ESD242B1W01005E6327XTSA1 [INFINEON]
Trans Voltage Suppressor Diode, 25W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon,;
| 型号： | ESD242B1W01005E6327XTSA1 |
| 厂家： | 
Infineon |
| 描述： | Trans Voltage Suppressor Diode, 25W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, 局域网 二极管 |
| 文件： | 总11页 (文件大小：334K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD242-B1-W01005
Protection Devices
TVS (Transient Voltage Suppressor)
Bi-directional, 3.3 V, 6 pF, 01005, RoHS and Halogen Free compliant
Features
•
ESD / transient protection according to:
-
-
-
IEC61000-4-2 (ESD): ±18 kV (air / contact discharge)
IEC61000-4-4 (EFT): ±2 kV / ±40 A (5/50 ns)
IEC61000-4-5 (Surge): ±4.5 A (8/20 μs)
•
•
•
•
•
•
Bi-directional working voltage up to: VRWM = ±3.3 V
Line capacitance: CL = 6 pF (typical) at f = 1 MHz
Clamping voltage: VCL = 6 V (typical) at ITLP = 16 A with RDYN = 0.09 Ω (typical)
Very low reverse current: IR < 1 nA (typical)
Small form factor SMD Size 01005 and low profile 0.43 mm x 0.23 mm x 0.15 mm
Bi-directional and symmetric I/V characteristics for optimized design and
assembly
•
Pb-free (RoHS compliant) and halogen free package
Guidelines for optimized PCB design and assembly process are available in [2].
Potential applications
•
•
IC/ASICs in audio, headset
Human digital interfaces, buttons, GPIO
Product validation
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22
Device information
b) Schematic diagram
a) Pin configuration
Figure 1
Pin configuration and schematic diagram
Table 1
Type
Part information
Package
Configuration
1 line, bi-directional
Marking code
AC 1)
ESD242-B1-W01005
WLL-2-2
1
The device does not have any marking on the device top. The marking code is on the pads.
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Table of contents
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Device information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Typical characteristic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
2
3
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4.1
WLL-2-2 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Datasheet
2
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Maximum ratings
1
Maximum ratings
Note:
TA = 25 °C, unless otherwise specified
Table 2
Maximum ratings1)
Parameter
Symbol
VRWM
Values
±3.3
Unit
V
Reverse working voltage
ESD discharge 2)
VESD (contact)
VESD (air)
PPK
±18
kV
±18
Peak pulse power 3)
25
W
A
Peak pulse current 3)
Operating temperature range
Storage temperature
IPP
±4.5
TOP
-55 to 125
-65 to 150
°C
°C
Tstg
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings. Exceeding only one of these values may cause
irreversible damage to the component.
1
Device is electrically symmetrical
VESD according to IEC61000-4-2 (R = 330 Ω, C = 150 pF discharge network)
Stress pulse: 8/20μs current waveform according to IEC61000-4-5
2
3
Datasheet
3
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Electrical characteristics
2
Electrical characteristics
I
F
IPP
ITLP
ΔV
ΔI
ΔV
V
... Forward voltage
... Forward current
... Reverse voltage
... Reverse current
RDYN
F
I
F
ΔI
V
R
I
R
VCL
IT
VTLP Vt1 Vh VRWM
IR
V
R
V
F
IR
VRWM Vh Vt1 VCL
VTLP
IT
R
... Dynamic resistance
... Reverse working voltage max.
... Trigger voltage
... Holding voltage
... Clamping voltage
... TLP voltage
... Reverse leakage current
... Peak pulse current
... TLP current
DYN
RWM
t1
V
V
V
V
V
I
h
CL
TLP
R
ΔI
ΔV
ΔI
RDYN
ΔV
I
I
I
IPP
pp
TLP
T
ITLP
... Test current
I
Diode_Characteristic_Curve_with_snapback_Bi-directional.svg
Figure 2
Definitions of electrical characteristics
Datasheet
4
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Electrical characteristics
Table 3
DC characteristics (TA = 25 °C, unless otherwise specified) 1)
Parameter
Symbol
Values
Typ.
Unit
Note or Test
Condition
Min.
Max.
Trigger Voltage2)3)
Holding voltage4)
Reverse current
Vt1
Vh
IR
5
4
–
6
–
V
–
5.7
1
7.2
30
V
IR = 1 mA
VR = 3.3 V
nA
Table 4
AC characteristics (TA = 25 °C, unless otherwise specified) 1)
Parameter
Symbol
Values
Typ.
Unit
Note or Test
Condition
Min.
Max.
Line capacitance
CL
–
–
6
6
–
–
pF
VR = 0 V, f = 1 MHz
VR = 0 V, f = 1 GHz
Table 5
ESD and Surge characteristics (TA = 25 °C, unless otherwise specified) 1)
Parameter
Symbol
Values
Typ.
Unit
Note or Test
Condition
Min.
Max.
Clamping voltage 5)
Clamping voltage 6)
Dynamic resistance 5)
VCL
–
–
–
–
–
6
7
5
6
–
–
–
–
V
ITLP = 16 A, tp = 100 ns
ITLP = 30 A, tp = 100 ns
IPP = 1 A, tp = 8/20 µs
IPP = 4 A, tp = 8/20 µs
tp = 100 ns
RDYN
0.09
Ω
1
Device is electrically symmetrical
Verified by design
Voltage forced
2
3
4
5
6
Current forced
Please refer to Application Note AN210 [1]. TLP parameters: Z0 = 50 Ω , tp = 100ns, tr = 0.6 ns.
Stress pulse: 8/20μs current waveform according to IEC61000-4-5
Datasheet
5
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Typical characteristic diagrams
3
Typical characteristic diagrams
Note:
TA = 25 °C, unless otherwise specified
10-6
10-7
10-8
10-9
10-10
10-11
10-12
10-13
-3.5 -3 -2.5 -2 -1.5 -1 -0.5
0
0.5
1
1.5
2
2.5
3
3.5
VR [V]
Figure 3
Reverse leakage current: IR = f(VR)
8
7
6
5
4
3
2
1
0
-3.5 -3 -2.5 -2 -1.5 -1 -0.5
0
0.5
1
1.5
2
2.5
3
3.5
VR [V]
Figure 4
Line capacitance: CL = f(VR), f = 1 MHz
Datasheet
6
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Typical characteristic diagrams
35
17.5
15
ESD242-B1-W01005
RDYN
30
25
20
15
10
5
RDYN = 0.09 Ω
12.5
10
7.5
5
2.5
0
0
-5
-2.5
-5
-10
-15
-20
-25
-30
-35
-7.5
-10
-12.5
-15
-17.5
RDYN = 0.09 Ω
-10
-8
-6
-4
-2
0
2
4
6
8
10
VTLP [V]
Figure 5
Clamping voltage (TLP): ITLP = f(VTLP) [1]
Datasheet
7
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Typical characteristic diagrams
5
4
3
2
1
0
-1
-2
-3
-4
-5
-10
-5
0
5
10
VCL [V]
Figure 6
Clamping voltage (Surge): IPP = f(VCL) [1]
Datasheet
8
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
Package information
4
Package information
4.1
WLL-2-2 package
Top view
Bottom view
±0.01
±0.03
0.15
0.23
2
1
±0.02
0.2
SG-WLL-2-2-PO V01
Figure 7
WLL-2-2 package outline (dimension in mm)
0.23
0.23
Copper
Solder mask
Stencil apertures
SG-WLL-2-2-FP V01
Figure 8
WLL-2-2 footprint (dimension in mm), recommendation for Printed Circuit Board assembly
see [2]
0.2
2
0.2
0.28
SG-WLL-2-2-TP V01
Figure 9
WLL-2-2 packing (dimension in mm)
Marking on pad-side
2 1
1
Type code
Type code
1 2
1
Figure 10 WLL-2-2 marking example (see Table 1)
Datasheet
9
Revision 1.0
2017-06-26
ESD242-B1-W01005
Protection Devices
References
5
References
[1]
Infineon AG - Application Note AN210: Effective ESD Protection design at System Level Using VF-TLP
Characterization Methodology
[2]
[3]
Infineon AG - Recommendation for Printed Circuit Board Assembly of Infineon WLL Packages
http://www.infineon.com/Packageinformation_WLL
Infineon AG - Application Note AN392: TVS Diodes in ChipScalePackage reduce size and save cost
Revision history
Revision history: Rev. 0.9.1, 2016-01-25
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2017-06-26
All
Final datasheet
Datasheet
10
Revision 1.0
2017-06-26
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2017-06-26
Published by
IMPORTANT NOTICE
WARNINGS
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values
stated herein and/or any information regarding the
application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of
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In addition, any information given in this document is
subject to customer’s compliance with its obligations
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in question please contact your nearest Infineon
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Infineon Technologies’ products may not be used in
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be expected to result in personal injury
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©
2017 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-qwu1485355255152
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
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application.
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