TLS850F0TAV33ATMA1 [INFINEON]
Fixed Positive LDO Regulator, 3.3V, 0.43V Dropout, PSSO7, GREEN, PLASTIC, TO-263, 7 PIN;型号: | TLS850F0TAV33ATMA1 |
厂家: | Infineon |
描述: | Fixed Positive LDO Regulator, 3.3V, 0.43V Dropout, PSSO7, GREEN, PLASTIC, TO-263, 7 PIN |
文件: | 总36页 (文件大小:1438K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Low Dropout Linear Voltage Regulator
TLS850F0TAV33
TLS850F0TAV33
Linear Voltage Regulator
Data Sheet
Rev. 1.0, 2015-12-01
Automotive Power
TLS850F0TAV33
Table of Contents
Table of Contents
1
2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Assignment TLS850F0TAV33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Definitions and Functions TLS850F0TAV33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1
4.2
4.3
5
Block Description and Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Voltage Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Typical Performance Characteristics Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Typical Performance Characteristics Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Typical Performance Characteristics Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Typical Performance Characteristics Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Standard Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Typical Performance Characteristics Standard Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
6
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Selection of External Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Reverse Polarity Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.1
6.2
6.2.1
6.2.2
6.3
6.4
6.5
7
8
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Data Sheet
2
Rev. 1.0, 2015-12-01
Low Dropout Linear Voltage Regulator
TLS850F0TAV33
1
Overview
Features
•
•
•
•
•
•
•
•
•
•
Wide Input Voltage Range from 3.0 V to 40 V
Fixed Output Voltage 3.3 V
Output Voltage Precision ≤ ±2 %
Output Current Capability up to 500 mA
Ultra Low Current Consumption typ. 40 µA
Very Low Dropout Voltage typ. 80 mV@100 mA
Stable with Ceramic Output Capacitor of 1 µF
Delayed Reset at Power-On: 16.5 ms
Adjustable Reset Threshold down to 2.50 V
Figure 1
PG-TO263-7
Watchdog with fixed timing and current dependent deactivation: 96 ms,
Activated at IQ > 5.5 mA
•
•
•
•
•
Enable, Undervoltage Reset, Overtemperature Shutdown
Output Current Limitation
Wide Temperature Range
Green Product (RoHS compliant)
AEC Qualified
Data Sheet
3
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Overview
Functional Description
The TLS850F0TAV33 is a high performance very low dropout linear voltage regulator for 3.3 V supply in a PG-
TO263-7 package.
With an input voltage range of 3 V to 40 V and very low quiescent of only 40 µA, these regulators are perfectly
suitable for automotive or any other supply systems connected to the battery permanently. The TLS850F0TAV33
provides an output voltage accuracy of 2 % and a maximum output current up to 500 mA.
The new loop concept combines fast regulation and very good stability while requiring only one small ceramic
capacitor of 1 µF at the output. At currents below 100 mA the device will have a very low typical dropout voltage
of only 80 mV. The operating range starts already at input voltages of only 3 V (extended operating range). This
makes the TLS850F0TAV33 also suitable to supply automotive systems that need to operate during cranking
condition.
The device can be switched on and off by the Enable feature as described in Chapter 5.5.
The output voltage is supervised by the Reset feature, including Undervoltage Reset, delayed Reset at Power-On
and an adjustable lower Reset Threshold, more details can be found in Chapter 5.7.
In addition, a Watchdog circuit with fixed timing is integrated to monitor the microcontroller‘s operation.
Internal protection features like output current limitation and overtemperature shutdown are implemented to
protect the device against immediate damage due to failures like output short circuit to GND, over-current and
over-temperatures.
Choosing External Components
An input capacitor CI is recommended to compensate line influences. The output capacitor CQ is necessary for
the stability of the regulating circuit. TLS850F0TAV33 is designed to be also stable with low ESR ceramic
capacitors.
Type
Package
Marking
TLS850F0TAV33
PG-TO263-7
850F0V33
Data Sheet
4
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Diagram
2
Block Diagram
I
Q
Current
Limitation
RO/WO
RADJ
Reset
EN
Enable
Bandgap
Reference
WI
Temperature
Shutdown
Watchdog
GND
Figure 2
Block Diagram TLS850F0TAV33
Data Sheet
5
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment TLS850F0TAV33
1 2 3 4 5 6 7
Figure 3
Pin Configuration
3.2
Pin Definitions and Functions TLS850F0TAV33
Pin
Symbol
Function
Input
1
I
It is recommended to place a small ceramic capacitor (e.g. 100 nF) to GND, close
to the IC terminals, in order to compensate line influences. See also Chapter 6.2.1
2
3
EN
Enable (integrated pull-down resistor)
Enable the IC with high level input signal;
Disable the IC with low level input signal;
RO/WO
Reset Output / Watchdog Output (intergrated pull-up resistor to Q)
Open collector output;
Leave open if the reset and watchdog function are not needed
4
5
GND
Ground
RADJ
Reset Threshold Adjustment
Connect to GND to use standard value;
Connect an external voltage divider to adjust reset threshold
6
7
WI
Q
Watchdog Input (integrated pull-down resistor)
Serve Watchdog with trigger input signal (usable for microcontroller monitoring)
Output Voltage
Connect output capacitor CQ to GND close to the IC’s terminals, respecting the
values specified for its capacitance and ESR in “Functional Range” on Page 8
Heat
Slug
–
Heat Slug
Connect to heatsink area;
Connect to GND
Data Sheet
6
Rev. 1.0, 2015-12-01
TLS850F0TAV33
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40 °C to +150 °C; all voltages with respect to ground (unless otherwise specified)
Parameter
Symbol
Values
Unit Note /
Test Condition
Number
Min. Typ. Max.
Input I, Enable EN
Voltage
VI, VEN
-0.3
–
–
–
45
7
V
V
V
–
P_4.1.1
P_4.1.3
P_4.1.5
Output Q, Reset/Watchdog Output RO/WO
Voltage VQ, VRO/WO -0.3
Watchdog Input WI, Reset Threshold Adjustment RADJ
–
–
Voltage
VWI, VRADJ -0.3
7
Temperatures
Junction Temperature
Storage Temperature
ESD Absorption
Tj
-40
-55
–
–
150
150
°C
°C
–
–
P_4.1.7
P_4.1.8
Tstg
ESD Susceptibility to GND
ESD Susceptibility to GND
VESD
VESD
-2
–
–
–
2
kV
V
2) HBM
3) CDM
3) CDM
P_4.1.9
-500
-750
500
750
P_4.1.10
P_4.1.12
ESD Susceptibility Pin 1, 7 (corner pins) VESD1,7
to GND
V
1) Not subject to production test, specified by design.
2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF)
3) ESD susceptibility, Charged Device Model “CDM” according JEDEC JESD22-C101
Note:
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Data Sheet
7
Rev. 1.0, 2015-12-01
TLS850F0TAV33
General Product Characteristics
4.2
Functional Range
Table 2
Functional Range
Tj = -40 °C to +150 °C; all voltages with respect to ground (unless otherwise specified)
Parameter
Symbol
Values
Typ.
Unit Note /
Test Condition
Number
Min.
V
Max.
40
1)
Input Voltage Range
VI
Q,nom + Vdr
–
–
–
–
V
–
–
P_4.2.1
P_4.2.3
P_4.2.5
P_4.2.6
2)
Extended Input Voltage Range
Enable Voltage Range
VI,ext
VEN
CQ
3.0
0
40
V
40
V
–
3)4)
Output Capacitor’s
1
–
µF
–
Requirements for Stability
3)
ESR
ESR(CQ) –
Tj -40
–
–
100
150
Ω
–
P_4.2.7
P_4.2.9
Junction Temperature
°C
–
1) Output current is limited internaly and depends on the input voltage, see Electrical Characteristics for more details.
2) When VI is between VI,ext,min and VQ,nom + Vdr, VQ = VI - Vdr. When VI is below VI,ext,min, VQ can drop down to 0 V.
3) Not subject to production test, specified by design.
4) The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%
Note:Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
Data Sheet
8
Rev. 1.0, 2015-12-01
TLS850F0TAV33
General Product Characteristics
4.3
Thermal Resistance
Note:This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3
Thermal Resistance
Parameter
Symbol
Values
Typ.
Unit
Note /
Test Condition
Number
Min.
Max.
Package Version PG-TO263-7
Junction to Case
1)
RthJC
RthJA
RthJA
–
–
–
3
–
–
–
K/W
K/W
K/W
–
P_4.3.6
P_4.3.7
P_4.3.8
Junction to Ambient
21
75
1)2) 2s2p board
1)3) 1s0p board,
Junction to Ambient
footprint only
Junction to Ambient
Junction to Ambient
RthJA
–
–
42
34
–
–
K/W
K/W
1)3) 1s0p board,
300 mm2 heatsink
area on PCB
1)3) 1s0p board,
600 mm2 heatsink
area on PCB
P_4.3.9
RthJA
P_4.3.10
1) Not subject to production test, specified by design
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
Data Sheet
9
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5
Block Description and Electrical Characteristics
5.1
Voltage Regulation
The output voltage VQ is divided by a resistor network. This fractional voltage is compared to an internal voltage
reference and the pass transistor is driven accordingly.
The control loop stability depends on the output capacitor CQ, the load current, the chip temperature and the
internal circuit design. To ensure stable operation, the output capacitor’s capacitance and its equivalent series
resistor (ESR) requirements given in “Functional Range” on Page 8 have to be maintained. For details, also see
the typical performance graph “Output Capacitor Series Resistor ESR(CQ) versus Output Current IQ” on
Page 13. As the output capacitor also has to buffer load steps, it should be sized according to the application’s
needs.
An input capacitor CI is recommended to compensate line influences. In order to block influences like pulses and
HF distortion at input side, an additional reverse polarity protection diode and a combination of several capacitors
for filtering should be used. Connect the capacitors close to the component’s terminals.
In order to prevent overshoots during start-up, a smooth ramp up function is implemented. This ensures almost
no output voltage overshoots during start-up, mostly independent from load and output capacitance.
Whenever the load current exceeds the specified limit, e.g. in case of a short circuit, the output current is limited
and the output voltage decreases.
The overtemperature shutdown circuit prevents the IC from immediate destruction under fault conditions (e.g.
output continuously short-circuit) by switching off the power stage. After the chip has cooled down, the regulator
restarts. This leads to an oscillatory behavior of the output voltage until the fault is removed. However, junction
temperatures above 150 °C are outside the maximum ratings and therefore significantly reduce the IC’s lifetime.
Regulated
Output Voltage
Supply
IQ
II
I
Q
RO/WO
RADJ
Current
Limitation
Reset
EN
C
Enable
CI
VI
VQ
Bandgap
Reference
LOAD
ESR
Temperature
Shutdown
CQ
WI
Watchdog
GND
Figure 4
Voltage Regulation
V
VI
Vdr
VQ,nom
VI,ext,min
VQ
t
Figure 5
Output Voltage vs. Input Voltage
Data Sheet
10
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Table 4
Electrical Characteristics Voltage Regulator 3.3 V version
Tj = -40 °C to +150 °C, VI = 13.5 V, all voltages with respect to ground (unless otherwise specified)
Typical values are given at Tj = 25 °C
Parameter
Symbol
Values
Unit Note / Test Condition
Number
Min. Typ. Max.
Output Voltage Precision
Output Voltage Precision
VQ
VQ
3.23 3.3
3.37
3.37
18
V
V
0.05 mA < IQ < 500 mA
4.23 V < VI < 28 V
P_5.1.23
P_5.1.24
P_5.1.27
3.23 3.3
0.05 mA < IQ < 200 mA
3.72 V < VI < 40 V
Output Voltage Start-up
slew rate
dVQ/dt 3.0
7.5
V/ms VI > 18 V/ms
CQ = 1 µF
0.33 V < VQ < 2.97 V
650 1100 mA 0 V < VQ < 3.1 V
Output Current Limitation
IQ,max
501
P_5.1.29
P_5.1.31
Load Regulation
steady-state
∆VQ,load -20
-1.5
5
mV
IQ = 0.05 mA to 500 mA
VI = 6 V
Line Regulation
steady-state
∆VQ,line -15
0
15
mV
VI = 8 V to 32 V
IQ = 5 mA
P_5.1.33
P_5.1.36
P_5.1.37
P_5.1.38
P_5.1.39
P_5.1.40
Dropout Voltage
Vdr = VI - VQ
Vdr
–
200 430 mV 1) IQ = 250 mA
Dropout Voltage
Vdr = VI - VQ
Vdr
–
80
63
–
175 mV 1) IQ = 100 mA
Power Supply Ripple Rejection
PSRR
Tj,sd
Tj,sdh
–
–
dB
2) fripple = 100 Hz
ripple = 0.5 Vpp
V
Overtemperature Shutdown
Threshold
151
–
200 °C
2) Tj increasing
Overtemperature Shutdown
Threshold Hysteresis
15
–
K
2) Tj decreasing
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5V
2) Not subject to production test, specified by design
Data Sheet
11
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.2
Typical Performance Characteristics Voltage Regulator
Typical Performance Characteristics
Output Voltage VQ versus
Junction Temperature Tj
Dropout Voltage Vdr versus
Junction Temperature Tj
3.5
350
IQ = 100mA
IQ = 100 mA
IQ = 250 mA
3.45
3.4
300
VQ = 3.3 V
250
200
150
100
50
3.35
3.3
3.25
3.2
3.15
3.1
0
−40
0
50
100
150
0
50
100
150
Tj [°C]
Tj [°C]
Load Regulation ∆VQ,load versus
Output Current Change IQ
Line Regulation ∆VQ,line versus
Input Voltage VI
8
0
−2
IQ = 5 mA
Tj = −40 o
Tj = 25 o
Tj = 150 oC
C
C
6
4
−4
−6
2
−8
−10
−12
0
−2
−4
−6
−8
−14
VI = 6 V
−16
Tj = −40 o
C
Tj = 25 o
Tj = 150 oC
100 200
C
−18
−20
0
300
IQ [mA]
400
500
10
15
20
25
30
VI [V]
Data Sheet
12
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Output Voltage VQ versus
Input Voltage VI
Power Supply Ripple Rejection PSRR versus
ripple frequency f
4
80
Tj = 25 o
C
Tj = −40 °C
Tj = 25 °C
3.5
70
60
50
40
30
20
10
0
Tj = 150 °C
IQ = 100 mA
3
2.5
2
1.5
1
IQ = 10 mA
Q = 1 μF
ripple = 0.5 Vpp
0.5
0
C
V
10−2
10−1
100
101
102
103
0
1
2
3
4
5
6
VI [V]
f [kHz]
Output Capacitor Series Resistor ESR(CQ) versus
Output Current IQ
Maximum Output Current IQ versus
Input Voltage VI
103
1200
1000
800
Unstable Region
102
101
Stable Region
600
100
400
VQ = 0 V
Tj = −40 o
Tj = 25 o
Tj = 150 oC
30
10−1
C
200
0
CQ = 1 μF
C
Tj = 25 o
C
10−2
0.05
0
10
20
VI [V]
40
1
10
IQ [mA]
100
500
Data Sheet
13
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Dropout Voltage Vdr versus
Output Current IQ
500
Tj = 25 o
C
450
400
350
300
250
200
150
100
50
0
0
100
200
300
400
500
IQ [mA]
Data Sheet
14
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.3
Current Consumption
Table 5
Electrical Characteristics Current Consumption
Tj = -40 °C to +150 °C, VI = 13.5 V (unless otherwise specified)
Typical values are given at Tj = 25 °C
Conditions of other pins: WI = GND
Parameter
Symbol
Values
Unit Note / Test Condition
Number
Min. Typ. Max.
Current Consumption
Iq = II
Iq,off
Iq,off
Iq
–
–
–
1.3
5
µA
µA
µA
V
V
EN = 0 V; Tj < 105 °C
EN = 0.4 V; Tj < 125 °C
P_5.3.1
P_5.3.3
P_5.3.4
Current Consumption
Iq = II
–
8
Current Consumption
Iq = II - IQ
40
52
IQ = 0.05 mA
Tj = 25 °C
Watchdog disabled
Current Consumption
Iq = II - IQ
Iq
Iq
–
–
62
62
77
82
µA
µA
IQ = 0.05 mA
Tj < 125 °C
Watchdog disabled
1) IQ = 500 mA
P_5.3.7
Current Consumption
P_5.3.11
Iq = II - IQ
Tj < 125 °C
Watchdog enabled
1) Not subject to production test, specified by design
Data Sheet
15
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.4
Typical Performance Characteristics Current Consumption
Typical Performance Characteristics
Current Consumption Iq versus
Output Current IQ
Current Consumption Iq versus
Input Voltage VI
200
100
Tj = 25 o
C
Tj = −40 °C
180
90
80
70
60
50
40
30
20
10
0
Tj = 25 °C
Tj = 150 °C
160
VEN = 5 V
IQ = 50 uA
140
120
100
80
60
40
20
0
0
100
200
300
400
500
5
10
15
20
VI [V]
25
30
35
40
IQ [mA]
Data Sheet
16
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.5
Enable
The TLS850F0TAV33 can be switched on and off by the Enable feature: Connect a HIGH level as specified below
(e.g. the battery voltage) to pin EN to enable the device; connect a LOW level as specified below (e.g. GND) to
shut it down. The enable has a built in hysteresis to avoid toggling between ON/OFF state, if signals with slow
slopes are applied to the EN input.
Table 6
Electrical Characteristics Enable
Tj = -40 °C to +150 °C, VI = 13.5 V, all voltages with respect to ground (unless otherwise specified)
Typical values are given at Tj = 25 °C
Parameter
Symbol
Values
Unit
Note / Test Condition
Number
Min. Typ. Max.
High Level Input Voltage
Low Level Input Voltage
Enable Threshold Hysteresis
High Level Input Current
High Level Input Current
VEN,H
VEN,L
VEN,Hy
IEN,H
2
–
–
–
–
–
–
V
VQ settled
VQ ≤ 0.1 V
–
P_5.5.1
P_5.5.2
P_5.5.3
P_5.5.4
P_5.5.6
P_5.5.7
–
0.8
–
V
100
–
mV
µA
µA
MΩ
3.5
22
2.6
V
V
–
EN = 3.3 V
IEN,H
–
EN ≤ 18 V
Enable internal pull-down resistor REN
0.95 1.5
Data Sheet
17
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.6
Typical Performance Characteristics Enable
Typical Performance Characteristics
Input Current IIN versus
Input Voltage VIN (condition: VEN = 0 V)
Enabled Input Current IEN versus
Enabled Input Voltage VEN
30
50
Tj = −40 °C
Tj = −40 °C
45
Tj = 25 °C
Tj = 25 °C
25
Tj = 150 °C
Tj = 150 °C
40
35
30
25
20
15
10
5
VEN = 0V
20
15
10
5
0
0
0
10
20
30
40
0
10
20
30
40
VIN [V]
VEN [V]
Output Voltage VQ versus
time (EN switched ON)
6
5
4
3
2
1
0
IQ = 100 mA
Tj = −40 °C
Tj = 25 °C
Tj = 150 °C
VEN
0
500
1000
t [us]
1500
2000
Data Sheet
18
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.7
Reset
The TLS850F0TAV33’s output voltage is supervised by the Reset feature, including Undervoltage Reset, delayed
Reset at Power-On and an adjustable Reset Threshold.
The Undervoltage Reset function sets the pin RO/WO to LOW, in case VQ is falling for any reason below the Reset
Threshold VRT,low
.
When the regulator is powered on, the pin RO/WO is held at LOW for the duration of the Power-On Reset Delay
Time trd.
Supply
I
Q
VDD
CQ
RRO /WO,int
Control
RO/WO
Reset
S
R
IRO/WO
Reference
OR
Q
OR
Micro-
Controller
RADJ ,1
Timer
RADJ
IRADJ
GND
GND
RADJ ,2
Figure 6
Block Diagram Reset Circuit
Reset Delay Time
The Reset Delay Time trd is fix defined according to Table 7.
Table 7
Reset DelayTime
Reset delay timing
trd
fix
16.5 ms
Power-On Reset Delay Time
The power-on reset delay time is defined by the parameter trd and allows a microcontroller and oscillator to start
up. This delay time is the time period from exceeding the upper reset switching threshold VRT,high until the reset is
released by switching the reset output “RO/WO” from “LOW” to “HIGH”.
Undervoltage Reset Delay Time
Unlike the power-on reset delay time, the undervoltage reset delay time is defined by the parameter trd and
considers an output undervoltage event where the output voltage VQ trigger the VRT,low threshold.
Reset Blanking Time
The reset blanking time trr,blank avoids that short undervoltage spikes trigger an unwanted reset “low” signal.
Data Sheet
19
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Reset Reaction Time
In case the output voltage of the regulator drops below the output undervoltage lower reset threshold VRT,low, the
reset output “RO/WO” is set to low, after the delay of the internal reset reaction time trr,int. The reset blanking time
t
rr,blank is part of the reset reaction time trr,int
.
Reset Output “RO/WO”
The reset output “RO/WO” is an open collector output with an integrated pull-up resistor. In case a lower-ohmic
“RO/WO” signal is desired, an external pull-up resistor can be connected to the output “Q”. Since the maximum
“RO/WO” sink current is limited, the minimum value of the optional external resistor “RRO/WO,ext” is given in Table
“Reset Output / Watchdog Output RO/WO” on Page 22.
Reset Output “RO/WO” Low for VQ ≥ 1 V
In case of an undervoltage reset condition reset output “RO/WO” is held “low” for VQ ≥ 1 V, even if the input voltage
VI is 0 V. This is achieved by supplying the reset circuit from the output capacitor.
Reset Adjust Function
The undervoltage reset switching threshold can be adjusted according to the application’s needs by connecting
an external voltage divider (RADJ1, RADJ2) at pin “RADJ”. For selecting the default threshold connect pin “RADJ” to
GND. The reset adjustment range for the TLS850F0TAV33 is given in Reset Threshold Adjustment Range.
When dimensioning the voltage divider, take into consideration that there will be an additional current constantly
flowing through the resistors.
With a voltage divider connected, the reset switching threshold VRT,new is calculated as follows
(neglecting the Reset Adjust Pin Current IRADJ):
VRT,lo,new = VRADJ,th × (RADJ,1 + RADJ,2) / RADJ,2
(1)
with
•
•
•
V
RT,lo,new: Desired undervoltage reset switching threshold.
R
V
ADJ,1, RADJ,2: Resistors of the external voltage divider, see Figure 6.
RADJ,th: Reset adjust switching threshold given in Reset Adjustment Switching Threshold.
Data Sheet
20
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
VI
t
t < trr,blank
VQ
VRH
VRT,high
VRT,low
1 V
t
trd
trr,int
trd
trr,int
trd
trr,int
VRO/WO
trd
1V
VRO/WO,low
t
Thermal
Shutdown
Input
Voltage Dip
Under-
voltage
Spike at Over-
output load
Figure 7
Typical Timing Diagram Reset
Data Sheet
21
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Table 8
Electrical Characteristics Reset
Tj = -40 °C to +150 °C, VI = 13.5 V, all voltages with respect to ground (unless otherwise specified)
Typical values are given at Tj = 25 °C
Parameter
Symbol
Values
Unit Note / Test Condition
Number
Min. Typ. Max.
Output Undervoltage Reset 3V3 Version only
Output Undervoltage Reset Upper VRT,high
Switching Threshold
3.08 3.15 3.22
V
V
VQ increasing
P_5.7.5
P_5.7.6
Output Undervoltage Reset Lower VRT,low
Switching Threshold - Default
3.0
60
3.05 3.13
VQ decreasing
RADJ = GND
Output Undervoltage Reset
Switching Hysteresis
VRT,hy
VRH
100
–
–
mV RADJ connected to GND P_5.7.7
Output Undervoltage Reset
100 250
mV RADJ = GND
P_5.7.8
Headroom VQ - VRT
Reset Threshold Adjustment
Reset Adjustment Switching
Threshold
VRADJ,th
1.15 1.20 1.25
V
V
–
P_5.7.9
Reset Threshold Adjustment Range VRT,range
2.5
–
–
2.9
for VQ,nom = 3.3 V
P_5.7.11
Reset Output / Watchdog Output RO/WO
Reset Output Watchdog Output
Low Voltage
VRO/WO,low
0.2
20
–
0.4
36
–
V
1 V ≤ VQ ≤ VRT;
R
P_5.7.16
RO/WO ≥ 5.1 kΩ
Reset Output Watchdog Output
Internal Pull-Up Resistor
RRO/WO,int 13
RRO/WO,ext 5.1
kΩ
kΩ
internally connected to Q P_5.7.17
Reset Output Watchdog Output
External Pull-up Resistor to VQ
1 V ≤ VQ ≤ VRT;
RO/WO ≤ 0.4 V
P_5.7.18
V
Reset Delay Timing
Reset Delay Time
trd
13.2 16.5 19.8 ms
Fixed Timing
1) for VQ,nom = 3.3 V
P_5.7.39
P_5.7.22
P_5.7.23
Reset blanking time
trr,blank
–
–
6
7
–
µs
µs
Internal Reset Reaction Time
trr,int
20
for VQ,nom = 3.3 V
1) Not subject to production test, specified by design.
Data Sheet
22
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.8
Typical Performance Characteristics Reset
Typical Performance Characteristics
Undervoltage Reset Threshold VRT versus
Junction Temperature Tj
Power On Reset Delay Time trd versus
Junction Temperature Tj
25
20
15
10
5
3.5
3.4
3.3
3.2
3.1
3
2.9
2.8
IQ = 1 mA
VQ = 3.3 V
2.7
2.6
2.5
RADJ set to GND
VRT, high
VRT, low
0
50
Tj [°C]
100
150
−40
0
50
Tj [°C]
100
150
Internal Reset Reaction Time trr,int versus
Junction Temperature Tj
20
18
16
14
12
10
8
6
4
2
0
−40
0
50
100
150
Tj [°C]
Data Sheet
23
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.9
Standard Watchdog
The TLS850F0TAV33 features a load dependent watchdog function. The watchdog function monitors a
microcontroller, including time base failures. In case of a missing falling edge within a certain pulse repetition time,
the watchdog output “RO/WO” is set to “low”.
The watchdog uses an internal oscillator as timebase. The effective trigger window is derived from the watchdog
timebase.
The watchdog output signal is provided by a combined Reset Output / Watchdog Output “RO/WO” pin.
Supply
I
Q
VDD
CQ
RRO /WO,int
RO/WO
Reset
IRO/WO
Reference
Control
WD core
Micro-
Controller
Control
GND
WI
IWI
GND
Figure 8
Block Diagram Watchdog Circuit
Watchdog Timing
Figure 9 shows the state diagram of the watchdog (WD) and the mode selection. After power-on, the reset output
signal at the “RO/WO” pin (microcontroller reset) is kept LOW for the reset delay time trd. With the LOW to HIGH
transition of the signal at “RO/WO” the device starts the watchdog ignore time tWI.i. Next, the WD starts the
watchdog trigger time (time frame within a trigger at WI must occur).
From now on, the timing of the signal on WI from the microcontroller must fit to the WD-trigger time tWI,tr. A Re-
Trigger of the WD-trigger time is done with a HIGH-to-LOW transient at the WI-pin within the active tWI,tr
.
Watchdog Output “RO/WO”
The watchdog output “RO/WO” is an open collector output with an integrated pull-up resistor. In case a lower-
ohmic “RO/WO” signal is desired, an external pull-up resistor can be connected to the output “Q”. Since the
maximum “RO/WO” sink current is limited, the minimum value of the optional external resistor “RRO/WO,ext” is given
in Table “Reset Output / Watchdog Output RO/WO” on Page 22. A HIGH to LOW transition of the watchdog
trigger signal on pin WI is taken as a trigger. A watchdog signal is generated (“RO/WO” goes LOW), if there is no
trigger pulse during the Watchdog trigger time.
Data Sheet
24
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
VI
t
VRT,high
VRT,low
VQ
t
IQ
IQ,W,act
IQ,W,deact
t
Current Controlled
WD-turn off
Trigger
VWI
trd
(WD-trigger time tWI,tr
96ms
)
Ignore Time
tWI,i
96ms *)
96ms *)
96ms *)
96ms *)
16.5ms typ.
t
t
t
WD Trigger
NO WD Trigger
WD Trigger
WD Trigger
WD Trigger
Don’t care WI
during t WO,low and
ignore time
Don’t care WI
during WD-off
and ignore time
Don’t care WI
during trd and ignore time
Power
Fail
VRO/WO
trd
tWO,low
No WO assertion during
Current shut down
Normal operation
Normal operation
trr,int
*) watchdog trigger time interrupted by correct WI signal serving the watchdog
Figure 9
Typical Watchdog Timing Diagram, Watchdog and Reset Modes
Watchdog Input “WI”
The watchdog is triggered by a falling edge at the watchdog input pin “WI”. The amplitude and slope of this signal
has to comply with the specification (Table “Watchdog Input WI” on Page 26). For details regarding test pulses,
see Figure 10 “Test Pulses Watchdog Input WI” on Page 25.
VWI
tWI,ph
VWI,high
tWI,pl
VWI,low
dVWI / dt
t
Figure 10 Test Pulses Watchdog Input WI
Data Sheet
25
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Table 9
Electrical Characteristics Watchdog
Tj = -40 °C to +150 °C, VI = 13.5 V, all voltages with respect to ground (unless otherwise specified)
Typical values are given at Tj = 25 °C
Parameter
Symbol
Values
Unit Note / Test Condition
Number
Min. Typ. Max.
Watchdog Timing
Watchdog Ignore Time
Watchdog Trigger Time
Watchdog Output Low Time
tWI,i
12.8 16
76.8 96
19.2 ms
115.2 ms
–
P_5.9.1
P_5.9.2
P_5.9.6
tWI,tr
–
–
tWO,low
6.4
8
9.6
ms
Load Dependent Watchdog Activation
Watchdog Activation Current
Threshold
IQ,W,act
IQ,W,deact
IQ,W,hy
–
–
5.5
mA for VQ,nom = 3.3 V:
VI > 4.23 V;
P_5.9.45
high current condition must
be applied at least for the
time of tW,filter,max
Watchdog Deactivation Current
Threshold
1
–
–
mA for VQ,nom = 3.3 V:
P_5.9.46
VI > 4.23 V;
low current condition must
be applied at least for the
time of tW,filter,max
Watchdog Deactivation Current
Hysteresis
0.35
–
–
–
–
mA for VQ,nom = 3.3 V:
P_5.9.47
P_5.9.14
P_5.9.15
VI > 4.23 V;
Watchdog Minimum Filter Time
state transition by current
tW,IQ,filter, 100
–
µs
µs
1) – see Page 27
min
Watchdog Maximum Filter Time tW,IQ,filter,
–
500
1) – see Page 27
state transition by current
max
Watchdog Input WI
2)
Watchdog Input
Low Signal Valid
VWI,low
VWI,high
tWI,ph
–
–
–
–
–
–
0.8
–
V
–
P_5.9.16
P_5.9.17
P_5.9.19
P_5.9.20
P_5.9.21
2)
Watchdog Input
High Signal Valid
2.0
1
V
–
2)
Watchdog Input
High Signal Pulse Length
–
µs
µs
V/µs
V
V
V
≥ VWI,high
WI
WI
2)
2)
Watchdog Input
Low Signal Pulse Length
tWI,pl
1
–
≤ VWI,low
< VWI < VWI,high
Watchdog Input
Signal Slew Rate
dVWI/dt
1
–
WI,low
High Level Input Current
IWI,H
–
–
3.5
2.6
µA
V
WI = 3.3 V
P_5.9.22
P_5.9.23
Watchdog Input internal pull-down RWI
0.9
1.5
MΩ
–
resistor
Watchdog Disable Threshold
WI Signal Value
VWI,dis
1.15
–
1.40
V
for VQ,nom = 3.3 V:
VI > 4.6 V;
P_5.9.24
signal must be applied for
> tW,filter,max to deactivate
and activate the watchdog
Data Sheet
26
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Table 9
Electrical Characteristics Watchdog (cont’d)
Tj = -40 °C to +150 °C, VI = 13.5 V, all voltages with respect to ground (unless otherwise specified)
Typical values are given at Tj = 25 °C
Parameter
Symbol
Values
Unit Note / Test Condition
Number
Min. Typ. Max.
Watchdog Minimum Filter Time
state transition by WI
tWI,filter,min 100
–
–
µs
µs
3) – see Page 28
3) – see Page 28
P_5.9.25
P_5.9.26
Watchdog Maximum Filter Time tWI,filter,max
–
–
500
state transition by WI
Reset Output / Watchdog Output RO/WO is defined in chapter Reset Output / Watchdog Output RO/WO
–
–
–
–
–
–
–
1) Not subject to production test, specified by design.
2) For details on applied test pulse, see Figure 10
3) Not subject to production test, specified by design.
Watchdog Trigger Time
The Watchdog Trigger Time tWI,tr is fixed to a static value according to Table 10.
Table 10 Watchdog Trigger Time
Watchdog trigger timing
tWI,tr,typ
fix to
96 ms
Watchdog deactivation by current control
The Watchdog is load dependent inactive. This ensures, that if the microcontroller is in a power save mode
(IQ ≤ IQ,W,deact) and not able to provide a correct watchdog trigger signal at pin “WI”, no watchdog signal
“RO/WO = low” is generated. The transition from an active to an inactive state will be performed after a dead time
of tW,IQ,filter,max, when output current keeps below the deactivation threshold. This protects against an unintended
entering of the watchdog deactivation state caused by short dynamic current drops. In case of very short current
drops up to the time of tW,IQ,filter,min, the activation state will definitely be kept. These scenarios are also valid for the
transition from deactivation to activation state. For details see also
IQ
IQ
Scenario „D“
>tWO,low
<tWO,low
IQ,W,act
IQ,W,act
IQ,W,deact
IQ,W,deact
t
t
t
t
t
t
VRO/WO
VRO/WO
VRO/WO
VRO/WO
WD disabled
Scenario „A“
WD-trigger time tWI,tr *)
WD disabled
WD disabled
ignore time tWI,i
ignore time tWI,i
ignore time tWI,i
WD-trigger time tWI,tr
WD-trigger time tWI,tr
tWO,low
ignore time tWI,i
WD-trigger time tWI,tr
*) interrupted by entering in „Watchdog deactivation by current control“
Watchdog filter time tW,IQ,filter
Scenario „B“
WD-trigger time tWI,tr
tWO,low
WD-trigger time tWI,tr
Scenario „C“
WD-trigger time tWI,tr
tWO,low
WD disabled
*)
WD-trigger time tWI,tr
Figure 11 Watchdog Output behavior for Watchdog deactivation by current control
Data Sheet
27
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
Scenario “A”
In scenario “A” the watchdog logic expects a next trigger at WI pin within the WD-trigger time tWI,tr. This state is
interrupted by the low current load state (IQ ≤ IQ,W,deact). During this state, the watchdog is disabled. The watchdog
output signal “RO/WO” will stay high while the watchdog is disabled. After leaving the low current load state
(IQ ≥ IQ,W,act), an ignore window tWI,i follows. After this, the watchdog trigger time tWI,tr starts. This behavior is
defined for cases with a low current load time greater than tWO,low
.
Scenario “B”
In scenario “B” the watchdog is not served within WD-trigger time tWI,tr with an trigger event at WI pin. As a result
the “RO/WO” is set to low. This state is interrupted by the low current load state (IQ ≤ IQ,W,deact). During this state,
the watchdog is disabled. The watchdog output signal “RO/WO” is kept in low state for tWO,low and then the
“RO/WO” is set to high. After leaving the low current load state (IQ ≥ IQ,W,act), an ignore window tWI,i follows. After
this, the watchdog trigger time tWI,tr starts. This behavior is defined for cases with a low current load time greater
than tWO,low
.
Scenario “C”
In scenario “C” the watchdog is not served within WD-trigger time tWI,tr with an trigger event at WI pin. As a result
the “RO/WO” is set to low. After this an ignore window follows. This state is interrupted by the low current load
state (IQ ≤ IQ,W,deact). During this state, the watchdog is disabled. The watchdog output signal “RO/WO” will stay
high while the watchdog is disabled. After leaving the low current load state (IQ ≥ IQ,W,act), an ignore window tWI,i
follows. After this, the watchdog trigger time tWI,tr starts. This behavior is defined for cases with a low current load
time greater than tWO,low
.
Scenario “D”
In scenario “D” the watchdog is not served within WD-trigger time tWI,tr with a trigger event at WI pin. As a result
the “RO/WO” is set to low. This state is interrupted by the low current load state (IQ ≤ IQ,W,deact). During this state,
the watchdog is disabled. The watchdog output signal “RO/WO” is kept in low state for the time of low current load
state. After leaving the low current load state (IQ ≥ IQ,W,act), an ignore window tWI,i follows. After this, the watchdog
trigger time tWI,tr starts. This behavior is defined for cases with a low current load time less than tWO,low
.
Watchdog deactivation by external signal (pin “WI”)
Note:Disabling the watchdog should only considered when the application is not running in the normal operating
conditions as the safe operation is not ensured any more. Example would be the flashing process of the
microcontroller.
The Watchdog can be disabled by connecting a voltage level between the range of 1.15 V to 1.40 V to WI. By
entering the Watchdog deactivation, the “RO/WO” signal behaves like it is described in . The transition from active
to an inactive state will be performed after a dead time of tWI,filter,max, when correct level to WI pin is applied. This
protects against the unintended entering of watchdog deactivation state. After leaving the deactivation voltage
range 1.15 V to 1.40 V, the Watchdog is again active and starts with an ignore window. This scenario is also valid
for the transition from deactivation to activation state.
Data Sheet
28
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
VWI
VWI
Scenario „D“
<tWO,low
>tWO,low
VWI,dis.high
VWI,dis,low
VWI,dis.high
VWI,dis,low
t
t
t
t
t
VRO/WO
VRO/WO
VRO/WO
VRO/WO
WD disabled
Scenario „A“
WD-trigger time tWI,tr *)
WD disabled
WD disabled
ignore time tWI,i
ignore time tWI,i
ignore time tWI,i
WD-trigger time tWI,tr
WD-trigger time tWI,tr
tWO,low
ignore time tWI,i
WD-trigger time tWI,tr
t
*) interrupted by entering in „Watchdog deactivation by WI pin“
Watchdog filter time tW,IQ,filter
Scenario „B“
WD-trigger time tWI,tr
tWO,low
WD-trigger time tWI,tr
Scenario „C“
WD-trigger time tWI,tr
tWO,low
WD disabled
*)
WD-trigger time tWI,tr
Figure 12 Watchdog Output behavior for Watchdog deactivation by WI pin
Scenario “A”
In scenario “A” the watchdog logic expects a next trigger at WI pin within the WD-trigger time tWI,tr. This state is
interrupted by setting VWI to the disable condition (VWI,dis,low ≤ VWI ≤ VWI,dis,high). During this state, the watchdog is
disabled. The watchdog output signal “RO/WO” will stay high while the watchdog is disabled. After leaving the
disable condition (VWI ≥ VWI,dis,high or VWI ≤ VWI,dis,low), an ignore window tWI,i follows. After this, the watchdog trigger
time tWI,tr starts. This behavior is defined for cases with a low current load time greater than tWO,low
.
Scenario “B”
In scenario “B” the watchdog is not served within WD-trigger time tWI,tr with an trigger event at WI pin. As a result
the “RO/WO” is set to low. This state is interrupted by setting VWI to the disable condition
(VWI,dis,low ≤ VWI ≤ VWI,dis,high). During this state, the watchdog is disabled. The watchdog output signal “RO/WO” is
kept in low state for tWO,low and then the “RO/WO” is set to high. After leaving the disable condition (VWI ≥ VWI,dis,high
or VWI ≤ VWI,dis,low), an ignore window tWI,i follows. After this, the watchdog trigger time tWI,tr starts. This behavior is
defined for cases with a low current load time greater than tWO,low
.
Scenario “C”
In scenario “C” the watchdog is not served within WD-trigger time tWI,tr with an trigger event at WI pin. As a result
the “RO/WO” is set to low. After this an ignore window follows. This state is interrupted by setting VWI to the disable
condition (VWI,dis,low ≤ VWI ≤ VWI,dis,high). During this state, the watchdog is disabled. The watchdog output signal
“RO/WO” will stay high while the watchdog is disabled. After leaving the disable condition (VWI ≥ VWI,dis,high or
VWI ≤ VWI,dis,low), an ignore window tWI,i follows. After this, the watchdog trigger time tWI,tr starts. This behavior is
defined for cases with a low current load time greater than tWO,low
.
Scenario “D”
In scenario “D” the watchdog is not served within WD-trigger time tWI,tr with a trigger event at WI pin. As a result
the “RO/WO” is set to low. This state is interrupted by setting VWI to the disable condition
(VWI,dis,low ≤ VWI ≤ VWI,dis,high). During this state, the watchdog is disabled. The watchdog output signal “RO/WO” is
kept in low state for the time of low current load state. After leaving the disable condition (VWI ≥ VWI,dis,high or
VWI ≤ VWI,dis,low), an ignore window tWI,i follows. After this, the watchdog trigger time tWI,tr starts. This behavior is
defined for cases with a low current load time less than tWO,low
.
Data Sheet
29
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Block Description and Electrical Characteristics
5.10
Typical Performance Characteristics Standard Watchdog
Typical Performance Characteristics
Watchdog Trigger Time tWI,tr versus
Junction Temperature Tj
Watchdog Output Low Time tWO,low versus
Junction Temperature Tj
15
IQ = 10 mA
120
100
80
10
60
5
40
20
IQ = 10 mA
0
0
−40
0
50
100
150
0
50
100
150
Tj [°C]
Tj [°C]
Watchdog Activation/Deactivation Current IQ,W,act
,
Watchdog Disable VWI,dis Threshold versus
Junction Temperature Tj
IQ,W,deact versus Junction Temperature Tj
3
2.5
2
7
6
5
4
3
2
1.5
1
0.5
1
IQ = 10 mA
IQ,W,deact
low
high
IQ,W,act
0
0
0
50
Tj [°C]
100
150
0
50
Tj [°C]
100
150
Data Sheet
30
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Application Information
6
Application Information
6.1
Application Diagram
Note:The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
Supply
Regulated Output Voltage
I
Q
RO/WO
RADJ
Load
e . g.
Micro
Controller
XC22xx
DI1
Current
Limitation
Reset
EN
D
C
C
I1
CQ
I 2
I2
R1
1 µF
100nF
< 45V
47µF
Enable
Bandgap
Reference
WI
Temperature
Shutdown
R2
Watchdog
GND
GND
e.g. Ignition
Figure 13 Application Diagram
Note:This is a very simplified example of an application circuit. The function must be verified in the real application.
6.2
Selection of External Components
6.2.1
Input Pin
The typical input circuitry for a linear voltage regulator is shown in the application diagram above.
A ceramic capacitor at the input, in the range of 100 nF to 470 nF, is recommended to filter out the high frequency
disturbances imposed by the line e.g. ISO pulses 3a/b. This capacitor must be placed very close to the input pin
of the linear voltage regulator on the PCB.
An aluminum electrolytic capacitor in the range of 10 µF to 470 µF is recommended as an input buffer to smooth
out high energy pulses, such as ISO pulse 2a. This capacitor should be placed close to the input pin of the linear
voltage regulator on the PCB.
An overvoltage suppressor diode can be used to further suppress any high voltage beyond the maximum rating
of the linear voltage regulator and protect the device against any damage due to over-voltage.
The external components at the input are not mandatory for the operation of the voltage regulator, but they are
recommended in case of possible external disturbances.
6.2.2
Output Pin
An output capacitor is mandatory for the stability of linear voltage regulators.
The requirement to the output capacitor is given in “Functional Range” on Page 8. The graph “Output
Capacitor Series Resistor ESR(CQ) versus Output Current IQ” on Page 13 shows the stable operation range
of the device.
Data Sheet
31
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Application Information
TLS850F0TAV33 is designed to be also stable with low ESR capacitors. According to the automotive
requirements, ceramic capacitors with X5R or X7R dielectrics are recommended.
The output capacitor should be placed as close as possible to the regulator’s output and GND pins and on the
same side of the PCB as the regulator itself.
In case of rapid transients of input voltage or load current, the capacitance should be dimensioned in accordance
and verified in the real application that the output stability requirements are fulfilled.
6.3
Thermal Considerations
Knowing the input voltage, the output voltage and the load profile of the application, the total power dissipation
can be calculated:
PD = (VI - VQ) × IQ + VI × Iq
(2)
with
•
•
•
•
•
PD: continuous power dissipation
VI : input voltage
VQ: output voltage
IQ: output current
Iq: quiescent current
The maximum acceptable thermal resistance RthJA can then be calculated:
RthJA,max = ( Tj,max - Ta ) / PD
(3)
with
•
•
T
j,max: maximum allowed junction temperature
Ta: ambient temperature
Based on the above calculation the proper PCB type and the necessary heat sink area can be determined with
reference to the specification in “Thermal Resistance” on Page 9.
Example
Application conditions:
VI = 13.5 V
VQ = 3.3 V
IQ = 175 mA
Ta = 85 °C
Calculation of RthJA,max
:
PD = (VI – VQ) × IQ + VI × Iq
= (13.5 V – 3.3 V) × 175 mA
= 1.785 W
(VI × Iq can be neglected because of very low Iq)
RthJA,max = (Tj,max – Ta) / PD
= (150 °C – 85 °C) / 1.785 W = 36.41 K/W
Data Sheet
32
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Application Information
As a result, the PCB design must ensure a thermal resistance RthJA lower than 36.41 K/W. According to “Thermal
Resistance” on Page 9, at least 600 mm2 heatsink area is needed on the FR4 1s0p PCB, or the FR4 2s2p board
can be used to ensure a proper cooling for the TLS850F0TAV33 in package.
6.4
Reverse Polarity Protection
TLS850F0TAV33 is not self protected against reverse polarity faults and must be protected by external
components against negative supply voltage. An external reverse polarity diode is needed. The absolute
maximum ratings of the device as specified in “Absolute Maximum Ratings” on Page 7 must be kept.
6.5
Further Application Information
•
For further information you may contact http://www.infineon.com/
Data Sheet
33
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Package Outlines
7
Package Outlines
4.4
±0.1
±0.2
1.27
0.05
10
0...0.3
8.51)
A
B
2.4
0.1
0...0.15
±0.1
7x 0.6
1.27
6x
8° MAX.
M
0.25
A B
0.1
B
1) Typical
Metal surface min. X = 7.25, Y = 6.9
All metal surfaces tin plated, except area of cut.
PG-TO263-7
Figure 14 PG-TO263-7
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Dimensions in mm
Data Sheet
34
Rev. 1.0, 2015-12-01
TLS850F0TAV33
Revision History
8
Revision History
Revision
Date
Changes
Data Sheet - Initial version
1.0
2015-12-01
Data Sheet
35
Rev. 1.0, 2015-12-01
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™,
EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, LITIX™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SPOC™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited,
UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of
Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay
Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association
Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc.
MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave
Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc.
TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last Trademarks Update 2011-11-11
www.infineon.com
Edition 2015-12-01
Published by
Infineon Technologies AG
81726 Munich, Germany
Legal Disclaimer
The information given in this document shall in
no event be regarded as
Warnings
Due to technical requirements, components
may contain dangerous substances. For
information on the types in question, please
contact the nearest Infineon Technologies
Office. Infineon Technologies components may
be used in life-support devices or systems only
with the express written approval of Infineon
Technologies, if a failure of such components
can reasonably be expected to cause the failure
of that life-support device or system or to affect
the safety or effectiveness of that device or
system. Life support devices or systems are
intended to be implanted in the human body or
to support and/or maintain and sustain and/or
protect human life. If they fail, it is reasonable to
assume that the health of the user or other
persons may be endangered.
a guarantee of
conditions or characteristics. With respect to any
examples or hints given herein, any typical
values stated herein and/or any information
regarding the application of the device, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation, warranties of non-
infringement of intellectual property rights of
any third party.
© 2015 Infineon Technologies AG.
All Rights Reserved.
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Email: erratum@infineon.com
Information
For further information on technology, delivery
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