SC180H045A5FPBF [INFINEON]
Rectifier Diode, Schottky, 1 Phase, 1 Element, 45V V(RRM), Silicon, WAFER;
| 型号： | SC180H045A5FPBF |
| 厂家： | 
Infineon |
| 描述： | Rectifier Diode, Schottky, 1 Phase, 1 Element, 45V V(RRM), Silicon, WAFER 二极管 |
| 文件： | 总5页 (文件大小：248K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Bulletin I0504J rev. C 05/01
SC180.....5. Series
SCHOTTKY DIE 150 x 180 mils
a
c
0.35 ± 0.01
(14 ± 0.4)
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
C
3. DIMENSIONS AND TOLERANCES:
a = 4.57 + 0, - 0.01
(180 + 0, - 0.4)
A
b = 3.81 + 0, - 0.01
(150 + 0, - 0.4)
D
c = 4.42 + 0, - 0.01
(174 + 0, - 0.4)
d = 3.66 + 0, - 0.01
(144 + 0, - 0.4)
Ø = 1 ± 0.15
(40 ± 6)
Ø
4. LETTER DESIGNATION:
40 (157)
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
5. SAWING:
Wafer flat alligned with
side b of the die
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
Ø 125 (492)
NOT TO SCALE
NOTE: 10 mils die thickness is available on specific request only.
Contact factory for information.
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1
SC180.....5.
Bulletin I0504J rev. C 05/01
Electrical Characteristics
Device
#
T
Max.
V
(V)
Typ. I @ 25°C Typ. I @ 125°C
Max. V @ I
F F
Package
Style
J
R
R
R
(°C)
(µA)
(mA)
(V)
SC180R015x5x
SC180S020x5x
SC180S030x5x
SC180S045x5x
SC180S060x5x
SC180H045x5x
SC180H100x5x
SC180H150x5x
125
150
150
150
150
175
175
175
15
n.a. contact factory
20
n.a. contact factory
n.a. contact factory
30
45
300
250
40
145
0.49 @ 20A
TO-247
TO-247
DO-4
60
130
35
0.53 @ 20A
0.64 @ 30A
0.77 @ 20A
45
100
150
20
13
TO-247
n.a. contact factory
Mechanical Data
Device
MetalThickness
FrontMetal
MetalThickness
#
BackMetal
SC180xxxxA5x
SC180xxxxS5x
WireBondable
Solderable
--
Al 30 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Ti 2 kÅ
Ni 1 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
Description
Minimum Order Quantity
Die in Sale Package
#
SC180xxxxx5B
SC180xxxxx5R
SC180xxxxx5P
SC180xxxxx5F
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
560
n.a.
560
560
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
2
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SC180.....5.
Bulletin I0504J rev. C 05/01
Ordering Information Table
Device Code
SC 180
H
100
S
5
B
7
1
2
3
4
5
6
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Chip Dimension in Mils
H = 830 Process
R = OR' ing Process
S = Standard Process
Process (see Electrical Characteristics Table)
Voltage code: Code = VRRM
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging(seePackagingTable)
Wafer on Film
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3
SC180.....5.
Bulletin I0504J rev. C 05/01
Wafer in Box
ROUNDCONTAINER
TYVEK DISK
FOAM DISK
Tape and Reel
CHIPTRAYPOCKET
4
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SC180.....5.
Bulletin I0504J rev. C 05/01
Die in Waffle Pack
REEL FRAME
BARE DIE CARRIER TAPE
WORLDHEADQUARTERS: 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332.
EUROPEANHEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408.
IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801.
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933.
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220.
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086.
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630.
IR TAIWAN: 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936.
http://www.irf.com
Fax-On-Demand: +44 1883 733420
Data and specifications subject to change without notice.
www.irf.com
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