  
• High Speed Control Circuits  
• Sensor Monitoring  
Specifications for Rad Hard QML devices are controlled  
by the Defense Supply Center in Columbus (DSCC). The  
SMD numbers listed below must be used when ordering.  
• Low Power Designs  
Detailed Electrical Specifications for the ACS147MS are  
contained in SMD 5962-98633. A “hot-link” is provided  
on our homepage for downloading.  
http://www.intersil.com/spacedefense/spaceselect.htm  
Ordering Information  
INTERNAL MARKETING  
o
ORDERING NUMBER  
5962F9863301VCC  
NUMBER  
TEMP. RANGE ( C)  
PACKAGE  
16 Ld SBDIP  
DESIGNATOR  
CDIP2-T16  
CDIP2-T16  
CDFP4-F16  
CDFP4-F16  
NA  
ACS147DMSR-03  
-55 to 125  
ACS147D/SAMPLE-03  
5962F9863301VXC  
ACS147K/SAMPLE-03  
5962F9863301V9A  
ACS147D/SAMPLE-03  
ACS147KMSR-03  
25  
-55 to 125  
25  
16 Ld SBDIP  
16 Ld Flatpack  
16 Ld Flatpack  
Die  
ACS147K/SAMPLE-03  
ACS147HMSR-03  
25  
Pinouts  
ACS147MS  
ACS147MS  
(SBDIP)  
(FLATPACK)  
TOP VIEW  
TOP VIEW  
I4  
I5  
1
2
3
4
5
6
7
8
16 V  
CC  
I4  
I5  
1
2
3
4
5
6
7
8
16  
V
CC  
15 NC  
14 Y3  
13 I3  
12 I2  
11 I1  
10 I9  
15  
14  
13  
12  
11  
10  
9
NC  
Y3  
I3  
I6  
I6  
I7  
I7  
I8  
I2  
I8  
Y2  
Y1  
GND  
I1  
Y2  
Y1  
GND  
I9  
Y0  
9
Y0  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999  
1
ACS147MS  
Die Characteristics  
DIE DIMENSIONS:  
PASSIVATION:  
Size: 2390µm x 2390µm (94 mils x 94 mils)  
Thickness: 525µm ±25µm (20.6 mils ±1 mil)  
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)  
Type: Phosphorous Silicon Glass (PSG)  
Thickness: 1.30µm ±0.15µm  
SPECIAL INSTRUCTIONS  
METALLIZATION: AI  
Bond V  
First  
ADDITIONAL INFORMATION:  
CC  
Metal 1 Thickness: 0.7µm ±0.1µm  
Metal 2 Thickness: 1.0µm ±0.1µm  
5
2
Worst Case Current Density: <2.0 x 10 A/cm  
Transistor Count: 233  
SUBSTRATE POTENTIAL  
Unbiased Insulator  
Metallization Mask Layout  
ACS147MS  
V
I5  
I4  
CC  
(2)  
(1)  
(16)  
NC  
(14) Y3  
(13) I3  
(12) I2  
(11) I1  
I6 (3)  
I7 (4)  
I8 (5)  
Y2 (6)  
(7)  
Y1  
(8)  
(9)  
Y0  
(10)  
I9  
GND  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (321) 724-7000  
FAX: (321) 724-7240  
2

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