IRLR8103PBF [INFINEON]

Power Field-Effect Transistor, 89A I(D), 30V, 0.0085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3;
IRLR8103PBF
型号: IRLR8103PBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 89A I(D), 30V, 0.0085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3

开关 脉冲 晶体管
文件: 总4页 (文件大小:38K)
中文:  中文翻译
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PD - 93838  
PD - 93839  
IRLR8103/IRLR8503  
Provisional Data Sheet  
HEXFET® Chipset for DC-DC Converters  
• N-Channel Application-Specific MOSFETs  
• Ideal for CPU Core DC-DC Converters  
• Low Conduction Losses  
D
• Low Switching Losses  
• Minimizes Parallel MOSFETs for high current  
applications  
Description  
G
These new devices employ advanced HEXFET® power  
MOSFET technology to achieve an unprecedented balance  
of on-resistance and gate charge.The reduced conduction  
and switching losses make them ideal for high efficiency  
DC-DC converters that power the latest generation of  
microprocessors.  
D-Pak  
S
Both the IRLR8103 and IRLR8503 have been optimized  
and are 100% tested for all parameters that are critical in  
synchronous buck converters including RDS(on), gate charge  
and Cdv/dt-induced turn-on immunity.The IRLR8103 offers  
particulary low RDS(on) and high Cdv/dt immunity for  
synchronous FET applications.The IRLR8503 offers an  
extremely low combination of Qsw & RDS(on) for reduced  
losses in control FET applications.  
DEVICE RATINGS (typ.)  
IRLR8103 IRLR8503  
VDS  
RDS  
QG  
30V  
30V  
6 mΩ  
12 mΩ  
15 nC  
5.4 nC  
23 nC  
(on)  
45 nC  
20.3 nC  
23 nC  
Qsw  
The package is designed for vapor phase, infrared,  
convection, or wave soldering techniques. Power  
dissipation of greater than 80W is possible in a typical PCB  
mount application.  
Qoss  
Absolute Maximum Ratings  
Parameter  
Symbol  
IRLR8103  
IRLR8503  
Units  
Drain-Source Voltage  
VDS  
VGS  
ID  
30  
V
Gate-Source Voltage  
±20  
Continuous Drain or Source TA = 25°C  
89ꢀ  
61ꢀ  
350  
89  
49ꢀ  
34ꢀ  
196  
62  
Current (VGS 10V)  
Pulsed Drain Current  
Power Dissipation  
TL = 90°C  
A
IDM  
PD  
TA = 25°C  
TL = 90°C  
W
42  
30  
Junction & Storage Temperature Range  
Continuous Source Current (Body Diode)  
Pulsed Source Current  
TJ,TSTG  
IS  
–55 to 150  
°C  
A
89ꢀ  
49ꢀ  
ISM  
350  
196  
Thermal Resistance  
Parameter  
Max.  
Units  
°C/W  
°C/W  
Maximum Junction-to-Ambient PCBƒ  
Maximum Junction-to-Case  
RθJA  
RθJC  
50  
1.4  
2.0  
Revised 1/13/00  
www.irf.com  
1
IRLR8103/IRLR8503  
Electrical Characteristics  
Parameter  
IRLR8103  
Min Typ Max Min Typ Max Units  
IRLR8503  
Conditions  
Drain-to-Source  
Breakdown Voltage*  
BVDSS  
RDS(ON)  
30  
30  
V
VGS = 0V, ID = 250µA  
Static Drain-Source  
6
7.0  
12  
16  
mVGS = 10V, ID = 15A‚  
mVGS = 4.5V, ID = 15A‚  
on Resistance*  
Gate Threshold Voltage*  
2.0  
7
8.5  
14  
18  
VGS(th)  
IDSS  
1.0  
V
VDS = VGS,ID = 250µA  
Drain-Source Leakage  
Current*  
30  
30  
VDS = 24V, VGS = 0  
150  
150  
µA VDS = 24V, VGS = 0,  
Tj = 100°C  
Gate-Source Leakage  
Current*  
IGSS  
±100  
±100 nA VGS = ±20V  
Total Gate Chg Cont FET*  
Total Gate Chg Sync FET*  
QG  
50  
45  
17  
15  
13  
VGS=5V, ID=15A, VDS=16V  
QG  
VGS = 5V, VDS< 100mV  
VDS = 16V, ID = 15A  
Pre-Vth  
QGS1  
3.7  
Gate-Source Charge  
Post-Vth  
QGS2  
4.3  
1.3  
nC  
Gate-Source Charge  
Gate to Drain Charge  
Switch Chg(Qgs2 + Qgd)*  
Output Charge*  
QGD  
Qsw  
Qoss  
RG  
16  
4.1  
5.4  
20.3  
23  
23  
VDS = 16V, VGS = 0  
VDD = 16V, ID = 15A  
Gate Resistance  
Turn-on Delay Time  
Rise Time  
1.5  
2.0  
td(on)  
tr  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
ns VGS = 5V  
Clamped Inductive Load  
Turn-off Delay Time  
FallTime  
td (off)  
tf  
See test diagram Fig 19.  
Input Capacitance  
Output Capacitance  
Ciss  
Coss  
pF VDS = 16V, VGS = 0  
Reverse Transfer Capacitance Crss  
Source-Drain Rating & Characteristics  
Parameter  
Min Typ Max  
Min Typ Max Units  
Conditions  
Diode Forward  
Voltage*  
VSD  
Qrr  
0.9  
1.0  
V
IS = 15A‚, VGS = 0V  
Reverse Recovery  
100  
89  
di/dt ~ 700A/µs  
Charge„  
nC VDS = 16V, VGS = 0V, IS = 15A  
Reverse Recovery  
Charge (with Parallel  
Schottky)„  
Qrr(s)  
77  
75  
di/dt = 700A/µs  
(with 10BQ040)  
VDS = 16V, VGS = 0V, IS = 15A  
Notes:  

‚
ƒ
Repetitive rating; pulse width limited by max. junction temperature.  
Pulse width 300 µs; duty cycle 2%.  
When mounted on 1 inch square copper board, t < 10 sec.  
„
Typ = measured - Qoss  
Calculated continuous current based on maximum allowable  
Junction temperature; packagle limitation current = 20A  
Devices are 100% tested to these parameters.  
*
2
www.irf.com  
IRLR8103/IRLR8503  
Package Outline  
TO-252AA Outline  
Dimensions are shown in millimeters (inches)  
2.38 (.094)  
2.19 (.086)  
6.73 (.265)  
6.35 (.250)  
1.14 (.045)  
0.89 (.035)  
- A -  
1.27 (.050)  
5.46 (.215)  
0.58 (.023)  
0.46 (.018)  
0.88 (.035)  
5.21 (.205)  
4
6.45 (.245)  
5.68 (.224)  
6.22 (.245)  
5.97 (.235)  
10.42 (.410)  
9.40 (.370)  
1.02 (.040)  
1.64 (.025)  
LEAD ASSIG NM ENTS  
1 - GATE  
1
2
3
0.51 (.020)  
MIN.  
2 - DRA IN  
- B -  
3 - SOURCE  
4 - DRA IN  
1.52 (.060)  
1.15 (.045)  
0.89 (.035)  
0.64 (.025)  
3X  
0.58 (.023)  
0.46 (.018)  
1.14 (.045)  
0.76 (.030)  
2X  
0.25 (.010)  
M
A M B  
NOTES:  
2.28 (.090)  
1
2
3
4
DIMENSIONING & TOLERANCING PER ANSI Y 14.5M, 1982.  
CONTROLLING DIMENSION : INCH.  
4.57 (.180)  
CONFORMS TO JEDE C OUTLINE TO-252AA.  
DIMENSIONS SHOW N ARE BEFORE SOLDER DIP,  
SOLDER DIP M AX. +0.16 (.006).  
Part Marking Information  
TO-252AA (D-PARK)  
EXAMPLE : THIS IS AN IRFR120  
W ITH ASSEM BLY  
A
INTERNATIONAL  
RECTIFIER  
LOGO  
LOT CODE 9U1P  
FIRST PORTION  
OF PART NUMBER  
IRFR  
120  
1P  
9U  
ASSEMBLY  
SECOND PORTION  
OF PART NUM BER  
LOT CODE  
www.irf.com  
3
IRLR8103/IRLR8503  
Tape & Reel Information  
TO-252AA  
TR  
TR L  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIR ECTIO N  
FEED DIR ECTIO N  
N O TES :  
1. C O NTRO LLING D IM EN SIO N : M ILLIM ETER.  
2. ALL D IM EN SIO N S ARE SH O W N IN M ILLIM ETERS ( INC HES ).  
3. O U TLINE C O N FO RM S TO EIA-481 & EIA-541.  
13 INC H  
16 m m  
NO TES :  
1. O U TLINE CO N FO RM S TO EIA-481.  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 838 4630  
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936  
http://www.irf.com/  
Data and specifications subject to change without notice.  
11/98  
4
www.irf.com  

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