BSC016N06NST [INFINEON]

采用 SuperSO8 封装的 OptiMOS™ 5 功率 MOSFET 彰显出先进的技术,封装的工作温度也随之改善。新型组合提高了功率密度以及坚固性。;
BSC016N06NST
型号: BSC016N06NST
厂家: Infineon    Infineon
描述:

采用 SuperSO8 封装的 OptiMOS™ 5 功率 MOSFET 彰显出先进的技术,封装的工作温度也随之改善。新型组合提高了功率密度以及坚固性。

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BSC016N06NST  
MOSFET  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
TDSON-8ꢀFLꢀ(enlargedꢀsourceꢀinterconnection)  
8
7
6
5
Features  
•ꢀOptimizedꢀforꢀsynchronousꢀrectification  
•ꢀ175ꢀ°Cꢀrated  
•ꢀ100%ꢀavalancheꢀtested  
1
5
2
6
7
3
4
8
•ꢀSuperiorꢀthermalꢀresistance  
•ꢀN-channel  
•ꢀQualifiedꢀaccordingꢀtoꢀJEDEC1)ꢀꢀforꢀtargetꢀapplications  
•ꢀPb-freeꢀleadꢀplating;ꢀRoHSꢀcompliant  
•ꢀHalogen-freeꢀaccordingꢀtoꢀIEC61249-2-21  
•ꢀHigherꢀsolderꢀjointꢀreliabilityꢀdueꢀtoꢀenlargedꢀsourceꢀinterconnection  
4
3
2
1
S 1  
S 2  
S 3  
G 4  
8 D  
7 D  
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters  
Parameter  
Value  
Unit  
6 D  
5 D  
VDS  
60  
V
RDS(on),max  
ID  
1.6  
234  
81  
m  
A
QOSS  
nC  
nC  
QG(0V..10V)  
71  
Typeꢀ/ꢀOrderingꢀCode  
Package  
Marking  
RelatedꢀLinks  
BSC016N06NST  
PG-TDSON-8 FL  
016N06NT  
-
1) J-STD20 and JESD22  
Final Data Sheet  
1
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
TableꢀofꢀContents  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Final Data Sheet  
2
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
1ꢀꢀꢀꢀꢀMaximumꢀratings  
atꢀTA=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified  
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
-
-
-
-
-
-
234  
164  
31  
VGS=10ꢀV,ꢀTC=25ꢀ°C  
Continuous drain current1)  
ID  
A
VGS=10ꢀV,ꢀTC=100ꢀ°C  
VGS=10ꢀV,ꢀTA=25ꢀ°C,ꢀRthJA=50ꢀK/W2)  
Pulsed drain current3)  
Avalanche energy, single pulse4)  
ID,pulse  
EAS  
-
-
-
-
936  
380  
20  
A
TC=25ꢀ°C  
-
mJ  
V
ID=50ꢀA,ꢀRGS=25ꢀΩ  
Gate source voltage  
VGS  
-20  
-
-
-
-
-
167  
3.0  
TC=25ꢀ°C  
TA=25ꢀ°C,ꢀRthJA=50ꢀK/W  
Power dissipation  
Ptot  
W
Operating and storage temperature  
Tj,ꢀTstg  
-55  
-
175  
°C  
-
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Thermal resistance, junction - case,  
bottom  
RthJC  
RthJC  
RthJA  
-
0.5  
0.9  
K/W  
K/W  
K/W  
-
-
-
Thermal resistance, junction - case,  
top  
-
-
-
-
20  
50  
Device on PCB,  
6 cm2 cooling area2)  
1) Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature  
at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual  
environmental conditions.  
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
3) See Diagram 3 for more detailed information  
4) See Diagram 13 for more detailed information  
Final Data Sheet  
3
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
3ꢀꢀꢀꢀꢀElectricalꢀcharacteristics  
atꢀTj=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified  
Tableꢀ4ꢀꢀꢀꢀꢀStaticꢀcharacteristics  
Values  
Typ.  
-
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
60  
Max.  
-
Drain-source breakdown voltage  
Gate threshold voltage  
V(BR)DSS  
VGS(th)  
V
V
VGS=0ꢀV,ꢀID=1ꢀmA  
VDS=VGS,ꢀID=95ꢀµA  
2.1  
2.8  
3.3  
-
-
0.5  
10  
1
100  
VDS=60ꢀV,ꢀVGS=0ꢀV,ꢀTj=25ꢀ°C  
VDS=60ꢀV,ꢀVGS=0ꢀV,ꢀTj=125ꢀ°C  
Zero gate voltage drain current  
Gate-source leakage current  
Drain-source on-state resistance  
IDSS  
µA  
nA  
IGSS  
-
10  
100  
VGS=20ꢀV,ꢀVDS=0ꢀV  
-
-
1.4  
1.9  
1.6  
2.4  
VGS=10ꢀV,ꢀID=50ꢀA  
VGS=6ꢀV,ꢀID=12.5ꢀA  
RDS(on)  
mΩ  
Gate resistance1)  
Transconductance  
RG  
gfs  
-
1.9  
2.9  
-
-
70  
140  
S
|VDS|>2|ID|RDS(on)max,ꢀID=50ꢀA  
Tableꢀ5ꢀꢀꢀꢀꢀDynamicꢀcharacteristics1)ꢀ  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Input capacitance  
Ciss  
Coss  
Crss  
3900 5200 6500 pF  
VGS=0ꢀV,ꢀVDS=30ꢀV,ꢀf=1ꢀMHz  
VGS=0ꢀV,ꢀVDS=30ꢀV,ꢀf=1ꢀMHz  
VGS=0ꢀV,ꢀVDS=30ꢀV,ꢀf=1ꢀMHz  
Output capacitance  
900  
14  
1200 1500 pF  
Reverse transfer capacitance  
48  
19  
96  
38  
pF  
ns  
VDD=30ꢀV,ꢀVGS=10ꢀV,ꢀID=30ꢀA,  
RG,ext=1.6ꢀΩ  
Turn-on delay time  
Rise time  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
VDD=30ꢀV,ꢀVGS=10ꢀV,ꢀID=30ꢀA,  
RG,ext=1.6ꢀΩ  
9
18  
70  
18  
ns  
ns  
ns  
VDD=30ꢀV,ꢀVGS=10ꢀV,ꢀID=30ꢀA,  
RG,ext=1.6ꢀΩ  
Turn-off delay time  
Fall time  
35  
9
VDD=30ꢀV,ꢀVGS=10ꢀV,ꢀID=30ꢀA,  
RG,ext=1.6ꢀΩ  
Tableꢀ6ꢀꢀꢀꢀꢀGateꢀchargeꢀcharacteristics2)ꢀ  
Values  
Typ.  
22  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
16  
Max.  
30  
Gate to source charge  
Gate charge at threshold  
Gate to drain charge  
Switching charge  
Qgs  
nC  
nC  
nC  
nC  
nC  
V
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDD=30ꢀV,ꢀID=50ꢀA,ꢀVGS=0ꢀtoꢀ10ꢀV  
VDS=0.1ꢀV,ꢀVGS=0ꢀtoꢀ10ꢀV  
Qg(th)  
Qgd  
10  
14  
19  
8.8  
14  
13  
20  
Qsw  
21  
30  
Gate charge total  
Qg  
58  
71  
95  
Gate plateau voltage  
Gate charge total, sync. FET  
Output charge  
Vplateau  
Qg(sync)  
Qoss  
3.7  
49  
4.3  
62  
4.9  
86  
nC  
nC  
60  
81  
102  
VDD=30ꢀV,ꢀVGS=0ꢀV  
1) Defined by design. Not subject to production test  
2) See Gate charge waveformsfor parameter definition. Defined by design, not subject to production test  
Final Data Sheet  
4
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
Tableꢀ7ꢀꢀꢀꢀꢀReverseꢀdiode  
Values  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Typ.  
-
Max.  
167  
936  
1.2  
Diode continuous forward current  
Diode pulse current  
IS  
-
A
TC=25ꢀ°C  
IS,pulse  
VSD  
trr  
-
-
A
TC=25ꢀ°C  
Diode forward voltage  
-
0.9  
61  
78  
V
VGS=0ꢀV,ꢀIF=50ꢀA,ꢀTj=25ꢀ°C  
VR=30ꢀV,ꢀIF=50A,ꢀdiF/dt=100ꢀA/µs  
VR=30ꢀV,ꢀIF=50A,ꢀdiF/dt=100ꢀA/µs  
Reverse recovery time1)  
Reverse recovery charge1)  
24  
39  
98  
ns  
nC  
Qrr  
156  
1) Defined by design. Not subject to production test  
Final Data Sheet  
5
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
4ꢀꢀꢀꢀꢀElectricalꢀcharacteristicsꢀdiagrams  
Diagramꢀ1:ꢀPowerꢀdissipation  
Diagramꢀ2:ꢀDrainꢀcurrent  
180  
240  
160  
140  
120  
100  
80  
200  
160  
120  
80  
60  
40  
40  
20  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
25  
50  
75  
100  
125  
150  
175  
200  
TCꢀ[°C]  
TCꢀ[°C]  
Ptot=f(TC)  
ID=f(TC);ꢀVGS10ꢀV  
Diagramꢀ3:ꢀSafeꢀoperatingꢀarea  
Diagramꢀ4:ꢀMax.ꢀtransientꢀthermalꢀimpedance  
103  
101  
1 µs  
10 µs  
102  
101  
100  
10-1  
100  
100 µs  
0.5  
1 ms  
10 ms  
0.2  
DC  
10-1  
0.1  
0.05  
0.02  
0.01  
10-2  
single pulse  
10-3  
10-1  
100  
101  
102  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
VDSꢀ[V]  
tpꢀ[s]  
ID=f(VDS);ꢀTC=25ꢀ°C;ꢀD=0;ꢀparameter:ꢀtp  
ZthJC=f(tp);ꢀparameter:ꢀD=tp/T  
Final Data Sheet  
6
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
Diagramꢀ5:ꢀTyp.ꢀoutputꢀcharacteristics  
Diagramꢀ6:ꢀTyp.ꢀdrain-sourceꢀonꢀresistance  
400  
5 V  
10 V  
3.0  
350  
6 V  
8 V  
300  
250  
200  
150  
100  
50  
5.5 V  
2.5  
5.5 V  
6 V  
2.0  
8 V  
5 V  
1.5  
10 V  
1.0  
0
0.5  
0
1
2
0
50  
100  
150  
200  
250  
300  
350  
400  
VDSꢀ[V]  
IDꢀ[A]  
ID=f(VDS);ꢀTj=25ꢀ°C;ꢀparameter:ꢀVGS  
RDS(on)=f(ID);ꢀTj=25ꢀ°C;ꢀparameter:ꢀVGS  
Diagramꢀ7:ꢀTyp.ꢀtransferꢀcharacteristics  
Diagramꢀ8:ꢀTyp.ꢀforwardꢀtransconductance  
400  
200  
320  
240  
160  
80  
160  
120  
80  
40  
0
175 °C  
25 °C  
0
0
1
2
3
4
5
6
0
20  
40  
60  
80  
100  
VGSꢀ[V]  
IDꢀ[A]  
ID=f(VGS);ꢀ|VDS|>2|ID|RDS(on)max;ꢀparameter:ꢀTj  
gfs=f(ID);ꢀTj=25ꢀ°C  
Final Data Sheet  
7
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
Diagramꢀ9:ꢀDrain-sourceꢀon-stateꢀresistance  
Diagramꢀ10:ꢀTyp.ꢀgateꢀthresholdꢀvoltage  
3.5  
4.0  
3.5  
3.0  
3.0  
2.5  
950 µA  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max  
2.0  
95 µA  
typ  
1.5  
1.0  
0.5  
0.0  
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
Tjꢀ[°C]  
Tjꢀ[°C]  
RDS(on)=f(Tj);ꢀID=50ꢀA;ꢀVGS=10ꢀV  
VGS(th)=f(Tj);ꢀVGS=VDS  
Diagramꢀ11:ꢀTyp.ꢀcapacitances  
Diagramꢀ12:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode  
104  
103  
25 °C  
Ciss  
25 °C, max  
175 °C  
175 °C, max  
Coss  
103  
102  
101  
102  
101  
100  
Crss  
0
10  
20  
30  
40  
50  
60  
0.0  
0.5  
1.0  
1.5  
VDSꢀ[V]  
VSDꢀ[V]  
C=f(VDS);ꢀVGS=0ꢀV;ꢀf=1ꢀMHz  
IF=f(VSD);ꢀparameter:ꢀTj  
Final Data Sheet  
8
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
Diagramꢀ13:ꢀAvalancheꢀcharacteristics  
Diagramꢀ14:ꢀTyp.ꢀgateꢀcharge  
102  
12  
30 V  
48 V  
10  
8
12 V  
25 °C  
100 °C  
150 °C  
101  
6
4
2
100  
0
100  
101  
102  
103  
0
20  
40  
60  
80  
tAVꢀ[µs]  
Qgateꢀ[nC]  
IAS=f(tAV);ꢀRGS=25ꢀ;ꢀparameter:ꢀTj(start)  
VGS=f(Qgate);ꢀID=50ꢀAꢀpulsed;ꢀparameter:ꢀVDD  
Diagramꢀ15:ꢀDrain-sourceꢀbreakdownꢀvoltage  
Diagram Gate charge waveforms  
70  
68  
66  
64  
62  
60  
58  
56  
54  
52  
50  
-60  
-20  
20  
60  
100  
140  
180  
Tjꢀ[°C]  
VBR(DSS)=f(Tj);ꢀID=1ꢀmA  
Final Data Sheet  
9
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
5ꢀꢀꢀꢀꢀPackageꢀOutlines  
DOCUMENT NO.  
Z8B000193699  
REVISION  
03  
MILLIMETERS  
DIMENSION  
MIN.  
0.90  
0.15  
0.26  
4.80  
3.70  
0.02  
5.70  
5.90  
3.88  
MAX.  
1.20  
0.35  
0.54  
5.35  
4.40  
0.23  
6.10  
6.42  
4.42  
SCALE 10:1  
A
A1  
b
3mm  
0
1
2
D
D1  
D2  
E
EUROPEAN PROJECTION  
E1  
E2  
e
1.27  
L
0.69  
0.45  
0.90  
0.69  
ISSUE DATE  
19.06.2019  
M
Figureꢀ1ꢀꢀꢀꢀꢀOutlineꢀPG-TDSON-8ꢀFL,ꢀdimensionsꢀinꢀmm  
Final Data Sheet  
10  
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTMꢀPower-MOSFET,ꢀ60ꢀV  
BSC016N06NST  
PG-TDSON-8­FL: Recommended Boardpads & Apertures  
Figure 2 Outline Boardpads (TDSON-8 FL)  
Final Data Sheet  
11  
Rev.ꢀ2.2,ꢀꢀ2020-08-13  
OptiMOSTM Power-MOSFET , 60 V  
BSC016N06NST  
Figure 3 Outline Tape (TDSON-8 FL )  
Final Data Sheet  
12  
Rev. 2.2, 2020-08-13  
OptiMOSTM Power-MOSFET , 60 V  
BSC016N06NST  
Revision History  
BSC016N06NST  
Revision: 2020-08-13, Rev. 2.2  
Previous Revision  
Revision Date  
Subjects (major changes since last revision)  
2.0  
2.1  
2.2  
Release of final version  
Update package drawings  
Update current rating  
2017-03-01  
2019-10-22  
2020-08-13  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
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The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics  
(“Beschaffenheitsgarantie”) .  
With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the  
product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation  
warranties of non-infringement of intellectual property rights of any third party.  
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this  
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the  
product of Infineon Technologies in customer’s applications.  
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s  
technical departments to evaluate the suitability of the product for the intended application and the completeness of the product  
information given in this document with respect to such application.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon  
Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the types in question,  
please contact the nearest Infineon Technologies Office.  
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or  
automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a  
failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and  
aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be endangered.  
Final Data Sheet  
13  
Rev. 2.2, 2020-08-13  

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