IR3720MTRPBF [INFINEON]

Power Supply Support Circuit, Fixed, 1 Channel, 3 X 3 MM, ROHS COMPLIANT, DFN-10;
IR3720MTRPBF
型号: IR3720MTRPBF
厂家: Infineon    Infineon
描述:

Power Supply Support Circuit, Fixed, 1 Channel, 3 X 3 MM, ROHS COMPLIANT, DFN-10

光电二极管
文件: 总20页 (文件大小:308K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IR3720  
DATA SHEET  
Power Monitor IC with  
Digital I2C Interface  
FEATURES  
DESCRIPTION  
„ Accurate TruePower™ monitor  
The IR3720 measures the output voltage and inductor  
current of low-voltage DC-to-DC converters and reports  
the average power over a user specified time interval as  
a digital word on the I2C. The output current is  
measured across a current sensing resistor or indirectly  
across the inductor’s DCR winding resistance.  
Additionally, the current measurement method is also  
applicable to multiphase converters.  
Minimizes dynamic errors  
Reports voltage, current, or power  
„ Digital interface  
SMBus and I2C compatible  
„ Programmable averaging interval  
„ Flexible current sensing  
Resistive or Inductor DCR  
„ Applications  
The real time voltage and current signals are multiplied,  
digitized, and averaged over a user selectable  
averaging interval providing Patent Pending  
Synchronous rectified buck converters  
Multiphase converters  
„ 10pin 3x3 DFN lead free package  
„ RoHS compliant  
TruePower™ measurement of highly dynamic loads.  
TYPICAL APPLICATION CIRCUIT  
3.3V  
DCR  
Phase  
L
Output  
Capacitors  
VO VDD  
LOAD  
Rcs1  
Rcs2  
To system  
Controller  
Single  
Phase  
Converter  
CCS1  
CCS2  
IR3720  
I2C Bus  
2
VREF  
VCS  
RT  
GND  
Power  
Return  
GND  
ORDERING INFORMATION  
Device  
IR3720MTRPBF  
* IR3720MPBF  
Package  
10 lead DFN (3x3 mm body)  
10 lead DFN (3x3 mm body)  
Order Quantity  
3000 piece reel  
121 Piece tube  
* Samples only  
Page 1 of 20  
www.irf.com  
09/09/08  
IR3720  
DATA SHEET  
ABSOLUTE MAXIMUM RATINGS  
All voltages referenced to GND  
VDD: ................................................................3.9V  
ALERT#:...........................................................3.9V  
ALERT#..............................................<VDD + 0.3V  
EXTCLK ...........................................................3.9V  
All other Analog and Digital pins......................3.9V  
Operating Junction Temperature.... -10°C to 150oC  
Storage Temperature Range.......... -65oC to 150oC  
Thermal Impedance (θJC)............................53°C/W  
ESD Rating ............HBM Class 2 JEDEC Standard  
MSL Rating ..................................................Level 2  
Reflow Temperature ..................................... 260°C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only and functional operation of the device at these or any other conditions beyond those  
indicated in the operational sections of the specifications are not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
ELECTRICAL SPECIFICATIONS  
Unless otherwise specified, these specifications apply: VDD = 3.3V ± 5%, 0oC TJ 125oC, 0.5 VO 1.8 V, and  
operation in the system accuracy test circuit. See notes following table.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
IC SYSTEM ACCURACY  
Power accuracy,  
IC only  
RCS2 = 600 , RT = 25.5 k, VDCR = 20 mV,  
VO=1 volt, CCS2 = 1μF  
3.3  
%
Sampling frequency 512 kHz.  
Sampling interval 8 ms, 0OC TJ 85OC  
Notes 1, 2  
BIAS SUPPLY  
VDD Turn-on Threshold, VDDUP  
VDD Turn-off Threshold, VDDDN  
VDD Operating Current  
VDD Shutdown Current  
VOLTAGE REFERENCE  
VREF Voltage  
3.1  
V
V
2.4  
RT = 25.5 kΩ  
480  
17  
660  
100  
μA  
μA  
Config Reg enable bit d4=1  
RT = 25.5 kΩ  
1.4  
1.5  
1.6  
40  
V
Reference load, RT  
Note 1  
20  
25.5  
kꢀ  
VOLTAGE SENSOR  
Voltage error  
VO=1V; VDCR=0 mV, 0OC TJ 85OC  
-0.75  
0.75  
%
V
R
CS2=600 , RT=25.5 k, Note 1  
Voltage, full scale VFS  
CURRENT SENSOR  
Voltage, Current Gain, VIG  
Current range, Io x DCR  
Current error  
1.854  
1.5  
RT = 25.5 kꢀ  
V
mV  
%
RCS2=600 , RT=25.5 kꢀ  
VO=1V; VDCR=20 mV, 0OC TJ 85OC  
RCS2=600 , RT=25.5 K, Note 1  
-35  
35  
-2.4  
2.4  
Page 2 of 20  
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09/09/08  
IR3720  
DATA SHEET  
PARAMETER  
TEST CONDITION  
MIN  
435  
TYP  
512  
MAX  
UNIT  
DIGITIZER  
Internal Sampling frequency  
External Sampling frequency  
Transition time  
Driven from internal clock  
589  
1126  
50  
kHz  
kHz  
ns  
Driven from external clock  
Driven from external clock Note 1  
922  
1024  
POWER INFORMATION  
Minimum Averaging Interval  
Maximum Averaging Interval  
Config Reg [d3..d0] = b‘0000, Note 1  
Config Reg [d3..d0] = b‘1000, Note 1  
0.9  
230  
1
1.1  
282  
ms  
ms  
256  
1440  
Output Register  
Measuring power  
VO=1V; VDCR=20 mV  
RCS2=600 , RT=25.5 k, Note 1,2  
1380  
1500  
HEX  
Output Register  
Measuring power  
VO=0.5V; VDCR=20 mV  
0980  
FF40  
F740  
3DC0  
0A00  
0000  
F800  
3F80  
0A80  
00C0  
F8C0  
4000  
HEX  
HEX  
HEX  
HEX  
R
CS2=600 , RT=25.5 k, Note 1,2  
VO=1V; VDCR=0 mV  
CS2=600 , RT=25.5 k, Note 1,2  
Output Register  
Measuring power  
R
Output Register  
Measuring power  
VO=1V; VDCR=-8 mV  
RCS2=600 , RT=25.5 k, Note 1,2  
Full Scale Output Register  
Measuring power  
VO = 1.8; VDCR=35 mV  
RCS2=600 , RT=25.5 k, Note 1,2  
DIGITAL INPUT AND OUTPUT  
ALERT# pull down resistance  
SDA & SCL HIGH Level  
SDA & SCL Low Level  
SCL Input current  
Sink 3 mA  
Note 1  
250  
Ω
V
2.1  
-5  
Note 1  
0.8  
+5  
V
Note 1  
uA  
V
SDA pull down voltage  
TIMING  
Sink 4 mA Note 1  
0.4  
Maximum Frequency  
Note 1  
Note 1  
10  
400  
kHz  
us  
Bus free time between stop and  
start TBUF  
1.3  
Hold time after (repeated) start  
condition THD:STA  
Note 1  
Note 1  
0.6  
0.6  
us  
us  
Repeated start condition setup  
time TSU:STA  
Stop condition setup time TSU:STO Note 1  
0.6  
300  
100  
1.3  
0.6  
20  
us  
ns  
ns  
us  
us  
ns  
ns  
Data hold time THD:DAT  
Data setup time TSU:DAT  
Clock low period TLOW  
Clock high period THIGH  
Clock or data fall time TF  
Clock or data rise time TR  
Note 1  
Note 1  
Note 1  
Note 1  
Note 1  
Note 1  
300  
300  
20  
NOTE:  
1. Guaranteed by design, not tested in production  
2. Average of eight data samples  
Page 3 of 20  
www.irf.com  
09/09/08  
IR3720  
DATA SHEET  
SYSTEM ACCURACY TEST CIRCUIT  
VDCR  
VDD  
RCS2  
CCS2  
VCS  
VO  
VDD  
ALERT#  
EXTCLK  
ADDR  
SDA  
VO  
VDD  
Bypass  
Cap  
VREF  
SCL  
RT  
GND  
Page 4 of 20  
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09/09/08  
IR3720  
DATA SHEET  
BLOCK DIAGRAM  
IC PIN DESCRIPTION  
NAME  
VCS  
NUMBER I/O LEVEL DESCRIPTION  
1
2
Analog  
Analog  
Analog  
Current sensing input  
Voltage sensing input  
Thermistor sensing input  
IC bias supply and signal ground  
3.3V bias supply  
VO  
VREF  
GND  
3
4
VDD  
5
3.3V  
EXTCLK  
ADDR  
SCL  
6
3.3V Digital Input for optional external clock  
3.3V Digital I2C Address selection input; See Table 1 for address  
3.3V Digital I2C Clock; Input only  
3.3V Digital I2C Data; Input / Open drain output  
7
8
SDA  
9
ALERT#  
BASE PAD  
10  
3.3V Digital Programmable output function; Open drain output clamped to VDD  
Connect to pin 4  
Page 5 of 20  
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09/09/08  
IR3720  
DATA SHEET  
IC PIN FUNCTIONS  
VDD PIN  
ADDR PIN  
This pin provides operational bias current to circuits  
internal to the IR3720. Bypass it with a high quality  
ceramic capacitor to the GND pin.  
The ADDR pin is an input that establishes the I2C  
address. Valid addresses are selected by grounding,  
floating, or wiring to VDD the ADDR pin. Table 1,  
“User Selectable Addresses”, provides a mapping of  
possible selections.  
GND PIN  
This pin returns operational bias current to its source.  
It is also the reference to which the voltage VO is  
measured, and it sinks the reference current  
established by the external resistor RT.  
Table 1 User selectable addresses  
ADDR pin configuration  
I2C Address  
b’1110 000  
b’1110 010  
b’1110 110  
Low  
Open  
High  
VO PIN  
Connect this pin to the location in the circuit where  
voltage for the power calculation is desired to be  
monitored. Since it also measures DCR voltage drop  
it is critical that it be Kelvin connected to the buck  
inductor output. Power accuracy may be degraded if  
EXTCLK  
This pin is a Schmitt trigger input for an optional  
externally provided square wave clock. The duty ratio  
of this externally provided clock, if used, shall be  
between 40% and 60%. If no external clock is used,  
connect this pin to GND and the internal clock will be  
used.  
the voltage at this pin is below VOmin  
.
VCS PIN  
The average current into this pin is used to calculate  
power. A switched current source internal to the  
IR3720 will maintain the average voltage of this pin  
equal to the voltage of the VO pin.  
SCL  
SCL is the I2C clock and is capable of functioning  
with a rate as low as 10 kHz. It will continue to  
function as the rate is increased to 400 kHz. This  
device is considered a slave, and therefore uses the  
SCL as an input only.  
VREF FUNCTION  
A voltage reference internal to the IR3720 drives the  
VREF pin while the pin current is monitored and used  
to set the amplitude of the current monitor switched  
current source IREF. This pin should be connected to  
GND through a precision resistor network RT. This  
network may include provision for canceling the  
positive temperature coefficient of the buck inductor’s  
DC resistance (DCR).  
SDA  
SDA is monitored as data input during master to  
slave transactions, and is driven as data output  
during slave to master transactions as indicated in  
the Packet Protocol section to follow.  
ALERT# FUNCTION  
The ALERT# pin is a multi-use pin. During normal  
use it can be configured via the I2C as an open drain  
ALERT# pin that will be driven logic low when new  
data is available in the output register. After the  
output register has been read via the I2C the ALERT#  
will be released to its high resistance state. This pin  
can also be programmed to pull low when the output  
exceeds the programmable level.  
Page 6 of 20  
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09/09/08  
TYPICAL PERFORMANCE CHARACTERISTICS  
(System Accuracy Test Circuit, VDD=3.3 V, RCS2 = 600 , CCS2 = 1 μF, RT = 25.5 k )  
Typical error - Current Configuration  
Average of 8 samples  
Typical transfer characteristic - Power configuration  
Average of 8 samples  
8
7
6
5
4
3
2
1
0
300  
Vo = 0.5V  
Vo = 1.0V  
Vo = 1.8V  
Ideal Code  
Vo = 0.5V  
Vo = 1.0V  
Vo = 1.8V  
0
-300  
-0.035  
0.000  
0.035  
VDCR (V)  
0
0.005  
0.01  
0.015  
0.02  
DCR(V)  
0.025  
0.03  
0.035  
V
Typical error - Power Configuration  
Average of 8 samples  
8
7
6
5
4
3
2
1
0
Vo = 1.0V  
Vo = 1.8V  
0
0.005  
0.01  
0.015  
0.02  
0.025  
0.03  
0.035  
VDCR (V)  
Page 7 of 20  
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09/09/08  
FUNCTIONAL DESCRIPTION  
Please refer to the Functional Description Diagram  
below. Power flow from the buck converter is the  
product of output voltage times the current IL flowing  
through the inductor.  
The full-scale voltage that can be measured is VFS.  
The full-scale positive current that can be measured  
is  
Average power is measured with the aid of  
V
(
RCS1 +RCS2  
)
.
IG  
IFS  
=
(1)  
International Rectifier’s proprietary TruePower™  
circuit. Voltage, current, or the product of voltage Vo  
and current is digitized over the interval of interest  
and ported to the OUTPUT register. The VCS pin is  
maintained at an average voltage equal to Vo.  
RT  
DCR  
Full-scale current capability is designed by specifying  
the external circuit values of equation 1.  
The full scale power PFS that can be measured is the  
product of full-scale voltage and full scale current.  
IL  
DCR  
CCS1  
Vin  
Phase  
VO  
L
RCS1  
RCS2  
ALERT#  
Pull-up  
Resistor  
CCS2  
VCS  
VDD  
VDD  
VO  
ALERT#  
VDD  
Bypass  
Cap  
EXTCLK  
VREF  
IR3720  
ADDR  
External  
Clock  
SDA  
SCL  
RT  
GND  
Figure 1 Functional Description Diagram  
Page 8 of 20  
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09/09/08  
RESISTOR SENSING APPLICATION  
The voltage on the shunt resistor of the circuit below  
is directly proportional to the current from the source.  
Shunts developing 5 mV to 75 mV at IFS have been  
used. Accuracy is enhanced at the higher voltage.  
Select RT to be a 25.5 k1% or better initial  
RCS2 should be chosen such that this current through  
it develops the same voltage that is developed by the  
shunt at full scale current.  
C
CS2 is the integrator capacitor and should be  
between 0.1 μF and 10 μF.  
tolerance resistor. This value will sink 1.5V /RT of  
current from the VREF pin of the IR3720.  
IL  
SHUNT  
DCR  
Vin  
VO  
Phase  
L
RCS2  
CCS2  
VDD  
VCS  
VO  
VDD  
ALERT#  
VDD  
Bypass  
Cap  
EXTCLK  
ADDR  
SDA  
VREF  
IR3720  
SCL  
RT  
GND  
Figure 2 Resistor Sensing Circuit  
Page 9 of 20  
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09/09/08  
INDUCTOR DCR CURRENT SENSING APPLICATION  
Referring to the Functional Description Diagram, it  
can be seen that the shunt function can be  
accomplished by the DC resistance of the inductor  
that is already present. Omitting the resistive shunt  
reduces BOM cost and increases efficiency. In  
exchange for these two significant advantages two  
easily compensated design complications are  
introduced, a time constant and a temperature  
coefficient.  
The inductor voltage sensed between the Rcs1  
resistors is not simply proportional to the inductor  
current, but rather is expressed in the Laplace  
equation below.  
Select a standard value CCS1 that is larger than  
4L  
DCRRSUM  
. Solve for Req.  
We now know Req and Rsum, but we do not know  
the individual resistor values RCS1 or RCS2. The next  
step is to solve for them simultaneously. By  
substituting Rsum into the Req equation the following  
can be written:  
RCS1 RCS2  
Req  
=
, which can then be rearranged to  
Rsum  
L
V = Ι DCR 1+ s  
RC2S1 RCS1 Rsum +Req Rsum = 0 .  
L
L
DCR  
Note that this equation is of the form  
ax2 + bx + c = 0 where a=0, b=-Rsum, and  
This inductor time constant is canceled when  
RCS1 RCS2  
c=Req•Rsum. The roots of this quadratic equation  
will be RCS1 and RCS2. Use the higher value resistor  
as RCS1 in order to minimize ripple current in CCS1  
L
=
CCS1 .  
DCR RCS1 +RCS2  
.
RCS1 RCS2  
RCS1 +RCS2  
Let  
= Req .  
Req  
1+ 14⋅  
RSUM  
RCS1 = RSUM  
A second equation is used to set the full scale  
inductor current.  
2
and  
V
(
RCS1 + RCS2  
)
. Let  
IG  
Req  
IFS  
=
114⋅  
RT  
DCR  
RSUM  
RCS1 = RSUM  
2
RCS1 +RCS2 = Rsum and solve for Rsum.  
Page 10 of 20  
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09/09/08  
THERMAL COMPENSATION FOR INDUCTOR DCR CURRENT  
SENSING  
The positive temperature coefficient of the DCR can  
be compensated if RT varies inversely proportional to  
the DCR. DCR of a copper coil, as a function of  
temperature, is approximated by  
where Rth(T) is the thermistor resistance at some  
temperature T, Rth(T0) is the thermistor resistance at  
the reference temperature T0, and β is the material  
constant provided by the thermistor manufacturer.  
Degrees Kelvin are used in equation 3. If RS is large  
and RP is small, the curvature of the effective network  
resistance can be reduced from the curvature of the  
thermistor alone. Although the exponential equation 3  
can never compensate linear equation 2 at all  
temperatures, a spreadsheet can be constructed to  
minimize error over the temperature interval of  
interest. The resistance RT of the network shown as a  
function of temperature is  
DCR(T) = DCR(TR ) (1+ (T TR ) TCRCu ) .  
(2)  
TR is some reference temperature, usually 25 °C, and  
TCRCu is the resistive temperature coefficient of  
copper, usually assumed to be 0.0039 near room  
temperature. Note that equation 2 is linearly  
increasing with temperature and has an offset of  
DCR(TR) at the reference temperature.  
If RT incorporates a negative temperature coefficient  
thermistor then temperature effects of DCR can be  
minimized. Consider a circuit of two resistors and a  
thermistor as shown below.  
1
RT(T) = Rs +  
(4)  
1
1
+
Rp Rth(T)  
using Rth(T) from equation 3.  
Equation 1 of the last section may be rewritten as a  
new function of temperature using equations 2 and 4  
as follows:  
Rs  
V
(
RCS1 +RCS2  
DCR(T)  
)
.
IG  
IFS(T) =  
(5)  
Rp  
Rth  
RT(T)  
With Rs and Rp as additional free variables, use a  
spreadsheet to solve equation 5 for the desired full  
scale current while minimizing the IFS(T) variation  
over temperature.  
Figure 3 RT Network  
If Rth is an NTC thermistor then the value of the  
network will decrease as temperature increases.  
Unfortunately, most thermistors exhibit far more  
variation with temperature than copper wire. One  
equation used to model thermistors is  
1
1
β⋅  
Rth (T) = Rth (T0 ) e⎜  
(3)  
T
T0  
Page 11 of 20  
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09/09/08  
TYPICAL 2-PHASE DCR-SENSING APPLICATION  
The IR3720 is capable of monitoring power in a  
multiphase converter. A two-phase circuit is shown  
below. The voltage output of any phase is equal to  
that of any and every other phase, and monitored at  
VO as before.  
If DCR1=DCR2, and RCS1=RCS3, then ICS can be  
simplified to  
(IL1 + IL2 ) DCR1  
RCS1 + 2RCS2  
ICS  
=
Output current is the sum of the two inductor currents  
(IL1 + IL2). Superposition is used to derive the transfer  
function for multiphase sensing. The voltage on RCS2  
due to IL1 is  
Full scale ICS current corresponds to  
V
IG  
ICSFS  
=
RT  
(RCS2 || RCS3  
)
which yields 256 digital current counts  
(0100 0000 0000 0000).  
IL1 DCR1 ⋅  
RCS1 + (RCS2 || RCS3  
)
Full scale total inductor current is  
Likewise, the voltage on RCS2 due to IL2 is  
(RCS2 || RCS1  
RCS3 + (RCS 2 || RCS1  
V
(RCS1 + 2RCS2 )  
IG  
(IL1 +IL2 FS  
)
=
RT  
DCR  
)
IL2 DCR2 ⋅  
)
The current through RCS2 due to both inductor  
currents is ICS. From the two equations above  
IL1DCR1RCS3 + IL2DCR2RCS1  
RCS1RCS2 + RCS1RCS3 + RCS2RCS3  
ICS  
=
IL1  
3.3V  
Phase 1  
L
DCR1  
RCS1  
VO  
VDD  
Multiphase  
Converter  
CCS1  
CCS2  
RCS2  
GNIDR3720  
LOAD  
RCS3  
VCS  
Ics  
RT  
2
I2C Bus  
VREF  
Phase 2  
L
T
DCR2  
To system  
Controller  
IL2  
Power  
Return  
RTN  
Figure 4Two Phase DCR Sensing Circuit  
Page 12 of 20  
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09/09/08  
ERROR MANAGEMENT  
Component value errors external to the IR3720  
contribute to power and current measurement error.  
The power reported by the IR3720 is a function not  
only of actual power or current, but also of products  
and quotients of RT, RCS1, RCS2, DCR (or RSHUNT), as  
well as parameters internal to the IR3720. The  
tolerance of these components increases the total  
power or current error. Small signal resistors are  
typically available in 1% tolerance, but 0.1% parts are  
available. Shunts are also available at 1% or 0.1%  
tolerance. The DCR tolerance of inductors can be  
5%, but 3% are available. Fortunately, it is not typical  
that worst-case errors would systematically stack in  
one direction. It is statistically likely that a high going  
value would be paired with a low going value to  
somewhat cancel the error. Because of this,  
Quantization error occurs in digital systems because  
the full scale is partitioned into a finite number of  
intervals and the number of the interval containing  
the measured value is reported. It is not likely that the  
measured value would correspond exactly to the  
center of the interval. The error could be as large as  
half the width of the interval. With a binary word size  
of eight, full scale is partitioned into 255 intervals.  
Consider a measurement made near full scale. Any  
signal in this interval is less than ± .2% (one-half of  
100% / 256) away from the interval’s center, and  
would therefore never have more error than that due  
to quantization. On the other hand, consider a  
measurement at one-tenth full scale. One-half of an  
interval size at this level corresponds to 2% of the  
reported value! Relative quantization error increases  
as the measured value becomes small compared to  
the full-scale value.  
tolerances can be added in quadrature (RSS). As an  
example, a 3% DCR used with a 1% RT, a 1% RCS,  
and 3.3% IR3720 contributes  
Quantization error can be reduced by averaging a  
sequence of returned values.  
(0.03)2 + (0.01)2 + (0.01)2 + (0.033)2 4.7%  
error to a typical system.  
Page 13 of 20  
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09/09/08  
CONFIGURATION REGISTER  
A configuration register is maintained via the I2C  
MFR_SPECIFIC_00 command, code # D0h. The low  
order nibble (d3, d2, d1, d0) contains a binary  
number N from zero to eight. The averaging interval  
is 2N milliseconds. N defaults to zero on start up.  
The results of a configuration register change will be  
reflected in the OUTPUT REGISTER after previously  
requested operations have completed.  
BIT #  
CONFIGURATION REGISTER  
The next bit (d4) is to be used as a function enable  
bit. b’1 commands an energy saving shut down  
mode, and power on default b’0 commands fully  
functioning mode.  
d0  
d1  
d2  
Averaging interval (LSB)  
Averaging interval  
Averaging interval  
d3  
d4  
d5  
d6  
d7  
d8  
d9  
d10  
d11  
d12  
d13  
d14  
d15  
Averaging interval (MSB)  
Enable  
External clock  
d5 high enables the EXTCLK pin to receive the  
external clock signal, and default d5 low enables the  
internal clock.  
OUTPUT config (LSB)  
OUTPUT config (MSB)  
ALERT# configuration  
ALERT# threshold (LSB + 2)  
ALERT# threshold  
ALERT# threshold  
ALERT# threshold  
ALERT# threshold  
ALERT# threshold  
ALERT# threshold (MSB)  
The next two bits (d7, d6) program the output  
parameter. B’00 causes power to be measured and is  
the power on default state. B’01 causes voltage to be  
measured. B’10 causes current to be measured. B’11  
is not defined and should not be used.  
The next bit (d8) is used to configure the ALERT#  
pin. b’0 is the power on default, and commands  
ALERT# being pulled low when new data is available.  
b’1 programs the ALERT# to pull low when the  
programmable threshold level is exceeded, whether it  
is power, voltage, or current.  
Register bits (d15...d9) are the ALERT# threshold  
register. If the output register is larger than this  
register, and if (d8) is b’1, then the ALERT# pin will  
pull low. The two least significant bits of the output  
register are not represented in the ALERT# threshold  
register. d15…d9 defaults to zero on start up.  
Page 14 of 20  
www.irf.com  
09/09/08  
OUTPUT REGISTER  
The output register is loaded with a two’s compliment  
factor of voltage, current, or power, depending on the  
last request loaded into the configuration register. I2C  
“Direct Data Format” is used. The value of the output  
register is to be multiplied by a scale factor that is  
derived from equations 1 and 2 above. Maximum  
power is the product of maximum voltage and  
maximum current.  
The equations below convert digital counts to  
engineering units:  
VFS  
Voltage = counts⋅  
when configuration register  
256  
bits (d7, d6) are set to (01).  
V (RCS1 +RCS2  
256RT DCR  
)
IG  
The range of valid values is indicated in Table 2  
below.  
Current = counts⋅  
when  
configuration register bits (d7, d6) are set to (10).  
Table 2 Output Register Range of Returned  
Values  
VFS V (RCS1 +RCS2  
256RT DCR  
configuration register bits (d7, d6) are set to (00).  
)
IG  
Power = counts⋅  
when  
Parameter  
Returned value  
(twos compliment  
binary)  
0100 0000 0000 0000  
0000 0000 0000 0000  
0100 0000 0000 0000  
1100 0000 0000 0000  
0100 0000 0000 0000  
1100 0000 0000 0000  
Returned  
value  
(decimal)  
256  
0
256  
-256  
256  
-256  
FS voltage  
Zero voltage  
+FS current  
-FS current  
+FS power  
-FS power  
There is but one output register, and it holds the  
measurement type (voltage, current, or power) last  
requested by the configuration register. It is  
incumbent upon the user to establish correct  
configuration before requesting a read.  
READ_VOUT, READ_IOUT, and READ_POUT are  
equivalent in that each returns the contents of the  
same output register.  
A binary point is implicitly located to the left of the first  
six least significant figures, as in the example below.  
SYYY YYYY YY.00 0000  
BIT#  
OUTPUT REGISTER  
d15:d0  
Output variable, D0 is LSB  
The “S” above is the twos compliment sign bit, and  
the “Y’s” are the twos compliment. Six zeros pad out  
the two byte response. These padding zeros could be  
considered a factor of the slope, which is allowed by  
the Direct Data Format. The output register multiplied  
by its scale factor Kx yields the requested quantity in  
engineering units of volts, amps, or watts.  
RESERVED COMMAND  
CODES  
Command codes D2h through D5h, D7h, and D8h  
are reserved for manufacturing use only and could  
lead to undesirable device behavior.  
Page 15 of 20  
www.irf.com  
09/09/08  
PACKET PROTOCOL  
S
W
R
A
=
=
=
=
=
=
Start Condition  
Bus write (lo)  
Bus read (hi)  
Acknowledge, = 0 for ACK, =1 for NACK  
Stop Condition  
P
master to slave  
=
slave to master  
Bus Write CONFIGURATION Register  
S
S
Slave Address  
see Table 1  
W A  
Command Code  
A
A
Data Byte Low  
A
A
Data Byte High  
A P  
A P  
0
A 1 1 0 1 0 0 0 0  
d7 d6 d5 d4 d3 d2 d1 d0  
d15  
d14  
d13  
d12  
d11  
d10 d9 d8  
Bus Read CONFIGURATION Register  
Slave  
Address  
see  
Table 1  
Slave  
Address  
See  
Table 1  
S
S
W
0
A
Command Code A S  
R A  
Data Byte Low  
A
A
Data Byte High  
A P  
1 P  
d7 d6 d5 d4 d3 d2 d1 d0  
1 A  
d15 d14 d13 d12 d11 d10 d9  
d8  
d8  
d8  
d8  
A 1 1 0 1 0 0 0 0 A S  
Bus Read_VOUT (Output Register for Configuration register Data Byte Low = 01XXXXXX)  
Slave  
Address  
see  
Slave  
Address  
See  
S
S
W
0
A
Command Code A S  
R A  
1 A  
Data Byte Low  
A
A
Data Byte High  
A P  
1 P  
d7 d6 d5 d4 d3 d2 d1 d0  
d15 d14 d13 d12 d11 d10 d9  
A 1 0 0 0 1 0 1 1 A S  
Table 1  
Table 1  
Bus Read_IOUT (Output Register for Configuration register Data Byte Low = 10XXXXXX)  
Slave  
Address  
see  
Slave  
Address  
See  
S
S
W
0
A
Command Code A S  
R A  
1 A  
Data Byte Low  
A
A
Data Byte High  
A P  
1 P  
d7 d6 d5 d4 d3 d2 d1 d0  
d15 d14 d13 d12 d11 d10 d9  
A 1 0 0 0 1 1 0 0 A S  
Table 1  
Table 1  
Bus Read_POUT (Output Register for Configuration register Data Byte Low = 00XXXXXX)  
Slave  
Address  
see  
Slave  
Address  
See  
S
S
W
0
A
Command Code A S  
R A  
1 A  
Data Byte Low  
A
A
Data Byte High  
A P  
1 P  
d7 d6 d5 d4 d3 d2 d1 d0  
d15 d14 d13 d12 d11 d10 d9  
A 1 0 0 1 0 1 1 0 A S  
Table 1  
Table 1  
Page 16 of 20  
www.irf.com  
09/09/08  
PCB PAD AND COMPONENT PLACEMENT  
The figure below shows suggested pad and component placement.  
Page 17 of 20  
www.irf.com  
09/09/08  
SOLDER RESIST  
The figure below shows the suggested solder resist placement.  
Page 18 of 20  
www.irf.com  
09/09/08  
STENCIL DESIGN  
The figure below shows a suggested stencil design.  
Page 19 of 20  
www.irf.com  
09/09/08  
PACKAGE INFORMATION  
3X3 MM 10L DFN LEAD FREE  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the consumer market.  
Qualification standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.  
Page 20 of 20  
www.irf.com  
09/09/08  

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