HC49USM-GB0F18-4.990 [ILSI]
Parallel - Fundamental Quartz Crystal, 4.99MHz Nom, SMD, 2 PIN;型号: | HC49USM-GB0F18-4.990 |
厂家: | ILSI |
描述: | Parallel - Fundamental Quartz Crystal, 4.99MHz Nom, SMD, 2 PIN |
文件: | 总2页 (文件大小:65K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2 Pad Metal Package, 4.7 mm x 13.3 mm
HC49USM Series
Product Features:
Low Cost SMD Package
Low ESR
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
Compatible with Leadfree Processing
802.11 / Wifi
T1/E1, T3/E3
System Clock
13.3 Max.
11.4 0.2
4.73 0.1
Frequency
3.2 MHz to 100.000 MHz
H Max.
See Part
Number Guide
ESR (Equivalent Series Resistance)
3.2 MHz – 3.49 MHz
3.5 MHz – 3.99 MHz
4.0 MHz – 4.99 MHz
5.0 MHz – 5.99 MHz
6.0 MHz – 6.99 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13 MHz – 19.9 MHz
20 MHz – 36 MHz
300 : Max.
200 : Max.
150 : Max.
120 : Max.
100 : Max.
80 : Max.
60 : Max.
40 : Max.
30 : Max.
100 : Max.
3.9 Nom.
0.5 Min.
27 MHz – 100 MHz (3rd O.T.)
Insulator
Shunt Capacitance (C0)
7 pF Max.
0.8 0.2
Frequency Tolerance @ 25q C
r30 ppm Standard (see Part Number Guide for more options)
r50 ppm Standard (see Part Number Guide for more options)
AT Cut Standard
Frequency Stability over
Temperature
Crystal Cut
5.5
Load Capacitance
Drive Level
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
Aging
r5 ppm Max. / Year Standard
1.6
Temperature
Operating
Recommended
Pad Layout
0q C to +70q C Standard (see Part Number Guide for more
options)
Dimension Units: mm
Storage
-40q C to +85q C Standard
Part Number Guide
Sample Part Number:
Stability
HC49USM – FB1F18 - 20.000
Package
Tolerance
(ppm) at Room
Temperature
B = 50 ppm
F = 30 ppm
G = 25 ppm
H = 20 ppm
I = 15 ppm
Operating
Temperature Range
Mode
(overtone)
Load Capacitance
(pF)
Frequency
(ppm) over Operating
Temperature
B = 50 ppm
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = Fundamental
3 = 3rd overtone
HC49USM -
(4.5 mm H)
F = 30 ppm
G = 25 ppm
18 pF Standard
or Specify
HC49USM2 -
(3.5 mm H)
- 20.000 MHz
H = 20 ppm
HC49USM3 -
(3.1 mm H)
I = 15 ppm
J = 10 ppm
J = 10 ppm
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com•www.ilsiamerica.com
Specifications subject to change without notice
04/09
Page 1
2 Pad Metal Package, 4.7 mm x 13.3 mm
HC49USM Series
Typical Circuit:
Pb Free Solder Reflow Profile:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Tape and Reel Information:
Quantity per
1000
Reel
A
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80/100
B
C
D
E
F
330
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Solvent Resistance
Marking
Line 1: ILSI, Frequency, Date Code
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com•www.ilsiamerica.com
Specifications subject to change without notice
04/09
Page 2
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