SPB80P06P G [INFINEON]

Infineon’s highly innovative OptiMOS™ families include p-channel power MOSFETs. These products consistently meet the highest quality and performance demands in key specifications for power system design such as on-state resistance and figure of merit characteristics.;
SPB80P06P G
型号: SPB80P06P G
厂家: Infineon    Infineon
描述:

Infineon’s highly innovative OptiMOS™ families include p-channel power MOSFETs. These products consistently meet the highest quality and performance demands in key specifications for power system design such as on-state resistance and figure of merit characteristics.

文件: 总11页 (文件大小:607K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPB80P06P G  
SIPMOS Power-Transistor  
Features  
Product Summary  
P-Channel  
Drain source voltage  
V
-60  
0.023  
-80  
V
A
DS  
Enhancement mode  
Drain-source on-state resistance R  
DS(on)  
Avalanche rated  
Continuous drain current  
I
D
dv/dt rated  
175°C operating temperature  
° Pb-free lead plating: RoHS compliant  
° Halogen-free according to IEC61249-2-21  
° Qualified according to AEC Q101  
Pin 1 PIN 2/4 PIN 3  
Type  
Package  
Lead free  
G
D
S
SPB80P06P G  
PG-TO263-3  
Yes  
Maximum Ratings,at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
Continuous drain current  
I
D
A
1)  
T
25 °C,  
-80  
-64  
C =  
T = 100 °C  
C
Pulsed drain current  
I
-320  
D puls  
T = 25 °C  
C
Avalanche energy, single pulse  
E
E
823  
mJ  
AS  
AR  
I = -80 A , V = -25 V, R = 25  
D
DD  
GS  
Avalanche energy, periodic limited by T  
34  
6
jmax  
Reverse diode dv/dt  
dv/dt  
kV/µs  
I = -80 A, V = -48 , di/dt = 200 A/µs,  
S
DS  
T
= 175 °C  
jmax  
Gate source voltage  
Power dissipation  
V
P
±20  
340  
V
GS  
tot  
W
T = 25 °C  
C
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T
,
T
-55...+175  
55/175/56  
°C  
j
stg  
1
Current limited by bondwire; with anRthJC = 0.4 K/W the chip is able to carry ID = -91A  
Rev 1.6 Page 1  
2011-09-01  
SPB80P06P G  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
min.  
typ.  
max.  
Characteristics  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
-
-
-
-
0.4  
62  
K/W  
thJC  
R
thJA  
R
thJA  
-
-
-
-
62  
40  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
-60  
max.  
Static Characteristics  
Drain- source breakdown voltage  
V
V
-
-
V
(BR)DSS  
GS(th)  
V
= 0 V, I = -250 µA  
D
GS  
Gate threshold voltage, V = V  
-2.1  
-3  
-4  
GS  
DS  
I = -5.5 mA  
D
Zero gate voltage drain current  
I
µA  
DSS  
V
V
= -60 V, V = 0 V, T = 25 °C  
-
-
-0.1  
-10  
-1  
DS  
DS  
GS  
j
= -60 V, V = 0 V, T = 150 °C  
-100  
GS  
j
Gate-source leakage current  
= -20 V, V = 0 V  
I
-
-10  
-100 nA  
GSS  
V
GS  
DS  
Drain-source on-state resistance  
R
-
0.021 0.023  
DS(on)  
V
= -10 V, I = -64 A  
D
GS  
1
2
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Rev 1.6  
Page 2  
2011-09-01  
SPB80P06P G  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
typ.  
max.  
Dynamic Characteristics  
Transconductance  
g
18  
-
36  
-
S
fs  
V
2*I *R  
, I = -64 A  
DS(on)max D  
DS  
D
Input capacitance  
= 0 V, V = -25 V, f = 1 MHz  
C
C
C
4026 5033 pF  
1252 1565  
iss  
oss  
V
GS  
DS  
Output capacitance  
= 0 V, V = -25 V, f = 1 MHz  
-
V
GS  
DS  
Reverse transfer capacitance  
= 0 V, V = -25 V, f = 1 MHz  
-
437  
24  
546  
36  
rss  
V
GS  
DS  
Turn-on delay time  
= -30 V, V = -10 V, I = -64 A,  
t
t
t
t
-
ns  
d(on)  
V
DD  
GS  
D
R = 1  
G
Rise time  
-
-
-
18  
56  
30  
27  
84  
45  
r
V
= -30 V, V = -10 V, I = -64 A,  
GS D  
DD  
R = 1  
G
Turn-off delay time  
= -30 V, V = -10 V, I = -64 A,  
d(off)  
V
DD  
GS  
D
R = 1  
G
Fall time  
f
V
= -30 V, V = -10 V, I = -64 A,  
GS D  
DD  
R = 1  
G
Rev 1.6  
Page 3  
2011-09-01  
SPB80P06P G  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
typ.  
max.  
Dynamic Characteristics  
Gate to source charge  
Q
Q
Q
-
-
-
-
27.4  
50  
41  
75  
173  
-
nC  
gs  
V
= -48 V, I = -80 A  
D
DD  
Gate to drain charge  
= -48 V, I = -80 A  
gd  
V
DD  
D
Gate charge total  
= -48 V, I = -80 A, V = 0 to -10 V  
115  
-6.2  
g
V
DD  
D
GS  
Gate plateau voltage  
= -48 V , I = -80 A  
V
V
(plateau)  
V
DD  
D
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
-80  
Reverse Diode  
Inverse diode continuous forward current  
I
-
-
-
-
-
-
A
S
T = 25 °C  
C
Inverse diode direct current,pulsed  
I
-
-320  
-1.6  
SM  
T = 25 °C  
C
Inverse diode forward voltage  
V
-1.2  
117  
420  
V
SD  
V
= 0 V, I = -80 A  
F
GS  
Reverse recovery time  
V = -30 V, I =I , di /dt = 100 A/µs  
t
175 ns  
630 nC  
rr  
R
F
S
F
Reverse recovery charge  
V = -30 V, I =l , di /dt = 100 A/µs  
Q
rr  
R
F S  
F
Rev 1.6  
Page 4  
2011-09-01  
SPB80P06P G  
Power dissipation  
Drain current  
I = f (T )  
P
= f (T )  
C
tot  
D
C
parameter: V  
10 V  
GS  
SPP80P06P  
SPP80P06P  
-90  
360  
A
W
-70  
-60  
-50  
-40  
-30  
-20  
-10  
0
280  
240  
200  
160  
120  
80  
P
I
40  
0
°C  
°C  
190  
0
20 40 60 80 100 120 140 16
190  
0
20 40 60 80 100 120 140 160  
T
T
C
C
Safe operating area  
I = f ( V  
Transient thermal impedance  
Z = f (t )  
thJC  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
C
p
SPP80P06P  
SPP80P06P  
-10 3  
10 1  
K/W  
t
= 14.0µs  
p
A
10 0  
-10 2  
10 -1  
100 µs  
I
Z
I
V
10 -2  
1 ms  
D = 0.50  
0.20  
10 ms  
R
-10 1  
10 -3  
0.10  
0.05  
DC  
0.02  
single pulse  
10 -4  
0.01  
-10 0  
10 -5  
-10 -1  
-10 0  
-10 1  
-10 2  
DS  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
V
s
V
t
p
Rev 1.6  
Page 5  
2011-09-01  
SPB80P06P G  
Typ. output characteristic  
I = f (V ); T =25°C  
Typ. drain-source-on-resistance  
= f (I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 80 µs  
parameter: V  
GS  
p
SPP80P06P  
SPP80P06P  
-190  
A
Ptot = 340.00W  
0.075  
b
c
d
e
f
g
h
i
k
j
V
[V]  
GS  
a
-160  
-140  
-120  
-100  
-80  
-4.0  
-4.5  
-5.0  
-5.5  
-6.0  
-6.5  
-7.0  
-7.5  
-8.0  
-9.0  
-10.0  
0.060  
0.055  
0.050  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
b
c
d
e
f
i
h
I
R
g
h
i
g
e
f
j
k
-60  
-40  
d
b
V
[V] =  
c
GS  
c
a
-20  
b
d
e
f
g
h
i
j
k
-4.5 -5.0 -5.5 -6.0 -6.5 -7.0 -7.5 -8.0 -9.0 -10.0  
j
k
0
V
A
0
-1 -2 -3 -4 -5 -6 -7 -8  
-10  
DS  
0
-20 -40 -60 -80 -100 -120  
-160  
V
I
D
Typ. transfer characteristics I = f ( V  
)
GS  
Typ. forward transconductance  
g = f(I ); T =25°C  
D
V
2 x I x R  
D DS(on)max  
DS  
fs  
D
j
parameter: t = 80 µs  
parameter: g  
p
fs  
50  
-80  
S
A
40  
35  
-60  
-50  
I
g
30  
25  
20  
15  
10  
5
-40  
-30  
-20  
-10  
0
0
0
-1 -2 -3 -4 -5 -6 -7 -8  
-10  
GS  
0
-10 -20 -30 -40 -50 -60 -70 -80  
-100  
V
V
A
I
D
Rev 1.6  
Page 6  
2011-09-01  
SPB80P06P G  
Drain-source on-state resistance  
= f (T )  
Gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter : I = -64 A, V = -10 V  
parameter: V = V , I = -5.5 mA  
GS DS D  
D
GS  
SPP80P06P  
-5.0  
0.070  
V
0.060  
0.055  
0.050  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
98%  
-4.0  
-3.5  
-3.0  
-2.5  
-2.0  
-1.5  
-1.0  
-0.5  
0.0  
typ  
2%  
V
R
98%  
typ  
°C  
-60  
-20  
20  
60  
100  
140  
200  
-60  
-20  
20  
60  
100  
140  
200  
°C  
T
T
j
j
Typ. capacitances  
C = f (V )  
Forward characteristics of reverse diode  
I = f (V )  
DS  
F
SD  
parameter: V =0V, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
SPP80P06P  
10 5  
10 3  
pF  
A
10 4  
10 2  
I
C
C
iss  
C
C
oss  
rss  
10 3  
10 1  
Tj = 25 °C typ  
Tj = 175 °C typ  
Tj = 25 °C (98%)  
Tj = 175 °C (98%)  
10 2  
10 0  
0.0  
V
0
-5  
-10  
-15  
-25  
DS  
-0.4 -0.8 -1.2 -1.6 -2.0 -2.4  
-3.0  
V
V
V
SD  
Rev 1.6  
Page 7  
2011-09-01  
SPB80P06P G  
Avalanche energy  
= f (T )  
Typ. gate charge  
= f (Q  
E
V
)
Gate  
AS  
j
GS  
para.: I = -80 A , V = -25 V, R = 25  
parameter: I = -80 A pulsed  
D
DD  
GS  
D
SPP80P06P  
850  
-16  
mJ  
V
700  
600  
500  
400  
300  
200  
100  
0
-12  
-10  
V
E
V
V
DS max  
0,2  
0,8  
DS max  
-8  
-6  
-4  
-2  
0
25  
45  
65  
85 105 125 145  
185  
0
20 40 60 80 100 120 140  
180  
°C  
nC  
T
j
Q
Gate  
Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
SPP80P06P  
-72  
V
-68  
-66  
-64  
-62  
-60  
-58  
-56  
-54  
V
°C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
Rev 1.6  
Page 8  
2011-09-01  
SPB80P06P G  
PG-TO220-3  
Rev 1.6  
2011-09-01  
Page 9  
SPB80P06P G  
PG-TO263-3  
Rev 1.6  
2011-09-01  
Page 10  
SPB80P06P G  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2008 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions  
or characteristics. With respect to any examples or hints given herein, any typical values stated  
herein and/or any information regarding the application of the device, Infineon Technologies  
hereby disclaims any and all warranties and liabilities of any kind, including without limitation,  
warranties of non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact  
).  
the nearest Infineon Technologies Office (www.infineon.com  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information  
on the types in question, please contact the nearest Infineon Technologies Office. Infineon  
Technologies components may be used in life-support devices or systems only with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be  
expected to cause the failure of that life-support device or system or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body or to support and/or maintain and sustain and/or protect human life.  
If they fail, it is reasonable to assume that the health of the user or other persons may be  
endangered.  
Rev 1.6  
Page 11  
2011-09-01  

相关型号:

SPB80P06PG

SIPMOSÒ Power-Transistor Features Enhancement mode Avalanche rated
INFINEON

SPB80P06PGATMA1

Power Field-Effect Transistor, 80A I(D), 60V, 0.023ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, GREEN, PLASTIC, TO-263, 3 PIN
INFINEON

SPBC1E104MA4

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-4, SIP
KYOCERA AVX

SPBC1E104MA8

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-8, SIP
KYOCERA AVX

SPBC1E104MAA

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-10, SIP
KYOCERA AVX

SPBC1E104MAC

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-12, SIP
KYOCERA AVX

SPBC1E104MAE

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-14, SIP
KYOCERA AVX

SPBC1E104PA2

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-2, SIP
KYOCERA AVX

SPBC1E104PAE

Array/Network Capacitor, 100V, Z5U, 0.1uF, Through Hole Mount, SIP-14, SIP
KYOCERA AVX

SPBI11N60C3

Cool MOS Power Transistor
INFINEON

SPBM505-4.2X1

300 AMPS DISCHARGE 20 AMPS CHARGE CURRENT PROGRAMABLE BATTERY BYPASS MODULE
SSDI

SPBM505-4.2X1A

Rectifier Diode, 1 Phase, 2 Element, Silicon,
SSDI