WLC1115-68LQXQ_技术文档

WLC1115

Wireless charging IC (WLC) - Transmitter

15W with integrated USB Type-C PD

controller

General description

WLC1115 is a highly integrated, Qi compliant wireless power transmitter with integrated USB Type-C Power

Delivery (PD). WLC1115 complies with the latest Qi specification for 15W applications. WLC1115 is also compliant

with the latest USB Type-C and PD specifications and is ideal for up to 15W charging applications.

WLC1115 has integrated gate drivers for the buck and inverter power supplies that are necessary for wireless

transmitter applications. WLC1115 supports a wide input voltage range and offers many programmable features

for creating distinct wireless transmitter solutions.

WLC1115 is a highly programmable wireless power transmitter and integrated USB-PD sink solution with an

on-chip 32-bit Arm® Cortex®-M0 processor, 128KB flash, 16KB RAM, and 32KB ROM that allows most flash

available for user application use. It also includes various analog and digital peripherals such as ADC, PWMs, and

timers. The inclusion of a fully programmable MCU with analog and digital peripherals enables scalable multi-coil

wireless charging solutions for free positioning transmitter designs.

• Protection

Potential applications

- Overcurrent protection (OCP), overvoltage

• Wireless charging pads for extended power profile

protection (OVP)

(EPP) (15W) and basic power profile (BPP) (5W)

- Supports over-temperature protection through

integrated ADC circuit and internal temperature

sensor

• Smart speakers

• Portable accessories

• Furniture and home goods

• Docking stations

• Temperature range

- -40°C to +105°C extended industrial temperature

range

• Package

• High speed charging support

- 68 lead QFN 8.0  8.0  0.65mm LD68B 5.7  5.7mm

EPAD

Features

VBUS

• Qi v1.3.x compliant transmitter (MP-A11 coil)

USB Type‐C

Receptacle

Q5

Q6

C_VIN

• Integrated USB-PD controller

- Supports latest USB-PD 3.0 version

- Programmable power supply (PPS) mode

L1

VBRG

C1

VBRG

CSPO

- Support for USB PD legacy charging protocols like

QC 2.0/ 3.0 and AFC^[1]

VBB_1

R_SNS

CSNO

• Integrated buck converter controller for VBRIDGE

(VBRG)

C_BRG

Q1

HG1_1

SW1_1

Q2

C_ZVS1

Tx Coil

• Integrated gate drivers for buck converter and

inverter

LG1_1

WLC1115-68LQXQ/T

VDDD

C_VDDD

VCCD

Q3

Cp

HG2_1

SW2_1

• Integrated Q factor detection

• Integrated FSK modulator

Q4

C_ZVS2

LG2_1

C_VCCD

GPIOs

ASK_DEMOD

ASK Demod

filters

LED(s)

• Wide input voltage range: 4.5V-24V

• Communication ports: I²C, UART

DEMOD

Note

1. Customers must acquire the licensing for QC2.0/3.0 and AFC. For any other legacy charging protocol support, contact

your local Infineon sales representative.

Datasheet

www.infineon.com

Please read the Important Notice and Warnings at the end of this document

page 1 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Logic block diagram

WLC1115: Wireless Transmitter Controller with Integrated PD

MCU Subsystem

Integrated Digital Blocks

4 x TCPWM

IO Subsystem

CC

®

arm

SCB X 4

(2 x I2C, SPI, UART)

CORTEX^-M0

48 MHZ

GPIOs

Buck Controller

PWM

Flash

(128 KB)

2 X OVT

High Side & Low

Side Gate drivers

SROM

(32 KB)

Current Sense

Amplifier

SRAM

(16 KB)

Wireless Controller with Integrated PD

Baseband MAC &

Qi v1.3.x Stack

System

Resource

PHY

PWM

Hi-Voltage LDO

High Side & Low

Side Gate Drivers

VBRG OVP, SCP

Protection

FOD

Q Factor, Resonance

Freq. & Power Loss

ASK Demodulator

Voltage & Current

ASK Decoder

1 x 8-bit SAR ADC

NFET Gate Driver w/

Slew Rate Control

USB PD Legacy Charging

Protocols - QC 2.0 / 3.0 & AFC

Current Sense

Amplifier

PPDE/Samsung FC,

Apple 7.5W

Note

2. Customers need to acquire their own licensing for Samsung FC.

Datasheet

2 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Table of contents

General description ...........................................................................................................................1

Potential applications........................................................................................................................1

Features ...........................................................................................................................................1

Logic block diagram ..........................................................................................................................2

Table of contents...............................................................................................................................3

1 Application diagram for 15W transmitter solution with MP-A11 Tx coil ................................................5

2 Pin information ..............................................................................................................................6

3 Electrical specifications.................................................................................................................11

3.1 Absolute maximum ratings ..................................................................................................................................11

3.2 Device-level specifications ...................................................................................................................................14

3.3 DC specifications...................................................................................................................................................14

3.3.1 CPU .....................................................................................................................................................................14

3.3.2 GPIO....................................................................................................................................................................15

3.3.3 XRES and POR ....................................................................................................................................................17

3.4 Digital peripherals.................................................................................................................................................18

3.4.1 Inverter pulse-width modulation (PWM) for GPIO pins ...................................................................................18

3.4.2 I2C, UART, SWD interface...................................................................................................................................18

3.4.3 Memory...............................................................................................................................................................18

3.5 System resources..................................................................................................................................................19

3.5.1 Internal main oscillator clock............................................................................................................................19

3.5.2 PD........................................................................................................................................................................19

3.5.3 ADC .....................................................................................................................................................................20

3.5.4 Current sense amplifier (CSA) / ASK amplifier (ASK_P and ASK_N) ................................................................20

3.5.5 VIN UV/OV ...........................................................................................................................................................21

3.5.6 Voltage regulation - VBRG .................................................................................................................................21

3.5.7 NFET gate driver specifications.........................................................................................................................22

3.5.8 Buck PWM controller .........................................................................................................................................22

3.5.9 Thermal ..............................................................................................................................................................23

4 Functional overview .....................................................................................................................24

4.1 Wireless power transmitter ..................................................................................................................................24

4.2 WPC system control^{.................................................................................................................................................................................. 24}

4.2.1 Selection phase..................................................................................................................................................25

4.2.2 Digital ping phase ..............................................................................................................................................25

4.2.3 Identification and configuration phase ............................................................................................................25

4.2.4 Negotiation ........................................................................................................................................................25

4.2.5 Calibration..........................................................................................................................................................25

4.2.6 Authentication ...................................................................................................................................................25

4.2.7 Renegotiation phase..........................................................................................................................................25

4.2.8 Power transfer phase.........................................................................................................................................26

4.2.9 Bidirectional in-band communication interface..............................................................................................26

4.3 Communication from Tx to Rx - FSK ....................................................................................................................26

4.4 Communication from Rx to Tx - ASK....................................................................................................................27

4.5 Demodulation .......................................................................................................................................................27

4.6 Inverter ..................................................................................................................................................................27

4.7 Rx detection ..........................................................................................................................................................28

4.7.1 Foreign object detection (FOD).........................................................................................................................29

4.7.2 Q factor FOD and Resonance Frequency FOD ..................................................................................................29

4.7.3 Power loss FOD ..................................................................................................................................................29

4.7.4 Over temperature FOD ......................................................................................................................................29

4.7.5 Buck regulator....................................................................................................................................................30

4.8 Buck operating modes..........................................................................................................................................31

Datasheet

3 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Table of contents

4.8.1 Pulse-width modulator (PWM) ..........................................................................................................................31

4.8.2 Pulse skipping mode (PSM)...............................................................................................................................31

4.8.3 Forced-continuous-conduction mode (FCCM).................................................................................................31

4.8.4 Overvoltage protection (OVP) ...........................................................................................................................31

4.8.5 Overcurrent protection (OCP) ...........................................................................................................................31

4.8.6 USB-PD controller..............................................................................................................................................31

4.8.7 MCU.....................................................................................................................................................................32

4.8.8 ADC .....................................................................................................................................................................32

4.8.9 Serial communications block (SCB)..................................................................................................................32

4.8.10 I/O subsystem ..................................................................................................................................................32

4.8.11 LDOs (VDDD and VCCD)....................................................................................................................................32

5 Programming the WLC1115 device .................................................................................................33

5.1 Programming the device Flash over SWD interface............................................................................................33

6 Ordering information ....................................................................................................................34

6.1 Ordering code definitions.....................................................................................................................................34

7 Packaging ....................................................................................................................................35

8 Package diagram ..........................................................................................................................36

9 Acronyms.....................................................................................................................................37

10 Document conventions................................................................................................................38

10.1 Units of measure .................................................................................................................................................38

Revision history ..............................................................................................................................39

Datasheet

4 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Application diagram for 15W transmitter solution with MP-A11 Tx coil

1

Application diagram for 15W transmitter solution with MP-A11

Tx coil

Figure 1 illustrates a typical application of WLC1115 for 15W, Qi v1.3.x compliant transmitter for fixed frequency

and voltage control based MP-A11 Qi transmitter coil. The input power to the system is through Type-C PD sink,

powering the buck converter. The buck converter powers the full bridge inverter which in turn drives the

transmitter coil. The WLC1115 controls the inverter bridge voltage (VBRG) using the buck converter to regulate

the power flow to the transmitter coil powering the receiver. A dual Opamp is used for converting the amplitude

shift key (ASK) modulated power signal into binary signal. WLC1115 uses a digital logic for decoding the binary

signals. The OPTIGA™ Trust Security IC is interfaced over I²C for authentication requirements per Qi v1.3.x.

5 m

VBUS_IN

10 m

BB_IN

NFET_CTRL_1

VDDD

9

68

67

1

2

5

7

8

6

13

11

12 14

1μF

4

3

PVDD_0

PGND_0

66

CSNI_0

CSPI_0

VIN

65

61

62

48

49

PVDD_1

PGND_1

VCCD

0.1μF

1μF

55

54

DNU2

DNU1

10

COMP

69

64

GND (EPAD)

GND

46

44

VBB_1

HG2_1

34

GND

VDDD

DP

Qi PTx Coil

23

24

DP

43

45

DM

BST2_1

SW2_1

DM

15

16

CC1

CC2

CC1

CC2

390pF

LG2_1 47

VBB_1

52

HG1_1

WLC1115-68LQXQ/T

VDDD

53

51

BST1_1

SW1_1

LG1_1

63

25

28

VDDD

0.1μF

10μF

50

VDDD

41

40

VDDD

0.1μF 1μF

ASK_P

ASK_N

Config PC

XRES

18

19

36

ASK_OUT

SWD_DAT/HPI_SDA

SWD_CLK/HPI_SCL

56

57

SWD_DAT/GPIO9

SWD_CLK/GPIO10

USB-I2C*

VDDD

ASK_DEMOD

ASK_SEL

Dual Opamp

VDDD

I2C_SDA

I2C_SCL

29

SDA_SEC

Optiga Trust

Charge

30

33

31

32

37

SCL_SEC

QCOMP2

QCOMP1

OPTIGA RESET

RES_SEC

UART/GPIO7

(

Qi v1.3.x EPP)

USB-UART*

59

26

27

60

58

39

Debug PC

Oscillator

(optional)

NOTE:

1/ Sink FET is Optional

2/ Optiga Trust Charge is required for Qi v1.3.x EPP 15W only

These are External Dongle Board not part of Solution HW

*

Figure 1

Application diagram for 15W transmitter solution with MP-A11 Tx coil

Datasheet

5 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Pin information

2

Pin information

Table 1

WLC1115 pinouts

Pin function for 15W

Pin#

Pin name

MP-A11 application

firmware

Pin description

Buck converter switching node (DC-DC bank 1) and input to zero

current detector for low side gate driver. Connect this pin to

switch node of buck with a short and wide trace.

1

2

3

SW1_0

Low side gate driver output for buck converter (DC-DC bank 1).

Connect to the buck Low side FET gate. Use a wide trace to

minimize inductance of this connection.

LG1_0

Ground for gate driver (DC-DC). Connect all grounds (GND) and

PGND pins (PNGD_0 and PGND_1) together. Connect directly PCB

ground plane and Exposed pad (E-PAD).

PGND_0

Connect to VDDD and to decoupling capacitors (1µF and 0.1µF),

as close to the IC as possible.

4

5

PVDD_0

LG2_0

Low side gate driver output for DC-DC bank 2.

Float this pin for 15W MP-A11 application.

Input rail of inverter bridge, connected to output of the buck

converter. Connect this to the buck side terminal of current sense

resistor for inverter bridge input current sensing. Use a dedicated

(Kelvin) trace for this connection.

6

VBB_0

Switching node (DC-DC bank 2).

7

8

SW2_0

HG2_0

BST2_0

COMP

Connect this pin directly to the E-PAD.

High side gate driver output of DC-DC bank 2.

Float this pin for 15W MP-A11 application.

Bootstrap power supply for DC-DC bank 2.

9

Connect this pin to VDDD via a Schottky diode.

Error amplifier (EA) output for buck controller.

Connect the RC compensation network to GND.

10

Positive input of current sensing amplifier of inverter bridge input

current. Connect to positive terminal of the output current sense

resistor (VBB_0).

11

CSPO

Negative input of current sensing amplifier of inverter bridge

input current. Connect to negative terminal of the current sense

resistor.

12

13

14

CSNO

VBRG

Feedback pin for buck output voltage. Connect it to buck output

before inverter bridge input current sense resistor.

Inverter input power supply voltage. Connect to buck output

before inverter bridge input current sense resistor. Used as weak

discharge of VBRG.

VBRG_DIS

Type-C connector configuration channel 1. Connect directly to

the CC1 pin on the port’s Type-C connector and to a capacitor

(recommended value 390pF) to ground.

15

16

CC1

CC2

Type-C connector configuration channel 2. Connect directly to

the CC2 pin on the port’s Type-C connector and to a capacitor

(recommended value 390pF) to ground.

17

18

NFET_CTRL_0

ASK_OUT

NFET gate driver output. Float this pin if it is not used.

ASK voltage/current sensing path.

IC output for ASK signal processing.

Input for ASK signal decoding. Connect external ASK comparator

output to this pin. Short this pin to pin-36 (ASK_SEL).

19

20

ASK_DEMOD

Inverter gate driver input signal for inverter bank 1.

Short this pin to pin-22. PWM_OUT.

GD_OVR_HB_1

PWM_IN1

Datasheet

6 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Pin information

Table 1

Pin#

WLC1115 pinouts (continued)

Pin function for 15W

Pin name

MP-A11 application

firmware

Pin description

Inverter gate driver input signal for inverter bank 2.

Short this pin to pin-22 PWM_OUT.

21

22

GD_OVR_HB_2

PWM_IN2

Inverter PWM signal output used for the inverter gate drive

inputs. Short this pin to pin 20 (PWM_IN1) and pin 21 (PWN_IN2).

PWM_OUT

Default USB D+ / configurable GPIO. For support of legacy

charging AFC and QC. IC does not support USB data transmission

on this pin.

23

24

25

63

DP/GPIO1

DM/GPIO2

DP

Default USB D- / configurable GPIO. For support of legacy

charging AFC and QC. IC does not support USB data transmission

on this pin.

DM

VDDD 5V LDO output from VIN. Connect a ceramic bypass

capacitor (recommended value 1µF) from this pin to GND close

to the IC. Connect all VDDD pins together.

VDDD

XRES

VDDD 5V LDO output from VIN. Connect a ceramic bypass

capacitor (recommended value 10µF) from this pin to GND close

to the IC. Connect all VDDD pins together.

Default LED1 for 15W MP-A11 application/configurable GPIO.

Float this pin if it is not used.

26

27

28

GPIO3

GPIO4

LED1

LED2

Default LED2 for 15W MP-A11 application/configurable GPIO.

Float this pin if it is not used.

External reset – active low, internally pulled-up (~6kΩ).

Float this pin if it is not used.

2

Used for interfacing as Master, with OPTIGA™ Trust I C SDA. The

29

GPIO5/SCB0

SDA_SEC

pin is configured for open drain connection, connect an external

pull-up resistor. Float this pin if it is not used.

2

Used for interfacing with OPTIGA™ Trust I C SCL. The pin is

30

31

32

33

GPIO6/SCB0

GPIO7/SCB1

SCL_SEC

configured for open drain connection, connect an external

pull-up resistor. Float this pin if it is not used.

Default UART Tx for debug/configurable GPIO.

Float this pin if it is not used.

UART/GPIO7

Q-factor based foreign object detection (FOD) pre-charge

measurement input for frequency counting. Short this pin to pin

37 (QCOMP1).

QCOMP2

GND

RESET for OPTIGA™ Trust IC. Configured for using OPTIGA™ Trust

in low power mode. Float this pin if it is not used.

GPIO8

RES_SEC

34, 64

35

Ground. Connect directly to the E-PAD and to ground plane.

NFET gate driver output. Float this pin if it is not used.

NFET_CTRL_1

Input for ASK signal decoding. Short this pin to pin-19

(ASK_DEMOD).

36

37

ASK_SEL

Q-factor based FOD pre-charge measurement input for peak

voltage detect. Short this pin to pin 32 (QCOMP2).

QCOMP1

BB_IN

Input voltage to BUCK (DC-DC) controller. Connect to USB Type-C

connector's VBUS pin. If EMI filter/choke is used after Type-C

connector then connect it to output of the EMI filter/choke.

38

39

Input voltage feedback of buck (DC-DC). Connect to USB Type-C

connector's VBUS pin. If EMI filter/choke is used after Type-C

connector then connect it to output of the EMI filter/choke.

VBUS_IN

Negative input of ASK voltage sensing signal input to internal

amplifier.

40

41

ASK_N

ASK_P

Positive input of ASK voltage sensing signal input to internal

amplifier.

Datasheet

7 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Pin information

Table 1

Pin#

WLC1115 pinouts (continued)

Pin function for 15W

Pin name

MP-A11 application

firmware

Pin description

ASK voltage sensing comparator output. Float this pin if it is not

used.

42

43

ASK_TST

Bootstrap power supply for (inverter bank 2) inverter high side

gate driver. Connect a capacitor (recommended value 0.1µF)

from this pin to SW2_1. Also, connect a Schottky diode from

VDDD to BST2_1.

BST2_1

High side gate driver for inverter FET (inverter bank 2). Connect

to the Inverter bank 2, high side FET gate. Use a wide trace to

minimize inductance of this connection.

44

45

46

HG2_1

SW2_1

VBB_1

Inverter switching node for inverter bank 2. Connect this pin to

the inverter bank 2 switching node with a short and wide trace.

Inverter input voltage sense. Connect to inverter input voltage,

after the current sense resistor. Use a dedicated (Kelvin) trace for

this connection.

Low side gate driver for inverter FET (inverter bank 2). Connect to

the inverter bank 2 low side FET gate.

47

48

49

50

51

52

LG2_1

PVDD_1

PGND_1

LG1_1

Connect to VDDD pin. Connect bypass capacitors (recommended

values 1µF and 0.1µF) as close to the IC as possible.

Ground for inverter gate driver. Connect directly to PCB ground

plane and E-PAD. Connect all GND and PGND pins together.

Low side gate driver for inverter FET (inverter bank 1). Connect to

the inverter bank 1 Low side FET gate.

Inverter switching node for inverter bank 1. Connect this pin to

the Inverter bank 1 switching node with a short and wide trace.

SW1_1

HG1_1

High side gate driver for inverter FET (inverter bank 1). Connect

to the inverter bank 1 high side FET gate.

Bootstrap power supply for (inverter bank 1) inverter high side

gate driver. Connect a capacitor (recommended values 0.1µF)

from this pin to SW1_1. Also, connect a Schottky diode from

VDDD to BST1_1.

53

BST1_1

Negative input of input current sense amplifier for inverter.

Float this pin if it is not used.

54

55

56

57

CSNI_1

CSPI_1

DNU1

DNU2

Positive input of input current sense amplifier for inverter.

Float this pin if it is not used.

2

Used for I C/SWD register access or programming/configurable

GPIO9/SCB3/SWD_DAT

SWD_DAT/GPIO9

GPIO.

2

Used for I C/SCL register access or programming/configurable

GPIO10/SCB3/SWD_CLK SWD_CLK/GPIO10

GPIO.

Tx coil temperature measurement via thermistor monitoring for

15W MP-A11 application/configurable GPIO. Float this pin if it is

not used.

58

GPIO11/SCB3

TEMP_FB

59

60

GPIO12/SCB3

GPIO12

Configurable GPIO. Float this pin if it is not used.

Default used as input for external clock/configurable GPIO.

Float this pin if it is not used.

GPIO13/CLK_IN

4.5V–24V input supply. Connect a decoupling capacitor

61

62

VIN

(recommended value 0.1µF) from this pin to GND close to this pin.

1.8V LDO output for Arm®-M0 power and 1.8V references.

Connect a decoupling capacitor (recommended value 0.1µF)

from this pin to ground. Not for external use or loading.

VCCD

Positive input of USB input current sense amplifier (DC-DC).

Connect to the positive terminal of the input current sense

resistor. Use a dedicated (Kelvin) connection.

65

CSPI_0

Datasheet

8 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Pin information

Table 1

Pin#

WLC1115 pinouts (continued)

Pin function for 15W

Pin name

MP-A11 application

firmware

Pin description

Negative input of USB input current sense amplifier t (DC-DC).

Connect to the negative terminal of the input current sense

resistor. Use a dedicated (Kelvin) connection.

66

67

68

CSNI_0

Bootstrap power supply for buck (DC-DC) high side gate driver.

Connect a capacitor (recommended value 0.1µF) from this pin to

SW1_0. Also, connect a Schottky diode from VDDD to BST1_0.

BST1_0

High side gate driver output of buck converter (DC-DC bank 1).

Connect to the buck high side FET gate. Use a wide trace to

minimize inductance of this connection.

HG1_0

EPAD

Exposed ground pad. Connect directly to ground plane and pins

34 and 64.

DC‐DC

bank 1

Inverter

bank 1

Inverter

bank 2

NFET_CTRL_1

HG2_1

SW2_1

HG1_1

HG1_0

SW1_0

SW1_1

LG1_1

LG2_1

LG1_0

[3]

Figure 2

WLC1115 key pin mapping with buck and inverter power supplies

Note

3. Refer Figure 2 for an overview of key WLC1115 pin mapping to power input, current sense and gate drivers of buck and

inverter power supplies.

Datasheet

9 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Pin information

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

SW1_0

SW1_1

LG1_1

1

LG1_0

2

PGND_0

PGND_1

PVDD_1

LG2_1

3

PVDD_0

4

LG2_0

5

VBB_0

VBB_1

6

SW2_1

HG2_1

SW2_0

7

HG2_0

8

EPAD

BST2_0

BST2_1

9

ASK_TST

COMP

10

ASK_P

CSPO

11

ASK_N

CSNO

12

VBUS_IN

BB_IN

VBRG

13

14

VBRG_DIS

QCOMP1

ASK_SEL

NFET_CTRL_1

CC1

15

CC2

16

NFET_CTRL_0

17

Figure 3

WLC1115 68-QFN pinout

Datasheet

10 of 40

002-34241 Rev. *B

2022-04-22

Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Electrical specifications

3

Electrical specifications

3.1

Absolute maximum ratings

Table 2

Absolute maximum ratings^[4]

Exceeding maximum ratings may shorten the useful life of the device.

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Parameter

Description

Min

Typ

Max

Unit

Description

Maximum input supply

voltage

VIN

40

Maximum supply voltage

relative to VSS

VDDD, PVDD

VBUS

6

–

Max VBRG_DIS (P0/P1)

voltage relative to VSS

24

V

Max voltage on CC and

ASK_SEL pins

CC_0, ASK_SEL

QCOMP1

Max voltage on QCOMP1

pins

–0.7

Current limited to 1mA for -0.7V

minimum specification.

QCOMP2

GPIO

Input to QCOMP2

Inputs to GPIO

–0.7

–0.5

VDDD + 0.5

–

Maximum current per

GPIO

IGPIO

–25

25

mA

V

GPIO injection current,

Absolute max, current injected

per pin

IGPIO_INJECTION Max for VIH > VDDD, and

Min for VIL < VSS

–0.5

0.5

Electrostatic discharge

Applicable for all pins except

CC1_0, CC2_0, ASK_SEL,

QCOMP1 pins.

ESD_HBM

(ESD) human body model

(HBM)

2000

1100

–

ESDHBM for CC1 and CC2

pins for both ports

Only applicable to CC1_0, CC2_0,

ASK_SEL, QCOMP1 pins

ESD_HBM_CC

ESD_CDM

ESD charged device model 500

Charged device model ESD

LU

TJ

Pin current for latch-up

Junction temperature

–100

–40

100

125

mA

°C

–

Note

4. Usage above the absolute maximum conditions listed in Table 2 may cause permanent damage to the device. Exposure

to absolute maximum conditions for extended periods of time may affect device reliability. The maximum storage

temperature is 150°C in compliance with JEDEC Standard JESD22-A103, high temperature storage life. When used below

absolute maximum conditions but above normal operating conditions, the device may not operate to specification.

Datasheet

11 of 40

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

Table 3

Pin#

Pin based absolute maximum ratings

Pin function for 15W

Pin name

MP-A11 application

firmware

Absolute minimum (V) Absolute maximum (V)

1

2

SW1_0

-0.7

-0.5

-0.3

-0.5

-0.3

-0.5

0

35

PVDD+0.5

0.3

[5]

LG1_0

3

PGND_0

PVDD_0

4

VDD

[5]

5

LG2_0

PVDD+0.5

24

6

VBB_0

SW2_0

7

24

[5, 6]

8

HG2_0 (w.r.t SW2_0)

PVDD+0.5

24

[5, 6, 7]

9

BST2_0 (w.r.t SW2_0)

[5]

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25, 63

26

27

28

29

30

31

32

33

34,64

35

36

37

Notes

COMP

-0.5

-0.3

-0.5

-0.3

-0.5

-0.7

-0.5

-0.3

-0.5

-0.7

CSPO

CSNO

24

VBRG

24

VBRG_DIS

CC1

24

CC2

24

NFET_CTRL_0

32

[5]

ASK_OUT

PVDD+0.5

6

[5]

ASK_DEMOD

[5]

GD_OVR_HB_1

PWM_IN1

PWM_IN2

[5]

GD_OVR_HB_2

[5]

PWM_OUT

[5]

DP/GPIO1

DP

[5]

DM/GPIO2

DM

VDDD

[5]

GPIO3

LED1

LED2

PVDD+0.5

0.3

[5]

GPIO4

[5]

XRES

[5]

GPIO5/SCB0

GPIO6/SCB0

GPIO7/SCB1

SDA_SEC

SCL_SEC

[5]

UART/GPIO7

[5, 8]

QCOMP2

GND

[5]

GPIO8

RES_SEC

NFET_CTRL_1

ASK_SEL

32

24

[8]

QCOMP1

24

5. Max voltage cannot exceed 6 V.

6. Max absolute voltage w.r.t GND must not exceed 40V.

7. Min absolute voltage w.r.t GND must not be lower than -0.3V.

8. Current limited to 1mA for -0.7V minimum specification only.

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Electrical specifications

Table 3

Pin#

Pin based absolute maximum ratings (continued)

Pin function for 15W

Pin name

MP-A11 application

firmware

Absolute minimum (V) Absolute maximum (V)

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

65

66

67

68

BB_IN

VBUS_IN

ASK_N

ASK_P

-0.3

-0.5

0

24

[5]

ASK_TST

PVDD+0.5

24

[5, 6, 7]

BST2_1 (w.r.t SW2_1)

HG2_1 (w.r.t SW2_1)

SW2_1

[5, 6]

-0.5

-0.7

-0.3

-0.5

-0.3

-0.5

-0.7

-0.5

0

VBB_1

24

[5]

LG2_1

PVDD+0.5

VDDD

0.3

PVDD_1

PGND_1

[5]

LG1_1

PVDD+0.5

35

SW1_1

[5, 6]

HG1_1 (w.r.t SW1_1)

PVDD+0.5

40

[5, 6, 7]

BST1_1 (w.r.t SW1_1)

CSNI_1

DNU1

-0.3

-0.5

-0.3

0

CSPI_1

DNU2

40

[5]

GPIO9/SCB3/SWD_DAT

SWD_DAT/GPIO9

SWD_CLK/GPIO10

TEMP_FB

PVDD+0.5

40

[5]

GPIO10/SCB3/SWD_CLK

[5]

GPIO11/SCB3

[5]

GPIO12/SCB3

GPIO12

[5]

GPIO13/CLK_IN

VIN

VCCD

2

CSPI_0

CSNI_0

40

[5, 6, 7]

BST1_0 (w.r.t SW1_0)

HG1_0 (w.r.t SW1_0)

EPAD

PVDD+0.5

0.3

[5, 6]

-0.5

-0.3

Notes

5. Max voltage cannot exceed 6 V.

6. Max absolute voltage w.r.t GND must not exceed 40V.

7. Min absolute voltage w.r.t GND must not be lower than -0.3V.

8. Current limited to 1mA for -0.7V minimum specification only.

Datasheet

13 of 40

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.2

Device-level specifications

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

3.3

DC specifications

Table 4

DC specifications (Operating conditions)

Spec ID

Parameter

VIN

Description

Min

Typ

Max

Unit

Details/conditions

SID.PWR#1

Input supply voltage

4.5

24

–

VDDD output voltage

range

5.5V < VINS < 24V;

Max load = 150 mA

SID.PWR#2

VDDD

4.6

5.5

–

V

4.5V < VIN < 5.5V;

Max load = 20 mA

SID.PWR#3

VDDD_MIN

VDDD dropout voltage VIN - 0.2

–

SID.PWR#20 VBRG

SID.PWR#5 VCCD

VBRG_0 output range

VCCD output voltage

3

–

22

VIN > VBRG

–

1.8

87

TA = 25°C, VIN = 12V.

CC IO in Transmit or Receive,

no I/O sourcing current,

Operating quiescent

–

SID.PWR#25 IDD_ACT48M current at 0.4MHz

switching frequency

mA No VCONN load current,

CPU at 48MHz,

buck and inverter ON,

3-nF gate driver capacitance.

3.3.1

CPU

Table 5

CPU specifications

Spec ID

SID.CLK#4

SYS.XRES#5 TxRES

Parameter

Description

Min

Typ

Max

Unit

Details/conditions

FCPU

CPU input frequency

–

48

MHz

External reset pulse

width

5

–

µs

–

Power-up to “Ready

2

SYS.FES#1

T_PWR_RDY

to accept I C/CC

–

5

25

ms

command”

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Electrical specifications

3.3.2

GPIO

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 6

GPIO specifications

Parameter

Details/

Spec ID

Description

Min

Typ

Max

Unit

Conditions

GPIO DC specifications

Input voltage HIGH

threshold

SID.GIO#9

SID.GIO#10

SID.GIO#7

SID.GIO#8

SID.GIO#2

SID.GIO#3

SID.GIO#4

SID.GIO#5

V

0.7 × VDDD

–

IH_CMOS

IL_CMOS

OH

CMOS input

Input voltage LOW

threshold

–

0.3 × VDDD

–

V

Output voltage HIGH

level

VDDD – 0.6

–

IOH = –4mA

IOL = 10mA

Output voltage LOW

level

–

0.6

8.5

2

OL

Pull-up resistor when

enabled

Rpu

Rpd

3.5

5.6

kΩ

–

Pull-down resistor

when enabled

Input leakage current

(absolute value)

TA = 25°C,

VDDD = 3V

I

nA

IL

–

3

–

Capacitance on

DP, DM pins

C

Max pin capacitance

22

PIN_A

–

pF

–40°C < TA < +105°C,

All VDDD,

SID.GIO#6

Max pin capacitance

7

–

all other I/Os

Input hysteresis,

SID.GIO#13

SID.GIO#14

V

100

VDDD > 2.7V

–

HYSTTL

LVTTL, VDDD > 2.7V

mV

Input hysteresis

CMOS

0.1 × VDDD

HYSCMOS

GPIO AC specifications

Rise time in Fast

Strong mode

SID.GIO#16

SID.GIO#17

SID.GIO#18

SID.GIO#19

T

2

12

60

RISEF

FALLF

RISES

FALLS

Fall time in Fast

Strong mode

ns

Rise time in Slow

Strong mode

10

Fall time in Slow

Strong mode

Cload = 25pF

–

GPIO FOUT;

SID.GIO#20

SID.GIO#21

SID.GIO#22

F

3.0V  VDDD  5.5V.

Fast Strong mode.

16

7

GPIO_OUT1

GPIO_OUT2

GPIO_IN

GPIO FOUT;

3.0V  VDDD 5.5V.

Slow Strong mode.

–

MHz

mA

GPIO input operating

frequency;

48

-40°C  TA  +105°C

3.0 V  VDDD  5.5 V.

GPIO OVT DC specifications

Max / min current

in to any input or

output, pin-to-pin,

pin-to-supply

SID.GPIO_20VT_

GPIO_20VT latch up

current limits

GPIO_20VT_I_LU

–140

–

140

GIO#4

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

Table 6

GPIO specifications (continued)

Details/

Spec ID

Parameter

Description

Min

Typ

Max

Unit

Conditions

SID.GPIO_20VT_

GIO#5

GPIO_20VT pull-up

resistor value

–40°C ≤ TA ≤

GPIO_20VT_RPU

3.5

8.5

+105°C, All VDDD

kΩ

GPIO_20VT

pull-down resistor

value

SID.GPIO_20VT_

GIO#6

–40°C ≤ TA ≤

GPIO_20VT_RPD

GPIO_20VT_IIL

3.5

–

8.5

2

+105°C, All VDDD

GPIO_20VT input

leakage current

(absolute value)

SID.GPIO_20VT

_GIO#16

nA +25°C TA, 3V VDDD

SID.GPIO_20VT

_GIO#17

GPIO_20VT pin

capacitance

–40°C ≤ TA ≤

pF

GPIO_20VT_CPIN

GPIO_20VT_Voh

GPIO_20VT_Vol

10

–

+105°C, All VDDD

SID.GPIO_20VT

_GIO#33

GPIO_20VT output

voltage high level

VDDD - 0.6

IOH = -4mA

IOL = 8mA

–

SID.GPIO_20VT

_GIO#36

GPIO_20VT output

voltage low level

–

2

0.6

–

V

SID.GPIO_20VT

_GIO#41

GPIO_20VT_Vih_ GPIO_20VT LVTTL

–40°C ≤ TA ≤

LV TTL

input

+105°C, All VDDD

SID.GPIO_20VT

_GIO#42

GPIO_20VT_Vil_

LV TTL

GPIO_20VT LVTTL

input

–40°C ≤ TA ≤

–

0.8

–

+105°C, All VDDD

SID.GPIO_20VT

_GIO#43

GPIO_20VT_

Vhysttl

GPIO_20VT input

hysteresis LVTTL

–40°C ≤ TA ≤

mV

100

+105°C, All VDDD

GPIO_20VT

SID.GPIO_20VT

_GIO#45

GPIO_20VT_

ITOT_G PIO

V (GPIO_20VT Pin)

maximum total sink

pin current to ground

–

95

mA

> VDDDs

GPIO OVT AC specifications

GPIO_20VT Rise time

in Fast Strong Mode

SID.GPIO_20VT_70 GPIO_20VT_TriseF

1

15

70

GPIO_20VT Fall time

in Fast Strong Mode

SID.GPIO_20VT_71 GPIO_20VT_TfallF

ns

SID.GPIO_20VT_

GIO#46

GPIO_20VT_

TriseS

GPIO_20VT Rise time

in Slow Strong Mode

10

SID.GPIO_20VT_

GIO#47

GPIO_20VT Fall time

in Slow Strong Mode

All VDDD,

GPIO_20VT_TfallS

Cload = 25pF

–

GPIO_20VT GPIO

SID.GPIO_20VT_

GIO#48

GPIO_20VT_FGPIO Fout;

33

_OUT1

3V ≤ VDDD ≤ 5.5V.

Fast Strong mode.

GPIO_20VT GPIO Fout;

3V ≤ VDDD ≤ 5.5V.

Slow Strong mode.

SID.GPIO_20VT_

GIO #50

GPIO_20VT_FGPIO

_OUT3

–

MHz

7

8

GPIO_20VTGPIOinput

operating frequency;

3V ≤ VDDD ≤ 5.5V

SID.GPIO_20VT_

GIO #52

GPIO_20VT_FGPIO

_IN

All VDDD

Datasheet

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002-34241 Rev. *B

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.3.3

XRES and POR

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 7 XRES specifications

Details/

Spec ID

Parameter

Description

Min

Typ

Max

Unit

conditions

XRES DC specifications

Input voltage HIGH

SID.XRES#1

SID.XRES#2

SID.XRES#3

SID.XRES#4

V

0.7 × VDDD

–

IH_XRES

IL_XRES

threshold on XRES pin

V

CMOS input

Input voltage LOW

–

0.3 × VDDD

threshold on XRES pin

Input capacitance on

XRES pin

C

–

7

–

pF

IN_XRES

–

Input voltage

V

0.05 × VDDD

–

mV

HYSXRES

hysteresis on XRES pin

Imprecise POR (IPOR) specifications

SID185

SID186

V

POR rising trip voltage

POR falling trip voltage

0.80

0.70

1.50

1.4

RISEIPOR

-40°C < TA < +105°C,

V

all VDDD

FALLIPOR

Precise POR (POR) specifications

Brown-out detect

SID190

SID192

V

(BOD) trip voltage in

active/sleep modes

1.48

1.1

1.62

1.5

FALLPPOR

FALLDPSLP

-40°C < TA < +105°C,

–

all VDDD

BOD trip voltage in

Deep Sleep mode

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.4

Digital peripherals

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

The following specifications apply to the Timer/counter/PWM peripherals in the Timer mode.

3.4.1

Inverter pulse-width modulation (PWM) for GPIO pins

Table 8

PWM AC specifications

Spec ID

Parameter

Description

Min

Typ

Max

Unit Details/conditions

SID.TCPWM.1 PWM_OUT

Operating frequency

85

127.7

600

kHz PWM_OUT pin

Minimum possible

width of overflow,

underflow, and CC

ns (counter equals

compare value)

Output trigger pulse

width

SID.TCPWM.3 T

2/Fc

–

PWMEXT

outputs.

Fc = System clock.

3.4.2

I²C, UART, SWD interface

Table 9

Communication interface specifications

Spec ID

Parameter

Description

Min

–

Typ

Max

Unit

Details/conditions

2

Fixed I C AC specifications

SID153

Fixed UART AC specifications

SID16

SWD interface specifications

F

Bit rate

–

1

Mbps –

I2C1

F

Bit rate

–

UART

SID.SWD#1

SID.SWD#2

SID.SWD#3

SID.SWD#4

SID.SWD#5

F_SWDCLK1

3.0V ≤ VDDIO ≤ 5.5V

–

14

MHz

ns

–

T_SWDI_SETUP

T_SWDI_HOLD

T_SWDO_VALID

T_SWDO_HOLD

0.25 × T

–

0.25 × T

–

0.50 × T

–

T = 1/f SWDCLK

–

1

3.4.3

Memory

Table 10

Flash AC specifications

Spec ID

Parameter

FLASH_WRITE

FLASH_ERASE

Description

Min

Typ

Max

20

Unit

Details/conditions

Row (block) write time

(erase and program)

SID.MEM#2

SID.MEM#1

SID.MEM#5

SID178

Row erase time

15.5

7

ms

FLASH_ROW_

PGM

Row program time after

erase

–

T

Bulk erase time (32KB)

35

BULKERASE

–

Total device program

time

SID180

T

7.5

s

DEVPROG

SID.MEM#6

SID182

FLASH

Flash write endurance

Flash retention,

100k

20

cycles 25°C < T < 55°C

ENPB

A

F

RET1

RET2

T < 55°C, 100K P/E cycles

–

A

years –

Flash retention,

SID182A

Datasheet

F

10

T < 85°C, 10K P/E cycles

A

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.5

System resources

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

3.5.1

Internal main oscillator clock

Table 11

IMO AC, clock specifications

Details/

Spec ID

IMO AC specifications

Parameter

Description

Min

Typ Max

Unit

conditions

Frequency variation at

48MHz (trimmed)

SID.CLK#13

F

–2

+2

%

3.0V < VDDD < 5.5V

–

IMOTOL

–

SID226

T

IMO start-up time

IMO frequency

–

7

µs

STARTIMO

SID.CLK#1

F

24

48

MHz

IMO

External clock specifications

-40°C < T < 105°C;

A

External clock input

frequency

3.0 V < VDDD <

5.5V. Tolerance

50 ppm.

SID.305

EXTCLKFREQ

–

48

–

MHz

3.5.2

PD

Table 12

PD DC specifications

Spec ID

Parameter

Description

Min

Typ Max Unit Details/conditions

Transmitter output high

voltage

SID.DC.cc_shvt.1 vSwing

1.05

1.2

V

0.075

Transmitter output low

voltage

SID.DC.cc_shvt.2 vSwing_low

–

Transmitter output

impedance

SID.DC.cc_shvt.3 zDriver

SID.DC.cc_shvt.4 zBmcRx

33

10

75

–



Receiver input impedance

M

Pull down termination

resistance when acting as

UFP

SID.DC.cc_shvt.8 Rd

4.59

5.61

k

–

CC impedance to ground

when disabled

SID.DC.cc_shvt.10 zOPEN

108

0.61

1.16

0.3

–

CC voltages on UFP

side-standard USB

SID.DC.cc_shvt.15 UFP_default_0 p66

SID.DC.cc_shvt.16 UFP_1.5A_1p23

SID.DC.cc_shvt.17 Vattach_ds

0.7

1.31

0.6

V

CC voltages on UFP

side-1.5A

Deep Sleep attach

threshold

%

SID.DC.cc_shvt.18 Rattach_ds

SID.DC.cc_shvt.19 VTX_step

Deep Sleep pull-up resistor

TX drive voltage step size

10

80

50

k

120

mV

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.5.3

ADC

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 13

ADC DC specifications

Details/

Spec ID

Parameter

Description

Min

Typ

Max

Unit

conditions

SID.ADC.1

SID.ADC.2

Resolution

ADC resolution

–

8

–

Bits –

Reference voltage

generated from

bandgap

INL

Integral non-linearity

-1.5

-2.5

1.5

2.5

Reference voltage

LSB generated from

VDDD

Differential

SID.ADC.3

SID.ADC.4

SID.ADC.5

DNL

non-linearity

–

Reference voltage

generated from

bandgap

Gain Error

VREF_ADC1

Gain error

-1.5

1.5

Reference voltage

generated from

VDDD

Reference voltage of

ADC

VDDDmin

VDDDmax

V

Reference voltage

generated from

deep sleep

Reference voltage of

ADC

SID.ADC.6

VREF_ADC2

1.96

2.0

2.04

reference

3.5.4

Current sense amplifier (CSA) / ASK amplifier (ASK_P and ASK_N)

Table 14

CSA/ASK amplifier specifications

Spec ID

Parameter

Description

Min Typ Max Unit

Details/conditions

HS CSA DC specifications

CSA short circuit

SID.HSCSA.7

Csa_SCP_Acc1

protection (SCP) at 6A with -10

10

5/10/20m sense resistor

–

CSA SCP at 10A with

-10

SID.HSCSA.8

SID.HSCSA.9

SID.HSCSA.10

Csa_SCP_Acc2

Csa_OCP_1A

Csa_OCP_5A

5/10/20m sense resistor

Active mode

CSA OCP at 1A with

104 130 156

117 130 143

5/10/20m sense resistor

%

CSA OCP for 5A with

5/10/20m sense resistor

CSA sense accuracy.

Active mode.

SID.HSCSA.13

Csa_CBL_MON_Acc2 Vsense > 10mV

–

3.5

–

3.0 V < VDDD < 5.5 V.

T = 25°C.

A

CSA AC specifications

Delay from SCP threshold

trip to external NFET

power gate turn off

SID.HSCSA.AC.1

SID.HSCSA.AC.2

T

3.5

8

1 nF NFET gate

3 nF NFET gate

SCP_GATE

–

µs

Delay from SCP threshold

trip to external NFET

power gate turn off

T

SCP_GATE_1

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

USB Type-C PD controller

Electrical specifications

3.5.5

VIN UV/OV

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 15

VIN UV/OV specifications

Parameter

Spec ID

Description

Min Typ Max Unit Details/conditions

Overvoltage threshold

accuracy, 4V-11V

SID.UVOV.1

SID.UVOV.2

SID.UVOV.3

SID.UVOV.4

SID.UVOV.5

VTHOV1

VTHOV2

VTHUV1

VTHUV2

VTHUV3

-3

-3.2

-4

3

3.2

4

Overvoltage threshold

accuracy, 11V-21.5V

Undervoltage threshold

accuracy, 3V-3.3V

–

%

Active mode

Undervoltage threshold

accuracy, 3.3V-4.0V

-3.5

-3

3.5

3

Undervoltage threshold

accuracy, 4.0V-21.5V

3.5.6

Voltage regulation - VBRG

Table 16

VBRG specifications

Spec ID

Parameter

Description

Min Typ Max Unit Details/conditions

VBRG discharge specifications

20V NMOS ON resistance for

DS = 1

SID.VBUS.DISC.1 R_DIS1

500

250

125

2000

1000

500

20V NMOS ON resistance for

DS = 2

SID. VBUS.DISC.2 R_DIS 2

SID. VBUS.DISC.3 R_DIS 4

SID. VBUS.DISC.4 R_DIS 8

SID. VBUS DISC.5 R_DIS 16

20V NMOS ON resistance for

DS = 4

Ω

Measured at 0.5V

–

20V NMOS ON resistance for

DS = 8

62.5

31.25

–

250

125

10

20V NMOS ON resistance for

DS = 16

Error percentage of final VBRG

value from setting

When VBRG is

SID. VBUS.DISC.6 VBRG_stop_error

%

discharged to 5V

Voltage regulation DC specifications

VBB output voltage range

SID.DC.VR.1

SID.DC.VR.2

VBB

VR

3.0

-5

–

22

+5

V

VBB voltage regulation accuracy

±3

%

–

VIN supply below which chip will

get reset

SID.DC.VR.3

SID.VREG.1

VIN_UVLO

TSTART

1.7

–

3.0

V

–

Total startup time for the

regulator supply outputs

Specification for

VDDD LDO

200

µs

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Electrical specifications

3.5.7

NFET gate driver specifications

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 17 NFET gate driver specifications

Spec ID

Parameter

Description

Min Typ Max Unit Details/conditions

NFET gate driver DC specifications

Gate to source overdrive during

ON condition

SID.GD.1

SID.GD.2

GD_VGS

GD_RPD

4.5

–

5

–

10

2

V

NFET driver is ON

Applicable on

Resistance when pull-down

enabled

kΩ NFET_CTRL to turn

off external NFET.

NFET gate driver AC specifications

NFET_CTRL Low to High

(1V to VBUS + 1V) with 3nF

external capacitance.

SID.GD.3

SID.GD.4

T

2

–

5

7

10

–

ms VBUS = 5V

ON

NFET_CTRL High to Low

(90% to 10%) with 3nF external

capacitance.

µs VBUS = 21.5V

OFF

3.5.8

Buck PWM controller

Table 18

PWM controller specifications

Spec ID

Parameter

Description

Min Typ Max Unit Details/conditions

PWM controller specifications

PWM.1

GD1

FSW

Buck switching frequency

150

85

–

600

–

Pins PWM_IN1 and

PWM_IN2 are

kHz

%

Fsw Gd Ovr

Inverter switching frequency

connected to pin

PWM_OUT.

Spread spectrum frequency

dithering span

PWM.2

FSS

–

10

–

Buck gate driver specifications

Top-side gate driver

DR.1

DR.2

DR.3

DR.4

DR.5

DR.6

R_HS_PU

R_HS_PD

R_LS_PU

R_LS_PD

Dead_HS

Dead_LS

2

on-resistance - gate pull-up

Top-side gate driver

1.5

2

on-resistance - gate pull-down

Ω

Bottom-side gate driver

on-resistance - gate pull-up

Bottom-side gate driver

1.5

30

–

on-resistance - gate pull-down

Dead time before high-side rising

edge

Dead time before low-side rising

edge

ns

DR.7

DR.8

Tr_HS

Tf_HS

Top-side gate driver rise time

Top-side gate driver fall time

25

20

NFET gate driver specifications

DR.9

Tr_LS

Tf_LS

Bottom-side gate driver rise time

Bottom-side gate driver fall time

25

20

–

DR.10

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Electrical specifications

3.5.9

Thermal

All specifications are valid for -40°C  TA  105°C and TJ  125°C, except where noted.

Table 19

Spec ID

SID.OTP.1

Thermal specifications

Parameter

Description

Min Typ Max Unit Details/conditions

120 125 130 °C

OTP

Thermal shutdown

–

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Functional overview

4

Functional overview

4.1

Wireless power transmitter

WLC1115 supports wireless power transfer between power transmitter (TX) and power receiver (RX), based on

inductive power transfer technology (IPT). The Tx runs an alternating electrical current through the Tx coil(s) to

generate an alternating magnetic field in accordance with Faraday's law. This magnetic field is mutually coupled

to the Rx coil inside the power receiver and is transformed back into an alternating electrical current that is

rectified and stored on a Vrect capacitor bank to power the Rx load.

Before the power transfer begins, the Rx and Tx communicate with each other to establish that a valid Rx device

has been placed and they negotiate the level of power to be transferred during the charging cycle. The digital

communication used by Tx and Rx is in-band communication. The communication from Tx to Rx is frequency shift

key (FSK) modulation and from Rx to Tx is amplitude shift key (ASK) modulation. The WLC1115 solution is

compliant with the Qi v1.3.x standard up to 15W. The WLC1115 operates in both BPP or EPP depending on the

capabilities of the Rx that gets placed by the user.

WLC1115 offers a highly integrated wireless power transmitter solution with a USB Type-C PD controller following

the Qi v1.3.x standard. This includes ready to use firmware stack with a robust demodulation scheme for

continuous power transfer and reliable FOD to ensure safety. WLC1115 firmware stack comes with a high level of

configurable options to enable differentiation by application using the configuration utility tool.

4.2

WPC system control

WLC1115 controls the wireless power system in compliance with Qi standard version 1.3.x. The system control

covers power transfer, system monitoring, and various phases of operation under BPP or EPP receivers

depending on the Rx type placed onto the Tx pad.

Error

Calibration

Failure

Or

Error

Negotiation

Failure

Or

Error

Start

Selection

No

Response

or

No power

nedded

Negotiation

Successful

Object

Detected

Renegotiation

Requested

Renegotiation

Negotiation

Calibration

Renegotiation

Completed

Ping

Calibration

Successful

Is

No

Receiver

Present

Power Transfer

As per Negotiation

Authentication

Required

Yes

Negotiation

Requested

Power Transfer

Limited to 5W

Identification

Error

&

Is

Configuration

Yes

Authentication

Challenge

Succesful

No Negotiation

Requested

(<5W PRx)

No

Power Transfer

Complete

Or

Error

Figure 4

WPC system control flow chart (negotiation, calibration and authentication are for EPP

only)^[9]

Note

9. The Functional overview section only describes the Qi specification. However, IC can support wireless charging pro-

prietary power delivery extensions (PPDE)/Samsung FC.

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.2.1

Selection phase

The Tx monitors the interface surface using low energy signals (analog ping or Q-factor) to detect objects'

placement and removal. The Analog Ping energy is limited such that impedance changes above the Tx coil may

be detected without powering or waking up the receiver. The WLC1115 sets the Bridge (VBRG) voltage powering

the inverter to a low voltage to generate sufficient energy to measure for any interface impedance changes

without transferring any power during the selection phase.

4.2.2

Digital ping phase

In this phase, the Tx sends a power signal that is sufficient to power the receiver and prompt a response. This

signal is called Digital Ping and the magnitude and length of time are predefined by the WPC Tx specifications.

The Digital Ping phase ends when no response is detected or the Rx responds with a signal strength packet (SSP).

When the Tx receives a valid SSP, the Digital Ping is extended and the system proceeds to the Identification and

Configuration phase.

4.2.3

Identification and configuration phase

In this phase, the Tx identifies whether the Rx belongs to BPP or EPP profile. Additionally, in this phase, the Tx

obtains configuration information such as the maximum amount of power that the Rx may require at its output.

The power transmitter uses this information to create a Power Transfer Contract.

If the receiver is a BPP type then the power transmitter enters into the power transfer phase at the completion of

the ID and Config phase as shown in Figure 8 or with EPP receivers it proceeds to the negotiation phase if

requested by the Rx.

4.2.4

Negotiation

In this phase, the EPP power receiver negotiates with the power transmitter to fine-tune the power transfer

contract. For this purpose, the power receiver sends negotiation requests to the power transmitter, which the

power transmitter can grant or deny.

In compliance with Q-factor FOD, the Tx will compare the Q-factor reported by the Rx with its own measurement

to determine if the Q-factor of the coil is appropriate for the Rx that has been placed (EPP only). If the Tx Q-factor

reading is too low it will flag a QFOD alarm and return to the selection phase.

4.2.5

Calibration

When this phase is requested, the Tx will ACK the request and commence with the EPP Rx to enable and enter the

calibration phase to calibrate for transmitter power losses at two fixed receiver loads. This system’s power loss

information will be used by the Tx to detect the presence of foreign objects on the interface surface during the

power delivery phase.

4.2.6

Authentication

Post successful calibration, Tx enters into power transfer mode limited to 5W. In this mode, Rx can request and

challenge Tx for authentication. In case of successful authentication, Tx proceeds with negotiated power

delivery. If authentication challenge is not successful then Tx continues to be in power transfer mode, limited to

5W. WLC1115 provides an I²C port for interfacing with OPTGA™ Trust Charge IC to enable authentication.

4.2.7

Renegotiation phase

In this phase, the EPP Rx can request to adjust the power transfer contract. This phase may be aborted

prematurely without changing the power transfer contract.

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.2.8

Power transfer phase

In this phase, the Tx transfers power to the Rx and the power level is determined by the control error packets

(CEP) and limited by the guaranteed power contract. Power loss FOD is also enabled and utilized to prevent

excessive power loss which could result in FO heating.

1. CEP: These packets are used by the Tx to adjust the amount of power being sent. The CEP may be positive,

negative, or 0. The Tx adjusts its operating point based on the value of the CEP. The CEP packet must be

received every 1.8s (configurable) or power will be withdrawn along with other constraints that specify when

a CEP may be sent by the Rx as defined in the WPC specifications.

2. Received power packet (RPP): The packet (8 bits for BPP and 24 bits for EPP) contains power received by

receiver. The RPP is used by the Tx to determine if the power loss is safe or excessive based on the FOD

thresholds contained in the FW.

3. End power transmit (EPT): The Rx may send an EPT packet anytime to inform Tx to withdraw/terminate the

power delivery. The Tx will end the power transfer immediately if an EPT packet is received.

The Rx and Tx communicate with each other by modulating the carrier wave used to transfer power. The

following sections describe the communication layer used and defined by the WPC.

4.2.9

Bidirectional in-band communication interface

The Qi standard requires bi-directional in-band communication between Tx and Rx. The communication from Tx

to Rx is FSK and is implemented by the Tx alternating the carrier wave frequency. The communication from Rx to

Tx is ASK and is created by modulating the load on the Rx side causing a reflection to appear on the Tx which is

filtered and decoded.

4.3

Communication from Tx to Rx - FSK

The power transmitter communicates to the power receiver using frequency shift keying, in which the power

transmitter modulates the operating frequency of the power signal.

In FSK, the Tx changes its operating frequency between the current operating frequency (f_OP) to an alternate

frequency (f_MOD) in the modulated state. The difference between these two frequencies is characterized by two

parameters that are determined during the initial ID and config stage of the wireless power connection:

• Polarity: This parameter determines whether the difference between f_MODand f_OPis positive or negative.

• Depth: This parameter determines the magnitude of the difference between f_OPand f_MODin Hertz (Hz).

The Tx uses a differential bi-phase encoding scheme to modulate data bits to the carrier wave. For this purpose,

the Tx aligns each data bit to segments of 512 cycles of the carrier wave frequency.

Figure 5

Example of differential bi-phase encoding - FSK

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.4

Communication from Rx to Tx - ASK

In the ASK communication scheme, the Rx modulates the amount of power that it draws from the Tx power signal.

The Tx detects this through as a modulation of the Tx current and/or voltage and uses a demodulation scheme

to convert the modulated signal into a binary signal.

The Rx shall use a differential bi-phase encoding scheme to modulate data bits onto the power signal. For this

purpose, the power receiver shall align each data bit to a full period t of an internal clock signal, such that the

CLK

start of a data bit coincides with the rising edge of the clock signal. This internal clock (INTCLK) signal shall have

a frequency fCLK = 2kHz 4%. tCLK is time period of the INTCLK clock.

Figure 6

Example of differential bi-phase encoding - ASK

When the Tx receives a modulated signal from the Rx the information is decoded and the Tx will react to the

packet according to the type and the WPC specification.

4.5

Demodulation

The WLC1115 ASK demodulating and decoding scheme works by detecting voltage and current variations in the

Tx coil caused by the Rx modulation signal. The voltage path for ASK uses an external band pass filter to filter the

demod signal out of the carrier wave. The current sense uses the bridge current sense resistor and an integrated

differential amplifier to sense the ASK variations. Both ASK sensing paths can be multiplexed to the external

Opamp filter and comparator to improve communication in low signal-to-noise environments or conditions.

Figure 7 shows the demodulation path used for current and voltage sensing of the modulation signal for packet

decoding.

COIL‐SNS

ASK_P

Low pass &

Peak

detector

High

pass

filter

ASK_DEMOD

Pulse

amplifier

ASK_AMP

Volt Path

ASK_OUT

Comparator

ASK_N

5V

CSPO_0

ASK_AMP

Current

Path

CSNO_0

Figure 7

WLC1115 voltage and current demodulation path for ASK

4.6

Inverter

The WLC1115 uses the integrated buck controller to generate the bridge voltage used to power the full-bridge

inverter that powers the Tx resonance tank to deliver power to the Rx. The inverter supports a wide input

operating voltage range (3V to 22V) for power transfer. The integrated gate drivers of the WLC1115 are designed

to control a full bridge or half-bridge Inverter depending on the WPC specification type and operating scenario.

The inverter is capable of operating at switching frequencies between 85kHz and 600kHz but are typically limited

to 110kHz to 148kHz. During the power transfer phase, the inverter responds to Rx CEP packets by adjusting the

operating frequency or adjusting the bridge voltage. The power control method (variable voltage or variable

frequency) is determined by the WPC specification but may be altered in order to promote better interoperability

and user experience.

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.7

Rx detection

During the selection phase, the Tx will periodically poll the interface to detect impedance changes in order to

quickly send a Digital Ping within 0.5s of a user placing an Rx. During this phase, the WLC1115 is able to distinguish

between large ferrous objects (such as keys or coins) and regular Rx devices using Q factor, input current, or shifts

in resonance frequency to attempt FOD before power transfer. In case of marginally high input current or

resonance shifts, the Tx will commence to Digital Ping in order to guarantee a connection with a valid Rx is made

in a timely manner. The typical sequence of operations used to scan the interface for Rx placement (or removal

if an EPT is received during power transfer) is shown in Figure 8.

0

time (s)

APING

Interval (s)

DPING

Interval (s)

Figure 8

Typical selection phase Rx detection timing diagram

Figure 9 describes the process used during the selection phase for quick Rx detection and connection.

Yes

Tx

Power

up

Run Q‐

factor and

DPING

Goto

APING

@interval

Rx

Object

Detected?

DPING

interval?

Detected?

Yes

No

Go to

power

XFER

Figure 9

Typical selection phase flow chart for Rx detection and connection

The Rx detection in Figure 9 also covers foreign object detection. The foreign object is identified by using Q

factor. In case of foreign object detection, the process flow proceeds to analog ping (APNG). Further details about

foreign object detection is covered in “Foreign object detection (FOD)” on page 29.

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.7.1

Foreign object detection (FOD)

WLC1115 supports enhanced FOD as per Qi v1.3.x standard. This includes FOD based on Q factor, resonance

frequency, power loss, and over temperature (if a thermistor is used).

4.7.2

Q factor FOD and Resonance Frequency FOD

WLC1115 offers integrated Q factor and resonance frequency measurements for QFOD pre-power delivery. The

measurements are made using the internal comparators QCOMP1 and QCOMP2 and the simple external

components to charge the resonance capacitor and then discharge by shorting the LC tank and observing the

resulting oscillation and voltage decay. The measurement of the Q factor is performed directly before every

digital ping. The number of cycle count ‘N’ between two coil voltages V1 and V2 and period between

corresponding rising edge pulses are used for Q factor and resonance frequency measurement as shown in

Figure 10.

V1

V2

COIL‐SNS

C1

Q_COMP

Cp

R1

R2

SW1_1

SW2_1

VDDD

Lp

T_period

C2

Q‐Factor = π*N/ [LN(V1/V2)]

N

Resonance Frequency = 1 / T_period

Figure 10

WLC1115 Q factor measurement schematic and signal

4.7.3

Power loss FOD

WLC1115 supports power loss FOD during power transfer. The power loss FOD uses the Tx power measured at

the buck output and is the product of the bridge voltage and the bridge current (current is sensed at inputs

CSPO_0 and CSNO_0). This result for Tx power is further adjusted by tuning FOD coefficients to account for

inverter losses and friendly metal losses. After computing the calibrated Tx power the result is compared against

the latest RPP value sent by the Rx. If the difference between Tx_Power_Calibrated and RPP exceeds the Ploss

threshold then an FOD event is logged. To prevent erroneous disconnects and improve user experience the

WLC1115 will only disconnect the power for Ploss FOD in the event that three consecutive Ploss threshold

breaches occur. The FOD coefficients and the Ploss thresholds are configurable to adapt to the system design.

4.7.4

Over temperature FOD

The WLC1115 is able to monitor interface temperature if an external NTC thermistor is connected and placed in

contact with the Tx coil. This can be enabled to disconnect the Tx from the Rx in the event that the Tx coil

temperature exceeds a configurable threshold.

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Functional overview

4.7.5

Buck regulator

The buck regulator powers the inverter at the input node VBRG to enable power transfer per Qi. The buck

regulator of WLC1115 requires input and output bypass capacitors as well as two FETs and an inductor. The

necessary external components and connections are shown in Figure 11. The buck also offers current protection

using a cycle-by-cycle current sense amplifier connected across resistance CSR1, integrated high and low side

gate drivers, and automatic PWM generation for output voltage control. The effective capacitance and inductor

have been deliberately selected to optimize buck performance and any substitutions should be made using

equivalent components as those found in the reference schematic and using hardware design guidelines.

VBRG

5 m

5/10/20 m

VBB_1

USB

PD

CSR1

CSR2

VDDD

WLC1115

Figure 11

WLC1115 typical buck regulator schematic for VBRG generation

The WLC1115’s buck controller provides two N-channel MOSFET gate drivers: complete with a floating high-side

gate driver via HG1_0 and a ground-referenced low-side driver via LG1_0 pins. The gate drivers are powered by

VDDD and are a nominal voltage of 5 V. The Buck regulator switching frequency is programmable and can be set

between 150kHz and 600kHz. In order to prevent EMI related issue’s gate drivers, have programmable drive

strength, dead-time, and can be run in a dithering mode to spread the radiated spectrum energy levels. An

external capacitor and Schottky diode from the BST1_0 pin are used for the high-side gate drive power supply.

Furthermore, the high and low-side gate driver blocks include zero-crossing detector (ZCD) to implement

discontinuous-conduction mode (DCM) mode with diode emulation.

The WLC1115’s buck controller uses an integrated error amplifier for output voltage regulation. The error

amplifier is a trans-conductance type amplifier with a single compensation pin (COMP_0) which requires the RC

filter shown in the reference schematic to be connected from this pin to GND.

The WLC1115 supports high-voltage (22V) VBRG discharge circuitry and upon detection of device disconnection,

faults, or hard resets, the chip may discharge the VBRG node to vSafe5V and/or vSafe0V within the time limits

specified in the USB PD specification.

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Functional overview

4.8

Buck operating modes

4.8.1

Pulse-width modulator (PWM)

The WLC1115 has a PWM generator to control the external FETs using the integrated gate drivers in peak current

mode control. This is the primary operating mode when the buck is loaded by the inverter and power transfer is

in progress.

4.8.2

Pulse skipping mode (PSM)

The WLC1115 buck has two firmware-selectable operating modes to optimize efficiency and reduce losses under

light load conditions: Pulse-skipping mode (PSM) and forced-continuous-conduction mode (FCCM). In PSM, the

controller reduces the total number of switching pulses without reducing the active switching frequency by

working in “bursts” of normal nominal-frequency switching interspersed with intervals without switching. The

output voltage thus increases during a switching burst and decreases during a quiet interval. This mode results

in minimal losses with a tradeoff of having higher output voltage ripple. When in this mode, WLC1115 devices

monitor the voltage across the buck sync FET to detect when the inductor current reaches zero; when this occurs,

the WLC1115 devices switch off the buck sync FET to prevent reverse current flow from the output capacitors (i.e.

diode emulation mode).

4.8.3

Forced-continuous-conduction mode (FCCM)

In forced-continuous-conduction mode (FCCM), the nominal switching frequency is maintained at all times, with

the inductor current going below zero (i.e. “backwards” or from the output to the input) for a portion of the

switching cycle as necessary to maintain the output voltage and current. This keeps the output voltage ripple to

a minimum at the cost of light-load efficiency.

4.8.4

Overvoltage protection (OVP)

The WLC1115 offers two types of overvoltage protections. The device monitors and limits VIN and VBRG. In case

of a USB VIN overvoltage event detected, WLC1115 can be configured to shutdown the Type-C port completely.

In case of VBRG over voltage events, the buck regulator is immediately shut down. The IC can be re-enabled after

a physical disconnect and reconnect. The over-voltage fault thresholds are configurable.

4.8.5

Overcurrent protection (OCP)

The WLC1115 protects the inverter from over-current and short-circuit faults by monitoring the bridge current

and continuously inspecting for over-current events using the internal CSAs that check the voltage on the current

sense resistor. Similar to OVP, the OCP and SCP fault thresholds and response times are configurable as well. The

IC can be re-enabled after a physical disconnect and reconnect.

4.8.6

USB-PD controller

The WLC1115 interfaces directly to Type-C USB power supplies and travel adaptors (TA). The WLC1115 manages

the incoming power supply throughout operation using the D+, D-, and CC lines. The WLC1115 manages the

USB-PD physical communication layer, the VCONN switches, as well as monitoring to prevent under-voltage

events caused by drawing too much power from the supply. The WLC1115 offers all the necessary electrical

controls to be fully compliant with revisions 3.0 and 2.0 of the USB-PD specification and includes SCP.

The USB-PD physical layer consists of the power transmitter and power receiver that communicates BMC

encoded data over the CC channel per the PD 3.0 standard. All communication is half-duplex. The physical layer

or PHY includes collision avoidance to minimize communication errors on the channel. The WLC1115 uses the RP

and RD resistors to implement connection detection and plug orientation detection. The RD resistor establishes

the role of the transmitter system as a USB sink. The device supports PPS operation at all valid voltages from 3V

to 22V when connected to a power adaptor.

Further, the WLC1115 device supports USB-PD extended messages containing data of up to 260 bytes by

implementing a chunking mechanism; messages are limited to revision 2.0 sizes unless both source and sink

confirm and negotiate compatibility with longer message lengths.

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Functional overview

The WLC1115 USB controller also supports battery charger emulation and detection (source and sink) for USB

legacy QC 2.0/3.0 & AFC protocols.

4.8.7

MCU

The Cortex®-M0 in WLC1115 device is a 32-bit MCU, which is optimized for low-power operation with extensive

clock gating. The device utilizes an interrupt controller (the NVIC block) with 32 interrupt inputs and a wakeup

interrupt controller (WIC), which can wake the processor up from Deep Sleep mode. Additionally, the WLC1115

device has 128-KB Flash and 32-KB ROM for nonvolatile storage. ROM stores libraries for device drivers such as

2

I C, SPI, and so on. The main wireless power firmware is stored in Flash memory to provide the flexibility to store

code for all wireless power features, enable the use of configuration tables, and allow firmware upgrades to meet

the latest USBPD specifications and application requirements. The device may be reset anytime by toggling the

XRES pin to force a full hardware and software reset.

The WLC1115 devices support external clock (EXTCLK) or INTCLK for the MCU and all internal sub-systems that

require clocks. To use the internal clock, float the CLK_IN pin. To use the optional external clock, provide a single

ended clock to the CLK_IN pin oscillating at 48MHz.

The TCPWM block of the WLC1115 device has four timers, counters, or PWM (TCPWM) generators. These timers

are used by FW to run the wireless power Tx system as required by WPC and USB compliance directives. The

WLC1115 device also has a watchdog timer (WDT) that can be used by FW for various timeout events.

4.8.8

ADC

The WLC1115 device has 8-bit SAR ADCs available for general purpose analog-to-digital conversion applications

within the chip and system. The ADCs are accessed from the GPIOs or directly on power supply pins through an

on-chip analog mux. See the “Electrical specifications” on page 11 for detailed specifications of the ADCs.

4.8.9

Serial communications block (SCB)

2

The WLC1115 devices have four SCB blocks that can be configured for I C, SPI, or UART. These blocks implement

2

full multi-master and slave I C interfaces capable of multi-master arbitration. I C is compatible with the standard

Philips I2C specification V3.0. These blocks operate at speeds of up to 1Mbps and have flexible buffering options

to reduce interrupt overhead and latency for the CPU. The SCB blocks support 8-byte deep FIFOs for Receive and

Transmit to decrease the time needed to interface by the MCU also reducing the need for clock stretching caused

by the CPU not having read data on time.

4.8.10

I/O subsystem

The WLC1115 devices have 13 GPIOs but many of them have dedicated functions for 15W MP-A11 applications

such as I2C comm, LED and temperature sensing in the wireless power application and cannot be repurposed.

The GPIOs output states have integrated controls modes that can be enabled by FW which include: weak pull-up

with strong pull-down, strong pull-up with weak pull-down, open drain with strong pull-down, open drain with

strong pull-up, strong pull-up with strong pull-down, disabled, or weak pull-up with weak pull-down and offer

selectable slew rates for dV/dt output control. When GPIOs are used as inputs they can be configured to support

different input thresholds (CMOS or LVTTL).

During POR, the GPIO blocks are forced to the disable state preventing any excess currents from flowing.

4.8.11

LDOs (VDDD and VCCD)

The WLC1115 has two integrated LDO regulators. The VDDD LDO is powered by VIN and provides 5V for the GPIOs,

gate drivers, and other internal blocks. The total load on VDDD LDO must be less than 150mA including internal

consumption. VDDD LDO will be externally loaded as shown in the reference schematic. For connecting any

additional external load on it, contact Infineon technical support. The VDDD 5V supply is externally routed to

various pins and they should all be externally shorted together. The VCCD LDO is a 1.8V LDO regulator and is

powered by VDDD. Do not externally load VCCD. Both LDOs must have ceramic bypass capacitors placed from

each pin to ground close to the WLC1115 device.

Datasheet

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Programming the WLC1115 device

5

Programming the WLC1115 device

There are two ways to program application firmware into a WLC1115 device:

1. Programming the device flash over SWD Interface

2

2. Application firmware update over specific interfaces (CC, I C)

Generally, the WLC1115 devices are programmed over the SWD interface only during development or during the

manufacturing process of the end-product. Once the end-product is manufactured, the WLC1115 device

application firmware can be updated via the appropriate bootloader interface. Infineon strongly recommends

2

customers to use the configuration utility to turn off the Application FW Update over CC or I C interface in the

firmware that is updated into WLC1115’s flash before mass production. This prevents unauthorized firmware

from being updated over the CC interface in the field. If you desire to retain the application firmware update over

2

CC/I C interfaces features post-production for on-field firmware updates, contact your local Infineon sales

representative for further guidelines.

5.1

Programming the device Flash over SWD interface

The WLC1115 family of devices can be programmed using the SWD interface. Infineon provides the MiniProg4

programming kit (CY8CKIT-005 MiniProg4 Kit) which can be used to program the flash and debug firmware. The

Flash is programmed by downloading the information from a hex file.

As shown in Figure 12, the SWD_DAT and SWD_CLK pins are connected to the host programmer’s SWDIO (data)

and SWDCLK (clock) pins respectively. During SWD programming, the device can be powered by the host

programmer by connecting its VTARG (power supply to the target device) to the VDDD pins of the WLC1115 device.

If the WLC1115 device is powered using an onboard power supply, it can be programmed using the “Reset

Programming” option. For more details, refer the WLCXXXX programming specification.

VDD

Host Programmer

WLC1115

VDDD

VTRAG

VDDD

10uF

0.1 uF

1 uF

0.1 uF

SWDCLK

SWD_CLK

SWD_DAT

XRES

SWDIO

XRES

V

CCD

GND

0.1 uF

GND

Figure 12

Connecting the programmer to WLC1115

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Ordering information

6

Ordering information

Table 20 lists the WLC1115 ordering part numbers and applications.

Table 20

WLC1115 ordering part numbers

Power

MPN

Application

WLC1115-68LQXQ

WLC1115-68LQXQT

Qi v1.3.x EPP Tx

Qi v1.3.x EPP Tx - Tape and reel option

15W

6.1

Ordering code definitions

WLC

X

XX -- XX XX

X

T: Tape and reel (Optional)

Grade/temperature range: Q = Extended industrial grade (–40°C to + 105°C)

Lead: X = Pb-free

Package type: LQ = QFN

Number of pins in the package

Wattage: 15 = 15W;

Type-: 1 = Tx, 2 = Rx, 3 = Tx-Rx , 4 = Custom

Product type: 1 = First-Generation product family

Marketing code: WLC = Wireless Charging

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Packaging

7

Packaging

Table 21

Parameter

Package characteristics

Description

Test conditions

Min

Typ

Max

125

14.8

4.3

Unit

T

Operating junction temperature

Package JA

-40

25

°C

J

TJA

TJB

TJC

–

Package JB

–

°C/W

Package JC

12.9

Table 22

Solder reflow peak temperature

Maximum time within 5°C of

peak temperature

Package

Maximum peak temperature

68-pin QFN

260°C

30 seconds

Table 23

Package moisture sensitivity level (MSL), IPC/JEDEC J-STD-2

Package

MSL

68-pin QFN

MSL 3

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Package diagram

8

Package diagram

NOTES:

DIMENSIONS

SYMBOL

e

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. N IS THE TOTAL NUMBER OF TERMINALS.

MIN.

0.30

NOM.

0.40 BSC

68

17

0.40

MAX.

0.50

3

DIMENSION "b" APPLIES TO METALLIZED TERMINAL AND IS MEASURED

BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. IF THE TERMINAL HAS

THE OPTIONAL RADIUS ON THE OTHER END OF THE TERMINAL, THE

DIMENSION "b" SHOULD NOT BE MEASURED IN THAT RADIUS AREA.

ND REFERS TO THE NUMBER OF TERMINALS ON D SIDE.

N

ND

L

b

D2

E2

D

0.15

5.60

0.20

5.70

0.25

5.80

4

5

6

PIN #1 ID ON TOP WILL BE LOCATED WITHIN THE INDICATED ZONE.

COPLANARITY ZONE APPLIES TO THE EXPOSED HEAT SINK

SLUG AS WELL AS THE TERMINALS.

5.70

8.00 BSC

E

A

8.00 BSC

7. JEDEC SPECIFICATION NO. REF. : N/A.

8. INDEX FEATURE CAN EITHER BE AN OPTION 1 : "MOUSE BITE" OR

OPTION 2 : CHAMFER.

-

0.65

0.05

A1

A3 (Option 1)

A3 (Option 2)

R

0.00

0.203 REF

0.152 REF

0.20 TYP

0.75 MIN

K

002-31802 *C

Figure 13

68LD QFN (8  8) device package drawing

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Acronyms

9

Acronyms

Table 24

Acronym

ACK

Acronyms used in this document

Description

Acronym

POR

PPDE

PPS

Description

Acknowledge

Power-on reset

ADC

Analog-to-digital converter

Advanced RISC machine, a CPU architecture

Amplitude shift key

proprietary power delivery extensions

Programmable power supply

Pulse-skipping mode

Arm®

ASK

PSM

PWM

QFOD

RPP

BPP

Basic power profile

Pulse-width modulator

BMC

CEP

BiPhase mark code

Q factor FOD

Control error packet

Received power packet

CC

Configuration channel

Current sense amplifier

Discontinuous-conduction mode

Error amplifier

RCP

Reverse current protection

Power receiver

CSA

Rx

DCM

EA

SAR

Successive approximation register

Short circuit protection

SCP

EPP

Extended power profile

End power transfer

SPI

Serial peripheral interface

Signal strength packet

EPT

SSP

ESD

Electrostatic discharge

Field effect transistor

SWD

TCPWM

Tx

Serial wire debug, a test protocol

Timer/counter pulse-width modulation

Power transmitter

FET

FCCM

Forced-continuous-conduction mode

Universal asynchronous receiver

transmitter

FOD

Foreign object detection

UART

FO

Foreign object

UFP

USB

UV

Upstream facing port

Universal serial bus

Undervoltage

FSK

FW

Frequency shift key

Firmware

GPIO

HBM

HS

General-purpose I/O

Human body model

High speed

WDT

WIC

WPC

ZCD

Watchdog timer

Wakeup interrupt controller

Wireless power consortium

Zero-crossing detector

2

I C

Inter-integrated circuit

Integrated circuit

IC

IMO

IPT

Internal main oscillator

Inductive power transfer technology

Linear drop out

LDO

MCU

NTC

NVIC

OCP

Opamp

OTP

OV

Microcontroller unit

Negative temperature coefficient

Nested vectored interrupt controller

Overcurrent protection

Operational amplifier

Over temperature protection

Overvoltage

OVP

PCB

PD

Overvoltage protection

Printed circuit board

Power delivery

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Document conventions

10

Document conventions

10.1

Units of measure

Table 25

Symbol

°C

Units of measure

Unit of measure

degree Celsius

Hz

hertz

KB

1024 bytes

kilohertz

kHz

k

LSB

MHz

M

µA

kilo ohm

least significant bit

megahertz

mega-ohm

microampere

microfarad

microhenry

microsecond

microvolt

microwatt

milliampere

millimeter

millisecond

millivolt

µF

µH

µs

µV

µW

mA

mm

ms

mV

nA

nanoampere

nanosecond

nanovolt

ohm

ns

nV



%

percent

pF

picofarad

second

s

V

volt

W

watt

Datasheet

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Wireless charging IC (WLC) - Transmitter 15W with integrated

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Revision history

Document

Date of release

Description of changes

version

*B

2022-04-22

Publish to web.

Datasheet

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Please read the Important Notice and Warnings at the end of this document

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

IMPORTANT NOTICE

For further information on the product, technology,

The information given in this document shall in no

event be regarded as a guarantee of conditions or

characteristics (“Beschaffenheitsgarantie”).

Edition 2022-04-22

Published by

delivery terms and conditions and prices please

contact your nearest Infineon Technologies office

(www.infineon.com).

Infineon Technologies AG

81726 Munich, Germany

With respect to any examples, hints or any typical

values stated herein and/or any information

regarding the application of the product, Infineon

Technologies hereby disclaims any and all

warranties and liabilities of any kind, including

without limitation warranties of non-infringement of

intellectual property rights of any third party.

WARNINGS

Due to technical requirements products may contain

dangerous substances. For information on the types

in question please contact your nearest Infineon

Technologies office.

Except as otherwise explicitly approved by Infineon

Technologies in a written document signed by

In addition, any information given in this document

is subject to customer’s compliance with its

obligations stated in this document and any

applicable legal requirements, norms and standards

concerning customer’s products and any use of the

product of Infineon Technologies in customer’s

applications.

Do you have a question about this

document?

Go to www.infineon.com/support

authorized

representatives

of

Infineon

Technologies, Infineon Technologies’ products may

not be used in any applications where a failure of the

product or any consequences of the use thereof can

reasonably be expected to result in personal injury.

Document reference

002-34241 Rev. *B

The data contained in this document is exclusively

intended for technically trained staff. It is the

responsibility of customer’s technical departments

to evaluate the suitability of the product for the

intended application and the completeness of the

product information given in this document with

respect to such application.


型号：	WLC1115-68LQXQ
厂家：	Infineon
描述：	WLC1115发射端控制器IC集成了USB-PD芯片、Buck压降电路、感应器件、软件和Qi v1.3.2系统解决方案控制器光电二极管
文件：	总40页 (文件大小：495K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WLC1115-68LQXQ [INFINEON]

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