IRF7103TRPBF [INFINEON]

adavanced process technology; ?????????? adavanced工艺技术
IRF7103TRPBF
型号: IRF7103TRPBF
厂家: Infineon    Infineon
描述:

adavanced process technology
?????????? adavanced工艺技术

晶体 晶体管 功率场效应晶体管 开关 光电二极管
文件: 总10页 (文件大小:309K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD -95037B  
IRF7103PbF  
HEXFET® Power MOSFET  
l Adavanced Process Technology  
l Ultra Low On-Resistance  
l Dual N-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
1
2
8
S1  
G1  
D1  
VDSS = 50V  
7
D1  
3
4
6
S2  
G2  
D2  
RDS(on) = 0.130Ω  
5
D2  
ID = 3.0A  
Top View  
l Lead-Free  
Description  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
dual-die capability making it ideal in a variety of power  
applications. With these improvements, multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
3.0  
Units  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
A
2.3  
10  
PD @TA = 25°C  
Power Dissipation  
2.0  
W
W/°C  
V
Linear Derating Factor  
0.016  
± 20  
4.5  
VGS  
Gate-to-Source Voltage  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
V/nS  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance Ratings  
Parameter  
Min.  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient „  
–––  
–––  
62.5  
°C/W  
02/09/10  
IRF7103PbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
50 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 0.049 ––– V/°C Reference to 25°C, ID = 1mA  
––– 0.11 0.13  
––– 0.16 0.20  
1.0 ––– 3.0  
––– 3.8 –––  
––– ––– 2.0  
––– ––– 25  
––– ––– 100  
––– ––– -100  
VGS = 10V, ID = 3.0A ƒ  
VGS = 4.5V, ID = 1.5A ƒ  
VDS = VGS, ID = 250µA  
VDS = 15V, ID = 3.0A ƒ  
VDS = 40V, VGS = 0V  
VDS = 40V, VGS = 0V, TJ = 55 °C  
VGS = 20V  
RDS(ON)  
Static Drain-to-Source On-Resistance  
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
µA  
nA  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = - 20V  
Qg  
Qgs  
Qgd  
td(on)  
tr  
––– 12  
30  
ID = 2.0A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
––– 1.2 –––  
––– 3.5 –––  
nC VDS = 25V  
VGS = 10V ƒ  
VDD = 25V  
––– 9.0  
––– 8.0  
––– 45  
––– 25  
20  
20  
70  
50  
RiseTime  
ID = 1.0A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
FallTime  
RG = 6.0Ω  
RD = 25ƒ  
D
S
LD  
LS  
Internal Drain Inductance  
Internal Source Inductance  
––– 4.0 –––  
––– 6.0 –––  
Between lead,6mm(0.25in.)  
nH  
pF  
G
from package and center  
of die contact  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 290 –––  
––– 140 –––  
––– 37 –––  
Output Capacitance  
VDS = 25V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFETsymbol  
D
S
IS  
––– ––– 2.0  
A
showing the  
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– 12  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
Forward Turn-On Time  
––– ––– 1.2  
––– 70 100  
––– 110 170  
V
TJ = 25°C, IS = 1.5A, VGS = 0V ƒ  
ns  
TJ = 25°C, IF = 1.5A  
Qrr  
ton  
nC di/dt = 100A/µs ƒ  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ Pulse width 300µs; duty cycle 2%.  
max. junction temperature.  
‚ ISD 1.8A, di/dt 90A/µs, VDD V(BR)DSS  
TJ 150°C  
,
„ Surface mounted on FR-4 board, t 10sec.  
IRF7103PbF  
IRF7103PbF  
IRF7103PbF  
TA, AmbientTemperature(°C)  
Fig 9. Maximum Drain Current Vs.  
AmbientTemperature  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
P
2
DM  
t
1
SINGLE PULSE  
(THERMAL RESPONSE)  
t
2
Notes:  
1. Duty factor D =  
t / t  
1
2. Peak T = P  
J
x Z  
+ T  
A
DM  
thJA  
0.1  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig11. MaximumEffectiveTransientThermalImpedance,Junction-to-Ambient  
IRF7103PbF  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
Q
G
.2µF  
.3µF  
12V  
10V  
+
Q
Q
GD  
GS  
V
DS  
D.U.T.  
-
V
G
V
GS  
3mA  
Charge  
I
I
D
G
Current Sampling Resistors  
Fig 12b. Gate Charge Test Circuit  
Fig 12a. Basic Gate Charge Waveform  
IRF7103PbF  
Peak Diode Recovery dv/dt Test Circuit  
+
ƒ
-
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
D.U.T  
+
‚
-
„
-
+

RG  
dv/dt controlled by RG  
+
-
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
VDD  
Driver Gate Drive  
P.W.  
Period  
Period  
D =  
P.W.  
*
V
=10V  
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig13. ForN-ChannelHEXFETS  
IRF7103PbF  
SO-8 Package Outline(Mosfet & Fetky)  
Dimensions are shown in milimeters (inches)  
SO-8 Part Marking Information  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
IRF7103PbF  
SO-8 Tape and Reel (Dimensions are shown in milimeters (inches))  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Consumer market.  
Qualifications Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.02/2010  
Mouser Electronics  
Authorized Distributor  
Click to View Pricing, Inventory, Delivery & Lifecycle Information:  
International Rectifier:  
IRF7103PBF IRF7103TRPBF  

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