C67078-S1309-A2 [INFINEON]
SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated); SIPMOS大功率晶体管（N沟道增强型雪崩额定）
| 型号： | C67078-S1309-A2 |
| 厂家： | 
Infineon |
| 描述： | SIPMOS Power Transistor (N channel Enhancement mode Avalanche-rated) |
| 文件： | 总9页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BUZ 80
®
SIPMOS Power Transistor
• N channel
• Enhancement mode
• Avalanche-rated
Pin 1
Pin 2
Pin 3
G
D
S
Type
V
I
R
Package
Ordering Code
DS
D
DS(on)
Ω
BUZ 80
800 V
3.1 A
4
TO-220 AB
C67078-S1309-A2
Maximum Ratings
Parameter
Symbol
Values
Unit
Continuous drain current
I
I
I
A
D
T = 28 °C
3.1
C
Pulsed drain current
Dpuls
T = 25 °C
12.5
3.1
8
C
Avalanche current,limited by T
jmax
AR
Avalanche energy,periodic limited by T
Avalanche energy, single pulse
E
mJ
jmax
AR
AS
E
Ω
I = 3.1 A, V = 50 V, R = 25
D
DD
GS
L = 62.4 mH, T = 25 °C
320
j
±
Gate source voltage
Power dissipation
V
P
20
V
GS
W
tot
T = 25 °C
100
C
Operating temperature
Storage temperature
T
T
-55 ... + 150 °C
-55 ... + 150
j
stg
≤
Thermal resistance, chip case
R
R
1.25
75
K/W
thJC
Thermal resistance, chip to ambient
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
thJA
E
55 / 150 / 56
Semiconductor Group
1
09/96
BUZ 80
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
typ.
Unit
min.
max.
Static Characteristics
Drain- source breakdown voltage
V
V
V
(BR)DSS
GS(th)
DSS
V
= 0 V, I = 0.25 mA, T = 25 °C
800
2.1
-
-
GS
D
j
Gate threshold voltage
I = 1 mA
V
=V
3
4
GS DS, D
Zero gate voltage drain current
I
I
µA
V
V
= 800 V, V = 0 V, T = 25 °C
-
-
0.1
10
1
DS
DS
GS
j
= 800 V, V = 0 V, T = 125 °C
100
GS
j
Gate-source leakage current
= 20 V, V = 0 V
nA
GSS
V
-
-
10
100
4
GS
DS
Ω
Drain-Source on-resistance
= 10 V, I = 2 A
R
DS(on)
V
3.5
GS
D
Semiconductor Group
2
09/96
BUZ 80
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
typ.
Unit
min.
max.
Dynamic Characteristics
Transconductance
g
S
fs
≥
V
2 I
R I = 2 A
1
-
3.6
900
95
-
DS
* D * DS(on)max, D
Input capacitance
= 0 V, V = 25 V, f = 1 MHz
C
C
C
pF
iss
V
1350
140
75
GS
DS
Output capacitance
= 0 V, V = 25 V, f = 1 MHz
oss
V
-
GS
DS
Reverse transfer capacitance
= 0 V, V = 25 V, f = 1 MHz
rss
V
-
50
GS
DS
Turn-on delay time
= 30 V, V = 10 V, I = 3 A
t
t
t
t
ns
d(on)
V
DD
GS
D
Ω
R
= 50
-
-
-
-
15
25
GS
Rise time
= 30 V, V = 10 V, I = 3 A
r
V
DD
GS
D
Ω
R
= 50
65
85
GS
Turn-off delay time
= 30 V, V = 10 V, I = 3 A
d(off)
V
DD
GS
D
R
= 50 Ω
200
65
270
85
GS
Fall time
= 30 V, V = 10 V, I = 3 A
f
V
DD
GS
D
R
= 50 Ω
GS
Semiconductor Group
3
09/96
BUZ 80
Electrical Characteristics, at T = 25°C, unless otherwise specified
j
Parameter
Symbol
Values
typ.
Unit
min.
max.
Reverse Diode
Inverse diode continuous forward current I
A
S
T = 25 °C
-
-
-
-
-
-
3.1
12.5
1.3
-
C
Inverse diode direct current,pulsed
I
SM
T = 25 °C
-
C
Inverse diode forward voltage
V
V
SD
V
= 0 V, I = 6.2 A
1
GS
F
Reverse recovery time
t
ns
µC
rr
=
V = 100 V, I l di /dt = 100 A/µs
370
2.5
R
F S,
F
Reverse recovery charge
Q
rr
=
V = 100 V, I l di /dt = 100 A/µs
-
R
F S,
F
Semiconductor Group
4
09/96
BUZ 80
Drain current
Power dissipation
ƒ
I = (T )
ƒ
P
= (T )
D
C
tot
C
≥
parameter: V
10 V
GS
3.2
A
110
W
90
80
70
60
50
40
30
20
10
ID
Ptot
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0
0
0
20
40
60
80 100 120
°C 160
TC
20
40
60
80 100 120
°C 160
TC
Safe operating area
Transient thermal impedance
ƒ
ƒ
I = (V
)
Z
= (t )
th JC
D
DS
p
parameter: D = 0.01, T = 25°C
parameter: D = t / T
C
p
10 1
K/W
10 2
A
10 0
ID
ZthJC
t
= 18.0µs
p
10 1
10 -1
100 µs
1 ms
D = 0.50
0.20
I
10 -2
10 0
0.10
V
0.05
10 ms
0.02
10 -3
R
single pulse
0.01
10 -1
10 -4
DC
V 10 3
VDS
10 0
10 1
10 2
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1s 10 0
tp
5
09/96
Semiconductor Group
BUZ 80
Typ. output characteristics
ƒ(
Typ. drain-source on-resistance
ƒ(
I =
V
)
R
=
I )
D
D
DS
DS (on)
parameter: t = 80 µs , T = 25 °C
parameter: t = 80 µs, T = 25 °C
p j
p
j
13
7.0
A
P
tot = 100W
k
j
Ω
l
h
g
i
a
b
c
d
e
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
11
10
9
V
[V]
GS
a
f
ID
RDS (on)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
9.0
b
c
d
e
f
e
8
7
g
h
i
6
d
b
f
5
g
h
j
i
4
j
k
k
l
10.0
20.0
c
a
3
2
V
[V] =
GS
a
b
c
d
e
f
g
h
i
j
k
1
0
0.5
0.0
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
0
10
20
30
40
V
60
0.0
1.0
2.0
3.0
4.0
5.0
A
6.5
VDS
ID
Typ. transfer characteristics I = f (V
)
Typ. forward transconductance g = f (I )
D
D
GS
fs
parameter: t = 80 µs
parameter: t = 80 µs,
p
p
≥
≥
V
DS
2 x I x R
V
DS
2 x I x R
D
DS(on)max
D
DS(on)max
5.0
A
3.0
S
4.0
3.5
3.0
2.5
2.0
1.5
1.0
ID
gfs
2.0
1.5
1.0
0.5
0.0
0.5
0.0
0
1
2
3
4
5
6
7
8
V
VGS
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
A
ID
4.0
Semiconductor Group
6
09/96
BUZ 80
Gate threshold voltage
Drain-source on-resistance
ƒ
= (T )
j
V
ƒ
= (T )
j
R
GS (th)
DS (on)
parameter: V = V , I = 1 mA
parameter: I = 2 A, V = 10 V
GS
DS
D
D
GS
19
4.6
V
Ω
98%
4.0
16
14
12
10
8
VGS(th)
RDS (on)
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
typ
2%
98%
typ
6
4
2
0
0.4
0.0
-60
-20
20
60
100
°C
Tj
160
-60
-20
20
60
100
°C
Tj
160
Typ. capacitances
Forward characteristics of reverse diode
ƒ
C = f (V )
I = (V
)
DS
F
SD
parameter: T , t = 80 µs
parameter:V = 0V, f = 1MHz
j
p
GS
10 1
10 2
nF
A
C
IF
Ciss
10 0
10 -1
10 -2
10 1
10 0
10 -1
Coss
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
Crss
0
5
10
15
20
25
30
V
VDS
40
0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
VSD
3.0
7
09/96
Semiconductor Group
BUZ 80
ƒ
Avalanche energy E = (T )
Typ. gate charge
AS
j
ƒ
parameter: I = 3.1 A, V = 50 V
V
= (Q
)
D
DD
GS
Gate
Ω
R
= 25 , L = 62.4 mH
parameter: I
= 5 A
D puls
GS
340
mJ
16
V
280
EAS
VGS
12
240
200
160
120
80
10
8
V
V
DS max
0,2
0,8
DS max
6
4
2
40
0
0
0
20
40
60
80
100
120
°C
Tj
160
10
20
30
40
50
nC
70
QGate
Drain-source breakdown voltage
ƒ
= (T )
j
V
(BR)DSS
960
V
920
V(BR)DSS
900
880
860
840
820
800
780
760
740
720
-60
-20
20
60
100
°C
Tj
160
Semiconductor Group
8
09/96
BUZ 80
Package Outlines
TO-220 AB
Dimension in mm
Semiconductor Group
9
09/96
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