BGSC2341ML10 [INFINEON]

BGSC2341ML10 is a versatile Integrated Circuit (IC) ideal for RF tuning applications such as tunable impedance matching, antenna tuning and tunable filtering. This IC integrates an 8-states tunable capacitor and an extremely low RON Single Pole Double Throw (SPDT) RF switch function; both controlled by on-chip MIPI 2.1 RFFE digital interface.;
BGSC2341ML10
型号: BGSC2341ML10
厂家: Infineon    Infineon
描述:

BGSC2341ML10 is a versatile Integrated Circuit (IC) ideal for RF tuning applications such as tunable impedance matching, antenna tuning and tunable filtering. This IC integrates an 8-states tunable capacitor and an extremely low RON Single Pole Double Throw (SPDT) RF switch function; both controlled by on-chip MIPI 2.1 RFFE digital interface.

光电二极管
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BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Features  
Designed for high-linearity applications  
Ultra low RON resistance of 0.87 at each SPDT throw in ON state  
High operating RF Voltage handling 40 V  
0.25-2.00 pF Tuning range at 1.8 GHz  
Operating frequencies: 0.4 - 3.8 GHz  
High ESD Robustness  
MIPI 2.1 RFFE compliant control interface  
2 default USID selectable via USID_SEL pin  
Supply voltage range: 1.65 to 1.95 V  
1.1x1.5mm2  
Small form factor 1.1 mm x 1.5 mm (MSL1, 260C per JEDEC J-STD-020)  
RoHS and WEEE compliant package  
Potential Applications  
Impedance Tuning  
Antenna Tuning  
Inductance Tuning  
Product Validation  
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.  
Block diagram  
RFC  
Voltage  
ESD  
Regulator  
C1  
SW1  
SW2  
VIO  
MIPI  
RFFE  
SCLK  
Drivers  
SDAT  
USID_SEL  
Chargepump  
ESD  
GND  
RF3 RF1  
RF2  
Final Data Sheet  
www.infineon.com  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Table of Contents  
Table of Contents  
Table of Contents  
1
2
1
Features  
2
3
4
5
6
7
8
Maximum Ratings  
3
DC Characteristics  
4
RF Small Signal Characteristics  
RF Large Signal Parameters  
MIPI RFFE Specification  
Application Information  
Package Information  
5
8
10  
17  
18  
Final Data Sheet  
1
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Features  
1 Features  
Designed for high-linearity applications  
Ultra low RON resistance of 0.87 at each SPDT throw in ON state  
High operating RF Voltage handling 40 V  
0.25-2.00 pF Tuning range at 1.8 GHz  
Operating frequencies: 0.4 - 3.8 GHz  
High ESD Robustness  
MIPI 2.1 RFFE compliant control interface  
2 default USID selectable via USID_SEL pin  
Supply voltage range: 1.65 to 1.95 V  
Small form factor 1.1 mm x 1.5 mm (MSL1, 260C per JEDEC J-STD-020)  
RoHS and WEEE compliant package  
Description  
The BGSC2341ML10 is a versatile Integrated Circuit (IC) ideal for RF tuning applications such as tunable impedance matching,  
antenna tuning, tunable filtering. This IC integrates a 8 states tunable capacitor and an extremely low Ron Single Pole  
Double Throw (SPDT) RF switch function; both controlled by on-chip MIPI2.1 RFFE digital interface. Last but not the least, the  
BGSC2341ML10 exhibits very good linearity in high RF power conditions and up to RF Voltage of 40 V which is a key attribute in  
application like antenna tuning. It does not require any additional High Voltage Supply Controller IC and can be powered by a  
single 1.8 V Power Supply at an extremely low current consumption level. With 1.1 mm x 1.5 mm package dimensions, it is a  
compact solution fitting well to any small form factor mobile phone-like applications.  
Product Name  
Marking  
Package  
Ordering Information  
BGSC2341ML10  
C2  
TSLP-10-2  
BGSC 2341ML10 E6327  
Final Data Sheet  
2
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Maximum Ratings  
2 Maximum Ratings  
Spectrum  
Analyser  
(Hx Monitor)  
50 Ohm  
50 Ohm Transmission Line  
SIGNAL  
SOURCE  
Power  
Meter  
RFC  
Voltage  
Regulator  
ESD  
C1  
SW1  
SW2  
VIO  
MIPI  
RFFE  
SCLK  
SDAT  
USID_SEL  
Drivers  
ESD  
Chargepump  
RF2  
RF3 RF1  
GND  
Figure 1: RF operating voltage measurement configuration (Switches 1,2 OFF and C1-Tuner position in Isolation Mode)  
Table 1: Maximum Ratings at TA = 25 C, unless otherwise specified  
Parameter  
Symbol  
Values  
Unit Note / Test Condition  
Min. Typ. Max.  
1)  
Frequency Range  
Storage temperature range  
RF input power  
f
0.4  
-55  
3.8  
150  
39  
GHz  
TSTG  
PRF_max  
C  
dBm Pulsed RF input duty cycle of  
25 % and 4620 µs in ON-state,  
measured per 3GPP TS 45.005  
RF voltage  
VRF_max  
45  
V
Short term peaks (1 µs in 0.1%  
duty cycle), exceeding typical  
linearity, RON and COFF param-  
eters, in Isolation mode, test  
condition schematic in Fig. 1  
ESD robustness, CDM 3)  
ESD robustness, HBM 4)  
Junction temperature  
Thermal resistance junction - soldering point RthJS  
RFFE Supply Voltage  
VESD  
-1  
-750  
-0.5  
-0.7  
40  
+1  
+750  
125  
43  
2.2  
kV  
V
CDM  
VESD  
HBM  
Tj  
C  
K/W  
V
VIO  
VSCLK  
RFFE Control Voltage Levels  
,
VIO+0.7  
V
VSDAT  
,
(max. 2.2)  
VUSID_SEL  
1) Switch has a low-pass response. For higher frequencies, losses have to be considered for their impact on thermal heating. The DC voltage at RF ports VRFDC has  
to be 0V.  
2) Note: Consider any ripple voltages on top of VDD. A high RF ripple at the VDD can exceed the maximum ratings by VDD = VDC + VRipple  
.
3) Field-Induced Charged-Device Model ANSI/ESDA/JEDEC JS-002. Simulates charging/discharging events that occur in production equipment and processes.  
Potential for CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing.  
4) Human Body Model ANSI/ESDA/JEDEC JS-001 (R = 1,5 kΩ, C = 100 pF).  
5) IEC 61000-4-2 (R = 330 , C = 150 pF), contact discharge.  
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Maximum rat-  
ings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.  
Exposure to conditions at or below absolute maximum rating but above the specified maximum operation conditions  
may aꢀect device reliability and life time. Functionality of the device might not be given under these conditions.  
Final Data Sheet  
3
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
DC Characteristics  
3 DC Characteristics  
Table 2: DC Characteristics at TA = 40 C to 85 C  
Parameter  
Symbol  
Values  
Unit  
Note / Test Condition  
Min.  
1.65  
Typ.  
1.8  
Max.  
1.95  
VIO  
RFFE supply voltage  
VIO  
VIH  
VIL  
V
RFFE input high voltage1  
RFFE input low voltage1  
RFFE output high voltage1  
RFFE output low voltage1  
0.7*VIO  
V
0
0.3*VIO  
VIO  
V
VOH  
VOL  
0.8*VIO  
V
0
0.2*VIO  
2
V
RFFE control input capacitance CCtrl  
pF  
µA  
µA  
1.7  
65  
9
110  
VIO shutdown mode  
Power up mode  
RFFE supply current  
IVIO  
1SCLK and SDATA  
Final Data Sheet  
4
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
RF Small Signal Characteristics  
4 RF Small Signal Characteristics  
RFC  
SPDT  
C-Tuner  
DC ROFF  
Ctune  
RON  
RF1  
RF3  
COFF  
GND  
GND  
DC ROFF  
RON  
RF2  
COFF  
GND  
GND  
Figure 2: RF measurement equivalent circuit  
Table 3: Parametric specifications of DC the equivalent circuit  
Parameter  
Symbol  
Values  
Unit  
STATE / Notes  
Min.  
Typ.  
Max.  
SPDT  
VIO = 1.65 1.95 V,  
RON DC ON resistance  
ROFF DC OFF resistance  
RON  
ROFF  
0.66  
77  
0.87  
110  
1.08  
133  
KΩ  
TA = 40 C... + 85 C  
Final Data Sheet  
5
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
RF Small Signal Characteristics  
Table 4: Parametric specifications of the RF equivalent circuit @ f= 900 MHz (1,2,3)  
Parameter  
Symbol  
Values  
Typ.  
Unit  
STATE / Notes  
Min.  
Max.  
CP,ESD SHUNT capacitance  
C-Tuner  
CP,ESD  
190  
220  
285  
fF  
Ctune State 0  
Ctune State 1  
Ctune State 2  
Ctune State 3  
Ctune State 4  
Ctune State 5  
Ctune State 6  
Ctune State 7  
C0  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
245  
440  
635  
260  
460  
665  
285  
520  
750  
970  
1210  
1430  
1675  
2000  
245  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
VIO = 1.65 1.95 V,  
TA = 25C  
835  
870  
1030  
1220  
1435  
1685  
175  
1075  
1280  
1500  
1775  
205  
CP,tune SHUNT capacitance  
SPDT  
CP,tune  
COFF OFF capacitance  
COFF  
CP,RF  
185  
120  
200  
165  
225  
225  
fF  
fF  
CP,RF SHUNT capacitance  
1) Network analyser input power: PIN = 0 dBm  
2) On application board without any matching components.  
3) This C-tuner has a monotonic behaviour: C value will increase if programming a growing C state and decrease if programming a decreasing C state.  
Table 5: Parametric specifications of the RF equivalent circuit @ f= 1.8 GHz (1,2,3)  
Parameter  
Symbol  
Values  
Typ.  
215  
Unit  
STATE / Notes  
Min.  
200  
Max.  
270  
CP,ESD SHUNT capacitance  
C-Tuner  
CP,ESD  
fF  
Ctune State 0  
Ctune State 1  
Ctune State 2  
Ctune State 3  
Ctune State 4  
Ctune State 5  
Ctune State 6  
Ctune State 7  
C0  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
250  
460  
670  
900  
1110  
1350  
1595  
1855  
160  
270  
500  
725  
1000  
1200  
1475  
1750  
2000  
185  
300  
560  
810  
1100  
1360  
1650  
1950  
2300  
230  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
VIO = 1.65 1.95 V,  
TA = 25C  
CP,tune SHUNT capacitance  
SPDT  
CP,tune  
COFF OFF capacitance  
COFF  
CP,RF  
185  
110  
205  
155  
230  
265  
fF  
fF  
CP,RF SHUNT capacitance  
1) Network analyser input power: PIN = 0 dBm  
2) On application board without any matching components.  
3) This C-tuner has a monotonic behaviour: C value will increase if programming a growing C state and decrease if programming a decreasing C state.  
Final Data Sheet  
6
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
RF Small Signal Characteristics  
Table 6: Parametric specifications of the RF equivalent circuit @ f= 2.7 GHz (1,2,3)  
Parameter  
Symbol  
Values  
Typ.  
Unit  
STATE / Notes  
Min.  
Max.  
CP,ESD SHUNT capacitance  
C-Tuner  
CP,ESD  
205  
225  
260  
fF  
Ctune State 0  
Ctune State 1  
Ctune State 2  
Ctune State 3  
Ctune State 4  
Ctune State 5  
Ctune State 6  
Ctune State 7  
C0  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
260  
500  
755  
1050  
1275  
1590  
1940  
2345  
155  
290  
550  
840  
1180  
1400  
1800  
2200  
2660  
180  
320  
610  
935  
1300  
1610  
2000  
2460  
3240  
210  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
fF  
VIO = 1.65 1.95 V,  
TA = 25C  
CP,tune SHUNT capacitance  
SPDT  
CP,tune  
COFF OFF capacitance  
COFF  
CP,RF  
190  
120  
215  
155  
250  
185  
fF  
fF  
CP,RF SHUNT capacitance  
1) Network analyser input power: PIN = 0 dBm  
2) On application board without any matching components.  
3) This C-tuner has a monotonic behaviour: C value will increase if programming a growing C state and decrease if programming a decreasing C state.  
Final Data Sheet  
7
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
RF Large Signal Parameters  
5 RF Large Signal Parameters  
Table 7: RF large signal specifications at TA = 40 .. + 85 C, unless otherwise specified  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note / Test Condition  
Min.  
Max.  
40  
RF operating voltage  
VRF_peak  
V
In Isolation mode, test condition  
schematic in Fig. 1 for H2/H3 < -  
35dBm @ 50, TA = 25 C  
Harmonic Generation up to 12.75 GHz(1,2)  
All RF Ports - Second Order Har- PH2  
monics  
-
-
-
-
-
-
-71  
-65  
-79  
-39  
-50  
-46  
-51  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
25 dBm,f0 = 824 MHz  
25 dBm,f0 = 824 MHz  
35 dBm,f0 = 824 MHz  
35 dBm, f0 = 824 MHz  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
-84  
-44  
-56  
-48  
-52  
-87  
All RF Ports - Second Order Har- PH2  
monics  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
All RF Ports - Second Order Har- PH2  
monics  
33 dBm,f0 = 1800 MHz,  
TA = 25 C  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
33 dBm,f0 = 1800 MHz,  
TA = 25 C  
26 dBm ,f0 = 663 MHz, TA = 25 C  
All RF Ports  
PHx  
-65  
Intermodulation Distortion IMD2 (1,2)  
IIP2, low  
IIP2, high  
IIP2,l  
IIP2,h  
100  
100  
111  
116  
dBm  
dBm  
IIP2 conditions Table 8  
IIP3 conditions Table 9  
Intermodulation Distortion IMD3 (1,2)  
IIP3  
IIP3  
70  
73  
dBm  
1) Terminating Port Impedance: Z0 = 50 Ω  
2) On application board without any matching components  
Table 8: IIP2 conditions table  
Band  
In-BandFrequency Blocker Frequency 1 Blocker Power 1  
Blocker Frequency 2 Blocker Power 2  
[MHz]  
2140  
[MHz]  
1950  
[dBm]  
20  
[MHz]  
190  
[dBm]  
-15  
Band 1 Low  
Band 1 High 2140  
Band 5 Low 881.5  
Band 5 High 881.5  
1950  
20  
4090  
45  
-15  
836.5  
836.5  
20  
-15  
20  
1718  
-15  
Final Data Sheet  
8
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
RF Large Signal Parameters  
Table 9: IIP3 conditions table  
Band  
In-BandFrequency Blocker Frequency 1 Blocker Power 1  
Blocker Frequency 2 Blocker Power 2  
[MHz]  
2140  
[MHz]  
1950  
[dBm]  
20  
[MHz]  
1760  
[dBm]  
-15  
Band 1  
Band 5  
881.5  
836.5  
20  
791.5  
-15  
Final Data Sheet  
9
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
6 MIPI RFFE Specification  
Warning: Register_0 and Register_1 RF switch control bits are identical. Writing both Registers Register_0 and Reg-  
ister_1 simultaneously will lead to undefined behavior. The unused register (Register_0 or Register_1) must remain  
0x00.  
The MIPI RFFE interface is working in systems following the ’MIPI Alliance Specification for RF Front-End Control Interface  
version 2.1 - 18 December 2017, the ’MIPI Alliance Errata 01 for MIPI RFFE Specification version 2.1 - 24 February 2019, and the  
’Qualcomm RFFE Vendor specification 80-N7876-1 Rev. W.’  
Table 10: MIPI Features  
Feature  
Supported Comment  
MIPI RFFE 2.1 standard  
Yes  
Yes  
Yes  
Backward compatible to MIPI 2.0 standard  
Register 0 write command sequence  
Register read and write command sequence  
Extended register read and write command sequence Yes  
Masked write command sequence Yes  
Indicated as MW in below register mapping tables  
Up to 26 MHz for read and write  
Support for standard frequency range operations for Yes  
SCLK  
Support for extended frequency range operations for Yes  
SCLK  
Up to 52 MHz for write  
Half speed read  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Up to 26 MHz  
Up to 26 MHz  
Full speed read  
Full speed write  
Longer Reach RFFE Bus Length Feature  
Programmable driver strength  
Programmable Group SID  
Programmable USID  
Up to 80 pF  
Trigger functionality  
Extended Triggers and Trigger Masks  
Broadcast / GSID write to PM TRIG register  
Reset  
Via VIO, PM TRIG or soꢀware register  
Status / error sum register  
Extended product ID register  
Revision ID register  
Group SID register  
USID_SEL pin  
See Table 14  
Table 11: Startup Behavior  
Feature  
State  
Comment  
Power status  
Low power  
Lower power mode aꢀer start-up  
Default power mode is HIGH  
Trigger function  
Final Data Sheet  
Enabled  
Enabled aꢀer start-up. Programmable via behavior control register  
10  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 12: Switching Time Behavior  
Parameter  
Symbol  
Values  
Typ.  
6.5  
Unit  
STATE / Notes  
Min.  
Max.  
13  
Power Up Settling Time  
tPUP  
µs  
Time from Power Up plus Switch  
command 50% last SCLK falling  
edge to 90% RF-Signal,  
see Fig. 3  
SW1, SW2 SPST Switching Time  
C1 C-Tuner Switching Time  
tST  
10.5  
9.5  
16  
17  
µs  
µs  
Time switching between RF  
states 50% last SCLK falling  
edge to 90% RF-Signal,  
see Fig. 3  
SW1,SW2  
tST  
C1  
VDD+IO  
1)  
>120ns  
tPUP  
tST  
<50ns  
SCLK 52MHz  
Power Up  
SDATA  
Switch A  
Command  
Switch B  
Command  
Command  
90%  
RF Path A  
90%  
RF Path B  
1)  
timing starts @ VIO > VIOmin (1.65V) and ends @ SDATA /SCLK < VILmax (0.3 x VIO  
)
Figure 3: BGSC2341ML10 Switching Time Behavior  
Final Data Sheet  
11  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 13: Register Mapping, Table I  
Register  
Address  
Register Name  
Data Function  
Bits  
Description  
Default  
Broadcast_ID  
Support  
Trigger  
Support  
R/W  
0x00  
0x01  
0x1C  
REGISTER_0  
7:0  
7:0  
7
MODE_CTRL  
RF Switches and C-Tuner Control  
00000000  
No  
No  
Yes  
Yes  
Trigger 0-10  
Yes  
R/W  
MW  
R/W  
MW  
R/W  
MW  
REGISTER_1  
PM_TRIG  
MODE_CTRL  
RF Switches and C-Tuner Control  
00000000  
Trigger 0-10  
No  
PWR_MODE(1)  
Operation Mode  
PWR_MODE(0)  
State Bit Vector  
0: Normal operation (ACTIVE)  
1: Low Power Mode (LOW POWER)  
0: No action (ACTIVE)  
1
6
0
1: Powered Reset (STARTUP to ACTIVE  
to LOW POWER)  
5
4
3
TRIGGER_MASK_2  
TRIGGER_MASK_1  
TRIGGER_MASK_0  
0: Data masked (held in shadow REG)  
0
0
0
No  
1: Datanotmasked(readyfortransferto  
active REG)  
0: Data masked (held in shadow REG)  
1: Datanotmasked(readyfortransferto  
active REG)  
0: Data masked (held in shadow REG)  
1: Datanotmasked(readyfortransferto  
active REG)  
2
1
TRIGGER_2  
TRIGGER_1  
TRIGGER_0  
PRODUCT_ID  
0: No action (data held in shadow REG)  
1: Data transferred to active REG  
0
Yes  
0: No action (data held in shadow REG)  
1: Data transferred to active REG  
0
0
0: No action (data held in shadow REG)  
1: Data transferred to active REG  
0
0x1D  
0x1E  
0x1F  
PRODUCT_ID  
MAN_ID  
7:0  
This is a read-only register. However,  
during the programming of the USID a  
write command sequence is performed  
on this register, even though the write  
does not change its value.  
01001101  
No  
No  
No  
No  
R
R
7:0  
7:4  
3:0  
MANUFACTURER_ID [7:0]  
MANUFACTURER_ID [11:8]  
USID[1:0]  
This is a read-only register. However,  
during the programming of the USID, a  
write command sequence is performed  
on this register, even though the write  
does not change its value.  
00011010  
MAN_USID  
These bits are read-only. However, dur-  
ing the programming of the USID, a  
write command sequence is performed  
on this register even though the write  
does not change its value.  
01  
USID_SEL pin  
See  
No  
No  
R/W  
Tab. 10  
Final Data Sheet  
12  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 14: Register Mapping, Table II  
Register  
Address  
Register Name  
Data Function  
Bits  
Description  
Default  
Broadcast_ID  
Support  
Trigger  
Support  
R/W  
0x20  
EXT_PRODUCT_ID 7:0  
EXT_PRODUCT_ID  
Extension to PRODUCT_ID in register  
0x1D. This is a read-only register. How-  
ever, during the programming of the  
USID a write command sequence is per-  
formedonthisregister, eventhoughthe  
write does not change its value.  
00000000  
No  
No  
R
0x21  
0x22  
0x23  
REV_ID  
GSID  
7:4  
3:0  
7:4  
3:0  
7
MAIN_REVISION  
SUB_REVISION  
GSID0[3:0]  
Chip main revision  
0001  
0000  
0000  
0000  
0
No  
No  
Yes  
No  
No  
No  
R
Chip sub revision  
Primary Group Slave ID.  
Secondary Group Slave ID.  
R/W  
R/W  
GSID1[3:0]  
UDR_RST  
UDR_RST  
Reset all configurable non-RFFE Re-  
served registers to default values.  
0: Normal operation  
1: Soꢀware reset  
6:0  
7
RESERVED  
Reserved for future use  
Reserved for future use  
0000000  
0x24  
ERR_SUM  
RESERVED  
0
0
No  
No  
R
6
COMMAND_FRAME_PARITY_ERR  
Command Sequence received with par-  
ity error discard command.  
Command length error.  
5
4
3
2
1
COMMAND_LENGTH_ERR  
ADDRESS_FRAME_PARITY_ERR  
DATA_FRAME_PARITY_ERR  
READ_UNUSED_REG  
0
0
0
0
0
0
Address frame with parity error.  
Data frame with parity error.  
Read command to an invalid address.  
Write command to an invalid address.  
WRITE_UNUSED_REG  
BID_GID_ERR  
0
Read command with a BROADCAST_ID  
or GROUP_ID.  
0x2B  
BUS_LD  
7:4  
3:0  
RESERVED  
Reserved for future use  
0x0  
0x4  
No  
No  
R/W  
BUS_LD[3:0]  
Set approximate bus load, default 50 pF  
0x8-0xF: Spare  
Final Data Sheet  
13  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 15: Register Mapping, Table III  
Register  
Address  
Register Name  
Data Function  
Bits  
Description  
Default  
Broadcast_ID  
Support  
Trigger  
Support  
R/W  
0x2D  
EXT_TRIG_MASK  
7
6
5
4
3
2
1
TRIGGER_MASK_10  
0: Data writes to registers tied to  
EXT_TRIGGER_10 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_10 bit is set to 1.  
1
No  
No  
R/W  
1: Data writes to registers tied to  
EXT_TRIGGER_10 are not masked. Data  
writes go directly to the active registers.  
MW  
TRIGGER_MASK_9  
TRIGGER_MASK_8  
TRIGGER_MASK_7  
TRIGGER_MASK_6  
TRIGGER_MASK_5  
TRIGGER_MASK_4  
TRIGGER_MASK_3  
0: Data writes to registers tied to  
EXT_TRIGGER_9 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_9 bit is set to 1.  
1
1
1
1
1
1
1
1: Data writes to registers tied to  
EXT_TRIGGER_9 are not masked. Data  
writes go directly to the active registers.  
0: Data writes to registers tied to  
EXT_TRIGGER_8 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_8 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_8 are not masked. Data  
writes go directly to the active registers.  
0: Data writes to registers tied to  
EXT_TRIGGER_7 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_7 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_7 are not masked. Data  
writes go directly to the active registers.  
0: Data writes to registers tied to  
EXT_TRIGGER_6 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_6 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_6 are not masked. Data  
writes go directly to the active registers.  
0: Data writes to registers tied to  
EXT_TRIGGER_5 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_5 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_5 are not masked. Data  
writes go directly to the active registers.  
0: Data writes to registers tied to  
EXT_TRIGGER_4 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_4 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_4 are not masked. Data  
writes go directly to the active registers.  
0
0: Data writes to registers tied to  
EXT_TRIGGER_3 are masked. Data  
is held in shadow registers until the  
EXT_TRIGGER_3 bit is set to 1.  
1: Data writes to registers tied to  
EXT_TRIGGER_3 are not masked. Data  
writes go directly to the active registers.  
Final Data Sheet  
14  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 16: Register Mapping, Table IV  
Register  
Address  
Register Name  
Data Function  
Bits  
Description  
Default  
Broadcast_ID  
Support  
Trigger  
Support  
R/W  
R/W  
MW  
0x2E  
EXT_TRIG  
7
6
5
4
3
2
1
TRIGGER_10  
TRIGGER_9  
TRIGGER_8  
TRIGGER_7  
TRIGGER_6  
TRIGGER_5  
TRIGGER_4  
TRIGGER_3  
0: No action. Data is held in shadow reg-  
isters.  
0
Yes  
No  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_10  
0: No action. Data is held in shadow reg-  
isters.  
0
0
0
0
0
0
0
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_9  
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_8  
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_7  
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_6  
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_5  
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_4  
0
0: No action. Data is held in shadow reg-  
isters.  
1: Data is transferred from shadow reg-  
isters to active registers for refisters tied  
to EXT_TRIGGER_3  
Final Data Sheet  
15  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
MIPI RFFE Specification  
Table 17: USID_SEL Selection  
Address  
USID_SEL6=0110  
USID_SEL9=1001  
Symbol  
Addr6  
Configuration  
default  
Ext. Condition at USID_SEL Port  
ground  
to VIO  
Addr9  
default  
RFC  
RFC  
10  
NC  
10  
NC  
1
2
3
4
9
RF1  
1
2
3
4
9
RF1  
RF3  
RF3  
RF2  
RF2  
8
7
6
8
7
6
USID_SEL  
USID_SEL  
GND  
GND  
SCLK  
SCLK  
VIO  
5
5
VIO  
SDAT  
SDAT  
Addr9=1001  
Addr6=0110  
Figure 4: BGSC2341ML10 USID_SEL Pin Configuration  
Table 18: Switch MIPI Control Combinations (truth table) 1)  
REGISTER_0 :C-Tuner control register  
State  
0
1
Mode  
Ctune State 0  
Ctune State 1  
D7  
X
X
X
X
X
X
X
X
X
X
X
X
D6  
X
D5  
0
0
0
0
0
0
0
0
0
0
0
0
D4  
X
X
X
X
X
X
X
X
0
0
1
D3  
X
X
X
X
X
X
X
X
0
1
D2  
0
0
0
0
1
D1  
0
0
1
D0  
0
1
X
2
Ctune State 2  
X
0
1
3
Ctune State 3  
X
1
4
5
Ctune State 4  
Ctune State 5  
X
0
0
1
0
1
X
1
6
7
Ctune State 6  
Ctune State 7  
X
1
0
1
X
1
1
8
9
10  
11  
SPDT ALL OFF  
SPDT RF SW1 ON  
SPDT RF SW2 ON  
SPDT RF SW1,SW2 ON  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
1
X
1
1)measured according to the measurement set-up of Fig. 2  
Combination of any state here above mentioned in Table 15 can be programmed in one single MIPI sequence. As an example,  
programmation of RF1 ON RF2 ON C tuner in state 1 can be done in one MIPI data frame with register 0x1=0bxx011001.  
Final Data Sheet  
16  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Application Information  
7 Application Information  
Pin Configuration and Function  
RFC  
10  
NC  
1
9
RF1  
SW1  
SW2  
RF3  
2
C1  
RF2  
8
7
6
GND  
USID_SEL  
VIO  
3
4
SCLK  
5
SDAT  
Figure 5: BGSC2341ML10 Pin Configuration (top view)  
Table 19: Pin Definition and Function of BGSC2341ML10 in Swap Configuration:USID=0111  
Pin No.  
1
Name  
NC  
Pin Type  
-
Function  
Not Connected  
2
3
4
5
6
7
8
9
10  
RF3  
I/O  
I/O  
I
Input/Output Tunable Capacitor Port  
Ground  
GND  
SCLK  
SDAT  
VIO  
MIPI Control Signal SCLOCK(Default)  
MIPI Control Signal SDATA(Default)  
MIPI/DC Voltage Supply  
I/O  
I
USID_SEL  
RF2  
I
USID_SEL hardware pin for USID selection (see Table.17)  
Input/Output RF Switch 2  
Input/Output RF Switch 1  
Input/Output RF Common Port  
I/O  
I/O  
I/O  
RF1  
RFC  
Table 20: ESD robustness, System Level Test (SLT)  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note / Test Condition  
Min.  
-8 2)  
Max.  
+8 2)  
ESD SLT 1)  
VESD  
kV  
RF vs system GND, with 27 nH shunt inductor  
SLT  
1) IEC 61000-4-2 (R = 330 , C = 150 pF), contact discharge.  
2) For RFC path only.  
Final Data Sheet  
17  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Package Information  
8 Package Information  
ꢀꢁꢂꢂꢁꢃ ꢄꢅꢆꢇ  
ꢈꢉꢉ ꢊꢅꢃꢆꢋꢌꢅꢁꢋꢌ ꢈꢍꢆ ꢅꢋ ꢎꢋꢅꢂꢌ ꢃꢃ  
ꢂꢌꢉꢏꢐꢑꢒꢐꢓꢐꢏꢁ  
Figure 6: TSLP-10-2 Package Outline (top, side and bottom views)  
Pin 1 marking  
Date code (YW)  
Type code  
TSLP-10-2 MK  
Figure 7: Marking Specification (top view): Date code digits Y and W defined in Table 21/22  
Final Data Sheet  
18  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Package Information  
Table 21: Year date code marking - digit "Y"  
Year  
2010  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
2018  
2019  
"Y"  
0
1
2
3
4
5
6
7
8
9
Year  
"Y"  
0
1
2
3
4
5
6
7
8
9
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
Table 22: Week date code marking - digit "W"  
Week  
"W"  
A
B
C
D
E
Week  
12  
13  
14  
15  
16  
17  
18  
19  
"W"  
N
P
Q
R
S
T
U
V
W
Y
Week  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
"W"  
4
5
6
7
a
b
c
d
e
f
Week  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
"W"  
h
j
k
l
n
p
q
r
Week  
45  
46  
47  
48  
49  
50  
"W"  
v
x
y
z
8
9
2
3
1
2
3
4
5
6
7
8
9
10  
11  
F
G
H
J
K
L
51  
52  
20  
21  
22  
s
t
u
Z
g
44  
Final Data Sheet  
19  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Package Information  
ꢙꢈꢁꢅꢍꢃꢇꢆ ꢋꢍꢆꢎꢂꢉ ꢏꢇꢋꢐ ꢎꢇꢏ  
ꢖꢑꢗ ꢑꢒꢘꢕ  
ꢑꢒꢓ  
ꢑꢒꢓ  
ꢑꢒꢓ  
ꢖꢑꢗ ꢑꢒꢘꢕ  
ꢀꢍꢆꢎꢂꢉ ꢏꢇꢋꢐ  
ꢑꢒꢓ  
ꢀꢁꢂꢃꢄꢅꢆ ꢇꢈꢂꢉꢁꢊꢉꢂꢋ  
ꢌꢍꢈꢈꢂꢉ  
Figure 8: Footprint Recommendation  
ꢁꢂꢃ  
ꢄꢅꢆ ꢇ  
ꢈꢉꢊꢋꢅꢆꢌ  
ꢇꢂꢍ  
Figure 9: TSLP-10-2 Carrier Tape  
Final Data Sheet  
20  
Revision 2.3  
2021-09-19  
BGSC2341ML10  
RF Digitally Tunable Capacitor + SPDT Switch  
Revision History  
Page or Item  
Subjects (major changes since previous revision)  
Revision 2.3, 2021-09-19  
4th version of the final datasheet  
with update in Table 4-6 (capacitance performance) and Table 18 (truth table)  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
Theinformationgiveninthisdocumentshallinnoevent For further information on technology, delivery terms  
Edition 2021-09-19  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
be regarded as a guarantee of conditions or characteris- and conditions and prices, please contact the nearest  
tics ("Beschaꢁenheitsgarantie"). With respect to any ex- Infineon Technologies Oꢁice (www.infineon.com).  
amples, hints or any typical values stated herein and/or  
any information regarding the application of the prod-  
uct, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without  
limitationwarrantiesofnon-infringementofintellectual  
property rights of any third party. In addition, any infor-  
mation given in this document is subject to customer’s  
WARNINGS  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon Tech-  
nologies oꢁice.  
c
2021 Infineon Technologies AG.  
All Rights Reserved.  
compliance with its obligations stated in this document Except as otherwise explicitly approved by Infineon  
and any applicable legal requirements, norms and stan- Technologies in a written document signed by autho-  
dards concerning customer’s products and any use of rized representatives of Infineon Technologies, Infineon  
the product of Infineon Technologies in customer’s ap- Technologies products may not be used in any applica-  
plications. The data contained in this document is ex- tionswhereafailureoftheproductoranyconsequences  
clusively intended for technically trained staꢁ. It is the of the use thereof can reasonably be expected to result  
responsibility of customer’s technical departments to in personal injury.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Document reference  
Doc_Number  
evaluate the suitability of the product for the intended  
application and the completeness of the product infor-  
mation given in this document with respect to such ap-  
plication.  
Final Data Sheet  
21  
Revision 2.3  
2021-09-19  

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