TLE4966G [INFINEON]
The TLE4966G is an integrated circuit double Hall-effect sensor designed specifically for highly accurate applications in the automotive sector. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. They provide a speed signal at Q2 for every magnetic pole pair and a direction information at Q1, which is provided before the speed signal.;
| 型号： | TLE4966G |
| 厂家： | 
Infineon |
| 描述： | The TLE4966G is an integrated circuit double Hall-effect sensor designed specifically for highly accurate applications in the automotive sector. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. They provide a speed signal at Q2 for every magnetic pole pair and a direction information at Q1, which is provided before the speed signal. 传感器 换能器 |
| 文件： | 总17页 (文件大小：1189K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet, Rev. 1.01, October 2019
TLE4966G
High Precision Hall-Effect Switch with
Direction Detection
Sensors
Edition 2019-10-22
Published by
Infineon Technologies AG
81726 München, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
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approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
TLE4966G
Revision History:
2019-10-22
Rev. 1.01
Previous Version:
none
Page
Subjects (major changes since last revision)
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TLE4966G
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
1.2
1.3
2
2.1
2.2
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electrical and Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Field Direction Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Timing Diagrams for the Speed and Direction Outputs . . . . . . . . . . . . 13
7
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Distance between Chip and Package Surface . . . . . . . . . . . . . . . . . . . . . 15
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.1
7.2
7.3
Data Sheet
4
Rev. 1.01, 2019-10-22
TLE4966G
Data Sheet
5
Rev. 1.01, 2019-10-22
High Precision Hall-Effect Switch with Direction
Detection
TLE4966G
1
Overview
1.1
Features
•
•
•
2.7 V to 24 V supply voltage operation
Operation from unregulated power supply
High sensitivity and high stability
of the magnetic switching points
High resistance to mechanical stress
by Active Error Compensation
Reverse battery protection (-18 V)
Superior temperature stability
Peak temperatures up to 195°C without damage
Low jitter (typ. 1 μs)
Digital output signals
Bipolar version
Excellent matching between the 2 Hall probes
Hall plate distance 1.45 mm
•
•
•
•
•
•
•
•
•
•
•
•
Direction & speed information
Direction signal switches before the speed signal
SMD package PG-TSOP6-6-9
1.2
Functional Description
The TLE4966G is an integrated circuit double Hall-effect sensor designed specifically for
highly accurate applications. Precise magnetic switching points and high temperature
stability are achieved by active compensation circuits and chopper techniques on chip.
They provide a speed signal at Q2 for every magnetic pole pair and a direction
information at Q1, which is provided before the speed signal.
Type
Ordering Code
Package
TLE4966G
SP002983176
PG-TSOP6-6-9
Data Sheet
6
Rev. 1.01, 2019-10-22
TLE4966G
Overview
1.3
Pin Configuration (top view)
Center of
Sensitive Area
0.73 ± 0.15
1.45
5
6
4
± 0.15
0.8
s
speed
direction
1
2
3
Figure 1
Pin Definition and Center of Sensitive Area
Table 1
Pin Definitions and Functions PG-TSOP6-6-9
Pin No.
Symbol
Q2
Function
1
2
3
4
5
6
Speed
GND
Q1
Recommended connection to GND
Direction
VS
Supply voltage
GND
GND
Recommended connection to GND
Ground
Data Sheet
7
Rev. 1.01, 2019-10-22
TLE4966G
General
2
General
2.1
Block Diagram
VS
Voltage Regulator
(reverse polarity protected)
ESD
Bias and
Compensation
Circuits
Oscillator
& Sequencer
GND
Q2
Amplifier Filter
Chopped
Hall
Probe
Comparator
with
Hysteresis
Q1
Amplifier Filter
Chopped
Hall
Probe
Direction
Detection
Figure 2
2.2
Block Diagram
Circuit Description
The chopped Double Hall Switch comprises two Hall probes, bias generator,
compensation circuits, oscillator, and output transistors.
The bias generator provides currents for the Hall probes and the active circuits.
Compensation circuits stabilize the temperature behavior and reduce technology variations.
The Active Error Compensation rejects offsets in signal stages and the influence of
mechanical stress to the Hall probes caused by molding and soldering processes and
other thermal stresses in the package. This chopper technique together with the threshold
generator and the comparator ensures high accurate magnetic switching points.
Data Sheet
8
Rev. 1.01, 2019-10-22
TLE4966G
Maximum Ratings
3
Maximum Ratings
Table 2
Parameter
Absolute Maximum Ratings
Tj = -40°C to 150°C
Symbol
Limit Values
Unit
Conditions
min.
max.
Supply voltage
VS
-18
-18
-18
18
24
26
V
for 1 h, RS ≥ 200 Ω
for 5 min, RS ≥ 200 Ω
Supply current
through
IS
-50
50
mA
protection device
Output voltage
VQ
IQ
Tj
-0.7
-0.7
18
26
V
for 5 min @ 1.2 kΩ pull up
Continuous
output current
-50
50
mA
°C
Junction
temperature
–
–
–
–
155
165
175
195
for 2000 h (not additive)
for 1000 h (not additive)
for 168 h (not additive)
for 3 x 1 h (additive)
Storage
temperature
TS
B
-40
150
°C
Magnetic flux
density
–
unlimited
mT
Note: Stresses above those listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3
ESD Protection 1)
Symbol
Parameter
Limit Values
Unit
Notes
min.
max.
ESD voltage
VESD
–
±4
kV
HBM, R = 1.5 kΩ,
C = 100 pF
TA = 25°C
1) Human Body Model (HBM) tests according to: EOS/ESD Association Standard S5.1-1993 and
Mil. Std. 883D method 3015.7
Data Sheet
9
Rev. 1.01, 2019-10-22
TLE4966G
Operating Range
4
Operating Range
Table 4
Operating Range
Symbol
Parameter
Limit Values
Unit
Conditions
min.
typ.
max.
Supply voltage
VS
2.7
–
–
–
–
–
18
24
26
V
1 h with RS ≥ 200 Ω
for 5 min RS ≥ 200 Ω
Output voltage
VQ
Tj
-0.7
–
18
V
Junction
temperature
-40
–
–
–
150
175
°C
for 168 h
Output current
IQ
0
–
10
mA
Data Sheet
10
Rev. 1.01, 2019-10-22
TLE4966G
Electrical and Magnetic Parameters
5
Electrical and Magnetic Parameters
1)
Table 5
Electrical Characteristics
Parameter
Symbol
Limit Values
min. typ. max.
Unit Conditions
Supply current
IS
4
0
–
5.2
0.2
0.3
7
mA
mA
V
VS = 2.7 V ... 18 V
Reverse current
ISR
1
VS = -18 V
IQ = 10 mA
Output saturation
voltage
VQSAT
0.6
Output leakage
current
IQLEAK
–
0.05
10
μA
for VQ = 18 V
Output fall time
Output rise time
tf
tr
–
–
0.2
0.2
1
1
μs
μs
R
L = 1.2 k
see:
Figure 3 on Page 13
Ω; CL < 50 pF
Chopper frequency
fOSC
–
320
–
–
kHz
Switching frequency fSW
Delay time 3)
0
15 2) kHz
μs
1000 ns
td
–
13
200
1
–
Count Signal Delay
Output jitter 4)
tdc
tQJ
50
–
–
μsRMS Typ. value for square-
wave signal 1 kHz
Repeatability of
BREP
–
40
–
μTRMS Typ. value for
ΔB/Δt > 12 mT/ms
magnetic thresholds 5)
Power-on time 6)
tPON
–
–
–
13
–
–
–
μs
VS ≥ 2.7 V
Distance of hall plates dHALL
Thermal resistance 7) RthJA
1.45
100
mm
K/W
PG-TSOP6-6-9
1) over operating range, unless otherwise specified. Typical values correspond to VS = 12 V and TA = 25°C
2) To operate the sensor at the max. switching frequency, the magnetic signal amplitude must be 1.4 times
higher than for static fields. This is due to the -3 dB corner frequency of the low pass filter in the signal path.
3) Systematic delay between magnetic threshold reached and output switching
4) Jitter is the unpredictable deviation of the output switching delay
5)
BREP is equivalent to the noise constant
6) Time from applying VS ≥ 2.7 V to the sensor until the output state is valid
7) Thermal resistance from junction to ambient
Data Sheet
11
Rev. 1.01, 2019-10-22
TLE4966G
Electrical and Magnetic Parameters
Calculation of the ambient temperature (PG-TSOP6-6-9 example)
e.g. for VS = 12.0 V, IStyp = 5.5 mA, VQSATtyp = 0.3 V and 2 x IQ = 10 mA :
Power Dissipation: PDIS = 72.0 mW.
In TA = Tj – (RthJA × PDIS) = 175°C – (100 K / W × 0.072 W)
Resulting max. ambient temperature: TA = 167.8°C
Table 6
Magnetic Characteristics 1)
.
Parameter
Symbol Tj [°C]
Limit Values
Unit
Conditions
min.
typ.
max.
Operate point
Release point
Hysteresis
BOP
-40
25
150
5.2
5.0
4.7
7.7
7.5
7.1
10.3
10.0
9.5
mT
BRP
-40
25
150
-10.3
-10.0
-9.5
-7.7
-7.5
-7.1
-5.2
-5.0
-4.7
mT
mT
mT
BHYS
-40
25
150
–
10.0
–
–
15.0
–
–
20.0
–
Magnetic
matching
BMATCH
-40
25
150
–
-2.0
–
–
0
–
–
2.0
–
Valid for
B
OP1 - BOP2
and
B
RP1 - BRP2
Magnetic offset BOFF
-40
25
150
–
-2.0
–
–
0
–
–
2.0
–
mT
(BOP + BRP)/2
Temperature
compensation of
magnetic
–
–
-350
–
ppm/°C
TC
thresholds
1) over operating range, unless otherwise specified. Typical values correspond to VS = 12 V
Note: Typical characteristics specify mean values expected over the production spread.
Field Direction Definition
Positive magnetic fields related with south pole of magnet to the branded side of
package.
Data Sheet
12
Rev. 1.01, 2019-10-22
TLE4966G
Timing Diagrams for the Speed and Direction Outputs
6
Timing Diagrams for the Speed and Direction
Outputs
Applied Magnetic Field
BOP
BRP
td
tf
td
tr
VQ
90%
10%
Figure 3
Timing Definition of the Speed Signal
tdc
tdc
Speed
Direction
t
Change of Direction
Figure 4
Timing Definition of the Direction Signal
Data Sheet
13
Rev. 1.01, 2019-10-22
TLE4966G
Timing Diagrams for the Speed and Direction Outputs
N
S
S
N
N
S
N
S
S
N
Rotation
Direction
Branded Side of
IC
N
S
TLE4966
Figure 5
Definition of the Direction Signal
Rotation Direction
Left to right
State of Direction Output VQ1
Low
Right to left
High
Data Sheet
14
Rev. 1.01, 2019-10-22
TLE4966G
Package Information
7
Package Information
7.1
Package Marking
S
6G
Figure 6
7.2
Marking PG-TSOP6-6-9
Distance between Chip and Package Surface
Branded Side
0.56 ± 0.1 mm
Figure 7
Distance Chip to Upper Side of IC
Data Sheet
15
Rev. 1.01, 2019-10-22
TLE4966G
Package Information
7.3
Package Outlines
Figure 8
PG-TSOP6-6-9 (Plastic Thin Small Outline Package)
PCB Footprint for PG-TSOP6-6-9
The following picture shows a recommendation for the PCB layout.
0.5
0.95
Figure 9
Footprint PG-TSOP6-6-9
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
Data Sheet
16
Rev. 1.01, 2019-10-22
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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