IDB30E120_07 [INFINEON]

Fast Switching EmCon Diode; 快速开关EMCON二极管
IDB30E120_07
型号: IDB30E120_07
厂家: Infineon    Infineon
描述:

Fast Switching EmCon Diode
快速开关EMCON二极管

二极管 开关
文件: 总8页 (文件大小:207K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IDB30E120  
Fast Switching EmCon Diode  
Product Summary  
Feature  
V
1200  
30  
V
A
RRM  
1200 V EmCon technology  
Fast recovery  
I
F
V
T
1.65  
150  
V
F
Soft switching  
°C  
jmax  
Low reverse recovery charge  
Low forward voltage  
Easy paralleling  
PG-TO263-3-2  
2
1
* RoHS compliant  
3
Type  
Package  
Ordering Code Marking Pin 1 PIN 2 PIN 3  
IDB30E120  
PG-TO263-3-2  
-
D30E120 NC  
C
A
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
V
Repetitive peak reverse voltage  
Continous forward current  
V
1200  
RRM  
I
A
F
T =25°C  
50  
30  
C
T =90°C  
C
Surge non repetitive forward current  
I
I
102  
FSM  
FRM  
T =25°C, t =10 ms, sine halfwave  
C
p
Maximum repetitive forward current  
76.5  
T =25°C, t limited by T  
, D=0.5  
C
p
jmax  
W
Power dissipation  
P
tot  
T =25°C  
138  
66  
C
T =90°C  
C
-55...+150  
°C  
°C  
Operating and storage temperature  
T , T  
j stg  
Soldering temperature  
T
245  
S
reflow soldering, MSL1  
Page 1  
Rev.2.2  
2007-09-01  
IDB30E120  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
-
-
0.9  
62  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
R
R
R
thJC  
thJA  
thJA  
-
-
-
62  
-
2
1)  
@ 6 cm cooling area  
35  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
µA  
V
min.  
typ. max.  
Static Characteristics  
Reverse leakage current  
I
R
V =1200V, T =25°C  
-
-
-
-
100  
R
j
V =1200V, T =150°C  
2500  
R
j
Forward voltage drop  
V
F
I =30A, T =25°C  
-
-
1.65  
1.7  
2.15  
-
F
j
I =30A, T =150°C  
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
Rev.2.2  
2007-09-01  
IDB30E120  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
ns  
A
Reverse recovery time  
t
I
rr  
V =800V, I =30A, di /dt=850A/µs, T =25°C  
-
-
-
243  
355  
380  
-
-
-
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =125°C  
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =150°C  
R
F
F
j
Peak reverse current  
rrm  
V =800V, I = 30 A, di /dt=850A/µs, T =25°C  
-
-
-
23.7  
28.3  
29.5  
-
-
-
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =125°C  
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =150°C  
R
F
F
j
nC  
Reverse recovery charge  
Q
S
rr  
V =800V, I =30A, di /dt=850A/µs, T =25°C  
-
-
-
2630  
4700  
5200  
-
-
-
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =125°C  
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =150°C  
R
F
F
j
Reverse recovery softness factor  
V =800V, I =30A, di /dt=850A/µs, T =25°C  
-
-
-
6
-
-
-
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =125°C  
7.4  
7.5  
R
F
F
j
V =800V, I =30A, di /dt=850A/µs, T =150°C  
R
F
F
j
Page 3  
Rev.2.2  
2007-09-01  
IDB30E120  
1 Power dissipation  
= f (T )  
2 Diode forward current  
I = f(T )  
P
tot  
C
F
C
parameter: T 150°C  
parameter: T 150°C  
j
j
55  
140  
W
A
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
45  
40  
35  
30  
25  
20  
15  
10  
5
0
25  
50  
75  
100  
150  
25  
50  
75  
100  
150  
°C  
°C  
T
T
C
C
3 Typ. diode forward current  
I = f (V )  
4 Typ. diode forward voltage  
V = f (T )  
F
F
F
j
90  
2.4  
A
60A  
V
-55°C  
25°C  
100°C  
150°C  
70  
60  
50  
40  
30  
20  
10  
0
2
1.8  
1.6  
1.4  
1.2  
30A  
15A  
0
0.5  
1
1.5  
2
3
-60  
-20  
20  
60  
100  
160  
V
°C  
T
V
F
j
Page 4  
Rev.2.2  
2007-09-01  
IDB30E120  
5 Typ. reverse recovery time  
t = f (di /dt)  
6 Typ. reverse recovery charge  
Q =f(di /dt)  
rr  
F
rr  
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125 °C  
R
j
R
j
1100  
6500  
ns  
nC  
60A  
900  
800  
700  
600  
500  
400  
300  
200  
5500  
5000  
4500  
4000  
3500  
3000  
2500  
60A  
30A  
15A  
30A  
15A  
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
A/µs  
di /dt  
di /dt  
F
F
7 Typ. reverse recovery current  
8 Typ. reverse recovery softness factor  
S = f(di /dt)  
I = f (di /dt)  
rr  
F
F
parameter: V = 800V, T = 125°C  
parameter: V = 800V, T = 125°C  
R j  
R
j
18  
35  
A
60A  
30A  
15A  
14  
12  
10  
8
25  
20  
15  
10  
5
60A  
30A  
15A  
6
4
200 300 400 500 600 700 800  
1000  
200 300 400 500 600 700 800  
1000  
A/µs  
di /dt  
A/µs  
di /dt  
F
F
Page 5  
Rev.2.2  
2007-09-01  
IDB30E120  
9 Max. transient thermal impedance  
= f (t )  
Z
thJC  
p
parameter : D = t /T  
p
10 1  
IDP30E120  
K/W  
10 0  
10 -1  
D = 0.50  
0.20  
10 -2  
0.10  
0.05  
0.02  
10 -3  
0.01  
single pulse  
10 -4  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
t
p
Page 6  
Rev.2.2  
2007-09-01  
IDB30E120  
Page 7  
Rev.2.2  
2007-09-01  
IDB30E120  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 8  
Rev.2.2  
2007-09-01  

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