AUIRFR120Z [INFINEON]

Power Field-Effect Transistor, 8.7A I(D), 100V, 0.19ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3;
AUIRFR120Z
型号: AUIRFR120Z
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 8.7A I(D), 100V, 0.19ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3

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PD - 96345  
AUIRFR120Z  
AUIRFU120Z  
AUTOMOTIVE MOSFET  
HEXFET® Power MOSFET  
Features  
D
V(BR)DSS  
RDS(on) typ.  
max.  
100V  
l
l
l
l
l
l
l
AdvancedProcessTechnology  
UltraLowOn-Resistance  
175°COperatingTemperature  
FastSwitching  
150m  
190m  
8.7A  
G
RepetitiveAvalancheAlloweduptoTjmax  
Lead-Free,RoHSCompliant  
AutomotiveQualified*  
S
ID  
D
D
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junction operating temperature, fast switching speed and  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliabledeviceforuseinAutomotiveapplicationsandawide  
varietyofotherapplications.  
S
S
D
D
G
G
D-Pak  
I-Pak  
AUIRFU120Z  
AUIRFR120Z  
G
Gate  
D
Drain  
S
Source  
AbsoluteMaximumRatings  
StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice. These  
arestressratingsonly;andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthoseindicatedin  
thespecificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevice  
reliability.Thethermalresistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.  
Ambienttemperature(TA)is25°C, unlessotherwisespecified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
8.7  
Units  
I
I
I
@ T = 25°C  
C
D
D
6.1  
A
@ T = 100°C  
C
35  
DM  
35  
Power Dissipation  
@T = 25°C  
C
W
W/°C  
V
P
D
0.23  
Linear Derating Factor  
± 20  
Gate-to-Source Voltage  
V
GS  
EAS  
18  
Single Pulse Avalanche Energy(Thermally limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
EAS (Tested )  
20  
IAR  
See Fig.12a, 12b, 15, 16  
A
EAR  
Repetitive Avalanche Energy  
Operating Junction and  
mJ  
-55 to + 175  
T
T
J
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting Torque, 6-32 or M3 screw  
°C  
STG  
300 (1.6mm from case )  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
4.28  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
12/06/10  
AUIRFR/U120Z  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
100 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
V
V
(BR)DSS/ TJ  
Breakdown Voltage Temp. Coefficient ––– 0.084 ––– V/°C Reference to 25°C, ID = 1mA  
m
RDS(on)  
VGS(th)  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
2.0  
150  
–––  
–––  
–––  
–––  
–––  
–––  
190  
4.0  
VGS = 10V, ID = 5.2A  
VDS = VGS, ID = 25µA  
VDS = 25V, ID = 5.2A  
V
gfs  
Forward Transconductance  
16  
–––  
20  
S
IDSS  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
µA  
V
DS = 100V, VGS = 0V  
VDS = 100V, VGS = 0V, TJ = 125°C  
nA VGS = 20V  
GS = -20V  
250  
200  
-200  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Qg  
Qgs  
Qgd  
td(on)  
tr  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
6.9  
1.6  
3.1  
8.3  
26  
10  
ID = 5.2A  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
ns  
VDS = 80V  
VGS = 10V  
VDD = 50V  
ID = 5.2A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
27  
RG = 53 Ω  
VGS = 10V  
23  
LD  
Internal Drain Inductance  
4.5  
Between lead,  
D
S
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
VGS = 0V  
DS = 25V  
pF ƒ = 1.0MHz  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
Ciss  
Coss  
Crss  
Coss  
Coss  
Input Capacitance  
–––  
–––  
–––  
–––  
–––  
–––  
310  
41  
–––  
–––  
–––  
–––  
–––  
–––  
Output Capacitance  
V
Reverse Transfer Capacitance  
Output Capacitance  
24  
150  
26  
Output Capacitance  
VGS = 0V, VDS = 80V, ƒ = 1.0MHz  
GS = 0V, VDS = 0V to 80V  
Coss eff.  
Effective Output Capacitance  
57  
V
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
–––  
–––  
8.7  
MOSFET symbol  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
–––  
–––  
35  
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
24  
1.3  
36  
35  
V
T = 25°C, I = 5.2A, V = 0V  
SD  
J
S
GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 5.2A, VDD = 50V  
J F  
rr  
di/dt = 100A/µs  
Q
t
23  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes  through ‡ are on page 3  
2
www.irf.com  
AUIRFR/U120Z  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Comments:  
This part number(s) passed  
Qualification Level  
Automotive qualification. IR’s Industrial and  
Consumer qualification level is granted by  
extension of the higher Automotive level.  
MSL1  
D PAK  
I-PAK  
Moisture Sensitivity Level  
N/A  
Machine Model  
Class M1B (100V)  
( per AEC-Q101-002)  
Class H0 (100V)  
(per AEC-Q101-001)  
Class C5 (2000V)  
AEC-Q101-005  
Yes  
Human Body Model  
ESD  
Charged Device  
Model  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
Notes:  
„ Coss eff. is a fixed capacitance that gives the same charging time  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 1.29mH  
RG = 25, IAS = 5.2A, VGS =10V. Part not  
recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
as Coss while VDS is rising from 0 to 80% VDSS  
.
†
‡
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive  
avalanche performance.  
This value determined from sample failure population. 100%  
tested to this value in production.  
When mounted on 1" square PCB (FR-4 or G-10 Material) .  
For recommended footprint and soldering techniques refer to  
application note #AN-994  
www.irf.com  
3
AUIRFR/U120Z  
100  
100  
10  
1
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
TOP  
TOP  
10  
1
BOTTOM 4.5V  
BOTTOM 4.5V  
4.5V  
4.5V  
0.1  
0.01  
60µs PULSE WIDTH  
Tj = 25°C  
60µs PULSE WIDTH  
Tj = 175°C  
0.1  
0.1  
1
1
10  
1
100  
1
0.1  
1
1
10  
1
100  
1
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
12  
100.0  
10.0  
1.0  
T
= 175°C  
= 25°C  
J
10  
8
T
= 175°C  
J
T
J
6
T
= 25°C  
4
J
V
= 25V  
2
DS  
60µs PULSE WIDTH  
V
= 10V  
DS  
380µs PULSE WIDTH  
0.1  
0
4.0  
5.0  
6.0  
7.0  
8.0  
0
2
4
6
8
V
, Gate-to-Source Voltage (V)  
GS  
I
Drain-to-Source Current (A)  
D,  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
Vs. DrainCurrent  
4
www.irf.com  
AUIRFR/U120Z  
500  
400  
300  
200  
100  
0
20  
16  
12  
8
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 5.2A  
C
C
C
+ C , C  
SHORTED  
D
iss  
gs  
gd  
ds  
V
= 80V  
= C  
DS  
rss  
oss  
gd  
VDS= 50V  
VDS= 20V  
= C + C  
ds  
gd  
Ciss  
4
Coss  
Crss  
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
0
2
4
6
8
10  
1
10  
, Drain-to-Source Voltage (V)  
100  
Q
Total Gate Charge (nC)  
G
V
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
100  
10  
100.0  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
10.0  
1.0  
T
= 175°C  
J
100µsec  
T
= 25°C  
V
J
1
Tc = 25°C  
Tj = 175°C  
Single Pulse  
1msec  
= 0V  
GS  
10msec  
0.1  
0.1  
1
10  
100  
1000  
0.0  
0.5  
1.0  
1.5  
V
, Drain-toSource Voltage (V)  
V
SD  
, Source-toDrain Voltage (V)  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRFR/U120Z  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
I
= 5.2A  
D
V
= 10V  
GS  
8
6
4
2
0
25  
50  
75  
100  
125  
150  
175  
-60 -40 -20  
T
0
20 40 60 80 100 120 140 160 180  
T
, Junction Temperature (°C)  
, Junction Temperature (°C)  
J
J
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current Vs.  
Vs. Temperature  
Case Temperature  
10  
D = 0.50  
0.20  
1
0.10  
0.05  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) τi (sec)  
0.33747 0.000053  
τ
J τJ  
τ
τ
Cτ  
τ
1τ1  
τ
2 τ2  
3τ3  
1.793  
2.150  
0.000125  
0.000474  
0.02  
0.01  
0.1  
Ci= τi/Ri  
/
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
SINGLE PULSE  
( THERMAL RESPONSE )  
0.01  
1E-006  
1E-005  
0.0001  
, Rectangular Pulse Duration (sec)  
0.001  
0.01  
t
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRFR/U120Z  
80  
60  
40  
20  
0
15V  
I
D
TOP  
0.9A  
1.2  
5.2A  
DRIVER  
+
L
BOTTOM  
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
2
V0GVS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
Vs. Drain Current  
Q
G
10 V  
Q
Q
5.0  
4.0  
3.0  
2.0  
GS  
GD  
V
G
Charge  
Fig 13a. Basic Gate Charge Waveform  
I
= 250µA  
D
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
.3µF  
+
V
DS  
D.U.T.  
-
-75 -50 -25  
0
25 50 75 100 125 150 175 200  
, Temperature ( °C )  
V
GS  
3mA  
T
J
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage Vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRFR/U120Z  
10  
Duty Cycle = Single Pulse  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming Tj = 25°C due to  
avalanche losses. Note: In no  
case should Tj be allowed to  
exceed Tjmax  
0.01  
0.05  
0.10  
1
0.1  
0.01  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
tav (sec)  
Fig 15. Typical Avalanche Current Vs.Pulsewidth  
20  
16  
12  
8
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
TOP  
BOTTOM 1% Duty Cycle  
= 5.2A  
Single Pulse  
I
D
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
4
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
0
25  
50  
75  
100  
125  
150  
175  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Fig 16. Maximum Avalanche Energy  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Vs. Temperature  
8
www.irf.com  
AUIRFR/U120Z  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
D.U.T  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple  
5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRFR/U120Z  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak (TO-252AA) Part Marking Information  
PartNumber  
AUFR120Z  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRFR/U120Z  
I-Pak (TO-251AA) Package Outline ( Dimensions are shown in millimeters (inches)  
I-Pak (TO-251AA) Part Marking Information  
PartNumber  
AUFU120Z  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRFR/U120Z  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
12  
www.irf.com  
AUIRFR/U120Z  
Ordering Information  
Base part  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Quantity  
75  
AUIRFR120Z  
DPak  
IPak  
Tube  
AUIRFR120Z  
AUIRFR120ZTR  
AUIRFR120ZTRL  
AUIRFR120ZTRR  
AUIRFU120Z  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Tube  
2000  
3000  
3000  
75  
AUIRFU120Z  
www.irf.com  
13  
AUIRFR/U120Z  
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business practice. IR is not responsible or liable for any such statements.  
IRproductsarenotdesigned,intended,orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantinto  
thebody,orinotherapplicationsintendedtosupportorsustainlife,orinanyotherapplicationinwhichthefailureoftheIRproduct  
couldcreateasituationwherepersonalinjuryordeathmayoccur. ShouldBuyerpurchaseoruseIRproductsforanysuch  
unintendedorunauthorizedapplication,BuyershallindemnifyandholdInternationalRectifieranditsofficers,employees,  
subsidiaries,affiliates,anddistributorsharmlessagainstallclaims,costs,damages,andexpenses,andreasonableattorney  
feesarisingoutof,directlyorindirectly,anyclaimofpersonalinjuryordeathassociatedwithsuchunintendedorunauthorized  
use, evenifsuchclaimallegesthatIRwasnegligentregardingthedesignormanufactureoftheproduct.  
IRproductsareneitherdesignednorintendedforuseinmilitary/aerospaceapplicationsorenvironmentsunlesstheIRproducts  
arespecificallydesignatedbyIRasmilitary-gradeorenhancedplastic.” OnlyproductsdesignatedbyIRasmilitary-grade  
meetmilitaryspecifications. BuyersacknowledgeandagreethatanysuchuseofIRproductswhichIRhasnotdesignated  
asmilitary-gradeissolelyattheBuyer’srisk,andthattheyaresolelyresponsibleforcompliancewithalllegalandregulatory  
requirementsinconnectionwithsuchuse.  
IRproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificIRproducts  
aredesignatedbyIRascompliantwithISO/TS16949requirementsandbearapartnumberincludingthedesignationAU”.  
Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR will not be  
responsibleforanyfailuretomeetsuchrequirements  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
233KansasSt.,ElSegundo,California90245  
Tel:(310)252-7105  
14  
www.irf.com  

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