AUIRF1405ZS-7P [INFINEON]

Power Field-Effect Transistor,;
AUIRF1405ZS-7P
型号: AUIRF1405ZS-7P
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor,

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中文:  中文翻译
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AUTOMOTIVEGRADE  
AUIRF1405ZS-7P  
HEXFET® Power MOSFET  
Features  
l
l
l
l
l
l
l
Advanced Process Technology  
D
Ultra Low On-Resistance  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free  
VDSS = 55V  
RDS(on) = 4.9mΩ  
G
S
ID = 120A  
Automotive Qualified *  
S (Pin 2, 3, 5, 6, 7)  
G (Pin 1)  
Description  
This HEXFET® Power MOSFET utilizes the  
latest processing techniques to achieve  
extremely low on-resistance per silicon area.  
Additional features of this design are a 175°C  
junction operating temperature, fast switching  
speed and improved repetitive avalanche  
rating.These features combine to make this  
design an extremely efficient and reliable device  
for use in a wide variety of applications.  
D2Pak 7 Pin  
Standard Pack  
Form  
Tube  
Base Part Number  
Package Type  
Orderable Part Number  
Quantity  
50  
800  
AUIRF1405ZS-7P  
AUIRF1405ZS-7TRL  
AUIRF1405ZS-7P  
D2Pak- 7 Pin  
Tape and Reel Left  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
Thesearestressratingsonly;andfunctionaloperationofthedeviceattheseoranyotherconditionbeyondthose  
indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended  
periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under  
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (See Fig. 9)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
Units  
150  
ID @ TC = 25°C  
ID @ TC = 100°C  
100  
A
120  
I
D @ TC = 25°C  
590  
IDM  
230  
PD @TC = 25°C  
Maximum Power Dissipation  
W
W/°C  
V
1.5  
Linear Derating Factor  
± 20  
250  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
See Fig.12a,12b,15,16  
EAR  
TJ  
Repetitive Avalanche Energy  
mJ  
-55 to + 175  
Operating Junction and  
°C  
TSTG  
Storage Temperature Range  
300 (1.6mm from case )  
Soldering Temperature, for 10 seconds  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
Max.  
0.65  
40  
Units  
Rθ  
JC  
°C/W  
Rθ  
JA  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
1
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AUIRF1405ZS-7P  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
55  
Typ.  
–––  
Max. Units  
Conditions  
V(BR)DSS  
ΔΒVDSS/ΔTJ  
RDS(on) SMD  
VGS(th)  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
–––  
4.9  
V
VGS = 0V, ID = 250μA  
–––  
0.054  
3.7  
V/°C Reference to 25°C, ID = 1mA  
mΩ  
–––  
2.0  
VGS = 10V, ID = 88A  
–––  
–––  
–––  
–––  
–––  
–––  
150  
37  
4.0  
V
S
VDS = VGS, ID = 150μA  
DS = 10V, ID = 88A  
Forward Transconductance  
gfs  
108  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
20  
V
IDSS  
Drain-to-Source Leakage Current  
μA VDS = 55V, VGS = 0V  
250  
200  
-200  
230  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
V
DS = 55V, VGS = 0V, TJ = 125°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
nA VGS = 20V  
VGS = -20V  
Qg  
Qgs  
Qgd  
td(on)  
tr  
nC ID = 88A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
VDS = 44V  
VGS = 10V  
VDD = 28V  
64  
16  
ns  
Rise Time  
140  
170  
130  
4.5  
ID = 88A  
td(off)  
tf  
Turn-Off Delay Time  
RG = 5.0Ω  
Fall Time  
VGS = 10V  
LD  
Internal Drain Inductance  
nH Between lead,  
D
S
6mm (0.25in.)  
from package  
LS  
Internal Source Inductance  
–––  
7.5  
–––  
G
and center of die contact  
Ciss  
Input Capacitance  
–––  
–––  
–––  
–––  
–––  
–––  
5360  
1310  
340  
–––  
–––  
–––  
–––  
–––  
–––  
pF VGS = 0V  
VDS = 25V  
Coss  
Crss  
Coss  
Coss  
Output Capacitance  
Reverse Transfer Capacitance  
Output Capacitance  
ƒ = 1.0MHz, See Fig. 5  
6080  
920  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 44V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 44V  
Output Capacitance  
C
oss eff.  
Effective Output Capacitance  
1700  
Diode Characteristics  
Parameter  
Min.  
Typ.  
Max. Units  
Conditions  
IS  
Continuous Source Current  
–––  
–––  
150  
MOSFET symbol  
D
S
(Body Diode)  
A
showing the  
G
ISM  
Pulsed Source Current  
–––  
–––  
590  
integral reverse  
(Body Diode)  
p-n junction diode.  
TJ = 25°C, IS = 88A, VGS = 0V  
VSD  
trr  
Diode Forward Voltage  
–––  
–––  
–––  
–––  
63  
1.3  
95  
V
ns  
nC  
TJ = 25°C, IF = 88A, VDD = 28V  
Reverse Recovery Time  
di/dt = 100A/μs  
Qrr  
Reverse Recovery Charge  
160  
240  
Notes:  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C,  
L=0.064mH, RG = 25Ω, IAS = 88A, VGS =10V.  
Part not recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical  
repetitiveavalancheperformance.  
† This is applied to D2Pak, when mounted on 1" square PCB  
( FR-4 or G-10 Material ). For recommended footprint and  
soldering techniques refer to application note #AN-994.  
‡ R is measured at TJ of approximately 90°C.  
θ
„ Coss eff. is a fixed capacitance that gives the same  
charging time as Coss while VDS is rising from 0 to 80%  
VDSS  
.
2
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AUIRF1405ZS-7P  
1000  
100  
10  
1000  
100  
10  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
TOP  
TOP  
BOTTOM  
BOTTOM  
4.5V  
4.5V  
60μs PULSE WIDTH  
Tj = 175°C  
60μs PULSE WIDTH  
Tj = 25°C  
1
1
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
200  
1000  
175  
150  
125  
100  
75  
T = 25°C  
J
100  
10  
1
T
= 175°C  
J
T = 175°C  
J
T
= 25°C  
J
50  
V
= 10V  
DS  
380μs PULSE  
WIDTH  
25  
V
= 25V  
DS  
60μs PULSE WIDTH  
0
0.1  
0
25 50  
75 100 125 150 175 200  
0
2
4
6
8
10 12  
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
3
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AUIRF1405ZS-7P  
100000  
10000  
1000  
12.0  
10.0  
8.0  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 88A  
D
C
C
C
+ C , C  
SHORTED  
ds  
iss  
gs  
gd  
V
V
= 44V  
= 28V  
= C  
DS  
DS  
rss  
oss  
gd  
= C + C  
ds  
gd  
C
iss  
6.0  
C
oss  
C
4.0  
rss  
2.0  
100  
0.0  
1
10  
, Drain-to-Source Voltage (V)  
100  
0
50  
100  
150  
200  
V
Q
Total Gate Charge (nC)  
DS  
G
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
10000  
1000  
100  
10  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
100μsec  
J
1msec  
T
= 25°C  
J
DC  
1
10msec  
100  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
0.1  
V
= 0V  
GS  
0.01  
1
1
10  
1000  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
V
, Drain-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
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AUIRF1405ZS-7P  
150  
125  
100  
75  
2.5  
2.0  
1.5  
1.0  
0.5  
I
= 88A  
D
V
= 10V  
GS  
50  
25  
0
25  
50  
75  
100  
125  
150  
175  
-60 -40 -20  
T
0
20 40 60 80 100 120 140 160 180  
T
, Case Temperature (°C)  
C
, Junction Temperature (°C)  
J
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
CaseTemperature  
1
D = 0.50  
0.20  
0.1  
0.10  
0.05  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) τi (sec)  
0.02  
0.01  
τ
J τJ  
τ
τ
Cτ  
0.1707  
0.1923  
0.2885  
0.000235  
0.000791  
0.008193  
0.01  
0.001  
τ
1τ1  
τ
2 τ2  
3τ3  
Ci= τi/Ri  
/
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.0001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
5
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AUIRF1405ZS-7P  
15V  
1000  
800  
600  
400  
200  
0
I
D
TOP  
14A  
23A  
DRIVER  
+
L
V
DS  
BOTTOM 88A  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
20V  
GS  
Ω
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
4.5  
V
G
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
Charge  
Fig 13a. Basic Gate Charge Waveform  
I
I
I
I
= 150μA  
= 250μA  
= 1.0mA  
= 1.0A  
D
D
D
D
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2μF  
12V  
.3μF  
+
V
DS  
D.U.T.  
-
-75 -50 -25  
0
25 50 75 100 125 150 175 200  
, Temperature ( °C )  
V
GS  
3mA  
T
J
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
6
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AUIRF1405ZS-7P  
1000  
100  
10  
Duty Cycle = Single Pulse  
Allowed avalanche Current vs avalanche  
pulsewidth, tav, assuming ΔTj = 150°C and  
Tstart =25°C (Single Pulse)  
0.01  
0.05  
0.10  
Allowed avalanche Current vs avalanche  
1
pulsewidth, tav, assuming ΔΤj = 25°C and  
Tstart = 150°C.  
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
300  
250  
200  
150  
100  
50  
TOP  
BOTTOM 1% Duty Cycle  
= 88A  
Single Pulse  
I
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. ΔT = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
0
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
7
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AUIRF1405ZS-7P  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
D.U.T  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
LowStrayInductance  
Ground Plane  
LowLeakageInductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
8
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AUIRF1405ZS-7P  
D2Pak - 7 Pin Package Outline  
Dimensions are shown in millimeters (inches)  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
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AUIRF1405ZS-7P  
D2Pak - 7 Pin Part Marking Information  
PartNumber  
AUF1405ZS-7P  
Date Code  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IR Logo  
YWWA  
XX or XX  
Lot Code  
D2Pak - 7 Pin Tape and Reel  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
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AUIRF1405ZS-7P  
Qualification Information†  
Qualification Level  
Automotive  
(per AEC-Q101)  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification  
level is granted by extension of the higher Automotive level.  
Moisture Sensitivity Level  
MSL1  
Class M4(425V)††  
(per AEC-Q101-002)  
7L-D2 PAK  
Machine Model  
Class H1C(2000V)††  
(per AEC-Q101-001)  
ESD  
Human Body Model  
Class C5(1125V)††  
(per AEC-Q101-005)  
Charged Device Model  
RoHS Compliant  
Yes  
Qualification standards can be found at International Rectifier’s web site:  
http://www.irf.com/product-info/reliability  
†† Highest passing voltage.  
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AUIRF1405ZS-7P  
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AUIRF1405ZS-7P  
Revision History  
Date  
Comments  
Corrected part number for TRL from "AUIRF1405ZS-7PTRL" to "AUIRF1405ZS-7TRL" on page1.  
2/27/2015  
13  
www.irf.com © 2015 International Rectifier Submit Datasheet Feedback February 27, 2015  

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