BSS126E6327 [INFINEON]

Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3;
BSS126E6327
型号: BSS126E6327
厂家: Infineon    Infineon
描述:

Small Signal Field-Effect Transistor, 0.021A I(D), 600V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3

光电二极管 晶体管
文件: 总9页 (文件大小:253K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BSS126  
SIPMOS® Small-Signal-Transistor  
Product Summary  
V DS  
Features  
600  
700  
V
• N-channel  
• Depletion mode  
R DS(on),max  
I DSS,min  
0.007 A  
• dv /dt rated  
• Available with VGS(th) indicator on reel  
• Pb-free lead plating; RoHS compliant  
PG-SOT-23  
Type  
Package  
Pb-free  
Tape and Reel Information  
Marking  
SHs  
BSS126  
BSS126  
PG-SOT-23 Yes  
PG-SOT-23 Yes  
L6327: 3000 pcs/reel  
L6906: 3000 pcs/reel sorted in V GS(th) bands1)  
SHs  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
T A=25 °C  
T A=70 °C  
Continuous drain current  
0.021  
0.017  
0.085  
A
I D,pulse  
dv /dt  
V GS  
T A=25 °C  
Pulsed drain current  
Reverse diode dv /dt  
Gate source voltage  
I D=0.016 A,  
V
DS=20 V,  
di /dt =200 A/µs,  
j,max=150 °C  
6
kV/µs  
V
T
±20  
ESD class  
(JESD22-A114-HBM)  
0 (<250V)  
P tot  
T A=25 °C  
Power dissipation  
0.50  
W
T j, T stg  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55 ... 150  
55/150/56  
°C  
1) see table on next page and diagram 11  
Rev. 1.6  
page 1  
2009-08-18  
BSS126  
Unit  
Values  
typ.  
Parameter  
Symbol Conditions  
min.  
max.  
Thermal characteristics  
Thermal resistance,  
junction - ambient  
R thJA  
minimal footprint  
-
-
250 K/W  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS=-5 V, I D=250 µA  
Drain-source breakdown voltage  
Gate threshold voltage  
600  
-2.7  
-
-
V
V GS(th)  
V DS=3 V, I D=8 µA  
-2.0  
-1.6  
V DS=600 V,  
I D(off)  
Drain-source cutoff current  
-
-
-
-
0.1  
10  
µA  
V
GS=-5 V, T j=25 °C  
V
V
DS=600 V,  
GS=-5 V, T j=125 °C  
I GSS  
I DSS  
V GS=20 V, V DS=0 V  
V GS=0 V, V DS=25 V  
Gate-source leakage current  
On-state drain current  
-
7
-
-
100 nA  
-
-
mA  
R DS(on) V GS=0 V, I D=3 mA  
V GS=10 V, I D=16 mA  
Drain-source on-state resistance  
320  
280  
700  
500  
-
|V DS|>2|I D|R DS(on)max  
I D=0.01 A  
,
g fs  
Transconductance  
0.008  
0.017  
-
S
V
Threshold voltage V GS(th) sorted in bands2)  
V GS(th)  
V DS=3 V, I D=8 µA  
J
-1.8  
-1.95  
-2.1  
-
-
-
-
-
-1.6  
-1.75  
-1.9  
K
L
M
N
-2.25  
-2.4  
-2.05  
-2.2  
2) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific  
band cannot be ordered separately.  
Rev. 1.6  
page 2  
2009-08-18  
BSS126  
Unit  
Values  
typ.  
Parameter  
Symbol Conditions  
min.  
max.  
Dynamic characteristics  
I D=f(V GS); V DS=3 V; T j=25 °C  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
-
-
-
-
-
-
-
21  
2.4  
1.0  
6.1  
9.7  
14  
28  
3.2  
1.5  
9.2  
14.5  
21  
pF  
ns  
V GS=-5 V, V DS=25 V,  
C oss  
Crss  
t d(on)  
t r  
f =1 MHz  
V DD=300 V,  
V
GS=-3…7 V,  
t d(off)  
t f  
Turn-off delay time  
Fall time  
I D=0.01 A, R G=6  
115  
170  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
0.05  
1.2  
0.08 nC  
1.8  
V DD=400 V,  
I D=10 mA,  
Q gd  
Q g  
1.4  
2.1  
V
GS=-3 to 5 V  
V plateau  
Gate plateau voltage  
0.10  
-
V
A
Reverse Diode  
I S  
Diode continous forward current  
Diode pulse current  
-
-
-
-
0.016  
0.064  
T A=25 °C  
I S,pulse  
V GS=-5 V, I F=16 mA,  
T j=25 °C  
V SD  
Diode forward voltage  
-
0.81  
1.2  
V
t rr  
Reverse recovery time  
-
-
160  
240 ns  
19.8 nC  
V R=300 V, I F=0.01 A,  
di F/dt =100 A/µs  
Q rr  
Reverse recovery charge  
13.2  
Rev. 1.6  
page 3  
2009-08-18  
BSS126  
1 Power dissipation  
tot=f(T A)  
2 Drain current  
P
I D=f(T A); V GS10 V  
0.6  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.5  
0.4  
0.3  
0.2  
0.1  
0
0
40  
80  
120  
160  
0
40  
80  
120  
160  
T A [°C]  
T A [°C]  
3 Safe operating area  
4 Max. transient thermal impedance  
Z thJA=f(t p)  
I D=f(V GS); V DS=3 V; T j=25 °C  
parameter: t p  
parameter: D =t p/T  
10-1  
103  
10 µs  
limited by on-state  
resistance  
100 µs  
10-2  
10-3  
10-4  
1 ms  
10 ms  
0.5  
102  
0.2  
0.1  
DC  
0.05  
single pulse  
0.02  
0.01  
101  
10-4  
100  
101  
102  
103  
10-3  
10-2  
10-1  
100  
101  
102  
V DS [V]  
t p [s]  
Rev. 1.6  
page 4  
2009-08-18  
BSS126  
5 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
6 Typ. drain-source on resistance  
R DS(on)=f(I D); T j=25 °C  
parameter: V GS  
parameter: V GS  
0.04  
0.03  
0.02  
0.01  
0
1000  
0.2 V  
0.1 V  
-0.2 V  
-0.1 V  
0 V  
0.5 V  
V 10  
V 1  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
V 0.5  
V 0.2  
V 0.1  
V 0  
V 0.1-  
V 0.2-  
1 V  
10 V  
0
4
8
12  
16  
0
0.01  
0.02  
ID [A]  
0.03  
0.04  
V DS [V]  
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
I D=f(V GS); V DS=3 V; T j=25 °C  
g fs=f(I D); T j=25 °C  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.025  
0.02  
0.015  
0.01  
0.005  
0
-2  
-1  
0
1
0.000  
0.005  
0.010  
0.015  
0.020  
V GS [V]  
ID [A]  
Rev. 1.6  
page 5  
2009-08-18  
BSS126  
9 Drain-source on-state resistance  
10 Typ. gate threshold voltage  
V GS(th)=f(T j); V DS=3 V; I D = 8 µA  
parameter: I D  
R
DS(on)=f(T j); I D= 0.016mA; V GS=0 V  
1600  
1400  
1200  
1000  
-1  
-1.5  
%98  
typ  
-2  
-2.5  
-3  
%98  
800  
600  
%2  
400  
typ  
200  
0
-3.5  
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
T j [°C]  
100  
140  
180  
T j [°C]  
11 Threshold voltage bands  
12 Typ. capacitances  
I D=f(V GS); V DS=3 V; T j=25 °C  
C =f(V DS); V GS=-3 V; f =1 MHz  
0.1  
100  
Ciss  
10  
0.01  
8 µA  
Coss  
Crss  
N
M
L
K
J
1
0.001  
-2.5  
0.1  
-2  
-1.5  
-1  
0
5
10  
15  
20  
25  
30  
V GS [V]  
V DS [V]  
Rev. 1.6  
page 6  
2009-08-18  
BSS126  
13 Forward characteristics of reverse diode  
I F=f(V SD  
15 Typ. gate charge  
V GS=f(Q gate); I D=0.1 A pulsed  
parameter: V DD  
)
parameter: T j  
6
0.1  
0.2 VDS(max)  
0.5 VDS(max)  
150 °C  
25 °C  
5
4
150 °C, 98%  
0.8 VDS(max)  
3
25 °C, 98%  
2
1
0.01  
0
-1  
-2  
-3  
-4  
0.001  
0
0
0.4  
0.8  
1.2  
1.6  
0.5  
1
1.5  
2
2.5  
V SD [V]  
Q gate [nC]  
16 Drain-source breakdown voltage  
I D=f(V GS); V DS=3 V; T j=25 °C  
700  
660  
620  
580  
540  
500  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
Rev. 1.6  
page 7  
2009-08-18  
BSS126  
Package Outline:  
Footprint:  
Packaging:  
Dimensions in mm  
Rev. 1.6  
page 8  
2009-08-18  
BSS126  
Published by  
Infineon Technologies AG  
Bereich Kommunikation  
St.-Martin-Straße 53  
D-81451 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as  
warranted characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact your  
nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide  
(see address list).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact your nearest Infineon Technologies office.  
Infineon Technologies' components may only be used in life-support devices or systems with the  
expressed written approval of Infineon Technologies if a failure of such components can reasonably  
be expected to cause the failure of that life-support device or system, or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted  
in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons may be endangered.  
Rev. 1.6  
page 9  
2009-08-18  

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