BSS84PWH6327XTSA1 [INFINEON]

Small Signal Field-Effect Transistor, 0.15A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3;
BSS84PWH6327XTSA1
型号: BSS84PWH6327XTSA1
厂家: Infineon    Infineon
描述:

Small Signal Field-Effect Transistor, 0.15A I(D), 60V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3

局域网 光电二极管 晶体管
文件: 总9页 (文件大小:434K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BSS84PW  
SIPMOS Small-Signal-Transistor  
Features  
Product Summary  
P-Channel  
Drain source voltage  
V
-60  
8
V
A
DS  
Enhancement mode  
Avalanche rated  
Logic Level  
Drain-source on-state resistance  
Continuous drain current  
R
DS(on)  
-0.15  
I
D
3
dv/dt rated  
2
Qualified according to AEC Q101  
1
VSO05561  
Halogen-free according to IEC61249-2-21  
Type  
Package  
Tape and Reel  
Marking Pin 1  
PIN 2  
PIN 3  
BSS84PW  
PG-SOT-323 H6327:3000pcs/r. YBs  
G
S
D
Maximum Ratings,at  
T
= 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
Continuous drain current  
= 25 °C  
-0.15  
A
I
D
T
A
Pulsed drain current  
= 25 °C  
-0.6  
I
D puls  
T
A
Avalanche energy, single pulse  
= -0.15 A , = -25 V, = 25  
GS  
2.61  
mJ  
E
E
AS  
AR  
I
V
R
D
DD  
0.03  
6
Avalanche energy, periodic limited by  
Reverse diode d /d  
= -0.15 A, = -48 V, di/dt = 200 A/µs,  
T
jmax  
v
t
dv/dt  
kV/µs  
I
V
S
DS  
T
= 150 °C  
jmax  
Gate source voltage  
Power dissipation  
V
P
±20  
0.3  
V
GS  
tot  
W
T
= 25 °C  
A
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55...+150  
55/150/56  
°C  
T , T  
j stg  
ESD Class  
Class 0  
JESF22-A114-HBM  
Rev 2.0  
Page 1  
2016-06-21  
BSS84PW  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Characteristics  
Thermal resistance, junction - soldering point  
(Pin 3)  
-
-
110 K/W  
R
thJS  
SMD version, device on PCB:  
@ min. footprint  
R
thJA  
-
-
-
-
420  
350  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
-60  
-1  
max.  
Static Characteristics  
Drain-source breakdown voltage  
V
V
-
-
V
(BR)DSS  
GS(th)  
V
= 0 V, I = -250 µA  
D
GS  
Gate threshold voltage, V = V  
-1.5  
-2  
GS  
DS  
I = -20 µA  
D
Zero gate voltage drain current  
µA  
I
DSS  
V
V
= -60 V, V = 0 V, T = 25 °C  
-
-
-0.1  
-10  
-1  
DS  
DS  
GS  
j
= -60 V, V = 0 V, T = 125 °C  
-100  
GS  
j
Gate-source leakage current  
= -20 V, V = 0 V  
-
-
-
-
-10  
10.5  
6.9  
-100 nA  
I
GSS  
V
GS  
DS  
Drain-source on-state resistance  
= -2.7 V, I = -0.01 A  
25  
12  
8
R
DS(on)  
V
GS  
D
Drain-source on-state resistance  
= -4.5 V, I = -0.12 A  
R
DS(on)  
V
GS  
D
Drain-source on-state resistance  
4.6  
R
DS(on)  
V
= -10 V, I = -0.15 A  
D
GS  
1
2
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Rev 2.0  
Page 2  
2016-06-21  
BSS84PW  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ.  
Unit  
min.  
max.  
Dynamic Characteristics  
Transconductance  
g
V
2*I *R ,  
DS(on)max  
0.08  
0.16  
-
S
fs  
DS  
D
I =0.15A  
D
Input capacitance  
Output capacitance  
C
C
V
=0V, V =-25V,  
-
-
-
-
-
-
-
15.3  
5.8  
3
19.1 pF  
7.3  
iss  
oss  
rss  
d(on)  
r
GS  
DS  
f=1MHz  
Reverse transfer capacitance C  
3.8  
Turn-on delay time  
Rise time  
t
t
t
t
V
=-30V, V =-4.5V,  
6.7  
16.2  
8.6  
20.5  
10  
ns  
DD  
GS  
I =-0.12A, R =25  
24.3  
12.9  
30.8  
D
G
Turn-off delay time  
Fall time  
d(off)  
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Q
Q
Q
V
=-48V, I =-0.15A  
D
-
-
-
0.25  
0.3  
1
0.38 nC  
0.45  
gs  
gd  
g
DD  
Gate charge total  
V
V
=-48V, I =-0.15A,  
D
1.5  
DD  
=0 to -10V  
GS  
Gate plateau voltage  
V
=-48V, I =-0.15A  
D
-
-3.4  
-
V
V(plateau)  
DD  
Reverse Diode  
Inverse diode continuous  
forward current  
T =25°C  
-
-
-
-
-0.15 A  
-0.6  
I
A
S
Inverse diode direct current,  
pulsed  
I
SM  
Inverse diode forward voltage  
Reverse recovery time  
V
=0V, I =-0.15A  
-
-
-
-0.84 -1.12 V  
V
GS  
F
SD  
t
V =-30V, I =l ,  
23.6  
11.6  
35.4 ns  
17.4 nC  
rr  
R
F S  
di /dt=100A/µs  
F
Reverse recovery charge  
Q
rr  
Rev 2.0  
Page 3  
2016-06-21  
BSS84PW  
Power Dissipation  
Drain current  
I = f (T )  
P
= f (T )  
A
tot  
D
A
parameter: V  
10 V  
GS  
BSS84PW  
BSS84PW  
0.32  
W
-0.16  
A
0.24  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
-0.12  
-0.10  
P
I
-0.08  
-0.06  
-0.04  
-0.02  
0.00  
0
20  
40  
60  
80 100 120  
160  
0
20  
40  
60  
80 100 120  
160  
°C  
°C  
T
T
A
A
Safe operating area  
I = f ( V  
Transient thermal impedance  
Z = f (t )  
thJA  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
A
p
BSS84PW  
BSS84PW  
-10 1  
10 3  
A
K/W  
-10 0  
t
= 40.0µs  
100 µs  
p
10 2  
I
I
Z
1 ms  
V
-10 -1  
10 ms  
D = 0.50  
0.20  
R
10 1  
0.10  
0.05  
-10 -2  
0.02  
single pulse  
0.01  
DC  
-10 -3  
10 0  
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1  
-10 -1  
-10 0  
-10 1  
-10 2  
DS  
10 3  
V
s
V
t
p
Rev 2.0  
Page 4  
2016-06-21  
BSS84PW  
Typ. output characteristic  
I = f (V ); T =25°C  
Typ. drain-source-on-resistance  
= f (I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 80 µs  
parameter: V  
p
GS  
BSS84PW  
BSS84PW  
26  
-0.36  
A
Ptot = 0W  
a
b
c
d
f
V
[V]  
g
e
GS  
a
22  
20  
18  
-2.5  
-3.0  
-3.5  
-4.0  
-4.5  
-5.0  
-6.0  
b
c
d
e
f
-0.28  
-0.24  
-0.20  
-0.16  
-0.12  
-0.08  
-0.04  
0.00  
d
16  
I
R
14  
12  
10  
8
g
c
b
6
e
f
g
4
V
[V] =  
b
GS  
a
c
d
e
f
g
a
2
0
-2.5 -3.0 -3.5 -4.0 -4.5 -5.0 -6.0  
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0  
-5.0  
0.00 -0.04 -0.08 -0.12 -0.16 -0.20 -0.24  
-0.30  
V
A
V
I
DS  
D
Typ. forward transconductance  
Typ. transfer characteristics I = f ( V  
)
GS  
D
g = f(I ); T =25°C  
V
2 x I x R  
D DS(on)max  
fs  
D
j
DS  
parameter: g  
parameter: t = 80 µs  
fs  
p
-0.30  
0.22  
S
A
0.18  
0.16  
-0.20  
0.14  
I
g
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
-0.15  
-0.10  
-0.05  
0.00  
0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0  
-5.0  
GS  
0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30  
-0.40  
V
A
I
V
D
Rev 2.0  
Page 5  
2016-06-21  
BSS84PW  
Drain-source on-resistance  
= f(T )  
Gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter: I = -0.17A, V = -10 V  
parameter: V = V , I = -20 µA  
GS DS D  
D
GS  
-2.5  
16  
V
max.  
12  
10  
8
max.  
R
V
typ.  
-1.5  
-1.0  
-0.5  
0.0  
min.  
6
typ.  
4
2
0
-60  
-20  
20  
60  
100  
160  
-60  
-20  
20  
60  
100  
180  
°C  
°C  
T
T
j
j
Typ. capacitances  
Forward characteristics of reverse diode  
I = f (V )  
C = f(VDS)  
F
SD  
Parameter: V =0 V, f=1 MHz  
parameter: T , tp = 80 µs  
j
GS  
BSS84PW  
10 2  
-10 0  
A
pF  
-10 -1  
Ciss  
I
C
10 1  
Coss  
-10 -2  
Crss  
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
10 0  
-10 -3  
0.0  
0
-5  
-10  
-15  
-20  
-30  
DS  
-0.4 -0.8 -1.2 -1.6 -2.0 -2.4  
-3.0  
SD  
V
V
V
V
Rev 2.0  
Page 6  
2016-06-21  
BSS84PW  
Typ. gate charge  
= f (Q  
Avalanche energy  
= f (T )  
V
)
Gate  
E
GS  
AS  
j
parameter: I = -0.15 A pulsed  
par.: I = -0.15 A , V = -25 V, R = 25  
D
D
DD  
GS  
BSS84PW  
3.0  
-16  
V
mJ  
-12  
2.0  
-10  
E
V
V
0,2  
DS max  
0,8 VDS max  
1.5  
1.0  
0.5  
0.0  
-8  
-6  
-4  
-2  
0
25  
45  
65  
85  
105  
125  
165  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.5  
°C  
nC  
T
Q
j
Gate  
Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
BSS84PW  
-72  
V
-68  
-66  
-64  
-62  
-60  
-58  
-56  
-54  
V
-60  
-20  
20  
60  
100  
180  
°C  
T
j
Rev 2.0  
Page 7  
2016-06-21  
BSS84PW  
Package Outline SOT-323  
Footprint  
Soldering type: Reflow soldering  
Soldering type: Wave soldering  
Tape and Reel  
Rev 2.0  
Page 8  
2016-06-21  
-60VꢀSIPMOSꢀSmallꢀSignalꢀTransistor  
BSS84PW  
RevisionꢀHistory  
BSS84PW  
Revision:ꢀ2016-06-27,ꢀRev.ꢀ2.0  
Previous Revision  
Revision Date  
2.0  
Subjects (major changes since last revision)  
Release of final version  
2016-06-27  
TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG  
AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCoolGaN™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCoolSiC™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,ꢀDI-POL™,ꢀDrBlade™,  
EasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPACK™,ꢀEconoPIM™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,ꢀHybridPACK™,ꢀInfineon™,  
ISOFACE™,ꢀIsoPACK™,ꢀi-Wafer™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOmniTune™,ꢀOPTIGA™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,  
PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPROFET™,ꢀPRO-SIL™,ꢀRASIC™,ꢀREAL3™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSIPMOS™,ꢀSmartLEWIS™,  
SOLIDꢀFLASH™,ꢀSPOC™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.  
TrademarksꢀupdatedꢀAugustꢀ2015  
OtherꢀTrademarks  
Allꢀreferencedꢀproductꢀorꢀserviceꢀnamesꢀandꢀtrademarksꢀareꢀtheꢀpropertyꢀofꢀtheirꢀrespectiveꢀowners.  
WeꢀListenꢀtoꢀYourꢀComments  
Anyꢀinformationꢀwithinꢀthisꢀdocumentꢀthatꢀyouꢀfeelꢀisꢀwrong,ꢀunclearꢀorꢀmissingꢀatꢀall?ꢀYourꢀfeedbackꢀwillꢀhelpꢀusꢀtoꢀcontinuously  
improveꢀtheꢀqualityꢀofꢀthisꢀdocument.ꢀPleaseꢀsendꢀyourꢀproposalꢀ(includingꢀaꢀreferenceꢀtoꢀthisꢀdocument)ꢀto:  
erratum@infineon.com  
Publishedꢀby  
InfineonꢀTechnologiesꢀAG  
81726ꢀMünchen,ꢀGermany  
©ꢀ2016ꢀInfineonꢀTechnologiesꢀAG  
AllꢀRightsꢀReserved.  
LegalꢀDisclaimer  
Theꢀinformationꢀgivenꢀinꢀthisꢀdocumentꢀshallꢀinꢀnoꢀeventꢀbeꢀregardedꢀasꢀaꢀguaranteeꢀofꢀconditionsꢀorꢀcharacteristics.ꢀWith  
respectꢀtoꢀanyꢀexamplesꢀorꢀhintsꢀgivenꢀherein,ꢀanyꢀtypicalꢀvaluesꢀstatedꢀhereinꢀand/orꢀanyꢀinformationꢀregardingꢀtheꢀapplication  
ofꢀtheꢀdevice,ꢀInfineonꢀTechnologiesꢀherebyꢀdisclaimsꢀanyꢀandꢀallꢀwarrantiesꢀandꢀliabilitiesꢀofꢀanyꢀkind,ꢀincludingꢀwithout  
limitation,ꢀwarrantiesꢀofꢀnon-infringementꢀofꢀintellectualꢀpropertyꢀrightsꢀofꢀanyꢀthirdꢀparty.  
Information  
Forꢀfurtherꢀinformationꢀonꢀtechnology,ꢀdeliveryꢀtermsꢀandꢀconditionsꢀandꢀpricesꢀpleaseꢀcontactꢀyourꢀnearestꢀInfineon  
TechnologiesꢀOfficeꢀ(www.infineon.com).  
Warnings  
Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,  
pleaseꢀcontactꢀtheꢀnearestꢀInfineonꢀTechnologiesꢀOffice.  
TheꢀInfineonꢀTechnologiesꢀcomponentꢀdescribedꢀinꢀthisꢀDataꢀSheetꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀand/or  
automotive,ꢀaviationꢀandꢀaerospaceꢀapplicationsꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies,ꢀifꢀa  
failureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-support,ꢀautomotive,ꢀaviationꢀand  
aerospaceꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffectꢀtheꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀare  
intendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀis  
reasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.  
9
Rev.ꢀ2.0,ꢀꢀ2016-06-27  

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