HFA30PA60CPBF [INFINEON]
Ultrafast Soft Recovery Dioe ; 超快软恢复Dioe
| 型号： | HFA30PA60CPBF |
| 厂家： | 
Infineon |
| 描述： | Ultrafast Soft Recovery Dioe |
| 文件： | 总6页 (文件大小：239K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 95685A
HFA30PA60CPbF
HEXFREDTM
Ultrafast, Soft Recovery Diode
Features
VR = 600V
2
Ultrafast Recovery
Ultrasoft Recovery
Very Low IRRM
Very Low Qrr
Specified at Operating Conditions
Lead-Free
VF(typ.)* = 1.2V
IF(AV) = 15A
Qrr (typ.)= 80nC
IRRM (typ.) = 4.0A
trr(typ.) = 19ns
1
Benefits
3
di(rec)M/dt (typ.)* = 160A/µs
Reduced RFI and EMI
Reduced Power Loss in Diode and Switching
Transistor
Higher Frequency Operation
Reduced Snubbing
Reduced Parts Count
Description
International Rectifier's HFA30PA60C is a state of the art center tap ultra fast
recovery diode. Employing the latest in epitaxial construction and advanced
processing techniques it features a superb combination of characteristics which
result in performance which is unsurpassed by any rectifier previously available.
With basic ratings of 600 volts and 15 amps per Leg continuous current, the
HFA30PA60C is especially well suited for use as the companion diode for IGBTs
and MOSFETs. In addition to ultra fast recovery time, the HEXFRED product
line features extremely low values of peak recovery current (IRRM) and does not
TO-247AC
exhibit any tendency to "snap-off" during the tb portion of recovery. The
HEXFRED features combine to offer designers a rectifier with lower noise and
significantly lower switching losses in both the diode and the switching transistor.
These HEXFRED advantages can help to significantly reduce snubbing,
component count and heatsink sizes. The HEXFRED HFA30PA60C is ideally
suited for applications in power supplies and power conversion systems (such
as inverters), motor drives, and many other similar applications where high
speed, high efficiency is needed.
Absolute Maximum Ratings (per Leg)
Parameter
Cathode-to-Anode Voltage
Max.
600
15
Units
V
VR
IF @ TC = 100°C
IFSM
Continuous Forward Current
Single Pulse Forward Current
Maximum Repetitive Forward Current
Maximum Power Dissipation
A
150
60
IFRM
PD @ TC = 25°C
74
W
C
PD @ TC = 100°C Maximum Power Dissipation
29
TJ
Operating Junction and
-55 to +150
TSTG
Storage Temperature Range
* 125°C
1
10/18/04
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HFA30PA60CPbF
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
VBR
VFM
Cathode Anode Breakdown Voltage
600
1.3 1.7
1.5 2.0
1.2 1.6
V
IR = 100µA
IF = 15A
See Fig. 1
See Fig. 2
Max Forward Voltage
V
IF = 30A
IF = 15A, TJ = 125°C
VR = VR Rated
1.0
400 1000
25 50
10
IRM
Max Reverse Leakage Current
µA
TJ = 125°C, VR = 0.8 x VR RatedD Rated
See Fig. 3
VR = 200V
CT
LS
Junction Capacitance
Series Inductance
pF
nH
Measured lead to lead 5mm from
package body
12
Dynamic Recovery Characteristics (per Leg)@ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
trr
Reverse Recovery Time
19
IF = 1.0A, dif/dt = 200A/µs, VR = 30V
trr1
42
60
ns TJ = 25°C
TJ = 125°C
See Fig. 5, 10
trr2
70 120
4.0 6.0
IF = 15A
VR = 200V
IRRM1
IRRM2
Qrr1
Qrr2
Peak Recovery Current
See Fig. 6
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
TJ = 25°C
TJ = 125°C
A
6.5
10
Reverse Recovery Charge
See Fig. 7
80 180
220 600
250
160
nC
dif/dt = 200A/µs
di(rec)M/dt1 Peak Rate of Fall of Recovery Current
di(rec)M/dt2 During tb
A/µs
See Fig. 8
Thermal - Mechanical Characteristics (per Leg)
Parameter
Lead Temperature
Min.
Typ.
0.25
6.0
Max.
300
1.7
Units
°C
Tlead
6.0
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Thermal Resistance, Junction to Ambient
Thermal Resistance, Case to Heat Sink
RthJC
0.85
40
K/W
RthJA
RthCS
12
g
Weight
Wt
0.21
(oz)
Kg-cm
lbfin
Mounting Torque
5.0
10
0.063 in. from Case (1.6mm) for 10 sec
Typical Socket Mount
Mounting Surface, Flat, Smooth and Greased
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2
HFA30PA60CPbF
100
10
1
10000
1000
100
10
T = 150°C
J
T = 125°C
J
1
0.1
T = 150°C
J
T = 25°C
J
A
0.01
T = 125°C
J
0
100
200
300
400
500
600
T = 25°C
J
Reverse Voltage - V (V)
R
Fig. 2 - Typical Reverse Current vs. Reverse
Voltage, (per Leg)
A
100
T = 25°C
J
A
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Forward Voltage Drop - V ( V )
FM
A
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current,
(per Leg)
10
0
100
200
300
400
500
600
Reverse Voltage - V (V)
R
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage, (per Leg)
10
1
D = 0.50
0.20
0.10
0.05
P
2
DM
0.1
t
1
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
t
2
Notes:
1. Duty factor D =t / t
1
2. Peak T = P
x Z
+ T
C
J
DM
thJC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t , Rectangular Pulse Duration (sec)
1
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics, (per Leg)
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3
HFA30PA60CPbF
100
25
20
15
10
5
VR= 200V
TJ = 125°C
TJ = 25°C
I
I
I
= 30A
= 15A
= 5.0A
F
F
F
80
60
40
20
0
I
I
= 30A
= 15A
F
F
I
= 5.0A
F
VR = 200V
TJ = 125°C
TJ = 25°C
A
A
0
100
100
1000
1000
di /dt - (A/µs)
f
di /dt - (A/µs)
f
Fig. 6 - Typical Recovery Current vs. dif/dt,
Fig. 5 - Typical Reverse Recovery Time vs.
(per Leg)
dif/dt, (per Leg)
10000
800
VR= 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
600
I
I
= 30A
= 15A
= 5.0A
F
F
I
I
I
= 30A
= 15A
= 5.0A
F
F
F
I
F
1000
400
200
0
A
A
100
100
1000
100
1000
di /dt - (A/µs)
f
di /dt - (A/µs)
f
Fig. 7 - Typical Stored Charge vs. dif/dt,
Fig. 8 - Typical di(rec)M/dt vs. dif/dt,
(per Leg)
(per Leg)
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4
HFA30PA60CPbF
3
t
rr
I
F
t
t
a
b
0
REVERSE RECOVERY CIRCUIT
4
Q
rr
V
= 200V
2
R
I
0.5
RRM
I
RRM
5
di(rec)M/dt
Ω
0.01
0.75 I
RRM
L = 70µH
1
di /dt
f
D.U.T.
4. Qrr - Area under curve defined by trr
1. dif/dt - Rate of change of current
through zero crossing
D
and IRRM
dif/dt
trr X IRRM
ADJUST
IRFP250
G
Qrr
=
2. IRRM - Peak reverse recovery current
2
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
S
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and
Fig. 9 - Reverse Recovery Parameter Test
Definitions
Circuit
Ordering Information Table
Device Code
HF
A
30 PA 60
C
2
4
5
6
1
3
1
2
-
-
HexfredFamily
ProcessDesignator
A
= subs. elec. irrad.
= subs. Platinum
B
3
4
5
6
-
-
-
-
Current Rating
PackageOutline
VoltageRating
Configuration
(30 = 30A)
(PA = TO-247, 3 pins)
(60 = 600V)
(C = CenterTapCommonCathode)
Note: PbF suffix at the end of the part number indicates Lead-Free
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5
HFA30PA60CPbF
TO-247AC Package Outline
TO-247AC Part Marking Information
P AR T N U M B E R
D AT E CO D E
IN T E R N AT IO N AL
R E C T IF IE R
L O G O
H F A1 6 P A6 0 C
P 0 3 5 H
E X AM P L E : T H IS IS A H F A1 6 P A6 0 C
W IT H AS S E M B L Y
5 6
5 7
L O T CO D E 5 6 5 7
AS S E M B L E D O N W W 3 5 , 2 0 0 0
IN AS S E M B L Y L IN E "H "
AS S E M B L Y
L O T C O D E
P
=
L E AD -F R E E
Y E AR 2 0 0 0
W E E K 3 5
L IN E
0
=
N ote: "P " in the beginning of date code
indicates "L ead-F ree"
H
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.10/04
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6
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