SMM310 [INFINEON]
Silicon MEMS Microphone; 硅MEMS麦克风
| 型号： | SMM310 |
| 厂家： | 
Infineon |
| 描述： | Silicon MEMS Microphone |
| 文件： | 总13页 (文件大小：323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet, V1.1, May 2008
SMM310
Silicon MEMS Microphone
Small Signal Discretes
Edition 2008-05-28
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2008.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
SMM310
SMM310
Revision History: 2008-05-28, V1.1
Previous Version: 2007-08-31, V1.0
Page
Subjects (major changes since last revision)
4
Halogen-free package
9
11
Typical measurement of output impedance added
Marking layout example removed
Data Sheet
3
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Silicon MEMS Microphone
Features
•
•
•
•
•
•
•
•
SMD MEMS microphone for automated surface mount assembly
Reflow soldering up to 260 °C (lead free)
High long-term temperature stability
Stable sensitivity over power supply range of 1.5 - 3.3 V
Low current consumption of 80 µA
Excellent power supply rejection of -55 dB
High integrated immunity to EMI
RoHS-compliant, halogen-free package with small footprint and
low height of 1.25 mm
Applications
The SMM310 is designed for
•
•
•
•
Mobile Phones (Handsets, Headsets)
Consumer (Game Consoles, PDA’s)
Computer (Personal Computers, Notebooks)
Cameras (Digital Still Cameras, Video Cameras)
Product Description
Miniature Silicon MEMS (Micro Electro Mechanical System) omni-directional Microphone with single-ended
analog interface designed for automated reflow soldering assembly as SMD (Surface Mounted Device)
component. It is an alternative to conventional ECMs (Electret Condenser Microphones).
Due to its robust design with a metallic lid and monolithic integrated EMI-blocking capacitors and utilization of
Silicon MEMS technology, the SMM310 shows high immunity to EMI (Electromagnetic Interference) and heat.
The capped Chip-On-Board package solution contains the micromechanical sensor chip and an amplifier chip.
The RoHS-compliant halogen-free device has a size of 4.72 x 3.76 x 1.25 mm3.
VDD (4)
OUT (1)
GND (2,3)
Figure 1
Block Diagram
Type
Package
Marking
SMM310
HG-MMA-4-2
S310
Data Sheet
4
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Pin Definition and Function
Table 1
Pin Definition and Function
Pin No.
Symbol
OUT
GND
GND
VDD
Function
Output
Ground
Ground
Power
1
2
3
4
Maximum Ratings
Table 2
Maximum Ratings
Storage Temperature
Operating Temperature Range
Operating Voltage Range
TSTG
TA
VDD
-40 °C - 125 °C
-40 °C - 85 °C
1.5 V - 3.3 V
ESD robustness
Table 3
Typical robustness to electrostatic discharge
ESD capability all pins (HBM, JESD22-A114)
ESD capability all pins (MM, JESD22-A115)
VESD_HBM
VESD_MM
± 4 kV
± 400 V
Acoustical and Electrical Characteristics
Table 4
Unless otherwise noted, typical test conditions are TA = 23 °C, VDD = 2.1 V and R.H. = 50 %
measured in a pressure chamber test setup. All voltages refer to GND node
Parameter
Symbol
Values
Typ.
-42
Unit
Note / Test Condition
Min.
-45
-1
Max.
-39
+4
+1
32.5
Sensitivity 1 kHz
S1kHz
dB(V/Pa) 1 kHz, 94 dB SPL
dB
dB
dB(pso)
dB(A)
dB(pso)
dB(A)
%
Relative Sensitivity 4 kHz
Relative Sensitivity 240 Hz
Equivalent Noise Level
∆S4kHz
∆S240Hz
ENL
Relative to sensitivity 1 kHz
-1
Relative to sensitivity 1 kHz
CCITT-weighted1)
A-weighted2)
CCITT-weighted
A-weighted
29.5
35
64.5
59
0.1
80
-55
Signal-to-Noise Ratio
SNR
61.5
Total Harmonic Distortion
Current Consumption
Power Supply Rejection Ratio PSRR
THD
ICC
0.5
140
-40
104 dB SPL, 1 kHz
µA
dBr
V
DD = 2.1 V
100 mV superimposed on
DD = 2.1 V, 1 kHz
V
DC Output Voltage
Output Impedance
VOUT
ZOUT
1.2
7
V
Ω
DC Voltage at Pin 1
1 kHz
1) Psophometrically weighted noise measurement with CCITT-filter (ITU-T Rec. P.53)
2) Noise measurement with A-weighting filter (IEC 651)
Data Sheet
5
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Typical Measurements Results
10
8
6
+4
-1
4
+1
-1
2
0
-2
-4
-6
-8
-10
100
1000
10000
Frequency [Hz]
Figure 2
Typical frequency response curve relative to the sensitivity at a frequency of 1 kHz
5
4
5
4
3
3
2
2
1
1
0
0
-1
-2
-3
-4
-5
-1
-2
-3
-4
-5
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature / °C
Temperature / °C
Figure 3
Typical change of sensitivity at 1 kHz and equivalent noise level over temperature relative to
TA = 23° C
Data Sheet
6
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
-39
-40
-41
-42
-43
-44
-45
32.5
31.5
30.5
29.5
28.5
27.5
26.5
90
85
80
75
70
65
60
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
DC Output
Voltage
Equivalent
Noise
Sensitivity
Current
Consumption
1.4 1.7
2
2.3 2.6 2.9 3.2 3.5
1.4 1.7
2
2.3 2.6 2.9 3.2
VDD [V]
VDD [V]
Figure 4
Typical measurement of sensitivity, equivalent noise level, current consumption and DC
output voltage over power supply VDD
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
90
100
110
120
130
Sound Pressure [dB SPL]
Figure 5
Typical total harmonic distortion over sound pressure level (1 kHz, VDD = 2.1 V)
Data Sheet
7
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
1000
100
10
A-weighted
CCITT-weighted
1
100
1000
10000
Frequency [Hz]
Figure 6
Typical noise density measurement with A-weighting and CCITT-weighting filter
-30
-35
-40
-45
-50
-55
-60
-65
-70
10
100
1000
10000
100000
Frequency [Hz]
Figure 7
Typical power supply rejection ratio (relative to 100 mV sinewave superimposed on the supply
voltage VDD)
Data Sheet
8
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
-10
-20
-30
-40
-50
-60
-70
-80
WCDMA
GSM850/900
GSM1800/1900
100 300 500 700 900 1100 1300 1500 1700 1900 2100 2300 2500
Frequency of RF disturbance [MHz]
Figure 8
Typical RF demodulation relative to the microphone signal (1 kHz, 1 Pa). RF disturbance
(100 MHz - 2.5 GHz, 80%-AM-modulated with 1 kHz) is directly injected in the power supply
100
90
80
70
60
50
40
30
20
10
0
10
100
1000
10000
100000
Frequency [Hz]
Figure 9
Typical output impedance measurement (VDD = 2.1 V)
Data Sheet
9
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Package Outline
0.1
4x
±0.1
0.84
4
3
2
3
2
4
1
1)
1
±0.2
±0.1
1.32
4.72
0.15 TYP.
1.45 TYP.
(2.97)
1) Area for acoustic seal diam. 1.64 mm typ.
GHG01248
Figure 10 Package outline
Table 5
Item
Height
Length
Width
Dimensions
Dimension (mm)
Tolerance (mm)
± 0.1
± 0.1
± 0.1
± 0.1
1.25
4.72
3.76
0.84
Sound Port Diameter
Recommended Customer Land Pattern
1.45
2.97
4.42
HLGF1250
Figure 11 Recommended customer land pattern
Data Sheet
10
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Solder Reflow
Table 6
Solder Reflow Conditions
Solder Reflow Profile
Maximum Peak Temperature
Number of Reflow
Compliant to J-STD-020-C
260 °C
3 times reflow soldering
Board washing after Reflow
Board washing can damage the microphone if the sound inlet hole is
uncovered
Moisture Sensitivity Level
MSL 2 classified
Recommended Vacuum Handling
0.5 mm MIN
Figure 12 Recommended minimum distance between sound port hole and vacuum pick tool opening is
0.50 mm
Data Sheet
11
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Tape Outline
Figure 13 Tape Outline, 1) Cumulative tolerance of 10 sprocket holes is ±0.2 mm
Table 7
W
Tape Dimensions (mm)
P0
P1
P2
D0
A0
B0
E1
12±0.3
4±0.1
8±0.1
2±0.05
1.5±0.1
4.1±0.1
5±0.1
1.75±0.1
E2
F
D1
T
T1
T2
G
K0
10.25 MIN
5.5±0.05
1.5 MIN
0.3±0.05
0.05±0.015 2.1±0.2
1.95 NOM
1.75±0.1
Data Sheet
12
V1.1, 2008-05-28
SMM310
Silicon MEMS Microphone
Reel Outline
Figure 14
Table 8
A
Reel Dimension (mm) and Quantity per Reel
W1
W2
N
Quantity per Reel
Ø 330
12.4±1.5
18.4 MAX
Ø 100
4000
Data Sheet
13
V1.1, 2008-05-28
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