F4-23MR12W1M1_B76 [INFINEON]
PressFIT;型号: | F4-23MR12W1M1_B76 |
厂家: | Infineon |
描述: | PressFIT |
文件: | 总12页 (文件大小:539K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
F4-23MR12W1M1_B76
™
EasyPACK module
Preliminary datasheet
EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
™
™
Features
• Electrical features
- VDSS = 1200 V
- IDN = 50 A / IDRM = 100 A
- Low switching losses
- High current density
- Low inductive design
• Mechanical features
- Integrated NTC temperature sensor
- PressFIT contact technology
- Rugged mounting due to integrated mounting clamps
Potential applications
• Welding
• DC charger for EV
• DC/DC converter
• High Frequency Switching application
Product validation
• Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068
Description
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
0.20
2021-02-12
F4-23MR12W1M1_B76
™
EasyPACK module
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Body diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
1
2
3
4
5
6
7
8
Datasheet
2
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F4-23MR12W1M1_B76
™
EasyPACK module
1 Package
1
Package
Table 1
Insulation Coordination
Symbol Note or test condition
Parameter
Values
3.0
Unit
Isolation test voltage
Internal Isolation
Creepage distance
Creepage distance
Clearance
VISOL
RMS, f = 50 Hz, t = 1 min
kV
basic insulation (class 1, IEC 61140)
Al2O3
11.5
6.3
dCreep terminal to heatsink
mm
mm
mm
mm
dCreep terminal to terminal
dClear terminal to heatsink
dClear terminal to terminal
CTI
10.0
5.0
Clearance
Comparative tracking index
RTI Elec.
> 200
140
RTI
housing
°C
Table 2
Characteristic Values
Symbol Note or test condition
Parameter
Values
Min. Typ. Max.
14
Unit
Stray inductance module
Storage temperature
Mounting force per clamp
Weight
LsCE
nH
°C
N
Tstg
F
-40
20
125
50
G
24
g
Note:
The current under continuous operation is limited to 25 A rms per connector pin.
Important note: The selection of positive and negative gate-source voltages impacts the long-term behavior
of the device. The design guidelines described in Application Note AN 2018-09 must be considered to ensure
sound operation of the device over the planned lifetime.
2
MOSFET
Table 3
Maximum Rated Values
Parameter
Symbol Note or test condition
Values
1200
50
Unit
Drain-source voltage
VDSS
IDN
Tvj = 25 °C
TH = 65 °C
V
A
A
A
V
Implemented drain current
Continuous DC drain current
Repetitive peak drain current
Gate-source voltage
IDDC
IDRM
VGSS
Tvj = 175 °C, VGS = 15 V
45
verified by design, tp limited by Tvjmax
100
-10/+20
Datasheet
3
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F4-23MR12W1M1_B76
™
EasyPACK module
2 MOSFET
Table 4
Characteristic Values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Drain-source on resistance
RDS(on) ID = 50 A, VGS = 15 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
22.5
29.5
33
mΩ
Gate threshold voltage
VGS(th) ID = 20 mA, VDS = VGS, Tvj = 25 °C, (tested afte 3.45
4.5
5.55
V
1ms pulse at VGS = +20 V)
Total gate charge
Internal gate resistor
Input capacitance
QG
RGint
CISS
VDS = 800 V, VGS = -5/+15 V
Tvj = 25 °C
0.124
2
µC
Ω
f = 1 MHz, VDS = 800 V,
VGS = 0 V
Tvj = 25 °C
Tvj = 25 °C
Tvj = 25 °C
3.68
nF
Output capacitance
COSS
Crss
f = 1 MHz, VDS = 800 V,
VGS = 0 V
0.22
nF
nF
Reverse transfer capacitance
f = 1 MHz, VDS = 800 V,
VGS = 0 V
0.028
COSS stored energy
EOSS
IDSS
IGSS
td on
VDS = 800 V, VGS = -5/+15 V, Tvj = 25 °C
88
µJ
µA
nA
ns
Drain-source leakage current
Gate-source leakage current
VDS = 1200 V, VGS = -5 V
VDS = 0 V, Tvj = 25 °C
Tvj = 25 °C
VGS = 20 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
0.2
210
400
Turn-on delay time
(inductive load)
ID = 50 A, RGon = 8.2 Ω,
VDS = 600 V,
23
22
VGS = -5/+15 V
22
Rise time (inductive load)
tr
td off
tf
ID = 50 A, RGon = 8.2 Ω,
VDS = 600 V,
15
ns
ns
14
VGS = -5/+15 V
14
Tuen-off delay time
(inductive load)
ID = 50 A, RGoff = 3.9 Ω,
VDS = 600 V,
48
52
VGS = -5/+15 V
52
Fall time (inductive load)
ID = 50 A, RGoff = 3.9 Ω,
VDS = 600 V,
19
ns
18
VGS = -5/+15 V
18
Turn-on energy loss per
pulse
Eon
ID = 50 A, VDS = 600 V,
0.717
0.793
0.825
mJ
L = 35 nH,
σ
VGS = -5/+15 V,
RGon = 8.2 Ω, di/dt = 3
kA/µs (Tvj = 150 °C)
Datasheet
4
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2021-02-12
F4-23MR12W1M1_B76
™
EasyPACK module
3 Body diode
Table 4
Characteristic Values (continued)
Symbol Note or test condition
Parameter
Values
Min. Typ. Max.
0.192
Unit
Tuen-off energy loss per
pulse
Eoff
ID = 50 A, VDS = 600 V,
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
mJ
L = 35 nH,
σ
0.194
VGS = -5/+15 V,
0.194
RGoff = 3.9 Ω, dv/dt = 37.2
kV/µs (Tvj = 150 °C)
Thermal resistance, junction
to heatsink
RthJH
Tvj op
per MOSFET
1.09
K/W
°C
Temperature under
switching conditions
-40
150
3
Body diode
Table 5
Maximum Rated Values
Symbol Note or test condition
Parameter
Values
Unit
DC body diode forward
current
ISD
Tvj = 175 °C, VGS = -5 V
TH = 65 °C
16
A
Table 6
Characteristic Values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Forward voltage
VSD
ISD = 50 A, VGS = -5 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
4.6
4.35
4.3
5.65
V
4
NTC-Thermistor
Table 7
Characteristic Values
Parameter
Symbol Note or test condition
Values
Unit
Min. Typ. Max.
Rated resistance
Deviation of R100
Power dissipation
B-value
R25
ΔR/R
P25
TNTC = 25 °C
5
kΩ
%
TNTC = 100 °C, R100 = 493 Ω
TNTC = 25 °C
-5
5
20
mW
K
B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]
B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]
B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]
3375
3411
3433
B-value
K
B-value
K
Note:
Specification according to the valid application note.
Datasheet
5
0.20
2021-02-12
F4-23MR12W1M1_B76
™
EasyPACK module
5 Characteristics diagrams
5
Characteristics diagrams
output characteristic (typical), MOSFET
output characteristic (typical), MOSFET
ID = f(VDS)
ID = f(VDS)
VGS = 15 V
Tvj = 150 °C
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
transfer characteristic (typical), MOSFET
ID = f(VGS)
capacity characteristic (typical), MOSFET
C = f(VDS)
VDS = 20 V
f = 1 MHz, Tvj = 25 °C, VGS = 0 V
100
90
80
70
60
50
40
30
20
10
0
100
10
1
0.1
0.01
4
5
6
7
8
9
10
11
12
0.1
1
10
100
1000
Datasheet
6
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F4-23MR12W1M1_B76
™
EasyPACK module
5 Characteristics diagrams
switching losses (typical), MOSFET
E = f(ID)
switching losses (typical), MOSFET
E = f(RG)
RGoff = 3.9 Ω, RGon = 8.2 Ω, VDS = 600 V, VGS = -5/15 V
VDS = 600 V, ID = 50 A, VGS = -5/15 V
1.50
1.25
1.00
0.75
0.50
0.25
0.00
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
10 20 30 40 50 60 70 80 90 100
0
10
20
30
40
50
60
70
80
90
reverse bias safe operating area (RBSOA), MOSFET
ID = f(VDS)
transient thermal impedance , MOSFET
Zth = f(t)
RGoff = 3.9 Ω, Tvj = 150 °C, VGS = -5/15 V
120
110
100
90
80
70
60
50
40
30
20
10
0
10
1
0.1
0.01
0
200
400
600
800 1000 1200 1400
0.001
0.01
0.1
1
10
Datasheet
7
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2021-02-12
F4-23MR12W1M1_B76
™
EasyPACK module
5 Characteristics diagrams
temperature characteristic (typical), NTC-Thermistor
R = f(TNTC
)
100000
10000
1000
100
0
25
50
75
100
125
150
Datasheet
8
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F4-23MR12W1M1_B76
™
EasyPACK module
6 Circuit diagram
6
Circuit diagram
J
Figure 2
Datasheet
9
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F4-23MR12W1M1_B76
™
EasyPACK module
7 Package outlines
7
Package outlines
Infineon
Figure 3
Datasheet
10
0.20
2021-02-12
F4-23MR12W1M1_B76
™
EasyPACK module
8 Module label code
8
Module label code
Module label code
Code format
Encoding
Data Matrix
ASCII text
Barcode Code128
Code Set A
23 digits
Symbol size
Standard
16x16
IEC24720 and IEC16022
IEC8859-1
Code content
Content
Digit
1 – 5
6 - 11
12 - 19
20 – 21
22 – 23
Example
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
71549
142846
55054991
15
30
Example
71549142846550549911530
71549142846550549911530
Figure 4
Datasheet
11
0.20
2021-02-12
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-02-12
Published by
Infineon Technologies AG
81726 Munich, Germany
IMPORTANT NOTICE
Please note that this product is not qualified
according to the AEC Q100 or AEC Q101 documents
of the Automotive Electronics Council.
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Btschafftnhtiꢀsgaeanꢀit”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies offict.
©
2021 Infineon Technologies AG
All Rights Reserved.
Except as otherwise explicitly approved by Infineon
Technologies in
a written document signed by
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
Document reference
IFX-
The data contained in this document is exclusively
intended for technically trained sꢀaff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
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