Q67040-S4493 [INFINEON]

Fast Switching EmCon Diode; 快速开关EMCON二极管
Q67040-S4493
型号: Q67040-S4493
厂家: Infineon    Infineon
描述:

Fast Switching EmCon Diode
快速开关EMCON二极管

二极管 开关
文件: 总9页 (文件大小:200K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDP18E120  
IDB18E120  
Fast Switching EmCon Diode  
Product Summary  
Feature  
V
1200  
18  
V
A
V
RRM  
1200 V EmCon technology  
Fast recovery  
Soft switching  
Low reverse recovery charge  
Low forward voltage  
Easy paralleling  
I
F
V
T
1.65  
150  
F
°C  
jmax  
P-TO220-3.SMD  
P-TO220-2-2.  
Type  
Package  
Ordering Code Marking Pin 1 PIN 2 PIN 3  
Q67040-S4493  
P-TO220-3.SMD Q67040-S4387  
C
A
C
-
A
IDP18E120  
IDB18E120  
P-TO220-2-2.  
D18E120  
D18E120 NC  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Repetitive peak reverse voltage  
Continous forward current  
Symbol  
Value  
1200  
Unit  
V
A
V
RRM  
I
F
T =25°C  
31  
C
T =90°C  
19.8  
C
Surge non repetitive forward current  
I
I
78  
FSM  
FRM  
T =25°C, t =10 ms, sine halfwave  
C
p
Maximum repetitive forward current  
47  
T =25°C, t limited by T  
, D=0.5  
C
p
jmax  
W
Power dissipation  
P
tot  
T =25°C  
113  
54  
C
T =90°C  
C
-55...+150  
260  
°C  
°C  
Operating and storage temperature  
T , T  
j stg  
S
Soldering temperature  
T
1.6mm(0.063 in.) from case for 10s  
Page 1  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
-
-
1.1  
62  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
R
R
thJC  
thJA  
thJA  
-
-
-
35  
62  
-
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
µA  
V
min.  
Static Characteristics  
Reverse leakage current  
V =1200V, T =25°C  
I
R
-
-
-
-
100  
1400  
R
j
V =1200V, T =150°C  
R
j
Forward voltage drop  
V
F
I =18A, T =25°C  
-
-
1.65  
1.7  
2.15  
-
F
j
I =18A, T =150°C  
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
Reverse recovery time  
ns  
A
t
I
rr  
V =800V, I =18A, di /dt=800A/µs, T =25°C  
-
-
-
195  
280  
300  
-
-
-
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =125°C  
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =150°C  
R
F
F
j
Peak reverse current  
rrm  
V =800V, I = 18 A, di /dt=800A/µs, T =25°C  
-
-
-
20.2  
24.4  
25.3  
-
-
-
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =125°C  
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =150°C  
R
F
F
j
nC  
Reverse recovery charge  
Q
S
rr  
V =800V, I =18A, di /dt=800A/µs, T =25°C  
-
-
-
1880  
3200  
3540  
-
-
-
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =125°C  
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =150°C  
R
F
F
j
Reverse recovery softness factor  
V =800V, I =18A, di /dt=800A/µs, T =25°C  
-
-
-
5.5  
6.6  
6.7  
-
-
-
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =125°C  
R
F
F
j
V =800V, I =18A, di /dt=800A/µs, T =150°C  
R
F
F
j
Page 3  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
1 Power dissipation  
= f (T )  
2 Diode forward current  
I = f(T )  
P
tot  
C
F
C
parameter: T 150°C  
parameter: T 150°C  
j
j
35  
120  
W
A
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
25  
20  
15  
10  
5
0
25  
50  
75  
100  
150  
25  
50  
75  
100  
150  
°C  
°C  
T
T
C
C
3 Typ. diode forward current  
I = f (V )  
4 Typ. diode forward voltage  
V = f (T )  
F
F
F
j
54  
2.6  
A
V
36A  
-55°C  
25°C  
42  
36  
30  
24  
18  
12  
6
100°C  
150°C  
2.2  
2
18A  
9A  
1.8  
1.6  
1.4  
1.2  
0
0
0.5  
1
1.5  
2
3
-60  
-20  
20  
60  
100  
160  
V
°C  
V
T
F
j
Page 4  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
5 Typ. reverse recovery time  
t = f (di /dt)  
6 Typ. reverse recovery charge  
Q =f(di /dt)  
rr  
F
rr  
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125 °C  
R
j
R j  
1000  
4600  
nC  
ns  
36A  
18A  
4200  
4000  
3800  
3600  
3400  
3200  
3000  
2800  
2600  
2400  
2200  
2000  
1800  
800  
700  
600  
500  
400  
300  
200  
100  
36A  
18A  
9A  
9A  
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
di /dt  
A/µs  
di /dt  
F
F
7 Typ. reverse recovery current  
8 Typ. reverse recovery softness factor  
S = f(di /dt)  
I = f (di /dt)  
rr  
F
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125°C  
R
j
R j  
30  
18  
A
36A  
18A  
9A  
14  
12  
10  
8
36A  
18A  
9A  
20  
15  
10  
5
6
4
2
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
di /dt  
A/µs  
di /dt  
F
F
Page 5  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
9 Max. transient thermal impedance  
= f (t )  
Z
thJC  
p
parameter : D = t /T  
p
IDP18E120  
10 1  
K/W  
10 0  
10 -1  
10 -2  
10 -3  
D = 0.50  
0.20  
0.10  
0.05  
single pulse  
10 -4  
0.02  
0.01  
10 -5  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
t
p
Page 6  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
TO-220-2-2  
A
N
P
dimensions  
[mm]  
[inch]  
min max  
symbol  
E
min  
9.70  
15.30  
0.65  
3.55  
2.60  
9.00  
13.00  
17.20  
4.40  
0.40  
max  
D
A
B
C
D
E
F
G
H
J
K
L
M
N
P
T
10.10 0.3819 0.3976  
15.90 0.6024 0.6260  
U
0.85  
3.85  
3.00  
9.40  
0.0256 0.0335  
0.1398 0.1516  
0.1024 0.1181  
0.3543 0.3701  
V
B
H
F
14.00 0.5118 0.5512  
17.80 0.6772 0.7008  
W
4.80  
0.60  
1.05 typ.  
0.1732 0.1890  
0.0157 0.0236  
0.41 typ.  
J
2.54 typ.  
4.4 typ.  
0.1 typ.  
0.173 typ.  
X
L
1.10  
1.40  
0.0433 0.0551  
0.095 typ.  
G
2.4 typ.  
6.6 typ.  
13.0 typ.  
7.5 typ.  
U
V
W
X
0.26 typ.  
0.51 typ.  
0.295 typ.  
0.00  
0.40  
0.0000 0.0157  
T
C
M
K
Page 7  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
TO-220-3-45 (P-TO220SMD)  
dimensions  
[mm]  
[inch]  
max  
10.00 0.3858 0.3937  
symbol  
min  
9.80  
max  
min  
A
B
C
D
E
F
G
H
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
1.3 typ.  
0.0512 typ.  
1.25  
0.95  
1.75  
1.15  
0.0492 0.0689  
0.0374 0.0453  
0.1 typ.  
2.54 typ.  
0.72  
0.85  
0.0283 0.0335  
0.2 typ.  
5.08 typ.  
4.30  
1.28  
9.00  
2.30  
4.50  
1.40  
9.40  
2.50  
0.1693 0.1772  
0.0504 0.0551  
0.3543 0.3701  
0.0906 0.0984  
0.5551 typ.  
14.1 typ.  
0.00  
3.30  
0.20  
3.90  
0.0000 0.0079  
0.1299 0.1535  
max  
max  
1.70  
0.50  
2.50  
0.65  
0.0669 0.0984  
0.0197 0.0256  
0.4252 typ.  
10.8 typ.  
1.35 typ.  
6.43 typ.  
4.60 typ.  
9.40 typ.  
16.15 typ.  
0.0532 typ.  
0.2532 typ.  
0.1811 typ.  
0.3701 typ.  
0.6358 typ.  
Page 8  
Rev.2  
2003-07-31  
IDP18E120  
IDB18E120  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 9  
Rev.2  
2003-07-31  

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