CYPD2119-24LQXI [INFINEON]

EZ-PD™ CCG2 USB Type-C Port Controller;
CYPD2119-24LQXI
型号: CYPD2119-24LQXI
厂家: Infineon    Infineon
描述:

EZ-PD™ CCG2 USB Type-C Port Controller

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EZ-PD™ CCG2 Datasheet  
USB Type-C Port Controller  
USB Type-C Port Controller  
General Description  
EZ-PD™ CCG2 is a USB Type-C controller that complies with the latest USB Type-C and PD standards. EZ-PD CCG2 provides a  
complete USB Type-C and U1SB Power Delivery port control solution for passive cables, active cables, and powered accessories. It  
can also be used in many upstream and downstream facing port applications. EZ-PD CCG2 uses Cypress’s proprietary M0S8  
technology with a 32-bit, 48-MHz Arm® Cortex®-M0 processor with 32-KB flash and integrates a complete Type-C Transceiver  
including the Type-C termination resistors RP, RD and RA.  
Type-C Support  
Integrated transceiver (baseband PHY)  
Applications  
USB Type-C EMCA cables  
Integrated UFP (RD), EMCA (RA) termination resistors, and  
USB Type-C powered accessories  
current sources for DFP (RP)  
USB Type-C upstream facing ports  
Supports one USB Type-C port  
USB Type-C downstream facing ports  
Low-Power Operation  
2.7-V to 5.5-V operation  
Features  
Two independent VCONN rails with integrated isolation  
between the two  
32-bit MCU Subsystem  
48-MHz ARM Cortex-M0 CPU  
32-KB Flash  
Independent supply voltage pin for GPIO that allows 1.71-V to  
5.5-V signaling on the I/Os  
4-KB SRAM  
Reset: 1.0 µA, Deep Sleep: 2.5 µA, Sleep: 2.0 mA  
In-system reprogrammable  
System-Level ESD on CC and VCONN Pins  
±8-kVContactDischargeand±15-kVAirGapDischargebased  
on IEC61000-4-2 level 4C  
Integrated Digital Blocks  
Integrated timers and counters to meet response times  
required by the USB-PD protocol  
Packages  
Run-time reconfigurable serial communication block (SCB)  
with reconfigurable I2C, SPI, or UART functionality  
1.63 mm × 2.03 mm, 20-ball wafer-level CSP (WLCSP) with  
0.4-mm ball pitch  
Clocks and Oscillators  
Integrated oscillator eliminating the need for external clock  
2.5 mm × 3.5 mm × 0.6 mm 14-pin DFN  
4.0 mm × 4.0 mm, 0.55 mm 24-pin QFN  
Supports industrial (40 °C to +85 °C) and extended industrial  
(40 °C to +105 °C) temperature ranges  
Logic Block Diagram  
CCG2: USB Type-C Cable Controller  
MCU Subsystem  
I/O Subsystem  
CC5  
Integrated Digital Blocks  
TCPWM1  
VCONN1  
SCB2  
(I2C, SPI, UART)  
CORTEX-M0  
48 MHz  
VCONN2  
SCB2  
(I2C, SPI, UART)  
VDDIO  
GPIO6  
Port  
Profiles and  
Configurations  
Flash  
(32 KB)  
Baseband MAC  
Baseband PHY  
4
SRAM  
(4 KB)  
Integrated Rd3, Ra  
,
7
and Rp  
Serial Wire Debug  
1 Timer, counter, pulse-width modulation block  
2 Serial communication block configurable as UART, SPI, or I2C  
3 Termination resistor denoting a UFP  
4 Termination resistor denoting an EMCA  
5 Configuration Channel  
6 General-purpose input/output  
7
Current Sources to indicate a DFP  
Cypress Semiconductor Corporation  
Document Number: 001-93912 Rev. *N  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 4, 2020  
EZ-PD™ CCG2 Datasheet  
Available Firmware and Software Tools  
EZ-PD Configuration Utility  
The EZ-PD Configuration Utility is a GUI-based Microsoft Windows application developed by Cypress to guide a CCGx user through  
the process of configuring and programming the chip. The utility allows users to:  
1. Select and configure the parameters they want to modify  
2. Program the resulting configuration onto the target CCGx device.  
The utility works with the Cypress supplied CCG1, CCG2, CCG3, and CCG4 kits, which host the CCGx controllers along with a USB  
interface. This version of the EZ-PD Configuration Utility supports configuration and firmware update operations on CCGx controllers  
implementing EMCA and Display Dongle applications. Support for other applications, such as Power Adapters and Notebook port  
controllers, will be provided in later versions of the utility.  
You can download the EZ-PD Configuration Utility and its associated documentation at the following link:  
http://www.cypress.com/documentation/software-and-drivers/ez-pd-configuration-utility  
Document Number: 001-93912 Rev. *N  
Page 2 of 41  
EZ-PD™ CCG2 Datasheet  
Contents  
EZ-PD CCG2 Block Diagram ............................................4  
Functional Overview .........................................................4  
CPU and Memory Subsystem .....................................4  
USB-PD Subsystem (SS) ............................................5  
System Resources .......................................................5  
Peripherals ..................................................................6  
GPIO ............................................................................6  
Pinouts ...............................................................................7  
Power .................................................................................9  
CCG2 Programming and Bootloading ..........................10  
Programming the CCG2 Device Flash  
over SWD Interface ...........................................................10  
Application Firmware Update (I2C, CC) ....................11  
Application Diagrams .....................................................13  
EMCA Applications ....................................................13  
Upstream Facing Port Applications ...........................16  
Downstream Facing Port Applications .......................18  
C-HDMI Dongle Application .......................................19  
C-DisplayPort Dongle Application ..............................20  
Dock/Monitor Application ...........................................21  
Electrical Specifications .................................................22  
Absolute Maximum Ratings .......................................22  
Device Level Specifications .......................................23  
Digital Peripherals .....................................................25  
Memory ......................................................................27  
System Resources ....................................................28  
Ordering Information ......................................................31  
Ordering Code Definitions .........................................31  
Packaging ........................................................................32  
Acronyms ........................................................................35  
Document Conventions .................................................36  
Units of Measure .......................................................36  
References and Links To Applications Collaterals .....37  
Knowledge Base Articles ...........................................37  
Application Notes .......................................................37  
Reference Designs ....................................................37  
Kits .............................................................................37  
Datasheets ................................................................37  
Document History Page .................................................38  
Sales, Solutions, and Legal Information ......................41  
Worldwide Sales and Design Support .......................41  
Products ....................................................................41  
PSoC®Solutions ........................................................41  
Cypress Developer Community .................................41  
Technical Support ......................................................41  
Document Number: 001-93912 Rev. *N  
Page 3 of 41  
EZ-PD™ CCG2 Datasheet  
EZ-PD CCG2 Block Diagram  
Figure 1. EZ-PD CCG2 Block Diagram  
CPU Subsystem  
CCG2  
SWD/TC  
SPCIF  
Cortex  
M0  
48 MHz  
FAST MUL  
FLASH  
32 KB  
SRAM  
4 KB  
SROM  
8 KB  
32-bit  
AHB-Lite  
Read Accelerator  
SRAM Controller  
SROM Controller  
NVIC, IRQMX  
System Resources  
Lite  
System Interconnect (Single Layer AHB)  
Peripheral Interconnect (MMIO)  
Power  
Sleep Control  
WIC  
Peripherals  
POR  
REF  
PCLK  
PWRSYS  
Clock  
Clock Control  
WDT  
USB-PD SS  
IMO  
ILO  
Reset  
Reset Control  
XRES  
Test  
DFT Logic  
DFT Analog  
Pads, ESD  
Power Modes  
Active/Sleep  
Deep Sleep  
High Speed I/O Matrix  
12 x GPIOs, 2 x OVTs  
I/O Subsystem  
input, which is made available to the user when it is not in use  
for system functions requested by the user.  
Functional Overview  
CPU and Memory Subsystem  
The CPU also includes a serial wire debug (SWD) interface,  
which is a 2-wire form of JTAG. The debug configuration used for  
EZ-PD CCG2 has four break-point (address) comparators and  
two watchpoint (data) comparators.  
CPU  
The Cortex-M0 CPU in EZ-PD CCG2 is part of the 32-bit MCU  
subsystem, which is optimized for low-power operation with  
extensive clock gating. It mostly uses 16-bit instructions and  
executes a subset of the Thumb-2 instruction set. This enables  
fully compatible binary upward migration of the code to higher  
performance processors such as the Cortex-M3 and M4, thus  
enabling upward compatibility. The Cypress implementation  
includes a hardware multiplier that provides a 32-bit result in one  
cycle. It includes a nested vectored interrupt controller (NVIC)  
block with 32 interrupt inputs and also includes a Wakeup  
Interrupt Controller (WIC). The WIC can wake the processor up  
from the Deep Sleep mode, allowing power to be switched off to  
the main processor when the chip is in the Deep Sleep mode.  
The Cortex-M0 CPU provides a Non-Maskable Interrupt (NMI)  
Flash  
The EZ-PD CCG2 device has a flash module with a flash  
accelerator, tightly coupled to the CPU to improve average  
access times from the flash block. The flash block is designed to  
deliver 1 wait-state (WS) access time at 48 MHz and with 0-WS  
access time at 24 MHz. The flash accelerator delivers 85% of  
single-cycle SRAM access performance on average. Part of the  
flash module can be used to emulate EEPROM operation if  
required.  
SROM  
Asupervisory ROM that contains boot and configuration routines  
is provided.  
Document Number: 001-93912 Rev. *N  
Page 4 of 41  
EZ-PD™ CCG2 Datasheet  
EZ-PD CCG2 USB-PD sub-system can be configured to  
respond to SOP, SOP’, or SOP” messaging.  
USB-PD Subsystem (SS)  
EZ-PD CCG2 has a USB-PD subsystem consisting of a USB  
Type-C baseband transceiver and physical-layer logic. This  
transceiver performs the BMC and the 4b/5b encoding and  
decoding functions as well as the 1.2-V front end. This  
subsystem integrates the required termination resistors to  
identify the role of the EZ-PD CCG2 solution. RA is used to  
identify EZ-PD CCG2 as an accessory or an electronically  
marked cable. RD is used to identify EZ-PD CCG2 as a UFP in  
a hybrid cable or a dongle. When configured as a DFP, integrated  
current sources perform the role of RP or pull-up resistors. These  
current sources can be programmed to indicate the complete  
range of current capacity on VBUS defined in the Type-C spec.  
EZ-PD CCG2 responds to all USB-PD communication. The  
The USB-PD sub-system contains a 8-bit SAR (Successive  
Approximation Register) ADC for analog to digital conversions.  
The ADC includes a 8-bit DAC and a comparator. The DAC  
output forms the positive input of the comparator. The negative  
input of the comparator is from a 4-input multiplexer. The four  
inputs of the multiplexer are a pair of global analog multiplex  
busses an internal bandgap voltage and an internal voltage  
proportional to the absolute temperature. All GPIO inputs can be  
connected to the global Analog Multiplex Busses through a  
switch at each GPIO that can enable that GPIO to be connected  
to the mux bus for ADC use. The CC1, CC2 and RD1 pins are  
not available to connect to the mux busses.  
Figure 2. USB-PD Subsystem  
To/From system Resources  
vref  
iref  
VDDD  
VCONN power logic  
To/ from AHB  
8-bit ADC  
VDDD  
Enable  
Logic  
From AMUX  
Ra Enable  
VConn1 detect  
VConn2 detect  
VCONN1  
Ra  
Ra  
VCONN  
Detect  
VCONN2  
TxRx Enable  
8kV IEC ESD  
Digital Baseband PHY  
Analog Baseband PHY  
Tx_data  
Enable Logic  
from AHB  
Tx  
SRAM  
4b5b  
Encoder  
BMC  
Encoder  
SOP  
Insert  
Rp  
TX  
CC1  
RD1  
CC2  
CRC  
Rx_data  
to AHB  
RX  
Rx  
4b5b  
SOP  
BMC  
SRAM  
Decoder  
Detect  
Decoder  
Ref  
Comp  
8kV IEC ESD  
Active  
Rd  
DB  
Rd  
CC control  
CC detect  
Deep Sleep Reference Enable  
Functional, Wakeup Interrupts  
Deep Sleep  
Vref & Iref Gen  
vref, iref  
Clock System  
System Resources  
Power System  
The clock system for EZ-PD CCG2 consists of the Internal Main  
Oscillator (IMO) and the Internal Low-power Oscillator (ILO).  
The power system is described in detail in the section Power on  
page 9. It provides assurance that voltage levels are as required  
for each respective mode and either delay mode entry (on  
power-on reset (POR), for example) until voltage levels are as  
required for proper function or generate resets (Brown-Out  
Detect (BOD)) or interrupts (Low Voltage Detect (LVD)). EZ-PD  
CCG2 can operate from three different power sources over the  
range of 2.7 to 5.5 V and has three different power modes,  
transitions between which are managed by the power system.  
EZ-PD CCG2 provides Sleep and Deep Sleep low-power  
modes.  
Document Number: 001-93912 Rev. *N  
Page 5 of 41  
EZ-PD™ CCG2 Datasheet  
Timer/Counter/PWM Block (TCPWM)  
Peripherals  
EZ-PD CCG2 has six TCPWM blocks. Each implements a 16-bit  
timer, counter, pulse-width modulator (PWM), and quadrature  
decoder functionality. The block can be used to measure the  
period and pulse width of an input signal (timer), find the number  
of times a particular event occurs (counter), generate PWM  
signals, or decode quadrature signals.  
Serial Communication Blocks (SCB)  
EZ-PD CCG2 has two SCBs, which can be configured to  
implement an I2C, SPI, or UART interface. The hardware I2C  
blocks implement full multi-master and slave interfaces capable  
of multimaster arbitration. In the SPI mode, the SCB blocks can  
be configured to act as master or slave.  
GPIO  
In the I2C mode, the SCB blocks are capable of operating at  
speeds of up to 1 Mbps (Fast Mode Plus) and have flexible  
buffering options to reduce interrupt overhead and latency for the  
CPU. These blocks also support I2C that creates a mailbox  
address range in the memory of EZ-PD CCG2 and effectively  
reduce I2C communication to reading from and writing to an  
array in memory. In addition, the blocks support 8-deep FIFOs  
for receive and transmit which, by increasing the time given for  
the CPU to read data, greatly reduce the need for clock  
stretching caused by the CPU not having read data on time.  
The I2C peripherals are compatible with the I2C Standard-mode,  
Fast-mode, and Fast-mode Plus devices as defined in the NXP  
I2C-bus specification and user manual (UM10204). The I2C bus  
I/Os are implemented with GPIO in open-drain modes.  
EZ-PD CCG2 has up to 10 GPIOs in addition to the I2C and SWD  
pins, which can also be used as GPIOs. The I2C pins from SCB  
0 are overvoltage-tolerant. The number of available GPIOs vary  
with the package. The GPIO block implements the following:  
Seven drive strength modes:  
Input only  
Weak pull-up with strong pull-down  
Strong pull-up with weak pull-down  
Open drain with strong pull-down  
Open drain with strong pull-up  
Strong pull-up with strong pull-down  
Weak pull-up with weak pull-down  
The I2C port on SCB 1 block of EZ-PD CCG2 is not completely  
Input threshold select (CMOS or LVTTL)  
compliant with the I2C spec in the following respects:  
Individual control of input and output buffer enabling/disabling  
in addition to the drive strength modes  
The GPIO cells for SCB 1's I2Cport arenot overvoltage-tolerant  
and, therefore, cannot be hot-swapped or powered up  
independently of the rest of the I2C system.  
Hold mode for latching previous state (used for retaining I/O  
state in Deep Sleep mode)  
Fast-mode Plus has an IOL specification of 20 mA at a VOL of  
0.4 V. The GPIO cells can sink a maximum of 8-mA IOL with a  
Selectable slew rates for dV/dt related noise control to improve  
EMI  
VOL maximum of 0.6 V.  
During power-on and reset, the I/O pins are forced to the disable  
state so as not to crowbar any inputs and/or cause excess  
turn-on current. A multiplexing network known as a high-speed  
I/O matrix is used to multiplex between various signals that may  
connect to an I/O pin.  
Fast-mode and Fast-mode Plus specify minimum Fall times,  
which are not met with the GPIO cell; Slow strong mode can  
help meet this spec depending on the bus load.  
Document Number: 001-93912 Rev. *N  
Page 6 of 41  
EZ-PD™ CCG2 Datasheet  
Pinouts  
Table 1. Pinouts  
Group  
Pin Map Ball Location  
Pin Map  
14-DFN  
Name  
Description  
24-QFN  
20-CSP  
USB Type-C  
Port  
CC1  
2
B4  
3
USB PD connector detect/Configuration Channel 1  
CC2  
RD1  
1
3
A4  
B3  
N/A  
N/A  
USB PD connector detect/Configuration Channel 2  
Dedicated Rd resistor pin for CC1  
Must be left open for cable applications and connected  
together with CC1 ball for UFP or DFP with dead battery  
applications  
GPIOs and  
GPIO  
22  
C3  
N/A  
GPIO / SPI_0_CLK / UART_0_ RX  
serial interfaces  
GPIO  
GPIO  
18  
13  
10  
15  
14  
17  
21  
23  
24  
20  
19  
11  
12  
16  
5
D3  
C2  
D2  
B2  
13  
10  
N/A  
11  
GPIO / SPI_0_MOSI / UART_0_TX  
GPIO / I2C_1_SDA / SPI_1_MISO / UART_1_RX  
GPIO / I2C_1_SCL / SPI_1_CLK / UART_1_TX  
GPIO / SPI_1_SEL / UART_1_RTS  
GPIO  
GPIO  
GPIO  
GPIO  
N/A  
N/A  
N/A  
N/A  
N/A  
A3  
N/A  
N/A  
N/A  
N/A  
N/A  
1
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
I2C_0_SCL  
I2C_0_SDA  
SWD _IO  
SWD_CLK  
XRES  
GPIO / I2C_0_SCL / SPI_0_MISO / UART_0_RTS  
GPIO / I2C_0_SDA / SPI_0_SEL / UART_0_CTS  
SWD IO / GPIO / UART_1_CTS / SPI_1_MOSI  
SWD clock / GPIO  
A2  
14  
8
E2  
D1  
B1  
9
RESET  
12  
5
Reset input  
POWER  
VCONN1  
VCONN2  
VDDIO  
VCCD  
E4  
VCONN 1 input (4.0 V to 5.5 V)  
VCONN 2 input (4.0 V to 5.5 V)  
1.71-V to 5.5-V supply for I/Os  
1.8-V regulator output for filter capacitor  
VDDD supply input/output (2.7 V to 5.5 V)  
VDDD supply input/output (2.7 V to 5.5 V)  
Ground supply  
4
C4  
E1  
4
8
N/A  
6
7
A1  
VDDD  
9
E3  
7
EPAD  
2
VDDD  
6
VSS  
N/A  
D4  
VSS  
Ground supply  
EPAD  
VSS  
C1  
Ground supply  
Document Number: 001-93912 Rev. *N  
Page 7 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 3. 20-ball WLCSP EZ-PD CCG2 Ball Map (Bottom (Balls Up) View)  
4
3
2
1
CC2  
I2C_0_SDA  
I2C_0_SCL  
VCCD  
A
CC1  
VCONN2  
VSS  
GPIO  
GPIO  
RD1  
XRES  
B
C
D
E
GPIO  
GPIO  
VDDD  
VSS  
GPIO  
SWD_CLK  
VCONN1  
SWD_IO  
VDDIO  
Figure 4. 14-pin DFN Pin Map (Top View)  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
I2C_0_SDA  
GPIO  
I2C_0_SCL  
VSS  
XRES  
CC1  
GPIO  
VCONN2  
VCONN1  
VCCD  
GPIO  
SWD_CLK  
SWD_IO  
8
VDDD  
Figure 5. 24-Pin QFN Pin Map (Top View)  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
CC2  
CC1  
GPIO  
GPIO  
XRES  
GPIO  
GPIO  
GPIO  
RD1  
EPAD  
VCONN2  
VCONN1  
VDDD  
Document Number: 001-93912 Rev. *N  
Page 8 of 41  
EZ-PD™ CCG2 Datasheet  
pins are left open. In DFP applications, the lowest VDDD level  
that CCG2 can operate is 3.0 V due to the need to support  
disconnect detection thresholds of up to 2.7 V.  
Power  
The following power system diagram shows the set of power  
supply pins as implemented in EZ-PD CCG2.  
A separate I/O supply pin, VDDIO, allows the GPIOs to operate  
at levels from 1.71 to 5.5 V. The VDDIO pin can be equal to or  
less than the voltages connected to the VCONN1, VCONN2, and  
VDDD pins. The independent VDDIO supply is not available on  
the 14-DFN package. On this package, the VDDIO rail is  
internally connected to the VDDD rails.  
EZ-PD CCG2 can operate from three different power sources.  
VCONN1 and VCONN2 pins can be used as connections to the  
VCONN pins on a Type-C plug of a cable or VCONN-powered  
accessory. Each of these inputs support operation over 4.0 to  
5.5 V. An internal isolation between VCONN1 and VCONN2 pins  
is provided allowing them to be at different levels simultaneously.  
CCG2 can be used in EMCA applications with only one or both  
VCONN pins as power sources. This is illustrated later in the  
section on Applications. Besides being power inputs, each  
VCONN pin is also internally connected to a RA termination  
resistor required for EMCA and VCONN-powered accessories.  
The VCCD output of EZ-PD CCG2 must be bypassed to ground  
via an external capacitor (in the range of 1 to 1.6 µF; X5R  
ceramic or better).  
Bypass capacitors must be used from VDDD and VCONN pins  
to ground; typical practice for systems in this frequency range is  
to use a 0.1-µF capacitor. Note that these are simply rules of  
thumb and that for critical applications, the PCB layout, lead  
inductance, and the bypass capacitor parasitic should be  
simulated to design and obtain optimal bypassing.  
EZ-PD CCG2 can also be operate from 2.7 to 5.5 V when  
operated from the VDDD supply pin. VCONN-powered  
accessory applications require that CCG2 work down to 2.7 V. In  
such applications, both the VDDD and VCONN pins should be  
connected to the VCONN pin of the Type-C plug in the  
accessory.  
An example of the power supply bypass capacitors is shown in  
Figure 6.  
In UFP, DFP, and DRP applications, CCG2 can be operated from  
VDDD as the only supply input. In such applications, the VCONN  
Figure 6. EZ-PD CCG2 Power and Bypass Scheme Example  
VCONN1  
VCONN2  
0.1uF  
1uF  
RA  
RA  
0.1uF  
VDDD  
Core Regulator  
VCCD  
VDDIO  
1uF  
CC  
Tx/Rx  
GPIO  
Core  
VSS  
Document Number: 001-93912 Rev. *N  
Page 9 of 41  
EZ-PD™ CCG2 Datasheet  
MiniProg3 Kit) called MiniProg3 and (CY8CKIT-005 MiniProg4  
Kit) MiniProg4 which can be used to program the flash as well as  
debug firmware. The flash is programmed by downloading the  
information from a hex file. This hex file is a binary file generated  
as an output of building the firmware project in PSoC Creator  
Software. Click here for more information on how to use the  
MiniProg3 programmer. Click here for more information on how  
to use the MiniProg4 programmer. There are many third-party  
programmers that support mass programming in a manufac-  
turing environment.  
As shown in the block diagram in Figure 7, the SWD_IO and  
SWD_CLK pins are connected to the host programmer's SWDIO  
(data) and SWDCLK (clock) pins respectively. During SWD  
programming, the device can be powered by the host  
programmer by connecting its VTARG (power supply to the  
target device) to VDDD pin of CCG2 device. If the CCG2 device  
is powered using an on-board power supply, it can be  
programmed using the “Reset Programming” option. For more  
details, refer to CCGx Programming Specifications.  
CCG2 Programming and Bootloading  
There are two ways to program application firmware into a  
CCG2 device:  
1. Programming the device flash over SWD Interface  
2. Application firmware update over specific interfaces (CC,  
I2C)  
Generally, the CCG2 devices are programmed over SWD  
interface only during development or during the manufacturing  
process of the end product. Once the end product is  
manufactured, the CCG2 device's application firmware can be  
updated via the appropriate bootloader interface. However, it is  
recommended to disable the update over bootloader interface  
before the end product goes to mass production, unless a  
secure method of firmware update is implemented by the  
customer.  
Programming the CCG2 Device Flash over SWD  
Interface  
The CCG2 family of devices can be programmed using the SWD  
interface. Cypress provides programming kits (CY8CKIT-002  
Figure 7. Connecting the Programmer to CCG2 Device  
3.3 V  
VDD  
1F  
Host Programmer  
CYPD2XXX  
VTARG  
VDDD  
SWDCLK  
SWDIO  
XRES  
SWD_CLK  
SWD_IO  
XRES  
VCCD  
1F  
GND  
GND  
GND  
Document Number: 001-93912 Rev. *N  
Page 10 of 41  
EZ-PD™ CCG2 Datasheet  
Application Firmware Update over I2C Interface  
2
Application Firmware Update (I C, CC)  
This method primarily applies to CYPD2104, CYPD2119,  
CYPD2120, CYPD2121, CYPD2122, CYPD2125 devices of the  
CCG2 family. In these applications, the CCG2 device interfaces  
to an on-board application processor or an embedded controller  
or a billboard device that will act as a USB to I2C bridge over I2C  
interface. Refer to Figure 8 for more details. For dongle applica-  
tions like C-HDMI or C-DisplayPort, the application firmware  
update can be done as shown in Figure 9.  
The application firmware can be updated over two different inter-  
faces depending on the default firmware programmed into the  
CCG2 device. Refer to Table 28 for more details on default  
firmware that various part numbers of the CCG2 family of  
devices are pre-programmed with (note that some of the devices  
have bootloader only and some have bootloader plus application  
firmware).  
Figure 8. Application Firmware Update Over I2C Interface  
VDDD  
2.2K2.2K  
2.2K  
I2C_SDA  
I2C_SCL  
I2C_INT  
Embedded Controller/  
Application Processor  
CYPD2xxx Device  
To be Programmed  
Figure 9. Application Firmware Update Over I2C Interface (for CYPD2119 and CYPD2120 Devices)  
Display Dongle  
Type-A to Type-C Cable  
Billboard  
(CY7C65211)  
OR  
Type-C Cable  
I2C  
Windows PC with Native  
Type-C Connector  
Running EZ-PD  
Configuration Utility  
CYPD2xxx  
(Dongle)  
Document Number: 001-93912 Rev. *N  
Page 11 of 41  
EZ-PD™ CCG2 Datasheet  
Application Firmware Update over CC Interface for DFPApplica-  
tions  
This method primarily applies to the CYPD2134 device of the  
CCG2 family. For bootloading, the CY4532 CCG3PA EVK can  
be used to send programming and configuration data as Cypress  
specific Vendor Defined Messages (VDMs) over the CC line. The  
CY4532 EVK’s base board is connected to the system  
containing CCG2 device on one end and a Windows PC running  
the EZ-PD™ Configuration Utility as shown in Figure 10 on the  
other end to bootload the CCG2 device.  
Figure 10. Application Firmware Update Over CC Interface for DFP Applications  
USB Serial Device of  
CY4532 EVK Power  
Board  
PC  
Running  
EZ-PD  
USB Mini-B  
cable  
I2C  
CC Line  
CYPD2xxx device  
to be Bootloaded  
CCG4 Device on  
CY4532 EVK Power  
Board  
Configuration  
Utility  
CY4532 CCG3PA EVK’s  
Power Board  
Type-C  
Receptacle  
Mini-B  
Receptacle  
Application Firmware Update Over CC Interface for Cable Appli-  
cations  
Utility User Manual for further details on how to do the application  
firmware update over CC interface for Cable applications.  
This method primarily applies to the CYPD2103 and CYPD2105  
devices of the CCG2 family. Refer to the EZ-PD Configuration  
Document Number: 001-93912 Rev. *N  
Page 12 of 41  
EZ-PD™ CCG2 Datasheet  
CCG2 device can be powered irrespective of which plug is  
connected to the host (DFP). However, in the application  
diagrams shown in Figure 13 and Figure 14, the VCONN signal  
does not run through the entire cable, but only runs to the  
respective VCONN pin of the CCG2 device at each end of the  
plug. Also, only one CCG2 device is powered at any given  
instance, depending on which one is nearer to the DFP that  
supplies VCONN.  
Application Diagrams  
EMCA Applications  
Figure 11 to Figure 14 show the application diagrams of a  
Passive EMCA application using CCG2 devices. Figure 11 and  
Figure 12 show the application using a single CCG2 device per  
cable present at one of the two plugs, whereas Figure 13 and  
Figure 14 show the same with two CCG2 devices per cable  
present at each plug. The VBUS signal, the SuperSpeed lines,  
HighSpeed lines, and CC lines are connected directly from one  
end to another.  
Note: Application diagram in Figure 12 requires external diodes  
to operate in the extended VCONN voltage range of 2.7V to 5.5V  
Cypress provides different firmware images for PD3.0 EMCA  
and USB4 EMCA. Please contact Cypress for the latest firmware  
images.  
The application diagrams shown in Figure 11 and Figure 12  
require a single VCONN wire to run through the cable so that the  
Figure 11. Passive EMCA Application – Single EZ-PD CCG2 Per Cable (VCONN range between 4.0V to 5.5V)  
Type-C  
Plug  
Type-C  
Plug  
VBUS  
VCONN 2  
VCONN 1  
1uF  
E3  
E1  
VDDD  
VDDIO  
C4  
D3  
E4  
VCONN2  
GPIO  
VCONN1  
0.1uF  
0.1uF  
C3  
A1  
C2  
D2  
GPIO  
GPIO  
GPIO  
VCCD  
1uF  
B2  
A4  
B4  
VDDIO  
4.7 k  
GPIO  
CCG2  
20-CSP  
CC2  
CC1  
B1  
D4  
XRES  
VSS  
B3  
C1  
VSS  
RD1  
I2C_0 I2C_0  
_SCL _SDA  
A3  
A2  
SWD_ SWD_  
IO CLK  
E2  
D1  
CC  
SuperSpeed and HighSpeed Lines  
GND  
Document Number: 001-93912 Rev. *N  
Page 13 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 12. Passive EMCA Application (PD3.0/USB4) – Single EZ-PD CCG2 Per Cable (VCONN range between 2.7V to 5.5V)  
Type-C  
Plug  
Type-C  
Plug  
VBUS  
Select a diode with VF less than 0.3V at 10mA  
NSR0620P2T5G  
NSR0620P2T5G  
VCONN 2  
VCONN 1  
2
1
1
2
1uF  
E3  
E1  
VDDD  
VDDIO  
C4  
D3  
E4  
C3  
A1  
VCONN2  
GPIO  
VCONN1  
GPIO  
0.1uF  
0.1uF  
C2  
D2  
GPIO  
GPIO  
B2  
A4  
B4  
VCCD  
GPIO  
1uF  
CCG2  
CC2  
CC1  
B1  
D4  
C1  
XRES  
VSS  
B3  
VSS  
RD1  
I2C_0 I2C_0  
_SCL _SDA  
SWD_SWD_  
IO  
E2  
CLK  
D1  
A3  
A2  
CC  
SuperSpeed and HighSpeed Lines  
GND  
Document Number: 001-93912 Rev. *N  
Page 14 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 13. Passive EMCA Application – Single EZ-PD CCG2 Per Plug (VCONN range between 4.0V to 5.5V)  
Type-C  
Plug  
Type-C  
Plug  
VBUS  
VCONN  
VCONN  
1uF  
1uF  
E3  
VDDD  
E1  
VDDIO  
E3  
VDDD  
E1  
VDDIO  
E4  
D3  
C4  
VCONN1  
GPIO  
VCONN2  
C4  
D3  
E4  
VCONN2  
GPIO  
VCONN1  
0.1uF  
0.1uF  
C3  
A1  
C2  
D2  
GPIO  
C3  
A1  
GPIO  
GPIO  
C2  
D2  
GPIO  
GPIO  
GPIO  
VCCD  
1uF  
VDDIO  
VCCD  
1uF  
VDDIO  
B2  
A4  
B4  
GPIO  
B2  
A4  
B4  
CCG2  
GPIO  
CCG2  
4.7k  
CC2  
CC1  
4.7k  
B1  
D4  
C1  
CC2  
CC1  
XRES  
VSS  
B1  
D4  
C1  
XRES  
VSS  
B3  
VSS  
RD1  
B3  
VSS  
RD1  
I2C_0 I2C_0  
_SCL _SDA  
SWD_ SWD_  
IO  
E2  
I2C_0 I2C_0  
_SCL _SDA  
SWD_ SWD_  
IO  
E2  
CLK  
D1  
CLK  
D1  
A3  
A2  
A3  
A2  
CC  
SuperSpeed and HighSpeed Lines  
GND  
Figure 14. Passive EMCA Application – Single EZ-PD CCG2 Per Plug (VCONN range between 2.7V to 5.5V)  
Type-C Plug  
Type-C Plug  
VBUS  
VCONN2  
VCONN1  
1uF  
1uF  
B1  
A2  
B1  
VDDD  
A2  
VDDD  
VDDIO  
D2  
A1  
VDDIO  
VCONN2  
VCONN1  
A1  
D2  
VCONN2  
VCONN1  
0.1uF  
C2  
B2  
GPIO  
GPIO  
0.1uF  
C2  
B2  
GPIO  
GPIO  
D1  
D3  
CCG2  
VCCD  
XRES  
D1  
D3  
1uF  
CCG2  
VCCD  
XRES  
C3  
D4  
1uF  
CC2  
CC1  
C3  
D4  
CC2  
CC1  
B3  
C1  
VSS  
RD1  
B3  
C1  
VSS  
RD1  
SWD_CLK  
A4  
I2C_SCL  
B4  
SWD_IO  
A3  
I2C_SDA  
C4  
I2C_SCL  
B4  
SWD_CLK  
A4  
I2C_SDA SWD_IO  
C4 A3  
CC  
SuperSpeed and HighSpeed Lines  
GND  
Document Number: 001-93912 Rev. *N  
Page 15 of 41  
EZ-PD™ CCG2 Datasheet  
Upstream Facing Port Applications  
Figure 15 shows a CCG2 device being used in a UFP application (tablet with a Type-C port) only as a power consumer.  
The Type-C receptacle brings in HighSpeed and SuperSpeed lines, which are connected directly to the applications processor. The  
VBUS line from the Type-C receptacle goes directly to the UFP (tablet) charger circuitry. The applications processor communicates  
over the I2C signal with the CCG2 device, and the CC1 and CC2 lines from the Type-C receptacle are connected directly to the  
respective CC1/2 pins of the CCG2 device.  
Figure 15. Upstream Facing Port (UFP) Application – Tablet with a Type-C Port  
Charger  
VBUS  
5.0 V  
1.8 V  
1 uF  
1 uF  
E3  
VDDD  
E1  
VDDIO  
C4  
D3  
C2  
D2  
B2  
A4  
VCONN2  
VCONN1  
SWD_IO  
SWD_CLK  
GPIO  
GPIO  
E4  
E2  
1.8 V  
GPIO  
GPIO  
GPIO  
CC2  
D1  
4.7 kΩ  
4.7 kΩ  
CCG2  
Type-C  
Receptacle  
INT  
C3  
A3  
A2  
B4  
B3  
I2C_0_SCL  
CC1  
Application  
Processor  
390 pF  
1.8 V  
390 pF  
I2C_0_SDA  
RD1  
VSS  
D4  
VSS  
C1  
VCCD XRES  
A1  
B1  
4.7 kΩ  
1 uF  
HighSpeed Lines  
SuperSpeed Lines  
Application  
Processor/  
Graphics  
Controller  
Notebook Applications  
mode) or the DisplayPort Chipset (during Alternate Mode). The  
SBU lines, SuperSpeed and HighSpeed lines are routed directly  
from the Display Mux of the notebook to the Type-C receptacle.  
Figure 16 shows a Notebook DRP application diagram using a  
CCG2 device. CCG2 is not recommended for new designs for  
the PC and notebook applications. CCG4, CCG5, CCG5C,  
CCG6DF, CCG6SF devices are more suited for notebook appli-  
cations. The below section is just maintained for legacy  
purposes.  
Optional FETs are provided for applications that need to provide  
power for accessories and cables using the VCONN pin of the  
Type-C receptacle. VBUS FETs are also used for providing  
power over VBUS and for consuming power over VBUS. A  
VBUS_DISCHARGE FET controlled by CCG2 device is used to  
quickly discharge VBUS after the Type-C connection is  
detached.  
The Type-C port can be used as a power provider or a power  
consumer. The CCG2 device communicates with the Embedded  
controller (EC) over I2C. It also controls the Data Mux to route  
the High Speed signals either to the USB chipset (during normal  
Document Number: 001-93912 Rev. *N  
Page 16 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 16. Dual Role Port (DRP) Application (Not Recommended for New Designs)  
VBUS FETs for  
CONSUMER PATH  
VBUS_SINK  
CHARGER  
VBUS_C_CTRL  
VBUS  
(5-20V)  
VBUS FETs for  
PROVIDER PATH  
VBUS_SOURCE  
VBUS  
DC/DC  
3.3V  
VDDIO  
VBUS_P_CTRL  
1uF  
5
1uF  
VBUS_P_CTRL  
15  
18  
22  
21  
24  
1
VCONN1  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
CC2  
VBUS_DISCHARGE  
5.0V  
5.0V  
VBUS_C_CTRL  
VDDIO  
4
11  
VCONN2  
SWD_IO  
SWD_CLK  
GPIO  
VBUS_DISCHARGE  
CC2_VCONN_CTRL  
CC1_VCONN_CTRL  
2.2kΩ  
OPTIONAL  
12  
FETS for DFPs  
SUPPORTING  
VCONN  
2.2kΩ  
I2C_INT  
2.2kΩ  
Type-C  
Receptacle  
CCG2  
24-QFN  
14  
20  
CC2  
I2C_0_SCL  
I2C_0_SDA  
XRES  
Embedded  
Controller  
19  
2
CC1  
CC1  
VBUS  
4.7kΩ  
VDDIO  
16  
3
RD1  
390pF  
390pF  
100kΩ  
EPAD  
17  
VBUS_MON  
VSS  
GPIO  
10kΩ  
D+/-  
HPD  
USB  
Chipset  
SS  
SS  
DP/DN  
D+/-  
HS/SS/DP/  
SBU Lines  
SDA  
SCL  
DisplayPort  
Chipset  
GND  
HPD  
SS  
Data Mux  
DP0/1/2/3  
AUX+/-  
Document Number: 001-93912 Rev. *N  
Page 17 of 41  
EZ-PD™ CCG2 Datasheet  
detect undervoltage and overvoltage conditions on VBUS. To  
ensure quick discharge of VBUS when the power adapter cable  
is detached, a discharge path is also provided.  
Downstream Facing Port Applications  
Figure 17 shows a CCG2 receptacle-based Power Adapter  
application in which the CCG2 device is used as a DFP. CCG2  
integrates all termination resistors and uses GPIOs (VSEL_0  
and VSEL_1) to indicate the negotiated power profile. The VBUS  
voltage on the Type-C port is monitored using internal ADC to  
For downstream facing port applications, CCG3PAoffers a much  
more integrated solution and depending on the customer’s appli-  
cation, it may result in additional BoM cost savings. Please refer  
to the CCG3PA datasheet for more information.  
Figure 17. Downstream Facing Port (DFP) Application  
DC/DC  
OR  
VBUS  
(5-20V)  
VSEL_1  
VSEL_0  
VBUS_IN  
AC-DC  
SECONDARY  
(5-20V)  
OPTIONAL VDDIO  
SUPPLY. CAN SHORT  
TO VDDD IN SINGLE  
SUPPLY SYSTEMS  
3.3V  
VDDIO  
VBUS_P_CTRL  
1uF  
5
1uF  
VBUS_P_CTRL  
VSEL_1 and VSEL_0  
15  
18  
22  
21  
24  
1
VCONN1  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
CC2  
CONTROL THE SECONDARY  
SIDE OF AN AC-DC OR A DC-DC  
TO SELECT THE VOLTAGE ON  
VBUS_IN. AN EXAMPLE IS  
SHOWN BELOW:  
VBUS_DISCHARGE  
5.0V  
4
11  
VCONN2  
SWD_IO  
SWD_CLK  
GPIO  
Type-C  
Receptacle  
5.0V  
VBUS_DISCHARGE  
CC2_VCONN_CTRL  
VSEL_1  
VSEL_0  
VBUS_IN  
5V  
OPTIONAL  
FETS for DFPs  
SUPPORTING  
VCONN  
0
0
1
1
0
1
0
1
12  
9V  
15V  
20V  
CCG2  
24-QFN  
CC1_VCONN_CTRL  
14  
VSEL_1  
VSEL_0  
20  
GPIO  
19  
2
GPIO  
CC1  
VBUS  
4.7kΩ  
VDDIO  
16  
3
390pF  
390pF  
XRES  
RD1  
100kΩ  
VBUS_MON  
EPAD  
17  
VSS  
GPIO  
10kΩ  
Document Number: 001-93912 Rev. *N  
Page 18 of 41  
EZ-PD™ CCG2 Datasheet  
users of any Notebook that implements USB-Type C to connect  
to other display types.  
C-HDMI Dongle Application  
CCG2 is not recommended for new designs of Type-C to video  
dongles. CCG3 offers a much more integrated solution for this  
application and also supports PD3.0. Please refer to the CCG3  
datasheet for more details.This section is just maintained for  
legacy purposes only.  
This application has a Type-C plug on one end and the legacy  
video (HDMI/DVI/VGA) receptacle on the other end. This appli-  
cation meets the requirements described in Section 4.3 of the  
VESA DisplayPort Alt Mode on USB Type-C Standard Version  
1.0. This application supports display output at a resolution of up  
to 4K Ultra HD (3840x2160) at 60 Hz. It also supports the USB  
Billboard Device Class, which is required by the USB PD speci-  
fication for enumeration of any accessories that support  
Alternate Mode when connected to a host PC.  
Figure 18 shows a USB Type-C to HDMI/DVI/VGAadapter appli-  
cation, which enables connectivity between a PC that supports  
a Type-C port with DisplayPort Alternate Mode support and a  
legacy monitor that has HDMI/DVI/VGA interface. It enables  
Figure 18. USB Type-C to HDMI/DVI/VGA Dongle Application Diagram  
5V  
VBUS_VCONN  
1.2V  
3.3V  
VBUS  
Power OR  
BuckBoost  
Regulator  
VCONN  
D+/-  
VBUS  
USB-Billboard  
CY7C65210  
XRES INT SDA SCL  
3.3V  
2.2k5%  
2.2k5%  
VBUS  
VBUS_VCONN VCONN  
2.2k5%  
18  
10 13  
22  
P1.7 P2.1 P1.3 P1.0  
14  
16  
5
HDMI/DVI/  
VGA  
Receptacle  
4
100KΩ, 1%  
10KΩ, 1%  
P1.4  
VCONN2  
Type-C  
Plug  
4.7KΩ  
17  
XRES  
0.1µF  
P1.6  
1µF  
12  
11  
VCONN1  
SWD_CLK  
SWD_IO  
CYPD2119  
6
VDDD1  
VDDD2  
VDDIO  
CC1  
3.3V  
9
21  
23  
P2.0  
P2.2  
24QFN  
8
1µF  
2
7
VCCD  
CC  
3
RD1  
1µF  
1
CC2  
EPAD  
P0.1  
20  
P1.5  
15  
P2.3:P0.0  
[24:19]  
HotPlug Detect  
1.2V  
3.3V  
DP to HDMI/  
DVI/VGA  
Convertor  
SBU_1/2  
SW for AUX  
Display Port  
Data Lanes  
Document Number: 001-93912 Rev. *N  
Page 19 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 19 shows a Type-C plug on one end and a DP/mDP plug  
on the other end. The application meets the requirements  
described in Section 4.2 of the VESA DisplayPort Alt Mode on  
USB Type-C Standard Version 1.0 (Scenarios 2a and 2b USB  
Type-C to DisplayPort Cables). It also supports the USB  
Billboard Device Class, which is required by the USB PD speci-  
fication for enumeration of any accessories that support  
Alternate Mode when connected to a host PC.  
C-DisplayPort Dongle Application  
CCG2 is not recommended for new designs of Type-C to video  
dongles. CCG3 offers a much more integrated solution for this  
application and also supports PD3.0. Please refer to the CCG3  
datasheet for more details.This section is just maintained for  
legacy purposes only.  
Figure 19 shows a USB Type-C to DisplayPort adapter appli-  
cation, which enables connectivity between a PC that supports  
a Type-C port with DisplayPort Alternate Mode support and a  
legacy monitor that has a DisplayPort interface.  
Figure 19. USB Type-C to Display Port Application Diagram  
Paddle Card  
VBUS_VCONN  
Power OR  
VBUS  
VCONN  
VBUS  
D+/-  
USB-Billboard  
CY7C65210  
XRES INT SDA SCL  
VBUS_VCONN  
2.2k5%  
2.2k5%  
VBUS  
2.2k5%  
18  
10 13  
22  
P1.7 P2.1 P1.3 P1.0  
14  
16  
5
4
100KΩ, 1%  
P1.4  
VCONN2  
Type-C  
Plug  
mDP/  
DP  
VCONN  
4.7KΩ  
17  
XRES  
P1.6  
12  
11  
VCONN1  
SWD_CLK  
SWD_IO  
CYPD2120  
10KΩ, 1%  
0.1µF  
6
VDDD1  
VDDD2  
VDDIO  
CC1  
VBUS_VCONN  
9
21  
23  
P2.0  
P2.2  
24QFN  
8
1µF  
2
7
VCCD  
CC  
3
RD1  
1µF  
1
CC2  
EPAD  
P0.1  
20  
P1.5  
15  
P2.3:P0.0  
[24:19]  
HotPlug Detect  
AUX_P/N  
SBU_1/2  
Display Port  
Data Lanes  
SW for AUX  
Display Port  
Data Lanes  
Document Number: 001-93912 Rev. *N  
Page 20 of 41  
EZ-PD™ CCG2 Datasheet  
Provides up to 45 W (15 V at 3A) on the Upstream Type-C port and up to 15 W  
(5 V at 3A) on the Downstream USB Type-C port  
Dock/Monitor Application  
CCG2 is not recommended for new designs of docks/monitors. CCG4 offers a much  
more integrated solution for this application and also supports PD3.0. Please refer  
to the CCG4 datasheet more details.This section is just maintained for legacy  
purposes only.  
Provides simultaneous 4K display output with USB 3.1 Gen 1 on the USB Type-A  
port  
Four-lane display on the DisplayPort connector  
Multi-Stream support on DisplayPort and Downstream Type-C port  
USB 3.1 Gen 1 hub for USB port expansion  
Figure 20 shows a CCG2 Monitor/Dock application diagram. It enables connectivity  
between a USB Type-C host system on the Upstream port and multiple Display/Data  
devices on the Downstream port. This application has a USB Type-C receptacle on  
the Upstream port, which supports data, power, and display. On the Downstream  
port, this application supports: USB Type-A, Gigabit Ethernet, DisplayPort, and USB  
Type-C receptacle.  
Gigabit Ethernet using RJ45 connector  
Supports firmware upgrade of CCG2 controllers, HX3 Hub controller, and Billboard  
controller  
The main features of this solution are:  
Powered from an external 24-V DC power adapter  
Figure 20. CCG2 in Dock/Monitor Application Diagram  
5-20V  
DS_I2C_INT  
5.0V  
VSEL_0  
VSEL_1  
3.3V  
5-20V 5V  
1.2V  
VBUS_DS  
Regulator  
Power In  
Brick  
100KΩ  
VBUS_US  
5V  
Power  
INT2  
100KΩ  
USB-Billboard  
CY7C65210  
INT1 SDA SCL  
Discharge  
NFET  
DS_VBUS_DIS  
HS_DS2  
1KΩ  
100Ω  
3.3V  
US_VBUS_P_CTRL  
1KΩ  
Discharge  
NFET  
2.2k5%  
US_VBUS_DIS  
US_VBUS_P_CTRL  
100KΩ  
I2C Slave  
VCONN  
2.2k5%  
100KΩ  
100KΩ  
100KΩ  
3.3V  
2.2k5%  
200KΩ  
2.2k5%  
14 19  
20  
20  
19 22  
24  
2.2k5%  
2.2k5%  
2.2k5%  
13  
13  
Cypress USB3.0 HUB  
P1.4 P0.0 P0.1 P1.3  
P1.3 P0.1 P0.0 P2.1 P2.3  
Type-C  
to  
Device  
15  
5
15  
5
I2C Master  
I2C Master  
P1.5  
10  
18  
24  
21  
P1.5  
10  
18  
P1.0  
P1.7  
P2.3  
P2.0  
VCONN2  
P1.0  
P1.7  
3.3V  
3.3V  
Type-C  
to  
Notebook  
VCONN  
100KΩ  
VSEL_0  
VSEL_1  
VCONN1  
VDDIO  
VCONN1  
VDDIO  
VBUS  
VBUS  
8
8
USB Type-A  
Receptacle  
HUB_VBUS_US  
6
6
4
0.1µF  
1µF  
VDDD1  
VDDD2  
VDDD1  
VDDD2  
1µF  
0.1µF  
VCONN2  
4
DRP  
DFP  
9
9
100KΩ, 1%  
10KΩ, 1%  
100KΩ, 1%  
CYPD2121  
24QFN  
CYPD2125  
24QFN  
200KΩ  
16  
2
17  
11  
7
16  
3
17  
11  
7
DS1  
HS_DS2  
DS3  
HS_DS4  
SS_DS4  
P1.6  
P1.6  
XRES  
CC1  
RD1  
CC2  
P2.1  
XRES  
RD1  
CC1  
CC2  
P2.0  
HUB_VBUS_US  
0.1µF  
0.1µF  
USB  
SWD_IO_P1.1  
VCCD  
Ethernet GX3  
CYUSB3610-  
68LTXC  
SWD_IO  
VCCD  
10KΩ, 1%  
USB D+/-  
Hub  
CC1  
CC2  
CC1  
CC2  
3
2
CYUSB3304  
-68LTXC  
SS Data Lines  
1µF  
1µF  
1
1
EPAD  
P2.2  
23  
EPAD  
22  
21  
US_VBUS_DIS  
P2.2 P1.4 SWD_CLK  
14  
12  
SWD_CLK_P1.2  
12  
DS_HotPlug Detect  
23  
HotPlug Detect  
DS_HotPlug Detect  
USB D+/-  
SBU_1/2  
HS_DS4  
HPD  
SCL SDA  
SDA SCL  
HPD  
DP2  
DP  
Port  
SS Data Lines_1  
SS Data Lines_2  
Type-C Mux  
Type-C Mux  
SS_DS4  
SS Data Lanes  
DP  
Spliter  
DP2  
CCG2 connected on the Downstream Port  
CCG2 connected on the Upstream Port  
Document Number: 001-93912 Rev. *N  
Page 21 of 41  
EZ-PD™ CCG2 Datasheet  
Electrical Specifications  
Absolute Maximum Ratings  
Table 2. Absolute Maximum Ratings[1]  
Parameter  
VDDD_MAX  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Digital supply relative to VSS  
Max supply voltage relative to VSS  
Max supply voltage relative to VSS  
Max supply voltage relative to VSS  
GPIO voltage  
–0.5  
6
V
V
V
V
V
Absolute max  
Absolute max  
Absolute max  
Absolute max  
Absolute max  
VCONN1_MAX  
VCONN2_MAX  
VDDIO_MAX  
VGPIO_ABS  
6
6
6
–0.5  
VDDIO + 0.5  
Absolute max voltage for CC1 and  
CC2 pins  
VCC_ABS  
6
V
Absolute max  
Absolute max  
IGPIO_ABS  
IGPIO_injection  
Maximum current per GPIO  
–25  
–0.5  
25  
0.5  
mA  
mA  
GPIO injection current, Max for  
VIH > VDDD, and Min for VIL < VSS  
Absolute max, current  
injected per pin  
Electrostatic discharge human  
body model  
ESD_HBM  
2200  
V
Electrostatic discharge charged  
device model  
ESD_CDM  
LU  
500  
V
Pin current for latch-up  
–200  
200  
mA  
Contact discharge on  
CC1, CC2, VCONN1, and  
VCONN2 pins  
Electrostatic discharge  
IEC61000-4-2  
ESD_IEC_CON  
ESD_IEC_AIR  
8000  
V
V
Air discharge for pins  
CC1, CC2, VCONN1, and  
VCONN2  
Electrostatic discharge  
IEC61000-4-2  
15000  
Note  
1. Usage above the absolute maximum conditions listed in Table 2 may cause permanent damage to the device. Exposure to absolute maximum conditions for extended  
periods of time may affect device reliability. The maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High Temperature  
Storage Life. When used below absolute maximum conditions but above normal operating conditions, the device may not operate to specification.  
Document Number: 001-93912 Rev. *N  
Page 22 of 41  
EZ-PD™ CCG2 Datasheet  
Device Level Specifications  
All specifications are valid for –40 °C TA 85 °C and TJ 100 °C, except where noted. Specifications are valid for 3.0 V to 5.5 V,  
except where noted.  
Table 3. DC Specifications  
Spec ID  
Parameter  
Description  
Power supply input voltage  
Power supply input voltage  
Power supply input voltage  
Power supply input voltage  
GPIO power supply  
Min  
2.7  
3.0  
4.0  
4.0  
1.71  
Typ  
Max  
5.5  
5.5  
5.5  
5.5  
5.5  
Units  
Details/Conditions  
UFP Applications  
SID.PWR#1  
VDDD  
V
V
V
V
V
V
SID.PWR#1_A VDDD  
DFP/DRP Applications  
SID.PWR#23  
VCONN1  
SID.PWR#23_A VCONN2  
SID.PWR#13  
SID.PWR#24  
VDDIO  
VCCD  
Output voltage (for core logic)  
1.8  
Externalregulatorvoltagebypasson  
VCCD  
SID.PWR#15  
SID.PWR#16  
SID.PWR#25  
CEFC  
CEXC  
1
1.3  
1
1.6  
µF  
µF  
µF  
X5R ceramic or better  
X5R ceramic or better  
X5R ceramic or better  
Power supply decoupling capacitor  
on VDDD  
Power Supply Decoupling Capacitor  
on VCONN1 and VCONN2  
0.1  
Active Mode, VDDD = 2.7 to 5.5 V. Typical values measured at VDD = 3.3 V.  
VCONN1 or VCONN2 = 5 V,  
TA = 25 °C,  
CC I/O IN Transmit or  
Receive, RA disconnected,  
no I/O sourcing current, CPU  
at 12 MHz  
SID.PWR#12  
IDD12  
Supply current  
7.5  
2.0  
mA  
mA  
Sleep Mode, VDDD = 2.7 to 5.5 V  
VDDD = 3.3 V, TA = 25 °C, all  
I2C wakeup. WDT ON. IMO at  
48 MHz  
blocks except CPU are ON,  
CC I/O ON, no I/O sourcing  
current  
SID25A  
IDD20A  
3.0  
Deep Sleep Mode, VDDD = 2.7 to 3.6 V (Regulator on)  
VCONN1, VCONN2 = 5 V,  
TA = 25 °C.  
RA termination disabled on  
VCONN1 and VCONN2, see  
SID.PD.7.  
VCONN1 = 5.0, RA termination  
disabled  
SID_DS_RA  
IDD_DS_RA  
100  
µA  
VCONN leaker circuits  
turned off during deep sleep  
RA switch disabled on  
VDDD = 2.7 to 3.6 V. I2C wakeup and  
WDT ON  
VCONN1 and VCONN2  
.
SID34  
IDD29  
50  
µA  
µA  
VDDD = 3.3 V, TA = 25 °C  
Power source = VDDD  
,
Type-C not attached, CC  
enabled for wakeup, RP  
disabled  
SID_DS  
IDD_DS  
VDDD = 2.7 to 3.6 V. CC wakeup ON  
Supply current while XRES asserted  
2.5  
XRES Current  
SID307  
IDD_XR  
1
10  
µA  
Document Number: 001-93912 Rev. *N  
Page 23 of 41  
EZ-PD™ CCG2 Datasheet  
Table 4. AC Specifications  
Spec ID  
Parameter  
Description  
CPU frequency  
Min  
Typ  
Max  
Units  
Details/Conditions  
SID.CLK#4  
FCPU  
DC  
48  
MHz  
3.0 V VDDD 5.5 V  
Guaranteed by  
characterization  
SID.PWR#20  
TSLEEP  
Wakeup from sleep mode  
0
µs  
24-MHz IMO.  
Guaranteed by charac-  
SID.PWR#21  
TDEEPSLEEP Wakeup from Deep Sleep mode  
35  
µs  
terization  
Guaranteed by  
characterization  
SID.XRES#5  
SYS.FES#1  
I/O  
TXRES  
External reset pulse width  
5
5
µs  
Power-up to “Ready to accept I2C /  
CC command”  
Guaranteed by  
characterization  
T_PWR_RDY  
25  
ms  
Table 5. I/O DC Specifications  
Spec ID  
SID.GIO#37  
SID.GIO#38  
SID.GIO#39  
SID.GIO#40  
SID.GIO#41  
SID.GIO#42  
Parameter  
Description  
Min  
Typ  
Max  
Units Details/Conditions  
[2]  
VIH  
Input voltage HIGH threshold  
Input voltage LOW threshold  
LVTTL input, VDDIO < 2.7 V  
LVTTL input, VDDIO < 2.7 V  
LVTTL input, VDDIO 2.7 V  
LVTTL input, VDDIO 2.7 V  
0.7 × VDDIO  
V
V
V
V
V
V
CMOS input  
VIL  
VIH  
VIL  
VIH  
VIL  
0.3 × VDDIO  
CMOS input  
[2]  
[2]  
0.7× VDDIO  
2.0  
0.3 × VDDIO  
0.8  
IOH = 4 mA at 3-V  
VDDIO  
SID.GIO#33  
SID.GIO#34  
SID.GIO#35  
VOH  
VOH  
VOL  
Output voltage HIGH level  
Output voltage HIGH level  
Output voltage LOW level  
VDDIO – 0.6  
VDDIO – 0.5  
V
V
V
IOH = 1 mA at 1.8-V  
VDDIO  
IOL = 4 mA at 1.8-V  
VDDIO  
0.6  
SID.GIO#36  
SID.GIO#5  
SID.GIO#6  
VOL  
Output voltage LOW level  
Pull-up resistor  
0.6  
8.5  
8.5  
V
IOL = 8 mA at 3 V VDDIO  
RPULLUP  
3.5  
3.5  
5.6  
5.6  
kΩ  
kΩ  
RPULLDOWN Pull-down resistor  
25 °C, VDDIO = 3.0  
nA V.Guaranteed by  
characterization  
Input leakage current (absolute  
value)  
SID.GIO#16  
SID.GIO#17  
SID.GIO#43  
IIL  
2
7
Guaranteed by  
pF  
CIN  
Input capacitance  
characterization  
VDDIO 2.7 V.  
mV Guaranteed by  
characterization.  
VHYSTTL  
Input hysteresis LVTTL  
Input hysteresis CMOS  
25  
40  
Guaranteed by  
mV  
SID.GPIO#44 VHYSCMOS  
0.05 × VDDIO  
characterization  
Current through protection diode to  
VDDIO/Vss  
Guaranteed by  
µA  
SID69  
IDIODE  
100  
200  
characterization  
Maximum total source or sink chip  
current  
Guaranteed by  
mA  
SID.GIO#45  
ITOT_GPIO  
characterization  
Note  
2.  
V
must not exceed V  
+ 0.2 V.  
IH  
DDIO  
Document Number: 001-93912 Rev. *N  
Page 24 of 41  
EZ-PD™ CCG2 Datasheet  
Table 6. I/O AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID70  
Parameter  
TRISEF  
Description  
Min  
2
Typ  
Max  
12  
Units  
ns  
Details/Conditions  
3.3-V VDDIO, Cload = 25 pF  
3.3-V VDDIO, Cload = 25 pF  
Rise time  
Fall time  
SID71  
TFALLF  
2
12  
ns  
XRES  
Table 7. XRES DC Specifications  
Spec ID  
Parameter  
VIH  
Description  
Min  
Typ  
Max Units  
Details/Conditions  
0.7 ×  
VDDIO  
SID.XRES#1  
Input voltage HIGH threshold  
V
V
CMOS input  
0.3 ×  
VDDIO  
SID.XRES#2  
SID.XRES#3  
SID.XRES#4  
VIL  
Input voltage LOW threshold  
Input capacitance  
CMOS input  
Guaranteed by  
characterization  
CIN  
7
pF  
0.05 ×  
VDDIO  
VHYSXRES  
Input voltage hysteresis  
mV Guaranteed by characterization  
Digital Peripherals  
The following specifications apply to the Timer/Counter/PWM peripherals in the Timer mode.  
Pulse Width Modulation (PWM) for GPIO Pins  
Table 8. PWM AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID.TCPWM.3  
SID.TCPWM.4  
Parameter  
Description  
Min  
Typ  
Fc  
Max  
Units  
Details/Conditions  
Fc max = CLK_SYS. Maximum  
= 48 MHz.  
TCPWMFREQ Operating frequency  
MHz  
ns  
TPWMENEXT Input trigger pulse width  
2/Fc  
For all Trigger Events  
Minimum possible width of  
Overflow, Underflow, and CC  
(Counter equals Compare  
value) outputs  
SID.TCPWM.5  
TPWMEXT  
Output trigger pulse width  
2/Fc  
ns  
Minimum time between  
successive counts  
SID.TCPWM.5A TCRES  
SID.TCPWM.5B PWMRES  
SID.TCPWM.5C QRES  
Resolution of counter  
PWM resolution  
1/Fc  
1/Fc  
1/Fc  
ns  
ns  
ns  
Minimum pulse width of PWM  
output  
Minimum pulse width between  
quadrature-phase inputs  
Quadrature inputs resolution  
Document Number: 001-93912 Rev. *N  
Page 25 of 41  
EZ-PD™ CCG2 Datasheet  
I2C  
Table 9. Fixed I2C DC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID149  
Parameter  
II2C1  
Description  
Min Typ Max Units  
Details/Conditions  
Block current consumption at 100 kbps  
Block current consumption at 400 kbps  
Block current consumption at 1 Mbps  
I2C enabled in Deep Sleep mode  
60  
µA  
µA  
µA  
µA  
SID150  
SID151  
SID152  
II2C2  
II2C3  
II2C4  
185  
390  
1.4  
Table 10. Fixed I2C AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID153  
Parameter  
FI2C1  
Description  
Min  
Typ Max Units  
Mbps –  
Details/Conditions  
Details/Conditions  
Bit rate  
1
UART  
Table 11. Fixed UART DC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID160  
SID161  
Parameter  
Description  
Min Typ  
Max Units  
Block current consumption at  
100 Kbps  
Guaranteed by  
characterization  
IUART1  
125  
312  
µA  
µA  
Block current consumption at  
1000 Kbps  
Guaranteed by  
characterization  
IUART2  
Table 12. Fixed UART AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID162  
SPI  
Parameter  
Description  
Min  
Typ  
Max Units  
Details/Conditions  
Guaranteed by  
characterization  
FUART  
Bit rate  
1
Mbps  
Table 13. Fixed SPI DC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID163  
Parameter  
ISPI1  
ISPI2  
ISPI3  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Guaranteed by  
characterization  
Block current consumption at 1 Mbps  
360  
µA  
Guaranteed by  
characterization  
SID164  
SID165  
Block current consumption at 4 Mbps  
Block current consumption at 8 Mbps  
560  
600  
µA  
µA  
Guaranteed by  
characterization  
Table 14. Fixed SPI AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID166  
Parameter  
FSPI  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SPI Operating frequency (Master; 6X  
oversampling)  
Guaranteed by  
characterization  
8
MHz  
Document Number: 001-93912 Rev. *N  
Page 26 of 41  
EZ-PD™ CCG2 Datasheet  
Table 15. Fixed SPI Master Mode AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID167  
Parameter  
TDMO  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
MOSI Valid after SClock driving  
edge  
Guaranteed by  
characterization  
15  
ns  
Full clock, late MISO  
sampling.Guaranteed  
by characterization  
MISO Valid before SClock  
capturing edge  
SID168  
SID169  
TDSI  
20  
0
ns  
ns  
Referred to Slave  
capturing edge.  
Guaranteed by  
characterization  
THMO  
Previous MOSI data hold time  
Table 16. Fixed SPI Slave Mode AC Specifications  
(Guaranteed by Characterization)  
Spec ID  
SID170  
Parameter  
TDMI  
Description  
Min  
Typ  
Max  
Units Details/Conditions  
MOSI Valid before Sclock  
Capturing edge  
Guaranteed by  
ns  
40  
characterization  
TCPU = 1/FCPU.  
Guaranteed by  
characterization.  
MISO Valid after Sclock driving  
edge  
42 + (3 ×  
SID171  
TDSO  
ns  
TCPU  
48  
)
MISO Valid after Sclock driving  
edge in Ext Clk mode  
Guaranteed by  
characterization  
SID171A  
SID172  
TDSO_EXT  
THSO  
0
ns  
ns  
ns  
Guaranteed by  
characterization  
Previous MISO data hold time  
Guaranteed by  
characterization  
SID172A  
TSSELSCK  
SSEL Valid to first SCK Valid edge 100  
Memory  
Table 17. Flash AC Specifications  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Row (block) write time (erase and  
program)  
Row (block) =  
128 bytes  
[3]  
SID.MEM#4 TROWWRITE  
20  
ms  
[3]  
SID.MEM#3 TROWERASE  
Row erase time  
13  
7
ms  
ms  
ms  
[3]  
SID.MEM#8 TROWPROGRAM  
Row program time after erase  
Bulk erase time (32 KB)  
[3]  
SID178  
TBULKERASE  
35  
Guaranteed by  
characterization  
[3]  
SID180  
TDEVPROG  
Total device program time  
Flash endurance  
100 K  
20  
7.5  
seconds  
cycles  
years  
Guaranteed by  
characterization  
SID181  
SID182  
SID182A  
FEND  
Flash retention. TA 55 °C, 100 K  
P/E cycles  
Guaranteed by  
characterization  
FRET1  
FRET2  
Flash retention. TA 85 °C, 10 K  
P/E cycles  
Guaranteed by  
characterization  
10  
years  
Note  
3. It can take as much as 20 milliseconds to write to Flash. During this time the device should not be Reset, or Flash operations will be interrupted and cannot be relied  
on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs.  
Make certain that these are not inadvertently activated.  
Document Number: 001-93912 Rev. *N  
Page 27 of 41  
EZ-PD™ CCG2 Datasheet  
System Resources  
Power-on-Reset (POR) with Brown Out  
Table 18. Imprecise Power On Reset (PRES)  
Spec ID  
SID185  
Parameter  
VRISEIPOR  
Description  
Rising trip voltage  
Min  
Typ  
Max  
Units  
Details/Conditions  
Guaranteed by  
characterization  
0.80  
1.50  
V
Guaranteed by  
characterization  
SID186  
VFALLIPOR  
Falling trip voltage  
0.75  
1.4  
V
Table 19. Precise Power On Reset (POR)  
Spec ID Parameter  
SID190 VFALLPPOR  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
BOD trip voltage in active and  
sleep modes  
Guaranteed by  
characterization  
1.48  
1.62  
V
Guaranteed by  
characterization  
SID192  
VFALLDPSLP  
BOD trip voltage in Deep Sleep  
1.1  
1.5  
V
SWD Interface  
Table 20. SWD Interface Specifications  
Spec ID Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
SWDCLK 1/3 CPU  
SID.SWD#1 F_SWDCLK1  
SID.SWD#2 F_SWDCLK2  
3.3 V VDDIO 5.5 V  
14  
MHz  
clock frequency  
SWDCLK 1/3 CPU  
clock frequency  
1.8 V VDDIO 3.3 V  
7
MHz  
ns  
Guaranteed by  
characterization  
SID.SWD#3 T_SWDI_SETUP T = 1/f SWDCLK  
SID.SWD#4 T_SWDI_HOLD T = 1/f SWDCLK  
0.25 × T  
Guaranteed by  
characterization  
0.25 × T  
0.5 × T  
ns  
Guaranteed by  
characterization  
SID.SWD#5 T_SWDO_VALID T = 1/f SWDCLK  
SID.SWD#6 T_SWDO_HOLD T = 1/f SWDCLK  
Internal Main Oscillator  
1
ns  
Guaranteed by  
characterization  
ns  
Table 21. IMO DC Specifications  
(Guaranteed by Design)  
Spec ID  
SID218  
Parameter  
IIMO  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
IMO operating current at 48 MHz  
1000  
µA  
Table 22. IMO AC Specifications  
Spec ID Parameter  
SID.CLK#13 FIMOTOL  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Frequency variation at 24, 36,  
and 48 MHz (trimmed)  
±2  
%
Guaranteed by  
characterization  
SID226  
TSTARTIMO  
IMO startup time  
7
µs  
Guaranteed by  
characterization  
SID229  
FIMO  
TJITRMSIMO  
RMS jitter at 48 MHz  
IMO frequency  
145  
ps  
24  
48  
MHz  
Document Number: 001-93912 Rev. *N  
Page 28 of 41  
EZ-PD™ CCG2 Datasheet  
Internal Low-Speed Oscillator  
Table 23. ILO DC Specifications  
(Guaranteed by Design)  
Spec ID  
SID231  
SID233  
Parameter  
IILO  
IILOLEAK  
Description  
Min  
Typ  
0.3  
2
Max  
1.05  
15  
Units  
µA  
Details/Conditions  
Guaranteed by  
Characterization  
ILO operating current at 32 kHz  
ILO leakage current  
nA  
Guaranteed by Design  
Table 24. ILO AC Specifications  
Spec ID  
Parameter  
TSTARTILO  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
Guaranteed by  
characterization  
SID234  
ILO startup time  
2
ms  
Guaranteed by  
characterization  
SID236  
TILODUTY  
ILO duty cycle  
ILO Frequency  
40  
20  
50  
40  
60  
80  
%
SID.CLK#5 FILO  
kHz  
Power Down  
Table 25. PD DC Specifications  
Spec ID  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Details/Conditions  
DFP CC termination for default  
USB Power  
SID.PD.1 Rp_std  
SID.PD.2 Rp_1.5A  
64  
80  
96  
µA  
DFP CC termination for 1.5A  
power  
166  
180  
194  
µA  
DFP CC termination for 3.0A  
power  
SID.PD.3 Rp_3.0A  
SID.PD.4 Rd  
304  
330  
5.1  
356  
µA  
kΩ  
UFP CC termination  
4.59  
5.61  
All supplies forced to 0 V  
and0.6VappliedatRD1  
or CC2  
UFP Dead Battery CC termi-  
nation on RD1 and CC2  
SID.PD.5 Rd_DB  
SID.PD.6 RA  
4.08  
0.8  
5.1  
1.0  
6.12  
1.2  
kΩ  
kΩ  
M
All supplies forced to 0 V  
and 0.2 V applied at  
VCONN1 or VCONN2  
Power cable termination  
2.7 V applied at VCONN1  
or VCONN2 with RA  
disabled  
Power cable termination -  
Disabled  
SID.PD.7 Ra_OFF  
0.4  
0.75  
SID.PD.8 Rleak_1  
SID.PD.9 Rleak_2  
SID.PD.10 Rleak_3  
SID.PD.11 Rleak_4  
SID.PD.12 Rleak_5  
SID.PD.13 Rleak_6  
VCONN leaker for 0.1-µF load  
VCONN leaker for 0.5-µF load  
VCONN leaker for 1.0-µF load  
VCONN leaker for 2.0-µF load  
VCONN leaker for 5.0-µF load  
VCONN leaker for 10-µF load  
216  
41.2  
19.6  
9.8  
kΩ  
kΩ  
kΩ  
kΩ  
kΩ  
kΩ  
Managed Active Cable  
(MAC) discharge  
4.1  
2.0  
Leaker on VCONN1 and VCONN2  
for discharge upon cable detach  
SID.PD.14 Ileak  
150  
µA  
Document Number: 001-93912 Rev. *N  
Page 29 of 41  
EZ-PD™ CCG2 Datasheet  
Analog-to-Digital Converter  
Table 26. ADC DC Specifications  
Spec ID  
Parameter  
Description  
Min Typ Max Units  
Details/Conditions  
bits Guaranteed by characterization  
LSB Guaranteed by characterization  
LSB Guaranteed by characterization  
LSB Guaranteed by characterization  
SID.ADC.1 Resolution ADC resolution  
8
SID.ADC.2 INL  
SID.ADC.3 DNL  
Integral non-linearity  
Differential non-linearity  
–1.5  
–2.5  
–1  
1.5  
2.5  
1
SID.ADC.4 Gain Error Gain error  
Table 27. ADC AC Specifications  
Spec ID  
Parameter  
Description  
Min Typ Max Units  
Details/Conditions  
Rate of change of sampled voltage  
signal  
SID.ADC.5 SLEW_Max  
3
V/ms Guaranteed by characterization  
Document Number: 001-93912 Rev. *N  
Page 30 of 41  
EZ-PD™ CCG2 Datasheet  
Ordering Information  
The EZ-PD CCG2 part numbers and features are listed in Table 28.  
Table 28. EZ-PD CCG2 Ordering Information  
Type-C Termination  
Part Number  
Application  
Role  
Default FW  
Package  
Ports  
Resistor  
[4]  
CYPD2103-20FNXIT  
CYPD2103-14LHXIT  
CYPD2104-20FNXIT  
Cable  
Cable  
1
1
1
RA  
Cable  
Cable  
20-ball CSP  
14-pin DFN  
20-ball CSP  
EMCA CC Bootloader with  
Application firmware  
[4]  
RA  
Accessory  
RD  
Accessory  
I2C Bootloader Only  
[5]  
EMCA CC Bootloader with  
Application firmware  
[4]  
CYPD2105-20FNXIT  
Active Cable  
1
RA  
Active Cable  
20-ball CSP  
[5]  
I2C Bootloader with Appli-  
cation firmware  
CYPD2119-24LQXIT  
CYPD2120-24LQXIT  
C-DP  
1
1
RD  
UFP  
UFP  
24-pin QFN  
24-pin QFN  
[5]  
C-HDMI  
RD  
Dock/Monitor  
Upstream port  
[5]  
CYPD2121-24LQXIT  
1
RP[6], RD  
DRP  
24-pin QFN  
[5]  
[5]  
[5]  
CYPD2122-20FNXIT  
CYPD2122-24LQXI  
CYPD2122-24LQXIT  
Tablet  
1
1
1
RP[6], RD  
RP[6], RD  
RP[6], RD  
DRP  
DRP  
DRP  
20-ball CSP  
24-pin QFN  
24-pin QFN  
Notebook  
Notebook  
I2C Bootloader Only  
Dock/Monitor  
Downstream port  
[6]  
CYPD2125-24LQXIT  
1
RP  
DFP  
24-pin QFN  
[6]  
CYPD2134-24LQXIT  
CYPD2134-24LQXQT  
DFP  
DFP  
1
1
RP  
DFP  
DFP  
24-pin QFN  
24-pin QFN  
DFP CC Bootloader Only  
[6]  
RP  
Ordering Code Definitions  
X
X
XX  
XX  
X
I
T
2
CY PD  
-
1
T = Tape and Reel  
Temperature Grade:  
I = Industrial (40 °C to 85 °C), Q = Extended Industrial (40 °C to105 °C)  
Pb-free  
Package Type: XX = FN, LH or LQ  
FN = CSP; LH = DFN; LQ = QFN  
Number of pins in the package: XX = 14, 20, or 24  
Device Role: Unique combination of role and termination:  
X = 0 or 1 or 2 or 3 or 4 or 5 or 9  
Feature: Unique Applications:  
X = 0 or 1 or 2 or 3  
Number of Type-C Ports: 1 = 1 Port  
Product Type: 2 = Second-generation product family, CCG2  
Marketing Code: PD = Power Delivery product family  
Company ID: CY = Cypress  
Notes  
4. Termination resistor denoting an EMCA.  
5. Termination resistor denoting an accessory or upstream facing port.  
6. Termination resistor denoting a downstream facing port.  
Document Number: 001-93912 Rev. *N  
Page 31 of 41  
EZ-PD™ CCG2 Datasheet  
Packaging  
Table 29. Package Characteristics  
Parameter  
TA  
Description  
Conditions  
Min  
Typ  
Max  
85  
105  
100  
125  
Units  
°C  
Industrial  
Operating ambient temperature  
Operating junction temperature  
–40  
25  
Extended Industrial  
°C  
Industrial  
°C  
TJ  
–40  
Extended Industrial  
°C  
TJA  
TJC  
TJA  
TJC  
TJA  
TJC  
Package JA (20-ball WLCSP)  
Package JC (20-ball WLCSP)  
Package JA (14-pin DFN)  
Package JC (14-pin DFN)  
Package JA (24-pin QFN)  
Package JC (24-pin QFN)  
66  
0.7  
31  
59  
22  
29  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Table 30. Solder Reflow Peak Temperature  
Package Maximum Peak Temperature  
20-ball WLCSP  
Maximum Time within 5 °C of Peak Temperature  
260 °C  
260 °C  
260 °C  
30 seconds  
30 seconds  
30 seconds  
14-pin DFN  
24-pin QFN  
Table 31. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2  
Package  
20-ball WLCSP  
MSL  
MSL 1  
MSL 3  
MSL 3  
14-pin DFN  
24-pin QFN  
Document Number: 001-93912 Rev. *N  
Page 32 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 21. 20-ball WLCSP (1.63 × 2.03 × 0.55 mm) Package Outline, 001-95010  
001-95010 *B  
Document Number: 001-93912 Rev. *N  
Page 33 of 41  
EZ-PD™ CCG2 Datasheet  
Figure 22. 14-pin DFN ((2.5 × 3.5 × 0.6 mm) 0.95 × 3.00 E-Pad (Sawn)) Package Outline, 001-96312  
001-96312 **  
Figure 23. 24-Pin QFN ((4 × 4 × 0.55 mm) 2.65 × 2.65 E-Pad (Sawn)) Package Outline, 001-13937  
001-13937 *H  
Document Number: 001-93912 Rev. *N  
Page 34 of 41  
EZ-PD™ CCG2 Datasheet  
Table 32. Acronyms Used in this Document (continued)  
Acronyms  
Acronym  
NVIC  
opamp  
OCP  
OVP  
PCB  
Description  
nested vectored interrupt controller  
operational amplifier  
overcurrent protection  
overvoltage protection  
printed circuit board  
power delivery  
Table 32. Acronyms Used in this Document  
Acronym  
ADC  
Description  
analog-to-digital converter  
API  
ARM®  
application programming interface  
advanced RISC machine, a CPU architecture  
configuration channel  
CC  
PD  
CCG2  
CPU  
Cable Controller Generation 2  
central processing unit  
PGA  
PHY  
programmable gain amplifier  
physical layer  
cyclic redundancy check, an error-checking  
protocol  
CRC  
POR  
PRES  
PSoC®  
PWM  
RAM  
RISC  
RMS  
RTC  
power-on reset  
CS  
current sense  
precise power-on reset  
Programmable System-on-Chip™  
pulse-width modulator  
random-access memory  
reduced-instruction-set computing  
root-mean-square  
DFP  
downstream facing port  
digital input/output, GPIO with only digital capabil-  
ities, no analog. See GPIO.  
DIO  
DRP  
dual role port  
electrically erasable programmable read-only  
memory  
EEPROM  
real-time clock  
a USB cable that includes an IC that reports cable  
characteristics (e.g., current rating) to the Type-C  
ports  
EMCA  
RX  
receive  
SAR  
successive approximation register  
I2C serial clock  
I2C serial data  
EMI  
ESD  
FPB  
FS  
electromagnetic interference  
electrostatic discharge  
flash patch and breakpoint  
full-speed  
SCL  
SDA  
S/H  
sample and hold  
Serial Peripheral Interface, a communications  
protocol  
SPI  
GPIO  
IC  
general-purpose input/output  
integrated circuit  
SRAM  
SWD  
TX  
static random access memory  
serial wire debug, a test protocol  
transmit  
IDE  
integrated development environment  
Inter-Integrated Circuit, a communications  
protocol  
I2C, or IIC  
a new standard with a slimmer USB connector and  
a reversible cable, capable of sourcing up to  
100 W of power  
ILO  
internal low-speed oscillator, see also IMO  
internal main oscillator, see also ILO  
input/output, see also GPIO  
low-voltage detect  
Type-C  
IMO  
I/O  
Universal Asynchronous Transmitter Receiver, a  
communications protocol  
UART  
USB  
LVD  
LVTTL  
MCU  
NC  
Universal Serial Bus  
low-voltage transistor-transistor logic  
microcontroller unit  
USB input/output, CCG2 pins used to connect to a  
USB port  
USBIO  
XRES  
no connect  
external reset I/O pin  
NMI  
nonmaskable interrupt  
Document Number: 001-93912 Rev. *N  
Page 35 of 41  
EZ-PD™ CCG2 Datasheet  
Document Conventions  
Units of Measure  
Table 33. Units of Measure  
Symbol  
°C  
Unit of Measure  
degrees Celsius  
hertz  
Hz  
KB  
kHz  
k  
Mbps  
MHz  
M  
Msps  
µA  
1024 bytes  
kilohertz  
kilo ohm  
megabits per second  
megahertz  
mega-ohm  
megasamples per second  
microampere  
microfarad  
microsecond  
microvolt  
µF  
µs  
µV  
µW  
mA  
ms  
mV  
nA  
microwatt  
milliampere  
millisecond  
millivolt  
nanoampere  
nanosecond  
ohm  
ns  
pF  
picofarad  
ppm  
ps  
parts per million  
picosecond  
second  
s
sps  
V
samples per second  
volt  
Document Number: 001-93912 Rev. *N  
Page 36 of 41  
EZ-PD™ CCG2 Datasheet  
AN95615 – Designing USB 3.1 Type-C Cables Using EZ-PD™  
CCG2  
References and Links To Applications  
Collaterals  
AN95599 – Hardware Design Guidelines for EZ-PD™ CCG2  
Knowledge Base Articles  
AN210403 – Hardware Design Guidelines for Dual Role Port  
Key Differences Among EZ-PD™ CCG1, CCG2, CCG3 and  
Applications Using EZ-PD™ USB Type-C Controllers  
CCG4 – KBA210740  
AN210771 – Getting Started with EZ-PD™ CCG4  
Programming EZ-PD™ CCG2, EZ-PD™ CCG3 and EZ-PD™  
CCG4 Using PSoC® Programmer and MiniProg3 – KBA96477  
Reference Designs  
CCGX Frequently Asked Questions (FAQs) – KBA97244  
Handling Precautions for CY4501 CCG1 DVK – KBA210560  
Cypress EZ-PD™ CCGx Hardware – KBA204102  
Difference between USB Type-C and USB-PD – KBA204033  
CCGx Programming Methods – KBA97271  
EZ-PD™ CCG2 Electronically Marked Cable Assembly  
(EMCA) Paddle Card Reference Design  
EZ-PD™ CCG2 USB Type-C to DisplayPort Cable Solution  
CCG1 USB Type-C to DisplayPort Cable Solution  
CCG1 USB Type-C to HDMI/DVI/VGA Adapter Solution  
EZ-PD™ CCG2 USB Type-C to HDMI Adapter Solution  
Getting started with Cypress USB Type-C Products –  
KBA04071  
CCG1 Electronically Marked Cable Assembly (EMCA) Paddle  
Type-C to DisplayPort Cable Electrical Requirements  
Card Reference Design  
Dead Battery Charging Implementation in USB Type-C  
Solutions – KBA97273  
CCG1 USB Type-C to Legacy USB Device Cable Paddle Card  
Reference Schematics  
TerminationResistorsRequired forthe USBType-C Connector  
– KBA97180  
EZ-USB GX3 USB Type-C to Gigabit Ethernet Dongle  
EZ-PD™ CCG2 USB Type-C Monitor/Dock Solution  
CCG2 20W Power Adapter Reference Design  
CCG2 18W Power Adapter Reference Design  
VBUS Bypass Capacitor Recommendation for Type-C Cable  
and Type-C to Legacy Cable/AdapterAssemblies – KBA97270  
Need for Regulator and Auxiliary Switch in Type-C to  
DisplayPort (DP) Cable Solution – KBA97274  
EZ-USB GX3 USB Type-A to Gigabit Ethernet Reference  
Design Kit  
Need for a USB Billboard Device in Type-C Solutions –  
KBA97146  
Kits  
CCG1DevicesinType-CtoLegacy Cable/AdapterAssemblies  
– KBA97145  
CY4501 CCG1 Development Kit  
CY4502 EZ-PD™ CCG2 Development Kit  
CY4531 EZ-PD™ CCG3 Evaluation Kit  
CY4541 EZ-PD™ CCG4 Evaluation Kit  
Cypress USB Type-C Controller Supported Solutions –  
KBA97179  
Termination Resistors for Type-C to Legacy Ports – KBA97272  
Handling Instructions for CY4502 CCG2 Development Kit –  
KBA97916  
Datasheets  
Thunderbolt™ Cable Application Using CCG3 Devices -  
KBA210976  
CCG1 Datasheet: USB Type-C Port Controller with Power  
Delivery  
PowerAdapterApplication Using CCG3 Devices – KBA210975  
CYPD1120 Datasheet: USB Power Delivery Alternate Mode  
Methods to Upgrade Firmware on CCG3 Devices –  
Controller on Type-C  
KBA210974  
CCG3: USB Type-C Controller Datasheet  
Device Flash Memory Size and Advantages – KBA210973  
Applications of EZ-PD™ CCG4 – KBA210739  
CCG4: Two-Port USB Type-C Controller Datasheet  
Application Notes  
AN96527 – Designing USB Type-C Products Using Cypress’s  
CCG1 Controllers  
Document Number: 001-93912 Rev. *N  
Page 37 of 41  
EZ-PD™ CCG2 Datasheet  
Document History Page  
Description Title: EZ-PD™ CCG2 Datasheet, USB Type-C Port Controller  
Document Number: 001-93912  
Submission  
Revision  
ECN  
Description of Change  
Date  
*E  
*F  
4680071  
4718374  
03/07/2015 Post to external web.  
04/09/2015 Added 24-pin QFN package related information in all instances across the document.  
Updated Application Diagrams:  
Added Figure 16.  
Added Figure 17.  
Updated Ordering Information:  
Updated Table 28:  
Updated part numbers.  
Updated Packaging:  
Added spec 001-13937 *E.  
*G  
4774142  
06/15/2015 Changed status from Preliminary to Final.  
Updated Logic Block Diagram.  
Updated Functional Overview:  
Updated GPIO:  
Updated description.  
Updated Power:  
Updated description.  
Updated Application Diagrams:  
Updated Figure 17.  
Updated Electrical Specifications:  
Updated Device Level Specifications:  
Updated Table 3:  
Added SID.PWR#1_A spec and its corresponding details.  
Updated Digital Peripherals:  
Updated UART:  
Updated Table 11:  
Updated all values corresponding to SID160 spec.  
Updated Ordering Information:  
Updated Table 28:  
Updated part numbers.  
Removed “Errata”.  
*H  
4979175  
10/23/2015 Updated EZ-PD CCG2 Block Diagram:  
Updated Figure 1.  
Updated Pinouts:  
Updated Figure 5.  
Document Number: 001-93912 Rev. *N  
Page 38 of 41  
EZ-PD™ CCG2 Datasheet  
Document History Page (continued)  
Description Title: EZ-PD™ CCG2 Datasheet, USB Type-C Port Controller  
Document Number: 001-93912  
Submission  
Revision  
ECN  
Description of Change  
Date  
*H (cont.)  
4979175  
10/23/2015 Updated Electrical Specifications:  
Updated Absolute Maximum Ratings:  
Updated Table 2:  
Added VCC_ABS spec and its corresponding details.  
Updated Device Level Specifications:  
Updated I/O:  
Updated Table 5:  
Updated details in “Details/Conditions” column corresponding to SID.GIO#16, SID.GIO#17  
specs.  
Updated XRES:  
Updated Table 7:  
Updated details in “Details/Conditions” column corresponding to SID.XRES#3 spec.  
Updated Digital Peripherals:  
Updated UART:  
Updated Table 11:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated Table 12:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated SPI:  
Updated Table 13:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated Table 14:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated Table 15:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated Table 16:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated System Resources:  
Updated Internal Main Oscillator:  
Updated Table 13:  
Updated details in “Details/Conditions” column corresponding to SID226, SID229 specs  
Updated Analog-to-Digital Converter:  
Updated Table 26:  
Updated details in “Details/Conditions” column corresponding to all specs.  
Updated all values corresponding to SID.ADC.4 spec.  
Updated Table 27:  
Updated details in “Details/Conditions” column corresponding to all specs.  
*I  
5028128  
5186972  
12/04/2015 Updated Application Diagrams:  
Added Figure 18.  
Added Figure 19.  
Added Figure 20.  
Updated Ordering Information:  
Updated Table 28:  
Updated part numbers.  
*J  
03/28/2016 Updated Features:  
Updated Packages:  
Updated description.  
Updated Ordering Information:  
Updated Table 28:  
Updated part numbers.  
Updated Packaging:  
No change in revisions.  
Updated Table 29:  
Updated all details corresponding to TA and TJ parameters.  
Document Number: 001-93912 Rev. *N  
Page 39 of 41  
EZ-PD™ CCG2 Datasheet  
Document History Page (continued)  
Description Title: EZ-PD™ CCG2 Datasheet, USB Type-C Port Controller  
Document Number: 001-93912  
Submission  
Revision  
ECN  
Description of Change  
Date  
*K  
5303957  
06/13/2016 Added Available Firmware and Software Tools.  
Updated Application Diagrams:  
Added description.  
Updated Figure 12.  
Updated Figure 15.  
Updated Figure 16.  
Updated Figure 17.  
Added References and Links To Applications Collaterals.  
Updated to new template.  
*L  
5387677  
6097993  
08/02/2016 Updated Ordering Information:  
Updated Table 28:  
Updated part numbers.  
Completing Sunset Review.  
*M  
07/11/2018 Updated Application Diagrams:  
Updated description.  
Updated Figure 11 (Updated caption only).  
Added Figure 12.  
Updated Figure 13 (Updated caption only).  
Added Figure 14.  
Updated Packaging:  
spec 001-95010 – Changed revision from *A to *B.  
spec 001-13937 – Changed revision from *F to *G.  
Added compliance to USB Specification.  
Updated to new template.  
*N  
7035126  
12/04/2020 Updated Figure 6 in Power section.  
Added CCG2 Programming and Bootloading section.  
Updated descriptions before all application diagrams in Application Diagrams section.  
Added column “Default FW” in Table 28 in Ordering Information section.  
Updated Figure 23 in Packaging section.  
Document Number: 001-93912 Rev. *N  
Page 40 of 41  
EZ-PD™ CCG2 Datasheet  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
®
Products  
PSoC Solutions  
Arm® Cortex® Microcontrollers  
cypress.com/arm  
cypress.com/automotive  
cypress.com/clocks  
cypress.com/interface  
cypress.com/iot  
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU  
Automotive  
Cypress Developer Community  
Clocks & Buffers  
Interface  
Forums | WICED IOT Forums | Projects | Video | Blogs | Training  
| Components  
Internet of Things  
Memory  
Technical Support  
cypress.com/memory  
cypress.com/mcu  
cypress.com/support  
Microcontrollers  
PSoC  
cypress.com/psoc  
cypress.com/pmic  
cypress.com/touch  
cypress.com/usb  
Power Management ICs  
Touch Sensing  
USB Controllers  
Wireless Connectivity  
cypress.com/wireless  
Notice regarding compliance with Universal Serial Bus specification. Cypress offers firmware and hardware solutions that are certified to comply with the Universal Serial Bus specification, USB  
Type-C™ Cable and Connector Specification, and other specifications of USB Implementers Forum, Inc (USB-IF). You may use Cypress or third party software tools, including sample code, to modify  
the firmware for Cypress USB products. Modification of such firmware could cause the firmware/hardware combination to no longer comply with the relevant USB-IF specification. You are solely  
responsible ensuring the compliance of any modifications you make, and you must follow the compliance requirements of USB-IF before using any USB-IF trademarks or logos in connection with any  
modifications you make. In addition, if Cypress modifies firmware based on your specifications, then you are responsible for ensuring compliance with any desired standard or specifications as if you  
had made the modification. CYPRESS IS NOT RESPONSIBLE IN THE EVENT THAT YOU MODIFY OR HAVE MODIFIED A CERTIFIED CYPRESS PRODUCT AND SUCH MODIFIED PRODUCT  
NO LONGER COMPLIES WITH THE RELEVANT USB-IF SPECIFICATIONS.  
© Cypress Semiconductor Corporation 2014–2020 This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,  
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress  
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to  
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users  
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as  
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation  
of the Software is prohibited.  
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. No computing  
device can be absolutely secure. Therefore, despite security measures implemented in Cypress hardware or software products, Cypress does not assume any liability arising out of any security breach,  
such as unauthorized access to or use of a Cypress product. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product  
to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any  
liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming  
code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this  
information and any resulting product. Cypress products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons  
systems, nuclear installations, life-support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances  
management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device  
or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you  
shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from  
and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United  
States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 001-93912 Rev. *N  
Revised December 4, 2020  
Page 41 of 41  

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