IPB80R290C3A [INFINEON]

The CoolMOS™ C3A technology was designed to meet the growing demands of higher system voltages in the area of electric vehicles, such as PHEVs and BEV.;
IPB80R290C3A
型号: IPB80R290C3A
厂家: Infineon    Infineon
描述:

The CoolMOS™ C3A technology was designed to meet the growing demands of higher system voltages in the area of electric vehicles, such as PHEVs and BEV.

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IPB80R290C3A  
CoolMOS® Power Transistor  
Product Summary  
VDS  
800  
0.29  
91  
V
R DS(on)max  
Q g,typ  
nC  
Features  
• New revolutionary high voltage technology  
• Ultra low gate charge and ultra low effective capacitances  
• Extreme dv/dt rated  
PG-TO263-3-2  
• High peak current capability  
• Automotive AEC Q101 qualified  
• Green package (RoHS compliant)  
CoolMOS C3A designed for:  
• DC/DC converters for Automotive Applications  
Type  
Package  
Marking  
IPB80R290C3A  
PG-TO263-3-2 8R290C3A  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
T C=25 °C  
T C=100 °C  
T C=25 °C  
17  
11  
Continuous drain current  
A
Pulsed drain current1)  
51  
I D,pulse  
EAS  
EAR  
I AR  
I D=3.4 A, VDD=50 V  
I D=17 A, VDD=50 V  
Avalanche energy, single pulse  
670  
mJ  
1),2)  
1),2)  
0.5  
Avalanche energy, repetitive t AR  
17  
A
Avalanche current, repetitive t AR  
MOSFET dv /dt ruggedness  
Gate source voltage  
V
DS=0…640 V  
50  
dv /dt  
VGS  
Ptot  
V/ns  
V
±20  
static  
T C=25 °C  
227  
Power dissipation  
W
T j  
-40 ... 150  
-40 ... 150  
Operating temperature  
Storage temperature  
°C  
T stg  
Rev. 2.0  
page 1  
2009-03-24  
IPB80R290C3A  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
17  
Parameter  
Symbol Conditions  
Unit  
I S  
Continuous diode forward current  
Diode pulse current1)  
Reverse diode dv /dt 3)  
A
T C=25 °C  
I S,pulse  
51  
dv /dt  
4
V/ns  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
-
-
-
-
0.55 K/W  
62  
SMD version, device  
R thJA  
on PCB, minimal  
footprint  
Thermal resistance, junction -  
ambient  
SMD version, device  
on PCB, 6 cm2 cooling  
area4)  
-
-
35  
-
-
Soldering temperature, reflow  
soldering  
T sold  
MSL1; 10s  
260 °C  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V(BR)DSS  
VGS(th)  
V
V
GS=0 V, I D=250 µA  
DS=VGS, I D=1.0 mA  
Drain-source breakdown voltage  
Gate threshold voltage  
800  
2.1  
-
-
V
3
3.9  
V
DS=800 V, VGS=0 V,  
I DSS  
Zero gate voltage drain current  
Gate-source leakage current  
Drain-source on-state resistance  
-
-
-
-
-
25  
µA  
T j=25 °C  
I GSS  
V
V
GS=20 V, VDS=0 V  
GS=10 V, I D=11 A,  
100 nA  
R DS(on)  
0.25  
0.29  
T j=25 °C  
V
GS=10 V, I D=11 A,  
-
-
0.67  
0.85  
-
-
T j=150 °C  
R G  
Gate resistance  
Rev. 2.0  
f =1 MHz, open drain  
page 2  
2009-03-24  
IPB80R290C3A  
Values  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics  
C iss  
Input capacitance  
Output capacitance  
-
-
2300  
94  
-
-
pF  
V
GS=0 V, VDS=100 V,  
f =1 MHz  
C oss  
Effective output capacitance, energy  
related5)  
C o(er)  
-
-
72  
-
-
V
GS=0 V, VDS=0 V  
to 480 V  
Effective output capacitance, time  
related6)  
C o(tr)  
210  
t d(on)  
t r  
t d(off)  
t f  
Turn-on delay time  
Rise time  
-
-
-
-
25  
15  
72  
12  
-
-
-
-
ns  
V
V
DD=400 V,  
GS=0/10 V, I D=17 A,  
R G=4.7 Ω,  
T j = 125°C  
Turn-off delay time  
Fall time  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
12  
45  
88  
5.5  
-
nC  
Q gd  
-
117  
-
V
V
DD=640 V, I D=17 A,  
GS=0 to 10 V  
Q g  
Vplateau  
Gate plateau voltage  
V
V
Reverse Diode  
V
GS=0 V, I F=I S,  
VSD  
Diode forward voltage  
-
1
1.2  
T j=25 °C  
t rr  
Reverse recovery time  
-
-
-
550  
15  
-
-
-
ns  
µC  
A
VR=400 V, I F=I S,  
diF/dt =100 A/µs  
Q rr  
I rrm  
Reverse recovery charge  
Peak reverse recovery current  
1) Pulse width t p limited by T j,max  
51  
2) Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f.  
3) I SDI D, di /dt 200A/µs, V DClink = 400V, V peak<V (BR)DSS, T j<T jmax, identical low side and high side switch  
4)  
Device on 40mm*40mm*1.5 epoxy  
PCB FR4 with 6cm2 (one layer, 70µm  
5) C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS.  
6) C o(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS.  
Rev. 2.0  
page 3  
2009-03-24  
IPB80R290C3A  
1 Power dissipation  
2 Safe operating area  
I D=f(VDS); T C=25 °C; D =0  
parameter: t p  
Ptot=f(T C)  
102  
240  
200  
160  
120  
80  
limited by on-state  
resistance  
1 µs  
10 µs  
101  
100 µs  
1 ms  
10 ms  
DC  
100  
40  
10-1  
0
1
10  
100  
1000  
0
25  
50  
75  
100  
125  
150  
T
C [°C]  
V
DS [V]  
3 Max. transient thermal impedance  
thJC=f(t P)  
4 Typ. output characteristics  
I D=f(VDS); T j=25 °C  
Z
parameter: D=tp/T  
parameter: VGS  
100  
60  
50  
40  
30  
20  
10  
0
20 V  
10 V  
0.5  
0.2  
10-1  
0.1  
6.5 V  
6 V  
0.05  
0.02  
0.01  
5.5 V  
5 V  
single pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
0
5
10  
15  
20  
25  
t p [s]  
V
DS [V]  
Rev. 2.0  
page 4  
2009-03-24  
IPB80R290C3A  
5 Typ. output characteristics  
I D=f(VDS); T j=150 °C  
parameter: VGS  
6 Typ. drain-source on-state resistance  
DS(on)=f(I D); T j=150 °C  
R
parameter: VGS  
35  
30  
25  
20  
1.4  
20 V  
1.3  
1.2  
1.1  
1
10 V  
6 V  
5.5 V  
15  
5 V  
10  
4.5 V  
5
0.9  
4.5 V  
5 V  
4 V  
6.5 V  
6 V  
0.8  
0.7  
10 V  
20 V  
0
0
5
10  
V
15  
DS [V]  
20  
25  
0
5
10  
D [A]  
15  
20  
I
7 Drain-source on-state resistance  
8 Typ. transfer characteristics  
I D=f(VGS); |VDS|>2|I D|R DS(on)max  
parameter: T j  
R
DS(on)=f(T j); I D=11 A; VGS=10 V  
0.8  
60  
50  
40  
30  
20  
10  
0
25 °C  
0.6  
0.4  
150 °C  
typ  
0.2  
0
-60  
-20  
20  
60  
100  
140  
180  
0
2
4
6
8
10  
T j [°C]  
V GS [V]  
Rev. 2.0  
page 5  
2009-03-24  
IPB80R290C3A  
9 Typ. gate charge  
GS=f(Q gate); I D=17 A pulsed  
10 Forward characteristics of reverse diode  
I F=f(VSD  
V
)
parameter: VDD  
parameter: T j  
102  
10  
8
6
4
2
160 V  
25 °C  
640 V  
101  
150 °C  
100  
10-1  
0
0
0
0.5  
1
1.5  
2
20  
40  
60  
80  
100  
Q
gate [nC]  
V
SD [V]  
11 Avalanche energy  
12 Drain-source breakdown voltage  
E
AS=f(T j); I D=3.4 A; VDD=50 V  
V
BR(DSS)=f(T j); I D=0.25 mA  
700  
600  
500  
400  
300  
200  
100  
0
960  
920  
880  
840  
800  
760  
720  
680  
25  
50  
75  
100  
125  
150  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
T j [°C]  
Rev. 2.0  
page 6  
2009-03-24  
IPB80R290C3A  
13 Typ. capacitances  
14 Typ. Coss stored energy  
C =f(VDS); VGS=0 V; f =1 MHz  
Eoss=f(V DS)  
104  
18  
16  
14  
12  
10  
8
Ciss  
103  
Coss  
102  
6
101  
4
Crss  
2
100  
0
0
0
100  
200  
300  
DS [V]  
400  
500  
100 200 300 400 500 600 700 800  
V
V DS [V]  
Rev. 2.0  
page 7  
2009-03-24  
IPB80R290C3A  
Definition of diode switching characteristics  
Rev. 2.0  
page 8  
2009-03-24  
IPB80R290C3A  
PG-TO263-3-2: Outlines  
Rev. 2.0  
page 9  
2009-03-24  
IPB80R290C3A  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions  
or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of the device,  
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including  
without limitation warranties of noninfringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices please  
contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information  
on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the  
express written approval of Infineon Technologies, if a failure of such components can reasonably  
be expected to cause the failure of that life-support device or system, or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be  
implanted in the human body, or to support and/or maintain and sustain and/or protect human life.  
If they fail, it is reasonable to assume that the health of the user or other persons may be  
endangered.  
Rev. 2.0  
page 10  
2009-03-24  

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