MA000107828 [INFINEON]
Material Content Data Sheet;
| 型号： | MA000107828 |
| 厂家： | 
Infineon |
| 描述： | Material Content Data Sheet |
| 文件： | 总1页 (文件大小：28K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Material Content Data Sheet
Sales Product Name SAB-C165-LM HA
Issued
29. August 2013
1786.70 mg
MA#
MA000725042
Package
PG-MQFP-100-2
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
17.388
0.538
0.97
0.03
0.13
0.60
19.30
0.18
0.39
11.22
65.76
1.09
0.10
0.06
0.17
0.97
9732
301
9732
leadframe
magnesium
silicon
2.331
1304
nickel
10.756
344.917
3.175
6020
copper
20.06
0.18
193047
1777
200672
1777
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
6.911
3868
200.412
1174.831
19.520
1.857
112169
657542
10925
1040
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
77.37
1.09
0.10
773579
10925
1040
leadfinish
plating
glue
silver
plastics
epoxy resin
silver
1.016
569
noble metal
7440-22-4
3.048
0.23
1706
2275
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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