IPP041N04N G [INFINEON]

OptiMOS™ 40V 是交换模式电源 (SMPS)中的同步整流的理想之选,例如服务器和台式机。此外,这些器件可用于电机控制变器和快速开关直流-直流转换器等广泛工业应用。;
IPP041N04N G
型号: IPP041N04N G
厂家: Infineon    Infineon
描述:

OptiMOS™ 40V 是交换模式电源 (SMPS)中的同步整流的理想之选,例如服务器和台式机。此外,这些器件可用于电机控制变器和快速开关直流-直流转换器等广泛工业应用。

开关 电机 服务器 转换器
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中文:  中文翻译
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IPP041N04N G  
IPB041N04N G  
!"#$%!&3 Power-Transistor  
Product Summary  
Features  
V DS  
40  
4.1  
80  
V
• Fast switching MOSFET for SMPS  
• Optimized technology for DC/DC converters  
• Qualified according to JEDEC1) for target applications  
R DS(on),max  
I D  
mW  
A
• N-channel, normal level  
• Excellent gate charge x R DS(on) product (FOM)  
• Very low on-resistance R DS(on)  
• 100% Avalanche tested  
• Pb-free plating; RoHS compliant  
• Halogen-free according to IEC61249-2-21  
Type  
IPB041N04N G  
IPP041N04N G  
Package  
Marking  
PG-TO263-3  
041N04N  
PG-TO220-3  
041N04N  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
V GS=10 V, T C=25 °C  
V GS=10 V, T C=100 °C  
Continuous drain current  
80  
80  
A
Pulsed drain current2)  
I D,pulse  
I AS  
T C=25 °C  
400  
80  
Avalanche current, single pulse3)  
Avalanche energy, single pulse  
Gate source voltage  
T C=25 °C  
E AS  
V GS  
I D=80 A, R GS=25 W  
60  
mJ  
V
±20  
1) J-STD20 and JESD22  
Rev. 1.2  
page 1  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
P tot  
T C=25 °C  
Power dissipation  
94  
W
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55 ... 175  
55/175/56  
°C  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
SMD version, device on PCB  
-
-
-
-
-
-
1.6  
62  
40  
K/W  
R thJA  
minimal footprint  
6 cm² cooling area4)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=0 V, I D=1 mA  
Drain-source breakdown voltage  
Gate threshold voltage  
40  
2
-
-
-
V
V GS(th)  
V DS=V GS, I D=45 µA  
4
V DS=40 V, V GS=0 V,  
T j=25 °C  
I DSS  
Zero gate voltage drain current  
-
-
0.1  
10  
1
µA  
V DS=40 V, V GS=0 V,  
T j=125 °C  
100  
I GSS  
V GS=20 V, V DS=0 V  
Gate-source leakage current  
-
-
-
10  
3.3  
1.6  
100 nA  
Drain-source on-state resistance5)  
Gate resistance  
R DS(on) V GS=10 V, I D=80 A  
4.1  
-
mW  
R G  
W
|V DS|>2|I D|R DS(on)max  
,
g fs  
Transconductance  
50  
100  
-
S
I D=80 A  
2) See figure 3 for more detailed information  
3) See figure 13 for more detailed information  
4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
5) Measured from drain tab to source pin  
Rev. 1.2  
page 2  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Dynamic characteristics  
C iss  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
-
-
-
-
-
-
-
3400  
980  
36  
4500 pF  
V GS=0 V, V DS=20 V,  
C oss  
Crss  
t d(on)  
t r  
1300  
-
f =1 MHz  
16  
-
-
-
-
ns  
3.8  
23  
V DD=20 V, V GS=10 V,  
I D=30 A, R G=1.6 W  
t d(off)  
t f  
Turn-off delay time  
Fall time  
4.8  
Gate Charge Characteristics6)  
Gate to source charge  
Gate charge at threshold  
Gate to drain charge  
Switching charge  
Q gs  
-
-
-
-
-
-
18  
10.3  
5.3  
-
-
nC  
Q g(th)  
Q gd  
-
V DD=20 V, I D=30 A,  
V GS=0 to 10 V  
Q sw  
12.5  
42  
-
Q g  
Gate charge total  
56  
-
V plateau  
Gate plateau voltage  
5.1  
V
V DS=0.1 V,  
Q g(sync)  
Gate charge total, sync. FET  
Output charge  
-
-
40  
41  
-
-
nC  
V GS=0 to 10 V  
Q oss  
V DD=20 V, V GS=0 V  
Reverse Diode  
I S  
Diode continuous forward current  
Diode pulse current  
-
-
-
-
78  
A
T C=25 °C  
I S,pulse  
400  
V GS=0 V, I F=80 A,  
T j=25 °C  
V SD  
Diode forward voltage  
-
-
0.96  
46  
1.2  
-
V
V R=20 V, I F=I S,  
di F/dt =400 A/µs  
Q rr  
Reverse recovery charge  
nC  
6) See figure 16 for gate charge parameter definition  
Rev. 1.2  
page 3  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
1 Power dissipation  
2 Drain current  
P tot=f(T C)  
I D=f(T C); V GS!10 V  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T C [°C]  
T C [°C]  
3 Safe operating area  
I D=f(V DS); T C=25 °C; D =0  
parameter: t p  
4 Max. transient thermal impedance  
Z thJC=f(t p)  
parameter: D =t p/T  
103  
101  
limited by on-state  
resistance  
1 µs  
10 µs  
100 µs  
102  
100  
0.5  
DC  
1 ms  
0.2  
0.1  
101  
10 ms  
10-1  
0.05  
0.02  
0.01  
100  
single pulse  
10-1  
10-2  
10-1  
100  
101  
102  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
V DS [V]  
t p [s]  
Rev. 1.2  
page 4  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
5 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
6 Typ. drain-source on resistance  
R DS(on)=f(I D); T j=25 °C  
parameter: V GS  
parameter: V GS  
300  
8
10 V  
5.5 V  
7
6 V  
250  
200  
150  
100  
50  
7 V  
6.5 V  
6
5
4
3
2
1
0
7 V  
6.5 V  
10 V  
6 V  
5.5 V  
5 V  
0
0
1
2
3
0
40  
80  
120  
160  
200  
V DS [V]  
I D [A]  
7 Typ. transfer characteristics  
I D=f(V GS); |V DS|>2|I D|R DS(on)max  
parameter: T j  
8 Typ. forward transconductance  
g fs=f(I D); T j=25 °C  
300  
250  
200  
150  
100  
50  
120  
100  
80  
60  
40  
20  
0
175 °C  
25 °C  
0
0
2
4
6
8
0
20  
40  
60  
80  
100  
V GS [V]  
I D [A]  
Rev. 1.2  
page 5  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
9 Drain-source on-state resistance  
10 Typ. gate threshold voltage  
R DS(on)=f(T j); I D=80 A; V GS=10 V  
V GS(th)=f(T j); V GS=V DS; I D=250 mA  
8
7
6
4
3
2
1
0
5
98 %  
4
typ  
3
2
1
0
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
T j [°C]  
11 Typ. capacitances  
12 Forward characteristics of reverse diode  
I F=f(V SD  
C =f(V DS); V GS=0 V; f =1 MHz  
)
parameter: T j  
104  
1000  
25 °C, 98%  
Ciss  
Coss  
175 °C, 98%  
103  
102  
101  
100  
25 °C  
175 °C  
10  
Crss  
1
0
0
10  
20  
V DS [V]  
30  
40  
0.5  
1
1.5  
2
V SD [V]  
Rev. 1.2  
page 6  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
13 Avalanche characteristics  
I AS=f(t AV); R GS=25 W  
parameter: T j(start)  
14 Typ. gate charge  
V GS=f(Q gate); I D=30 A pulsed  
parameter: V DD  
100  
12  
10  
8
20 V  
8 V  
25 °C  
32 V  
100 °C  
150 °C  
10  
6
4
2
1
10-1  
0
100  
101  
t AV [µs]  
102  
103  
0
10  
20  
30  
40  
50  
Q gate [nC]  
15 Drain-source breakdown voltage  
16 Gate charge waveforms  
V BR(DSS)=f(T j); I D=1 mA  
45  
40  
35  
30  
25  
20  
V GS  
Q g  
V gs(th)  
Q g(th)  
Q sw  
Q g d  
Q gate  
Q gs  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
Rev. 1.2  
page 7  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
Package Outline  
PG-TO220-3-1  
Rev. 1.2  
page 8  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
Package Outline  
PG-TO263-3  
Rev. 1.2  
page 9  
2009-12-17  
IPP041N04N G  
IPB041N04N G  
   ꢃꢄꢅ       
  ꢌꢄꢋ          ꢃꢍ  ꢄꢇ     
        ꢄꢏ       ! "ꢋ   
#  $ $    ꢌꢄꢋ          ꢃꢍ  ꢄꢇ     
 ꢃꢃ % ꢄꢐ  &ꢅ %      'ꢇ  (  
Rev. 1.2  
page 10  
2009-12-17  

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