BA592_07 [INFINEON]
Silicon RF Switching Diode; 硅射频开关二极管
| 型号： | BA592_07 |
| 厂家： | 
Infineon |
| 描述： | Silicon RF Switching Diode |
| 文件： | 总11页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BA592/BA892...
Silicon RF Switching Diode
• For band switching in TV/VTR tuners
and mobile applications
• Very low forward resistance (typ. 0.45 Ω @ 3 mA)
• Small capacitance
1)
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
BA592
BA892/-02L
BA892-02V
1
2
Type
Package
SOD323
SCD80
Configuration
single
L (nH) Marking
S
BA592
BA892
1.8
0.6
0.4
0.6
blue S
AA
single
BA892-02L
BA892-02V
TSLP-2-1
SC79
single, leadless
single
AA
A
Maximum Ratings at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Value
Unit
35
100
V
Diode reverse voltage
Forward current
V
R
mA
°C
I
F
150
Junction temperature
Operating temperature range
Storage temperature
T
j
T
-55 ... 125
-55 ... 150
op
T
stg
1Pb-containing package may be available upon special request
2007-04-19
1
BA592/BA892...
Thermal Resistance
Parameter
Symbol
Value
Unit
1)
K/W
Junction - soldering point
BA592
R
thJS
≤ 135
≤ 120
≤ 70
BA892, BA892-02V
BA892-02L
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
Unit
min.
typ. max.
DC Characteristics
-
-
-
-
20
1
Reverse current
I
nA
V
R
V = 20 V
R
Forward voltage
V
F
I = 100 mA
F
1For calculation of R
please refer to Application Note Thermal Resistance
thJA
2007-04-19
2
BA592/BA892...
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
typ. max.
Unit
min.
AC Characteristics
pF
Diode capacitance
C
T
V = 1 V, f = 1 MHz
0.65
0.6
-
0.92
0.85
1
1.4
1.1
-
R
V = 3 V, f = 1 MHz
R
V = 0 V, f = 100 MHz
R
Reverse parallel resistance
R
-
100
-
kΩ
P
V = 0 V, f = 100 MHz
R
Forward resistance
r
Ω
f
I = 3 mA, f = 100 MHz
-
-
-
0.45
0.36
120
0.7
0.5
-
F
I = 10 mA, f = 100 MHz
F
ns
Charge carrier life time
τ
rr
I = 10 mA, I = 6 mA, measured at I = 3mA,
F
R
R
R = 100 Ω
L
I-region width
W
-
3
-
µm
dB
I
1)
Insertion loss
I = 0.1 mA, f = 1.8 GHz
I
L
-
-
-
0.1
0.5
0.4
-
-
-
F
I = 3 mA, f = 1.8 GHz
F
I = 10 mA, f = 1.8 GHz
F
1)
Isolation
I
SO
V = 0 V, f = 100 MHz
-
-
-
23.5
10.5
5.5
-
-
-
R
V = 0 V, f = 470 MHz
R
V = 0 V, f = 1 GHz
R
1BA892-02L in series configuration,Z = 50Ω
2007-04-19
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BA592/BA892...
Diode capacitance C = ƒ (V )
Reverse parallel resistance R = ƒ(V )
P R
T
R
f = Parameter
f = Parameter
10 3
2
KOhm
100 MHz
pF
10 2
10 1
10 0
10 -1
1.2
0.8
0.4
0
1 GHz
1 MHz ... 1 GHz
V
V
0
5
10
15
20
30
0
5
10
15
20
30
V
VR
R
Forward resistance r = ƒ (I )
Forward current I = ƒ (V )
f
F
F
F
f = 100MHz
T = Parameter
A
10 2
10 0
A
Ohm
10 -1
10 -2
10 -3
10 -4
10 -5
10 -6
10 1
-40 °C
25 °C
85 °C
125 °C
10 0
10 -1
10 -2
10 -1
10 0
10 1
10 2
0
0.2
0.4
0.6
0.8
1.2
mA
V
V
I
F
F
2007-04-19
4
BA592/BA892...
2
2
Insertion loss I = -|S | = ƒ(f)
Isolation I = -|S | = ƒ(f)
SO 21
L
21
I = Parameter
V = Paramter
R
F
BA892-02L in series configuration,Z = 50Ω
BA892-02L in series configuration,Z = 50Ω
0
0
dB
dB
-10
0 V
1 V
10 V
10 mA
3 mA
1 mA
0.1 mA
-0.2
-0.3
-0.4
-15
-20
-25
-30
GHz
GHz
0
0.5
1
1.5
2
3
0
0.5
1
1.5
2
3
f
f
2007-04-19
5
Package SC79
BA592/BA892...
Package Outline
M
0.2
A
+0.05
-0.03
±0.1
0.13
0.8
A
2
1
0.3
Cathode
marking
±0.05
±0.04
0.55
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02V
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Standard
4
Reel with 2 mm Pitch
2
0.2
0.4
0.66
Cathode
marking
Cathode
marking
0.93
2007-04-19
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Package SCD80
BA592/BA892...
Package Outline
M
0.2
A
±0.1
0.13+0.05
0.8
-0.03
A
2
1
0.3
Cathode
marking
±0.05
±0.1
0.7
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Standard
4
Reel with 2 mm Pitch
2
0.2
0.7
Cathode
marking
0.4
0.9
Cathode
marking
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BA592/BA892...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC751)) CES-Code
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01
02
03
04
05
06
07
08
09
10
11
12
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
s
t
s
t
s
t
u
v
x
y
z
2
3
u
v
x
y
z
2
3
u
v
x
y
z
2
3
g
h
j
g
h
j
g
h
j
k
l
K
L
k
l
K
L
k
l
K
L
n
N
5
n
N
5
n
N
5
1) New Marking Layout for SC75, implemented at October 2005.
.
2007-04-19
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Package SOD323
BA592/BA892...
Package Outline
+0.2
-0.1
0.9
+0.2
-0.1
1.25
±0.05
0
A
2
Cathode
marking
1
+0.1
-0.05
+0.05
0.3
-0.2
0.3
+0.1
-0.06
0.15
M
0.25
A
Foot Print
0.6
Marking Layout (Example)
BAR63-03W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
1
0.65
1.35
Cathode
marking
2007-04-19
9
Package TSLP-2-1
BA592/BA892...
Package Outline
Top view
Bottom view
0.4+0.1
±0.05
0.6
0.05 MAX.
2
2
1
1
1)
±0.035
0.5
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
4
Cathode
marking
0.76
2007-04-19
10
BA592/BA892...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
2007-04-19
11
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