FF450R08A03P2 [INFINEON]
Double Side Cooled;型号: | FF450R08A03P2 |
厂家: | Infineon |
描述: | Double Side Cooled |
文件: | 总13页 (文件大小:777K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DoubleꢀSideꢀCooledꢀModule
FF450R08A03P2
FinalꢀDataꢀSheet
V3.0,ꢀ2020-05-11
AutomotiveꢀHighꢀPower
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription
VCES = 750 V
IC = 450 A
TypicalꢀApplications
Description
• AutomotiveꢀApplications
• HybridꢀElectricalꢀVehiclesꢀ(H)EV
The HybridPACKTM DSC S2 is a very compact
half-bridge module targeting hybrid and electric
vehicles.
• Optimized for automotive applications with DC link
voltages up to 450 V and gate driver voltage level
ofꢀ-8ꢀVꢀ/ꢀ+15ꢀV
The module is based on Infineon’s long-term
experience developing IGBT power modules and
implements the EDT2 IGBT generation, which is an
automotive Micro-Pattern Trench-Field-Stop cell
design optimized for electric drive train applications.
The chipset has benchmark current density
combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve System
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz. Additionally,
on-die integrated current sensor and temperature
sensor allow precise monitoring of IGBT state.
These features enable enhanced protection and
intelligent control of the system.
ElectricalꢀFeatures
• IntegratedꢀCurrentꢀSensor
• IntegratedꢀTemperatureꢀSensor
• LowꢀInductiveꢀDesign
• Blockingꢀvoltageꢀ750V
• LowꢀSwitchingꢀLosses
• Short-time extended Operation Temperature
Tvjꢀopꢀ=ꢀ175°C
MechanicalꢀFeatures
• 2.5kVꢀACꢀ1minꢀInsulation
• Doubleꢀsidedꢀcooling
• Compactꢀdesign
The innovative and small package is designed for
Double Sided Cooling (DSC) with superior thermal
performance. The low stray inductance and
increased blocking voltage support the design of
systems with a very high efficiency. Furthermore,
new material combinations and assembly
technologies enable best thermal and electrical
performance at highest reliability and mechanical
robustness.
• RoHSꢀcompliant
ProductꢀName
OrderingꢀCode
SP001630036
FF450R08A03P2
Final Data Sheet
2
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
2ꢀꢀꢀꢀꢀIGBT,Inverter
2.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues
Parameter
Conditions
Symbol
VCES
ICN
Value
750
Unit
V
Collector-emitterꢀvoltage
Tvj = 25°C
Implementedꢀcollectorꢀcurrent
ContinuousꢀDCꢀcollectorꢀcurrent
Repetitiveꢀpeakꢀcollectorꢀcurrent
Totalꢀpowerꢀdissipation
450
A
TC = 120°C, Tvj max = 175°C
tP = 1 ms
IC nom
ICRM
300
A
900
A
TC = 25°C, Tvj max = 175°C
Ptot
1667
+/-20
W
V
Gate-emitterꢀpeakꢀvoltage
VGES
2.2ꢀꢀꢀꢀCharacteristicꢀValues
min. typ. max.
Collector-emitterꢀsaturationꢀvoltage
IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
IC = 300 A, VGE = 15 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1.20 1.44
1.27
1.29
VCE sat
V
Gateꢀthresholdꢀvoltage
Gateꢀcharge
IC = 4.85 mA, VCE = VGE
Tvj = 25°C
VGEth
QG
4.90 5.80 6.50
V
µC
Ω
VGE = -8 V ... 15 V, VCE = 400V
2.15
2.0
Internalꢀgateꢀresistor
Tvj = 25°C
Tvj = 25°C
Tvj = 25°C
Tvj = 25°C
Tvj = 25°C
RGint
Cies
Cres
ICES
IGES
Inputꢀcapacitance
f = 1 MHz, VCE = 25 V, VGE = 0 V
f = 1 MHz, VCE = 25 V, VGE = 0 V
VCE = 450 V, VGE = 0 V
38.5
0.18
0.1
nF
nF
mA
nA
Reverseꢀtransferꢀcapacitance
Collector-emitterꢀcut-offꢀcurrent
Gate-emitterꢀleakageꢀcurrent
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload
VCE = 0 V, VGE = 20 V
400
IC = 300 A, VCE = 400 V
VGE = -8/+15 V
RGon = 3.6 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.34
0.36
0.36
td on
µs
µs
µs
µs
mJ
Riseꢀtime,ꢀinductiveꢀload
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload
Fallꢀtime,ꢀinductiveꢀload
Turn-onꢀenergyꢀlossꢀperꢀpulse
Turn-offꢀenergyꢀlossꢀperꢀpulse
SCꢀdata
IC = 300 A, VCE = 400 V
VGE = -8/+15 V
RGon = 3.6 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.06
0.07
0.07
tr
IC = 300 A, VCE = 400 V
VGE = -8/+15 V
RGoff = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.48
0.54
0.56
td off
IC = 300 A, VCE = 400 V
VGE = -8/+15 V
RGoff = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.07
0.12
0.13
tf
IC = 300 A, VCE = 400 V, LS = 25 nH
VGE = -8/+15 V, di/dt = 3400 A/µs (Tvj = 175°C)Tvj = 150°C
RGon = 3.6 Ω
Tvj = 25°C
11.5
13.5
14.5
Eon
Eoff
Tvj = 175°C
IC = 300 A, VCE = 400 V, LS = 25 nH
VGE = -8/+15 V, du/dt = 3200 V/µs (Tvj = 175°C)Tvj = 150°C
RGoff = 2.4 Ω
Tvj = 25°C
12.0
15.5
17.0
mJ
A
Tvj = 175°C
VGE ≤ 15 V, VCC = 400 V
VCEmax = VCES -LsCE ·di/dt
ISC
tP ≤ 3 µs, Tvj = 175°C
2000
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink
perꢀIGBT
perꢀIGBT
RthJC
0.0901) K/W
0.1001)
λ
Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)
RthCH
K/W
ClampingꢀForceꢀFꢀ=ꢀ700N
Temperatureꢀunderꢀswitchingꢀconditions
top continuous
-40
150
150
°C
for 10s within a period of 30s, occurrence maximum 3000
times over lifetime
Tvj op
175
1) with double sided cooling, evaluation according to HybridPACK cool application note
Final Data Sheet
3
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
3ꢀꢀꢀꢀꢀDiode,ꢀInverter
3.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues
Parameter
Conditions
Symbol
VRRM
IFN
Value
750
Unit
V
Repetitiveꢀpeakꢀreverseꢀvoltage
Implementedꢀforwardꢀcurrent
ContinuousꢀDCꢀforwardꢀcurrent
Repetitiveꢀpeakꢀforwardꢀcurrent
I²tꢀ-ꢀvalue
Tvj = 25°C
450
A
IF
300
A
tP = 1 ms
IFRM
I²t
900
A
VR = 0 V, tP = 10 ms, Tvj = 150°C
8500
A²s
3.2ꢀꢀꢀꢀCharacteristicꢀValues
min. typ. max.
Forwardꢀvoltage
IF = 300 A, VGE = 0 V
IF = 300 A, VGE = 0 V
IF = 300 A, VGE = 0 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1.55 1.83
1.45
1.40
VF
IRM
Qr
V
A
Peakꢀreverseꢀrecoveryꢀcurrent
Recoveredꢀcharge
IF = 300 A, - diF/dt = 3400 A/µs (Tvj = 175°C) Tvj = 25°C
VR = 400 V
VGE = -8 V
170
235
250
Tvj = 150°C
Tvj = 175°C
IF = 300 A, - diF/dt = 3400 A/µs (Tvj = 175°C) Tvj = 25°C
VR = 400 V
VGE = -8 V
12.0
26.0
31.0
Tvj = 150°C
Tvj = 175°C
µC
mJ
Reverseꢀrecoveryꢀenergy
IF = 300 A, - diF/dt = 3400 A/µs (Tvj = 175°C) Tvj = 25°C
2.90
6.60
8.00
VR = 400 V
VGE = -8 V
Tvj = 150°C
Tvj = 175°C
Erec
RthJC
RthCH
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink
perꢀdiode
perꢀdiode
0.1451) K/W
K/W
0.1401)
λ
Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)
ClampingꢀForceꢀFꢀ=ꢀ700N
Temperatureꢀunderꢀswitchingꢀconditions
top continuous
-40
150
150
°C
for 10s within a period of 30s, occurrence maximum 3000
times over lifetime
Tvj op
175
4ꢀꢀꢀꢀꢀModule
Parameter
Conditions
Symbol
Value
2.5
Unit
Isolationꢀtestꢀvoltage
Materialꢀofꢀmoduleꢀbaseplate
Internalꢀisolation
RMS, f = 50 Hz, t = 1 min.
VISOL
ꢀ
ꢀ
ꢀ
ꢀ kV
Cu
ꢀ
ꢀ
basicꢀinsulationꢀ(classꢀ1,ꢀIECꢀ61140)
Al2O3
Creepageꢀdistance
terminalꢀtoꢀheatsink
terminalꢀtoꢀterminal
dCreep
ꢀ
ꢀ mm
3.5
Clearance
terminalꢀtoꢀheatsink
terminalꢀtoꢀterminal
dClear
CTI
ꢀ
ꢀ
ꢀ mm
3.5
Comperativeꢀtrackingꢀindex
> 600
ꢀ
min. typ. max.
15
Strayꢀinductanceꢀmodule
Storageꢀtemperature
Terminalꢀconnectionꢀtorque
Mounting force per clamp
Weight
LsCE
Tstg
M
nH
-40
125 °C
Nm
ScrewꢀM5
-
-
F
750
N
g
G
31
5ꢀꢀꢀꢀꢀTemperatureꢀSensor
Parameter
Conditions
Symbol Min Typ Max Unit
Forwardꢀvoltage
ITS = 0.22 mA, Tvj = 25°C
ITS = 0.22 mA
VTS 2.2202) 2.280 2.3402)
V
temperatureꢀcoefficientꢀ(tcr)
TCTS -5.50
mV/K
1) with double sided cooling, evaluation according to HybridPACK cool application note
2) Verified by design, not by test
Final Data Sheet
4
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
6ꢀꢀꢀꢀꢀCurrentꢀSensor
Parameter
Conditions
Symbol Min Typ Max Unit
Outputꢀvoltage
VCE = 1.85 V, IC = 900 A
Rsense = 2.40 Ω, Tvj = 25°C
VGE = 15 V
Vsense
0.55
V
7ꢀꢀꢀꢀꢀCustomized
min. typ. max.
Current Sensor
Output Current
IC = 100 A, Tvj = 175°C, evaluation according to
HybridPACKTM DSC application note
Ics
80
100
120 mA
Final Data Sheet
5
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
8ꢀꢀꢀꢀꢀCharacteristicsꢀDiagrams
outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
ICꢀ=ꢀfꢀ(VCE
ICꢀ=ꢀfꢀ(VCE
)
)
VGEꢀ=ꢀ15ꢀV
Tvjꢀ=ꢀ175°C
900
900
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
VGE = 19V
VGE = 17V
VGE = 15V
VGE = 13V
VGE = 11V
VGE = 9V
800
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4
0,0
0,5
1,0
1,5
2,0
VCE [V]
2,5
3,0
3,5
4,0
VCE [V]
transferꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
switchingꢀlossesꢀIGBT,Inverterꢀ(typical)
ICꢀ=ꢀfꢀ(VGE
)
Eonꢀ=ꢀfꢀ(IC),ꢀEoffꢀ=ꢀfꢀ(IC)
VCEꢀ=ꢀ20ꢀV
VGEꢀ=ꢀ-8ꢀ/ꢀ+15ꢀV,ꢀRGonꢀ=ꢀ3.6ꢀΩ,ꢀRGoffꢀ=ꢀ2.4ꢀΩ,ꢀVCEꢀ=ꢀ400ꢀV
900
40
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
Eoff, Tvj = 175°C
800
700
600
500
400
300
200
100
35
30
25
20
15
10
5
0
5
0
6
7
8
9
10
11
12
13
0
100
200
300
IC [A]
400
500
600
VGE [V]
Final Data Sheet
6
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
switchingꢀlossesꢀIGBT,Inverterꢀ(typical)
Eonꢀ=ꢀfꢀ(RG),ꢀEoffꢀ=ꢀfꢀ(RG)
transientꢀthermalꢀimpedanceꢀIGBT,Inverterꢀ
ZthJHꢀ=ꢀfꢀ(t)
VGEꢀ=ꢀ-8ꢀ/ꢀ+15ꢀV,ꢀICꢀ=ꢀ300ꢀA,ꢀVCEꢀ=ꢀ400ꢀV
30
1
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
Eoff, Tvj = 175°C
ZthJH : IGBT
25
20
15
10
0,1
0,01
i:
1
2
3
4
ri[K/W]: 0,007845 0,02284 0,08379 0,06864
τi[s]:
0,0003479 0,013
0,1423 0,5561
0,001
2
4
6
8
10
12
0,001
0,01
0,1
t [s]
1
10
RG [Ω]
reverseꢀbiasꢀsafeꢀoperatingꢀareaꢀIGBT,Inverterꢀ(RBSOA)
ICꢀ=ꢀfꢀ(VCE
forwardꢀcharacteristicꢀofꢀDiode,ꢀInverterꢀ(typical)
IFꢀ=ꢀfꢀ(VF)
)
VGEꢀ=ꢀ±15ꢀV,ꢀRGoffꢀ=ꢀ2.4ꢀΩ,ꢀTvjꢀ=ꢀ175°C
1000
900
Ic, Modul
Tvj = 25°C
IC, Chip
Tvj = 150°C
Tvj = 175°C
900
800
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
0
100
200
300
400
VCE [V]
500
600
700
800
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4
VF [V]
Final Data Sheet
7
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)
Erecꢀ=ꢀfꢀ(IF)
switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)
Erecꢀ=ꢀfꢀ(RG)
RGonꢀ=ꢀ3.6ꢀΩ,ꢀVCEꢀ=ꢀ400ꢀV
IFꢀ=ꢀ300ꢀA,ꢀVCEꢀ=ꢀ400ꢀV
12
12
10
8
Erec, Tvj = 150°C
Erec, Tvj = 175°C
Erec, Tvj = 150°C
Erec, Tvj = 175°C
10
8
6
6
4
4
2
2
0
0
0
100
200
300
IF [A]
400
500
600
2
3
4
5
6
7
8
9
10
RG [Ω]
transientꢀthermalꢀimpedanceꢀDiode,ꢀInverterꢀ
ZthJHꢀ=ꢀfꢀ(t)
1
ZthJH : Diode
0,1
0,01
i:
ri[K/W]: 0,01463
τi[s]: 0,0003128 0,01194 0,119 0,4694
1
2
3
4
0,03657 0,1284 0,09856
0,001
0,001
0,01
0,1
t [s]
1
10
Final Data Sheet
8
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
9ꢀꢀꢀꢀꢀCircuitꢀdiagram
P in Numbe r
S ymbol
P
I/O
Function
1
DC Supply (+)
DC Supply (-)
AC Output
Input
Positive Supply
2
N
Negative Supply
3
U
U Phase Output
4
T+L
T-L
EL
Temperature Sensor Plus Low Side
Temperature Sensor Minus Low Side
IGBT Emitter Output Low Side
IGBT Current Sensor Output Low Side
Gate Input Low Side
5
Output
Output
Output
Input
6
7
CSL
GL
8
9
T+H
T-H
EH
Input
Temperature Sensor Plus High Side
Temperature Sensor Minus High Side
IGBT Emitter Output High Side
IGBT Current Sensor output High Side
Gate Input High Side
10
11
12
13
14
Output
Output
Output
Input
CSH
GH
PS
Output
P-Terminal Voltage Sensing / IGBT Collector Output
Final Data Sheet
9
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
10ꢀꢀꢀꢀꢀPackageꢀoutlines
Final Data Sheet
10
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
RevisionꢀHistory
Major changes since previous revision
Revision History
Reference
V2.0
Date
Description
2018-12-06
2020-04-16
2020-05-11
-
V2.1
Correction of package outlines
Final datasheet
V3.0
Final Data Sheet
11
V3.0,ꢀꢀ2020-05-11
FF450R08A03P2
DoubleꢀSideꢀCooledꢀModule
Termsꢀ&ꢀConditionsꢀofꢀusage
ꢀ
Editionꢀ2018-08-01
Publishedꢀby
InfineonꢀTechnologiesꢀAG
81726ꢀMunich,ꢀGermany
©ꢀ2018ꢀInfineonꢀTechnologiesꢀAG
AllꢀRightsꢀReserved.
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productꢀrequirementsꢀandꢀreliabilityꢀtesting.
InfineonꢀTechnologiesꢀcomponentsꢀmayꢀbeꢀusedꢀinꢀspecialꢀapplicationsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies.ꢀClass
IIIꢀmedicalꢀdevicesꢀareꢀintendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀthey
fail,ꢀitꢀisꢀreasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.
Trademarks
ꢀ
TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG
AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCIPURSE™,ꢀEconoPACK™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,
DI-POL™,ꢀEasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPIM™,ꢀEconoPACK™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,
HybridPACK™,ꢀI²RF™,ꢀISOFACE™,ꢀIsoPACK™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,
PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPRO-SIL™,ꢀPROFET™,ꢀRASIC™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSINDRION™,
SIPMOS™,ꢀSmartLEWIS™,ꢀSOLIDꢀFLASH™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.
OtherꢀTrademarks
AdvanceꢀDesignꢀSystem™ꢀ(ADS)ꢀofꢀAgilentꢀTechnologies,ꢀAMBA™,ꢀARM™,ꢀMULTI-ICE™,ꢀKEIL™,ꢀPRIMECELL™,ꢀREALVIEW™,ꢀTHUMB™,
µVision™ꢀofꢀARMꢀLimited,ꢀUK.ꢀAUTOSAR™ꢀisꢀlicensedꢀbyꢀAUTOSARꢀdevelopmentꢀpartnership.ꢀBluetooth™ꢀofꢀBluetoothꢀSIGꢀInc.ꢀCAT-iq™ꢀof
DECTꢀForum.ꢀCOLOSSUS™,ꢀFirstGPS™ꢀofꢀTrimbleꢀNavigationꢀLtd.ꢀEMV™ꢀofꢀEMVCo,ꢀLLCꢀ(VisaꢀHoldingsꢀInc.).ꢀEPCOS™ꢀofꢀEpcosꢀAG.
FLEXGO™ꢀofꢀMicrosoftꢀCorporation.ꢀFlexRay™ꢀisꢀlicensedꢀbyꢀFlexRayꢀConsortium.ꢀHYPERTERMINAL™ꢀofꢀHilgraeveꢀIncorporated.ꢀIEC™ꢀof
CommissionꢀElectrotechniqueꢀInternationale.ꢀIrDA™ꢀofꢀInfraredꢀDataꢀAssociationꢀCorporation.ꢀISO™ꢀofꢀINTERNATIONALꢀORGANIZATION
FORꢀSTANDARDIZATION.ꢀMATLAB™ꢀofꢀMathWorks,ꢀInc.ꢀMAXIM™ꢀofꢀMaximꢀIntegratedꢀProducts,ꢀInc.ꢀMICROTEC™,ꢀNUCLEUS™ꢀofꢀMentor
GraphicsꢀCorporation.ꢀMIPI™ꢀofꢀMIPIꢀAlliance,ꢀInc.ꢀMIPS™ꢀofꢀMIPSꢀTechnologies,ꢀInc.,ꢀUSA.ꢀmuRata™ꢀofꢀMURATAꢀMANUFACTURINGꢀCO.,
MICROWAVEꢀOFFICE™ꢀ(MWO)ꢀofꢀAppliedꢀWaveꢀResearchꢀInc.,ꢀOmniVision™ꢀofꢀOmniVisionꢀTechnologies,ꢀInc.ꢀOpenwave™ꢀOpenwave
SystemsꢀInc.ꢀREDꢀHAT™ꢀRedꢀHat,ꢀInc.ꢀRFMD™ꢀRFꢀMicroꢀDevices,ꢀInc.ꢀSIRIUS™ꢀofꢀSiriusꢀSatelliteꢀRadioꢀInc.ꢀSOLARIS™ꢀofꢀSun
Microsystems,ꢀInc.ꢀSPANSION™ꢀofꢀSpansionꢀLLCꢀLtd.ꢀSymbian™ꢀofꢀSymbianꢀSoftwareꢀLimited.ꢀTAIYOꢀYUDEN™ꢀofꢀTaiyoꢀYudenꢀCo.
TEAKLITE™ꢀofꢀCEVA,ꢀInc.ꢀTEKTRONIX™ꢀofꢀTektronixꢀInc.ꢀTOKO™ꢀofꢀTOKOꢀKABUSHIKIꢀKAISHAꢀTA.ꢀUNIX™ꢀofꢀX/OpenꢀCompanyꢀLimited.
VERILOG™,ꢀPALLADIUM™ꢀofꢀCadenceꢀDesignꢀSystems,ꢀInc.ꢀVLYNQ™ꢀofꢀTexasꢀInstrumentsꢀIncorporated.ꢀVXWORKS™,ꢀWINDꢀRIVER™ꢀof
WINDꢀRIVERꢀSYSTEMS,ꢀINC.ꢀZETEX™ꢀofꢀDiodesꢀZetexꢀLimited.
Last update
2011-11-11
Final Data Sheet
12
V3.0,ꢀꢀ2020-05-11
wꢀwꢀwꢀ.ꢀiꢀnꢀfꢀiꢀnꢀeꢀoꢀnꢀ.ꢀcꢀoꢀm
PublishedꢀbyꢀInfineonꢀTechnologiesꢀAG
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