V23848-C18-C56_技术文档

Fiber Optics

iSFP™ - Intelligent Small Form-factor Pluggable

SONET OC-3 IR-1 / SDH STM S-1.1

V23848-C18-C56

V23848-C19-C56

Multirate Applications up to 155 Mbit/s

Single Mode 1310 nm Transceiver with LC™ Connector

Features

• Small Form-factor Pluggable (SFP) MSA compatible

transceiver¹⁾

• Fully SFF-8472 compatible

• Incorporating Intelligent – Digital Diagnostic

Monitoring Interface

• Internal calibration implementation

• Advanced release mechanism

• Easy access, even in belly to belly applications

• Wire handle release for simplicity

• Color coded blue tab (single mode)

• PCI height compatible

File: 1132

• Excellent EMI performance

• Separate and common chassis/signal ground module

concepts available

• RJ-45 style LC™ connector system

• Single power supply (3.3 V)

• Low power consumption

File: 1133

• Small size for high channel density

• UL-94 V-0 certified

• ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7)

• According to FCC (Class B) and EN 55022

• For distances of up to 21 km (see Supported Link Lengths)

• Fabry Perot laser, PIN photo diode

• Laser safety according to Class 1 FDA and IEC

• AC/AC Coupling according to MSA

• Suitable for multirate applications up to 155 Mbit/s

• Fast Ethernet (FE) compatible

• Extended operating temperature range of –40°C to 85°C

• SFP evaluation kit V23848-S5-V4 available upon request

• A press fit cage and cage plugs are available as accessory products from Infineon (see

SFP Accessories)

1)

MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFP Transceivers.

For ordering information see next page.

iSFP™ is a trademark of Infineon Technologies. LC™ is a trademark of Lucent.

Data Sheet

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V23848-C19-C56

Pin Configuration

Ordering Information

Part Number

Chassis/Signal Grounding Concept

V23848-C18-C56

V23848-C19-C56

Common

Separated

Pin Configuration

1

2

3

4

5

6

7

8

9

10

V

T

20

V

T

EE

19

18

17

16

15

14

13

12

11

Tx Fault

TD−

Tx Disable

TD+

MOD-DEF(2)

MOD-DEF(1)

V

T

EE

CC

MOD-DEF(0)

Rate Select

V

R

EE

LOS

RD+

V

R

RD−

EE

V

R

EE

Bottom of transceiver (as viewed

through top of transceiver)

Top of transceiver

File: 1306

Figure 1

iSFP™ Transceiver Electrical Pad Layout

Data Sheet

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Pin Configuration

Pin Description

Pin No. Name

Logic Level

N/A

Function

1

V_EET

Transmitter Ground¹⁾

Transmitter Fault Indication^{2) 8)}

Transmitter Disable³⁾

Module Definition 2^{4) 8)}

Module Definition 1^{5) 8)}

Module Definition 0^{6) 8)}

Not connected

2

Tx Fault

Tx Disable

MOD-DEF(2)

MOD-DEF(1)

MOD-DEF(0)

Rate Select

LOS

LVTTL

N/A

3

4

5

6

7

N/A

8

LVTTL

N/A

Loss Of Signal^{7) 8)}

Receiver Ground¹⁾

9

V_EER

10

11

12

13

14

15

16

17

18

19

20

V_EER

N/A

Receiver Ground¹⁾

Inv. Received Data Out⁹⁾

Received Data Out⁹⁾

Receiver Ground¹⁾

V_EER

N/A

RD–

LVPECL

N/A

RD+

V_EER

V_CCR

N/A

Receiver Power

V_CCT

N/A

Transmitter Power

Transmitter Ground¹⁾

Transmit Data In¹⁰⁾

Inv. Transmit Data In¹⁰⁾

Transmitter Ground¹⁾

V_EET

N/A

TD+

LVPECL

N/A

TD–

V_EET

1)

2)

3)

4)

5)

6)

7)

Common transmitter and receiver ground within the module.

A high signal indicates a laser fault of some kind and that laser is switched off.

A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off.

MOD-DEF(2) is the data line of two wire serial interface for serial ID.

MOD-DEF(1) is the clock line of two wire serial interface for serial ID.

MOD-DEF(0) is grounded by the module to indicate that the module is present.

A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received

optical power is below the worst case receiver sensitivity.

Should be pulled up on host board to V_CCby 4.7 - 10 kΩ.

AC coupled inside the transceiver. Must be terminated with 100 Ω differential at the user SERDES.

AC coupled and 100 Ω differential termination inside the transceiver.

8)

9)

10)

Data Sheet

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Description

The Infineon OC-3 transceiver – part of Infineon iSFP™ family – is compatible to the

Physical Medium Depend (PMD) sublayer and baseband medium compatible to SONET

OC-3 IR-1 (Telcordia GR-253-CORE) and SDH STM-1 S-1.1 (ITU-T G.957).

The appropriate fiber optic cable is 9 µm single mode fiber with LC™ connector.

Supported Link Lengths

Category within Standard

Reach

max.¹⁾

Unit

min.

SDH STM-1 S-1.1

0

15,000

21,000

meters

SONET OC-3 IR-1

1)

Maximum reach over fiber type SM-G.652 as defined by ITU-T G.957 and Telcordia GR-253-CORE standards.

Longer reach possible depending upon link implementation.

The Infineon iSFP™ single mode transceiver is a single unit comprised of a transmitter,

a receiver, and an LC™ receptacle.

This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45

style backpanels for high end datacom and telecom applications while providing the

advantages of fiber optic technology.

The Infineon single mode OC-3 transceiver is a single unit comprised of a transmitter, a

receiver, and an LC receptacle. This design frees the customer from many alignment

and PC board layout concerns. The module is designed for low cost LAN and

applications with datarates from 10 to 155 Mbit/s. It can be used as the network end

device interface in workstations, servers, and storage devices, and in a broad range of

network devices such as bridges, routers, and intelligent hubs, as well as local and wide

area ATM switches.

This transceiver operates at up to OC-3 datarates from a single power supply (+3.3 V).

The 100 Ω differential data inputs and outputs are LVPECL and CML compatible.

Data Sheet

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Description

Functional Description of iSFP™ Transceiver

This transceiver is designed to transmit serial data via single mode cable.

Tx Fault

Automatic

Shut-Down

Tx Disable

Tx Coupling Unit

TD+

TD−

Laser

Driver

e/o

Laser

Power

Control

o/e

Single Mode Fiber

Monitor

Rx Coupling Unit

o/e

RD+

Limiting

Amp

TIA

RD−

LOS

Digital Diagnostic

Monitoring Interface

MOD-DEF(2)

MOD-DEF(1)

EEPROM

Alarm and

Warning Flags

File: 1354

Figure 2

Functional Diagram

The receiver component converts the optical serial data into CML compatible electrical

data (RD+ and RD–). The Loss Of Signal (LOS) shows whether an optical signal is

present.

The transmitter converts CML compatible electrical serial data (TD+ and TD–) into

optical serial data. Data lines are differentially 100 Ω terminated.

The transmitter contains a laser driver circuit that drives the modulation and bias current

of the laser diode. The currents are controlled by a power control circuit to guarantee

constant output power of the laser over temperature and aging. The power control uses

the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a

controlling signal, to prevent the laser power from exceeding the operating limits.

Single fault condition is ensured by means of an integrated automatic shutdown circuit

that disables the laser when it detects laser fault to guarantee the laser Eye Safety.

Data Sheet

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Description

The transceiver contains a supervisory circuit to control the power supply. This circuit

makes an internal reset signal whenever the supply voltage drops below the reset

threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage

has risen above the reset threshold. During this time the laser is inactive.

A low signal on TxDis enables transmitter. If TxDis is high or not connected the

transmitter is disabled.

An enhanced Digital Diagnostic Monitoring Interface (Intelligent) has been incorporated

into the Infineon Small Form-factor Pluggable (SFP) transceiver. This allows real time

access to transceiver operating parameters, based on the SFF-8472.

This transceiver features Internal Calibration. Measurements are calibrated over

operating temperature and voltage and must be interpreted as defined in SFF-8472.

The transceiver generates this diagnostic data by digitization of internal analog signals

monitored by a new diagnostic Integrated Circuit (IC).

This diagnostic IC has inbuilt sensors to include alarm and warning thresholds. These

threshold values are set during device manufacture and therefore allow the user to

determine when a particular value is outside of its operating range.

Alarm and Warning Flags are given. Alarm Flags indicate conditions likely to be

associated with an inoperational link and cause for immediate action. Warning Flags

indicate conditions outside the normally guaranteed bounds but not necessarily causes

of immediate link failures.

These enhanced features are in addition to the existing SFP features provided by the

manufacturer i.e. serial number and other vendor specific data.

The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a

2 wire, serial interface at the 8 bit address 1010000X (A0h).

The Digital Diagnostic Monitoring Interface makes use of the 8 bit address 1010001X

(A2h), so the originally defined serial ID memory map remains unchanged and is

therefore backward compatible.

Digital Diagnostic Monitoring Parameters

Parameter

Accuracy SFF-8472

Accuracy Actual

±2 dB

Tx Optical Power

Rx Optical Power

Bias Current

±3 dB

±10%

±3%

±3 dB

±10%

Power Supply Voltage

Transceiver Temperature

±3%

±3°C

Data Sheet

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Description

Regulatory Compliance (EMI)

Feature

Standard

EIA/JESD22-A114-B

Comments

ESD:

Class 1C

Electrostatic Discharge (MIL-STD 883D

to the Electrical Pins

method 3015.7)

Immunity:

EN 61000-4-2

IEC 61000-4-2

Discharges ranging from ±2 kV to

±15 kV on the receptacle cause no

damage to transceiver (under

recommended conditions).

Against Electrostatic

Discharge (ESD) to the

Duplex LC Receptacle

Immunity:

Against Radio

Frequency

EN 61000-4-3

IEC 61000-4-3

With a field strength of 10 V/m,

noise frequency ranges from

10 MHz to 2 GHz. No effect on

transceiver performance between

the specification limits.

Electromagnetic Field

Emission:

FCC 47 CFR Part 15, Noise frequency range:

Radiated Field Strength Class B

CISPR 22

30 MHz to 18 GHz

EN 55022 Class B

1)

This device complies with part 15 of

the FCC Rules²⁾. Operation is

subject to the following two

conditions:

iSFP™

V23848-C18-C56

Tested To Comply

With FCC Standards

FOR HOME OR OFFICE USE

File: 1407

1 This device may not cause

harmful interference.

2 This device must accept any

interference received, including

interference that may cause

undesired operation.

1)

2)

Only for V23848-C18-C56.

Any kind of modification not expressly approved by Infineon Technologies may affect the regulatory

compliance of the concerned product. As a consequence thereof this could void the user’s authority to operate

the equipment.

Data Sheet

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Technical Data

Absolute Maximum Ratings

Parameter

Symbol

Limit Values

Unit

min.

max.

Data Input Voltage

V_{ID max}

V_IDpk-pk

T_S

V_CC+0.5

V

Differential Data Input Voltage Swing

Storage Ambient Temperature

Operating Case Temperature¹⁾

Storage Relative Humidity

Operating Relative Humidity

Supply Voltage

5

V

–40

5

85

95

85

4

°C

%

T_C

RH_s

RH_o

5

%

V_{CC max}

I_data

V

Data Output Current

50

3

mA

dBm

Receiver Optical Input Power

Rx_{P max}

1)

Operating case temperature measured at transceiver reference point (in cage through 2nd centre hole from

rear, see Figure 9).

Exceeding any one of these values may permanently destroy the device.

Data Sheet

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Technical Data

Electrical Characteristics (V_CC= 2.97 V to 3.63 V, T_C= –40°C to 85°C)

Parameter

Symbol

Values

typ.

Unit

min.

max.

Common

Supply Voltage

In-rush Current¹⁾

Power Dissipation

Transmitter

V_CC–V_EE2.97

3.3

3.63

30

1

V

I_{IR max}

P

mA

W

Differential Data Input Voltage V_IDpk-pk 500

3200

mV

Swing²⁾

Tx Disable Voltage

Tx Enable Voltage

Tx Fault High Voltage

Tx Fault Low Voltage

Supply Current³⁾

Receiver

Tx_Dis

Tx_En

Tx_FH

Tx_FL

I_Tx

2

V_CC

0.8

V

V_EE

2.4

V_EE

V

V_CC

0.5

V

150

mA

Differential Data Output Voltage V_ODpk-pk 500

1000

mV

Swing⁴⁾

LOS Active

LOS Normal

Rise Time⁵⁾

Fall Time⁵⁾

Power Supply Noise Rejection⁶⁾PSNR

Supply Current³⁾

LOS_A

LOS_N

t_R-Rx

2.4

V_CC

V

V_EE

0.5

V

120

100

ps

t_F-Rx

ps

mV_pp

mA

7)

I_Rx

130

1)

Measured with MSA recommended supply filter network (Figure 7). Maximum value above that of the steady

state value.

Internally AC coupled. Typical 100 Ω differential input impedance.

MSA defines maximum current at 300 mA.

Internally AC coupled. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of

50 mV should be added.

Measured values are 20% - 80%.

2)

3)

4)

5)

6)

Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter

network (Figure 7) in place. A change in sensitivity of less than 1 dB can be typically expected.

Supply current excluding Rx output load.

7)

Data Sheet

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Technical Data

Optical Characteristics (V_CC= 2.97 V to 3.63 V, T_C= –40°C to 85°C)

Parameter

Symbol

Values

typ.

Unit

min.

max.

Transmitter

Launched Power (Average)¹⁾

Extinction Ratio (Dynamic)

Center Wavelength

P_O

ER

λ_C

σ_I

–15

8.2

–8

dBm

dB

1270

1355

2.5

nm

Spectral Width (rms)

nm

Tx Disable Laser Output Power P_O-TxDis

–50

dBm

Optical Eye Mask²⁾

According to standards

Jitter Generation (pk-pk)³⁾

Jitter Generation (rms)³⁾

Rise Time⁴⁾

J_{pk-pk Tx}

J_{rms Tx}

t_R-Tx

0.033

0.001

40

0.045

UI

ps

0.0025

Fall Time⁴⁾

t_F-Tx

155

Receiver⁵⁾

Saturation (Average Power)⁶⁾

Sensitivity (Average Power)⁷⁾

@ 155 Mbit/s

P_SAT

P_IN

–8

dBm

–32

–35

–28

@ 125 Mbit/s

@ 10 Mbit/s⁸⁾

LOS Assert Level⁹⁾

LOS Deassert Level⁹⁾

LOS Hysteresis⁹⁾

P_LOSA

P_LOSD

–39

dBm

dB

–30

P_LOSA

0.5

3

–P_LOSD

Input Center Wavelength

λ_C

1260

1580

nm

1)

Into single mode fiber, 9 µm diameter.

2)

Transmitter eye is according to ITU-T G.957 S-1.1 and SONET OC-3 IR-1. Measured with 10% eye mask

margin.

3)

The transceiver is specified to meet the SONET/SDH Jitter performance as outlined in ITU-T G.958 and

Telcordia GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The

Jitter Generation specifications are referenced to the optical OC-3 signals. If no or minimum jitter is applied to

the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter on

the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI rms, maximum and 0.1 UI

pk-pk, maximum. For SDH, 10 mUI rms, maximum. Both are measured with a 12 kHz - 1.3 MHz filter in line.

A UI is a Unit Interval, which is equivalent to one bit slot.

Values are 20% - 80%, filtered and measured at nominal data rate.

Receiver characteristics are measured with a worst case reference laser.

At 9 dB Extinction Ratio of the incoming signal.

4)

5)

6)

Data Sheet

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Technical Data

7)

Minimum average optical power at which the BER is less than 1x10^–10. Measured with a 2²³–1 NRZ PRBS as

recommended by ANSI T1E1.2, SONET, and ITU-T G.957.

8B/10B, K28.5 and equivalent coding only.

8)

9)

See Figure 3.

1

LOS Level

0

LOS Assert

(Minimum)

Hysteresis

(Minimum)

LOS Deassert

(Maximum)

Received Optical

Power Level

[dBm]

LOS / Hysteresis

(Typical)

File: 1522

Figure 3

Data Sheet

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V23848-C19-C56

Technical Data

Timing of Control and Status I/O

Parameter

Symbol

Values

min. max.

Unit

Condition

Tx Disable

Assert Time

t_off

10

µs

Time from rising edge of Tx

Disable to when the optical

output falls below 10% of

nominal

Tx Disable

Negate Time

t_on

1

ms

Time from falling edge of Tx

Disable to when the modulated

optical output rises above 90%

of nominal

Time to Initialize, t_init

Including Reset

of Tx Fault

300

100

From power on or negation of

Tx Fault using Tx Disable

Tx Fault Assert t_fault

Time

µs

Time from fault to Tx Fault on

Tx Disable to

Reset

t_reset

10

Time Tx Disable must be held

high to reset Tx Fault

LOS Assert Time t_loss_on

100

Time from LOS state to Rx

LOS assert

LOS Deassert

Time

t_loss_off

Time from non-LOS state to Rx

LOS deassert

Data Sheet

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V23848-C19-C56

Technical Data

I/O Timing of Soft Control and Status Functions

Parameter

Symbol

Max.

Unit

Condition

Value

Tx Disable assert

time

t_off

100

300

ms

Time from Tx Disable bit set¹⁾

until optical output falls below

10% of nominal

Tx Disable deassert t_on

time

ms

Time from Tx Disable bit

cleared until optical output

rises above 90% of nominal

Time to initialize,

including reset of

Tx Fault

t_init

Time from power on or

negation of Tx Fault using

Tx Disable until transmitter

output is stable²⁾

Tx Fault assert time t_fault

100

ms

Time from fault to Tx Fault bit

set

LOS assert time

t_loss_on

Time from LOS state to

Rx LOS bit set

LOS deassert time t_loss_off

Time from non-LOS state to

Rx LOS bit cleared

Rate select change t_rate_sel

time³⁾

Time from change of state of

Rate Select bit¹⁾until receiver

bandwidth is in conformance

with appropriate specification

Serial ID clock rate⁴⁾f_serial_clock 400

kHz

ms

N/A

Analog parameter

data ready

t_data

1000

From power on to data ready,

bit 0 of byte 110 set

Serial bus hardware t_serial

ready

300

ms

Time from power on until

module is ready for data

transmission

1)

Measured from falling clock edge after stop bit of write transaction.

2)

3)

4)

See Gigabit Interface Converter (GBIC). SFF-0053, Rev. 5.5, September 27, 2000.

Not implemented.

The maximum clock rate of the serial interface is defined by the I²C bus interface standard.

Data Sheet

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V23848-C19-C56

Eye Safety

This laser based single mode transceiver is a Class 1 product. It complies with IEC

60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10

and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.

CLASS 1 LASER PRODUCT

To meet laser safety requirements the transceiver shall be operated within the Absolute

Maximum Ratings.

Note: All adjustments have been made at the factory prior to shipment of the devices.

No maintenance or alteration to the device is required.

Tampering with or modifying the performance of the device will result in voided

product warranty.

Failure to adhere to the above restrictions could result in a modification that is

considered an act of “manufacturing”, and will require, under law, recertification of

the modified product with the U.S. Food and Drug Administration (ref. 21 CFR

1040.10 (i)).

Laser Emission Data

Wavelength

1310 nm

Maximum total output power

15.6 mW / 11.9 dBm

(as defined by IEC: 7 mm aperture at 14 mm distance)

Beam divergence (full angle) / NA (half angle)

11° / 0.1 rad

FDA

IEC

Complies with 21 CFR

1040.10 and 1040.11

Class 1 Laser Product

File: 1401

Figure 4

Required Labels

Laser

Emission

Tx

Top view

Rx

File: 1333

Figure 5

Laser Emission

Data Sheet

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Application Notes

EMI Recommendations

To avoid electromagnetic radiation exceeding the required limits set by the standards,

please take note of the following recommendations.

When Gigabit switching components are found on a PCB (e.g. multiplexer,

serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak

radiation; this may also occur at chassis slots other than that of the device itself. Thus

every mechanical opening or aperture should be as small as feasible and its length

carefully considered.

On the board itself, every data connection should be an impedance matched line (e.g.

strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed

symmetrically. Vias should be avoided. Where internal termination inside an IC or a

transceiver is not present, a line terminating resistor must be provided. The decision of

how best to establish a ground depends on many boundary conditions. This decision

may turn out to be critical for achieving lowest EMI performance. At RF frequencies the

ground plane will always carry some amount of RF noise. Thus the ground and V_CC

planes are often major radiators inside an enclosure. As a general rule, for small systems

such as PCI cards placed inside poorly shielded enclosures, the common ground

scheme has often proven to be most effective in reducing RF emissions. In a common

ground scheme, the PCI card becomes more equipotential with the chassis ground. As

a result, the overall radiation will decrease. In a common ground scheme, it is strongly

recommended to provide a proper contact between signal ground and chassis ground at

every location where possible. This concept is designed to avoid hotspots which are

places of highest radiation, caused when only a few connections between chassis and

signal grounds exist. Compensation currents would concentrate at these connections,

causing radiation. However, as signal ground may be the main cause for parasitic

radiation, connecting chassis ground and signal ground at the wrong place may result in

enhanced RF emissions.

For example, connecting chassis ground and signal ground at a front

panel/bezel/chassis by means of a fiber optic transceiver/cage may result in a large

amount of radiation especially where combined with an inadequate number of grounding

points between signal ground and chassis ground. Thus the transceiver becomes a

single contact point increasing radiation emissions. Even a capacitive coupling between

signal ground and chassis ground may be harmful if it is too close to an opening or an

aperture. For a number of systems, enforcing a strict separation of signal ground from

chassis ground may be advantageous, providing the housing does not present any slots

or other discontinuities. This separate ground concept seems to be more suitable in large

systems where appropriate shielding measures have also been implemented.

Data Sheet

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Application Notes

In many situations the question on which ground concept to implement in the design

cannot be easily decided prior to the receipt of first EMI measurement results. Infineon

thus offers both module versions; V23848-Xx8-Xxx for common ground and

V23848-Xx9-Xxx for separate ground concept.

The return path of RF current must also be considered. Thus a split ground plane

between Tx and Rx paths may result in severe EMI problems irrespective of which

module ground concept has been applied.

The bezel opening for a transceiver should be sized so that all contact springs of the

transceiver cage make good electrical contact with the face plate. Please consider that

the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the

wavelength of the harmonics inside the PCB will be half of that in free space. Thus even

the smallest PCBs may have unexpected resonances.

Large systems can have many openings in the front panel for SFP transceivers. In

typical applications, not all of these ports will hold transceivers; some may be

intentionally left empty. These empty slots may emit significant amounts of radiation.

Thus it is recommended that empty ports be plugged with an EMI plug as shown in

Figure 6. Infineon offers an EMI/dust plug, P/N V23818-S5-B1.

Data Sheet

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Application Notes

SFP Accessories

Cage:

Infineon Technologies

Host Board Connector:

Tyco Electronics

Part Number: V23838-S5-N1/V23838-S5-N1-BB Part Number: 1367073-1

Cage EMI/Dust Plug:

Cage Dust Plug:

Infineon Technologies

Part Number: V23818-S5-B1

Infineon Technologies

Part Number: V23818-S5-B2

CAGE

HOST BOARD

CONNECTOR

CAGE EMI/DUST PLUG

iSFP™

HOST BOARD

DUST PLUG

File: 1521

Figure 6

Data Sheet

17

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

EEPROM Serial ID Memory Contents (A0h), V23848-C18-C56

Addr. Hex ASCII Name/Description

0

03

04

07

00

10

02

00

05

02

00

0F

96

00

49

6E

66

69

6E

65

6F

6E

20

46

4F

20

Identifier

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

47

6D

62

48

00

03

19

56

32

33

38

34

38

2D

43

31

38

2D

43

35

36

20

46

33

41

39

05

1E

00

BA

G

m

b

Vendor name

1

Extended identifier

Connector

2

3

Transceiver optical

compatibility

H

4

Reserved

5

Vendor OUI

6

7

8

V

2

3

8

4

8

-

Vendor part number

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Encoding

BR, nominal

Reserved

Length (9 µm) - km

Length (9 µm)

Length (50 µm)

Length (62.5 µm)

Length (copper)

Reserved

C

1

8

-

C

5

6

I

Vendor name

n

f

i

n

e

o

n

F

3

A

9

Vendor revision,

product status

dependent

Wavelength

Reserved

F

O

Check sum of

bytes 0 - 62

Data Sheet

18

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

EEPROM Serial ID Memory Contents (A0h), V23848-C18-C56 (cont’d)

Addr. Hex ASCII Name/Description

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

00

1A

00

5E

Transceiver signal

options

96

20

Vendor specific

EEPROM

97

98

BR, maximum

99

BR, minimum

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

Vendor serial number

20

Vendor manufacturing

date code

20

68

Diagnostic monitoring

type

93

94

95

B0

01

125

126

127

20

Enhanced options

SFF-8472 compliance

Low order 8 bits of the

sum of the contents of

all the bytes from byte

64 to byte 94, inclusive

128 - 00

255

Vendor specific.

Reserved for future

use

Data Sheet

19

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

EEPROM Serial ID Memory Contents (A0h), V23848-C19-C56

Addr. Hex ASCII Name/Description

0

03

04

07

00

10

02

00

05

02

00

0F

96

00

49

6E

66

69

6E

65

6F

6E

20

46

4F

20

Identifier

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

47

6D

62

48

00

03

19

56

32

33

38

34

38

2D

43

31

39

2D

43

35

36

20

46

33

41

39

05

1E

00

BB

G

m

b

Vendor name

1

Extended identifier

Connector

2

3

Transceiver optical

compatibility

H

4

Reserved

5

Vendor OUI

6

7

8

V

2

3

8

4

8

-

Vendor part number

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Encoding

BR, nominal

Reserved

Length (9 µm) - km

Length (9 µm)

Length (50 µm)

Length (62.5 µm)

Length (copper)

Reserved

C

1

9

-

C

5

6

I

Vendor name

n

f

i

n

e

o

n

F

3

A

9

Vendor revision,

product status

dependent

Wavelength

Reserved

F

O

Check sum of

bytes 0 - 62

Data Sheet

20

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

EEPROM Serial ID Memory Contents (A0h), V23848-C19-C56 (cont’d)

Addr. Hex ASCII Name/Description

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

00

1A

00

5E

Transceiver signal

options

96

20

Vendor specific

EEPROM

97

98

BR, maximum

99

BR, minimum

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

Vendor serial number

20

Vendor manufacturing

date code

20

68

Diagnostic monitoring

type

93

94

95

B0

01

125

126

127

20

Enhanced options

SFF-8472 compliance

Low order 8 bits of the

sum of the contents of

all the bytes from byte

64 to byte 94, inclusive

128 - 00

255

Vendor specific.

Reserved for future

use

Data Sheet

21

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

Digital Diagnostic Monitoring Interface – Intelligent

Alarm and Warning Thresholds (2-Wire Address A2h)

Address # Bytes Name

Description

MSB at low address

Value

95°C¹⁾

00 - 01

02 - 03

04 - 05

06 - 07

08 - 09

10 - 11

12 - 13

14 - 15

16 - 17

18 - 19

20 - 21

22 - 23

24 - 25

26 - 27

28 - 29

30 - 31

32 - 33

34 - 35

36 - 37

38 - 39

40 - 55

2

16

Temp High Alarm

Temp Low Alarm

MSB at low address

–40°C¹⁾

90°C¹⁾

–35°C¹⁾

3.7 V²⁾

2.85 V²⁾

3.63 V²⁾

2.97 V²⁾

70 mA

Temp High Warning

Temp Low Warning

Voltage High Alarm

Voltage Low Alarm

Voltage High Warning

Voltage Low Warning

Bias High Alarm

Bias Low Alarm

4 mA

Bias High Warning

Bias Low Warning

Tx Power High Alarm

Tx Power Low Alarm

Tx Power High Warning

Tx Power Low Warning

Rx Power High Alarm

Rx Power Low Alarm

Rx Power High Warning

Rx Power Low Warning

Reserved

60 mA

5 mA

–7 dBm

–16 dBm

–8 dBm

–15 dBm

–7 dBm

–32 dBm

–8 dBm

–28 dBm

Reserved for future

monitored quantities

1)

A delta exists between actual transceiver temperature and value shown as measurement is taken internal to

an IC located on the underside of the iSFP™ PCB.

Transceiver voltage measured after input filter with typical 0.1 V voltage drop.

2)

Data Sheet

22

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

Calibration Constants for External Calibration Option (2-Wire Address A2h)

Address # Bytes Name

Description

Value

56 - 59

60 - 63

64 - 67

68 - 71

72 - 75

76 - 77

4

2

Rx_PWR (4)

Rx_PWR (3)

Rx_PWR (2)

Rx_PWR (1)

Rx_PWR (0)

Tx_I (Slope)

Single precision floating point

calibration data, Rx optical power.

0

1

0

1

Fixed decimal (unsigned)

calibration data, laser bias current.

78 - 79

80 - 81

82 - 83

84 - 85

86 - 87

88 - 89

90 - 91

2

Tx_I (Offset)

Fixed decimal (signed two’s

complement) calibration data,

laser bias current.

0

1

0

1

0

1

0

Tx_PWR (Slope) Fixed decimal (unsigned)

calibration data, transmitter

coupled output power.

Tx_PWR (Offset) Fixed decimal (signed two’s

complement) calibration data,

transmitter coupled output power.

T (Slope)

T (Offset)

V (Slope)

V (Offset)

Fixed decimal (unsigned)

calibration data, internal module

temperature.

Fixed decimal (signed two’s

complement) calibration data,

internal module temperature.

Fixed decimal (unsigned)

calibration data, internal module

supply voltage.

Fixed decimal (signed two’s

complement) calibration data,

internal module supply voltage.

92 - 94

95

3

1

Reserved

Check sum

Byte 95 contains the low order

8 bits of the sum of bytes 0 - 94.

Data Sheet

23

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

A/D Values and Status Bits (2-Wire Address A2h)

Byte Bit Name Description

Converted Analog Values. Calibrated 16 Bit Data.

96

All

Temperature MSB

Internally measured module

temperature¹⁾

97

98

All

Temperature LSB

V_CCMSB

Internally measured supply voltage

in transceiver

99

All

V_CCLSB

100

101

102

103

104

105

106

Tx Bias MSB

Tx Bias LSB

Tx Power MSB

Tx Power LSB

Rx Power MSB

Rx Power LSB

Reserved MSB

Internally measured Tx Bias Current

Measured Tx output power

Measured Rx input power

Reserved for 1st future definition of

digitized analog input

107

108

109

All

Reserved LSB

Reserved MSB

Reserved LSB

Reserved for 1st future definition of

digitized analog input

Reserved for 2nd future definition of

digitized analog input

Reserved for 2nd future definition of

digitized analog input

Optional Status/Control Bits

110

7

Tx Disable State²⁾

Digital state of the Tx Disable Input

110

6

Soft Tx Disable²⁾

Read/write bit that allows software

disable of laser. Writing 1 disables

laser

110

5

4

Reserved

Rx Rate Select State²⁾

Digital state of the SFP Rx Rate

Select Input Pin

110

3

Soft Rx Rate Select²⁾

Read/write bit that allows software

Rx rate select. Writing 1 selects full

bandwidth operation. Not

implemented.

Data Sheet

24

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

A/D Values and Status Bits (2-Wire Address A2h) (cont’d)

Byte

Bit

Name

Description

110

2

Tx Fault

Digital state of the Tx Fault Output

110

1

0

LOS

Digital state of the LOS Output Pin

Data_Ready_Bar

Indicates transceiver has achieved

power up and data is ready

111

7 - 0

Reserved

1)

Temperature measurement is performed on an IC located on the underside of the iSFP™ PCB.

Not implemented.

2)

Data Sheet

25

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

Alarm and Warning Flags (2-Wire Address A2h)

Byte

Bit

Name

Description

112

7

Temp High Alarm

Set when internal temperature

exceeds high alarm level

112

113

6

5

4

3

2

1

0

7

6

Temp Low Alarm

Set when internal temperature is

below low alarm level

V_CCHigh Alarm

Set when internal supply voltage

exceeds high alarm level

V_CCLow Alarm

Set when internal supply voltage is

below low alarm level

Tx Bias High Alarm

Tx Bias Low Alarm

Tx Power High Alarm

Tx Power Low Alarm

Rx Power High Alarm

Rx Power Low Alarm

Set when Tx Bias current exceeds

high alarm level

Set when Tx Bias current is below

low alarm level

Set when Tx output power exceeds

high alarm level

Set when Tx output power is below

low alarm level

Set when received power exceeds

high alarm level

Set when received power is below

low alarm level

113

114

115

116

5

Reserved Alarm

Reserved

4

3

2

1

0

All

7

Reserved

Temp High Warning

Set when internal temperature

exceeds high warning level

116

6

5

Temp Low Warning

Set when internal temperature is

below low warning level

V_CCHigh Warning

Set when internal supply voltage

exceeds high warning level

Data Sheet

26

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

Alarm and Warning Flags (2-Wire Address A2h) (cont’d)

Byte

Bit

Name

Description

116

4

V_CCLow Warning

Set when internal supply voltage is

below low warning level

116

117

3

2

1

0

7

6

Tx Bias High Warning

Tx Bias Low Warning

Tx Power High Warning

Tx Power Low Warning

Rx Power High Warning

Rx Power Low Warning

Set when Tx bias current exceeds

high warning level

Set when Tx bias current is below

low warning level

Set when Tx output power exceeds

high warning level

Set when Tx output power is below

low warning level

Set when received power exceeds

high warning level

Set when received power is below

low warning level

117

118

119

5

Reserved Warning

Reserved

4

3

2

1

0

All

Reserved

Vendor Specific Memory Addresses (2-Wire Address A2h)

Address # Bytes Name

Description

120 -127 8

Vendor Specific

Vendor specific

User EEPROM (2-Wire Address A2h)

Address # Bytes Name

Description

128 - 247 120

248 - 255 8

User EEPROM

Vendor Specific

User writable EEPROM

Vendor specific control functions

Data Sheet

27

2004-06-25

V23848-C18-C56

V23848-C19-C56

Application Notes

Single Mode 1310 nm iSFP™ Transceiver, AC/AC TTL

Host Board

Infineon

iSFP™

3.3 V

Transceiver

1 µH

V_CC

T

16

1 µH

10 µF

0.1 µF

Protocol V_CC

1)

0.1 µF

xx

Protocol V_CC

4.7 to

10 kΩ

V_EE

T

1/17/20

3

4.7 to

10 kΩ

Tx Disable

Tx Fault

TD–

Tx Disable

Tx Fault

2

0.1 µF

19

Laser

Driver

100 Ω

TD+

18

15

0.1 µF

V_CC

R

1)

4.7 to

10 kΩ

10 µF

0.1 µF

xx

Protocol IC

ASIC IC

V_EE

R

9/10/11/14

0.1 µF

13

RD+

Pre-Amp./

Post Amp.

100 Ω

0.1 µF

RD–

LOS

12

8

LOS

Rate Select ²⁾

7

Rate Select ²⁾

Diagnostic IC / EEPROM

3.3 V

6

5

4

4.7 to

10 kΩ

4.7 to

10 kΩ

4.7 to

10 kΩ

MOD-DEF(0) MOD-DEF(1)

MOD-DEF(2)

PLD / PAL

1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal

data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory.

2) Not implemented.

File: 1319

Figure 7

Example iSFP™ Host Board Schematic and

Recommended Host Board Supply Filtering Network

Data Sheet

28

2004-06-25

V23848-C18-C56

V23848-C19-C56

Package Outlines

56.5

47.5

6.25

13.7

Dimensions in mm

Figure 8

File: 1215

TRANSCEIVER TEMPERATURE

REFERENCE POINT

29.80

Dimensions in mm

File: 1224

Figure 9

Data Sheet

29

2004-06-25

V23848-C18-C56

V23848-C19-C56

Revision History:

2004-06-25

DS4

Previous Version:

2003-08-13

Page

Subjects (major changes since last revision)

V23848-C19-C56 added

“Preliminary Data Sheet” removed

iSFP™ trademark added

Title changed

1

7, 9, 10,

Tables changed

18, 22, 24

11

15

17

28

Figure 3 added

EMI Recommendations changed

SFP Accessories changed

Figure 7 Host Board Schematic changed

Edition 2004-06-25

Published by Infineon Technologies AG,

St.-Martin-Strasse 53,

81669 München, Germany

Attention please!

The information herein is given to describe certain components and shall not be considered as a guarantee of

characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding

circuits, descriptions and charts stated herein.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.


型号：	V23848-C18-C56
厂家：	Infineon
描述：	iSFP-Intelligent Small Form-factor Pluggable SONET OC-3 IR-1 / SDH STM S-1.1 Multirate Applications up to 155 Mbit/s ISFP - 智能小型可插拔SONET OC- 3 IR- 1 / SDH STM S- 1.1多速率应用高达155 Mbit / s的
文件：	总30页 (文件大小：727K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

V23848-C18-C56 [INFINEON]

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