XFL216015.000000I [IDT]

LVDS Output Clock Oscillator;
XFL216015.000000I
型号: XFL216015.000000I
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

LVDS Output Clock Oscillator

机械 输出元件 振荡器
文件: 总16页 (文件大小:312K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
XF Family of Low Phase Noise  
Quartz-based PLL Oscillators  
XF  
Datasheet  
Description  
Features  
Output types: LVDS, LVPECL, CML  
Frequency range: 15MHz to 2100MHz  
Output type: HCSL  
Frequency range: 15MHz to 725MHz  
Supply voltage options: 1.8V, 2.5V, or 3.3V  
The XF devices are low phase noise quartz-based PLL oscillators  
supporting a large range of frequencies and output interface  
types. These devices are designed to operate at three different  
power supplies.  
Typical Applications  
FOM Gear Box  
Data centers  
Phase jitter (12kHz to 20MHz): 150fs typical at 156.25MHz  
Package: 2.5 × 2.0 mm, 0.4mm pitch DFN  
Operating temperature: -40°C to +85°C  
Frequency stability options: ±25ppm  
10G / 40G / 100G / 400G Ethernet  
Operating temperature: -40°C to +105°C  
Frequency stability options: ±50ppm  
Pin Assignments  
1
2
3
4
5
6
12  
11  
10  
9
NC  
Ground Core  
VDD Core  
NC  
Voltage Control  
SDA  
Ground Output  
Output 0b  
8
Output 0  
OE  
7
SCL  
VDD Output  
Table 1. Pin Descriptions  
Pin Number  
Pin Name  
Description  
1
2
NC  
No connect.  
No connect.  
NC  
3
Voltage Control  
Voltage control for VCXO option.  
Serial data.  
4
SDA  
OE  
5
Output enable.  
6
SCL  
Serial clock.  
7
V
Output  
Supply voltage.  
DD  
8
Output 0  
Output 0.  
9
Output 0b  
Complementary output 0.  
Connect to ground.  
Supply voltage.  
10  
11  
12  
13  
Ground Output  
V
Core  
DD  
Ground Core  
Connect to ground.  
EPAD (dotted area shown in Pin Assignment diagram) Connect to ground (required for heat dissipation).  
See Ordering Information for more details.  
©2019 Integrated Device Technology, Inc.  
1
January 23, 2019  
XF Datasheet  
Contents  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
ESD Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Mechanical Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Solder Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Output Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.3V Differential Clock Input Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Package Outline Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
©2019 Integrated Device Technology, Inc.  
2
January 23, 2019  
XF Datasheet  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the device. These ratings, which are standard values for IDT  
commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those  
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended  
periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.  
Thermal characteristics, in actual applications, should be assessed case by case to guarantee junction temperature does not exceed  
125°C.  
Table 2. Absolute Maximum Ratings  
Item  
Rating  
V
-0.5V to +3.8V  
-0.5V to +3.8V  
-55°C to 125°C  
125°C  
DD  
E/D  
Storage Temperature  
Maximum Junction Temperature  
1
Theta J (Still air, 2s2p board)  
97.0 C/W  
A
1
Theta J (Still air, 2s2p board)  
62.2 C/W  
B
1 Thermal characteristics are based on simulation in standard condition.  
ESD Compliance  
Table 3. ESD Compliance  
Human Body Model (HBM)  
2000V  
Mechanical Testing  
Table 4. Mechanical Testing *  
Parameter  
Test Method  
Mechanical Shock  
Half-sine wave with 0.3ms 3000G. X, Y, Z each direction 1 time.  
Frequency: 10 to 55MHz amplitude: 1.5mm.  
Frequency: 55–2000Hz peak value: 20G.  
Mechanical Vibration  
Duration time: 4H for each X,Y,Z axis; total 12hours.  
High Temp Operating Life (HTOL)  
Hermetic Seal  
1000 hours at 125°C (under power).  
Gross leak (air leak test). Fine leak (Helium leak test) He-pressure: 6kgf/cm² 2 hours.  
* MSL level does not apply.  
Solder Reflow Profile  
tP  
10 seconds Max within5°C of  
260°C peak  
260°C  
Ramp up 3°C/s Max  
225°C  
180°C  
Ramp down not to  
exceed 6°C/s  
50 ±10 seconds  
above 225°C  
reflow area  
160°C  
120 ±20 seconds in  
pre-heating area  
25°C  
400 seconds Max from+25°C to 260°C peak  
©2019 Integrated Device Technology, Inc.  
3
January 23, 2019  
XF Datasheet  
DC Electrical Characteristics  
Note for all DC Electrical Characteristics tables: A pull-up resistor from VDD to OE enables output when pin 5 is left open.  
Table 5. 3.3V IDD DC Electrical Characteristics  
VDD = 3.3V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Output Type  
Conditions  
Minimum  
Typical  
Maximum  
Units  
15MHz to 400MHz.  
85  
85  
LVDS  
400.000+MHz to 2.1GHz.  
15MHz to 212.5MHz.  
212.5+MHz to 400MHz.  
400+MHz to 670MHz.  
15MHz to 725MHz.  
105  
110  
110  
95  
I
Current Consumption  
LVPECL  
mA  
DD  
HCSL  
CML  
15MHz to 2.1GHz.  
95  
Table 6. 2.5V IDD DC Electrical Characteristics  
VDD = 2.5V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Output Type  
Conditions  
Minimum  
Typical  
Maximum  
Units  
15MHz to 400MHz.  
85  
85  
LVDS  
400.000+MHz to 2.1GHz.  
15MHz to 156.25MHz.  
156.25+MHz to 400MHz.  
400+MHz to 670MHz.  
15MHz to 400MHz.  
105  
110  
110  
95  
LVPECL  
I
Current Consumption  
mA  
DD  
HCSL  
CML  
400.000+MHz to 725MHz.  
15MHz to 2.1GHz.  
95  
90  
Table 7. 1.8V IDD DC Electrical Characteristics  
VDD = 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Output Type  
Conditions  
Minimum  
Typical  
Maximum  
Units  
15MHz to 400MHz.  
85  
85  
LVDS  
400.000+MHz to 2.1GHz.  
15MHz to 250MHz.  
105  
110  
95  
LVPECL  
I
Current Consumption  
250.000+MHz to 670MHz.  
15MHz to 400MHz.  
mA  
DD  
HCSL  
CML  
400.000+MHz to 725MHz.  
15MHz to 2.1GHz.  
95  
90  
©2019 Integrated Device Technology, Inc.  
4
January 23, 2019  
XF Datasheet  
Table 8. LVCMOS DC Electrical Characteristics  
VDD = 3.3V, 2.5V, 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Input High Voltage  
Input Low Voltage  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
OE  
OE  
0.5V  
0.4V  
IH  
DD  
DD  
V
V
IL  
Table 9. LVDS DC Electrical Characteristics  
VDD = 3.3V, 2.5V, 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
Differential Output Voltage  
Output Offset Voltage  
0.35  
1.25  
OD  
V
V
OS  
Table 10. LVPECL DC Electrical Characteristics  
VDD = 3.3V, 2.5V, 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
V
V
V
V
V
= 3.3V ±5%.  
= 2.5V ±5%.  
= 1.8V ±5%.  
= 3.3V ±5%.  
= 2.5V ±5%.  
= 1.8V ±5%.  
V
V
- 1.0  
- 1.0  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
V
Output High Voltage  
OH  
0.9  
V
V
V
- 1.65  
- 1.65  
DD  
DD  
V
Output Low Voltage  
OL  
0.4  
Table 11. HCSL DC Electrical Characteristics  
VDD = 3.3V, 2.5V, 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol Parameter Conditions  
Minimum  
Typical  
Maximum  
Units  
V
V
V
= 3.3V ±5%.  
= 2.5V ±5%.  
= 1.8V ±5%.  
0.8  
0.8  
0.7  
0
DD  
DD  
DD  
V
Output High Voltage  
OH  
V
V
Output Low Voltage  
OL  
©2019 Integrated Device Technology, Inc.  
5
January 23, 2019  
XF Datasheet  
Table 12. CML DC Electrical Characteristics  
VDD = 3.3V, 2.5V, 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
V
V
= 3.3V ±5%.  
= 2.5V ±5%.  
= 1.8V ±5%.  
V
V
V
DD  
DD  
DD  
DD  
DD  
V
Output High Voltage  
OH  
V
DD  
V
Output Low Voltage  
V
- 0.4  
OL  
DD  
AC Electrical Characteristics  
Notes for all AC Electrical Characteristics tables:  
1. A pull-up resistor from VDD to OE enables output when pin 5 is left open.  
2. Installation should include a 0.01μF bypass capacitor placed between VDD and GND to minimize power supply line noise.  
3. Stability is inclusive of 25°C tolerance, operating temperature range, input voltage change, load change, aging, shock and vibration.  
Table 13. 3.3V AC Electrical Characteristics  
VDD = 3.3V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Test Condition  
LVDS, LVPECL, CML.  
Minimum  
Typical  
Maximum Units  
15  
15  
2100  
MHz  
725  
F
Output Frequency Range  
HCSL.  
Temperature = -40°C to +85°C.  
Temperature = -40°C to +105°C.  
±25  
±50  
±3  
ppm  
ppm  
1
Frequency Stability  
Aging (1st year)  
Aging (10 years)  
T = 25°C.  
A
T = 25°C.  
±10  
A
LVDS.  
Differential.  
- 2.0V.  
100  
50  
50  
Output Load  
LVPECL.  
HCSL.  
V
DD  
To GND.  
Output valid time after V meets minimum  
specified level.  
DD  
T
Start-up Time  
5
ms  
ST  
LVDS.  
250  
250  
250  
250  
250  
250  
250  
250  
LVPECL.  
HCSL.  
CML.  
20% to 80%  
156.25MHz  
t
Output Rise Time  
Output Fall Time  
ps  
ps  
R
LVDS.  
LVPECL.  
HCSL.  
CML.  
80% to 20%  
156.25MHz  
t
F
©2019 Integrated Device Technology, Inc.  
6
January 23, 2019  
XF Datasheet  
Table 13. 3.3V AC Electrical Characteristics (Cont.)  
VDD = 3.3V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Test Condition  
156.25MHz.  
Minimum  
Typical  
Maximum Units  
LVDS.  
50  
50  
O
Output Clock Duty Cycle  
LVPECL.  
HCSL.  
156.25MHz.  
156.25MHz.  
%
DC  
OE  
50  
T
Output Enable/ Disable Time  
1
ms  
LVDS.  
LVPECL.  
HCSL.  
CML.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
150  
150  
150  
150  
Phase Jitter  
(12kHz–20MHz)  
f
fsec  
JITTER  
1 Room temperature offset ±10ppm.  
©2019 Integrated Device Technology, Inc.  
7
January 23, 2019  
XF Datasheet  
Table 14. 2.5V AC Electrical Characteristics  
VDD = 2.5V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Test Condition  
LVDS, LVPECL, CML.  
Minimum  
Typical  
Maximum Units  
15  
15  
2100  
MHz  
725  
F
Output Frequency Range  
HCSL.  
Temperature = -40°C to +85°C.  
Temperature = -40°C to +105°C.  
±25  
±50  
±3  
ppm  
ppm  
1
Frequency Stability  
Aging (1st year)  
Aging (10 years)  
T = 25°C.  
A
T = 25°C.  
±10  
A
LVDS.  
Differential.  
- 2.0V.  
100  
50  
50  
Output Load  
LVPECL.  
HCSL.  
V
DD  
To GND.  
Output valid time after V meets minimum  
specified level.  
DD  
T
Start-up Time  
5
ms  
ST  
LVDS.  
250  
250  
250  
250  
250  
250  
250  
250  
50  
LVPECL.  
HCSL.  
CML.  
20% to 80%  
156.25MHz  
t
Output Rise Time  
Output Fall Time  
ps  
ps  
R
LVDS.  
LVPECL.  
HCSL.  
CML.  
80% to 20%  
156.25MHz  
t
F
LVDS.  
LVPECL.  
HCSL.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
O
Output Clock Duty Cycle  
50  
%
DC  
50  
T
Output Enable/ Disable Time  
1
ms  
OE  
LVDS.  
LVPECL.  
HCSL.  
CML.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
150  
150  
150  
150  
Phase Jitter  
(12kHz–20MHz)  
f
fsec  
JITTER  
1 Room temperature offset ±10ppm.  
©2019 Integrated Device Technology, Inc.  
8
January 23, 2019  
XF Datasheet  
Table 15. 1.8V AC Electrical Characteristics  
VDD = 1.8V ±5%, TA = -40°C to +85°C, -40°C to +105°C.  
Symbol  
Parameter  
Test Condition  
LVDS, LVPECL, CML.  
Minimum  
Typical  
Maximum Units  
15  
15  
2100  
MHz  
725  
F
Output Frequency Range  
HCSL.  
Temperature = -40°C to +85°C.  
Temperature = -40°C to +105°C.  
±25  
±50  
±3  
ppm  
ppm  
1
Frequency Stability  
Aging (1st year)  
Aging (10 years)  
T = 25°C.  
A
T = 25°C.  
±10  
A
LVDS.  
Differential.  
To GND.  
100  
50  
Output Load  
LVPECL, HCSL.  
Output valid time after V meets minimum  
specified level.  
DD  
T
Start-up Time  
5
ms  
ST  
LVDS.  
250  
250  
250  
250  
250  
250  
250  
250  
50  
LVPECL.  
HCSL.  
CML.  
20% to 80%  
156.25MHz  
t
Output Rise Time  
Output Fall Time  
ps  
ps  
R
LVDS.  
LVPECL.  
HCSL.  
CML.  
80% to 20%  
156.25MHz  
t
F
LVDS.  
LVPECL.  
HCSL.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
O
Output Clock Duty Cycle  
50  
%
DC  
50  
T
Output Enable/ Disable Time  
1
ms  
OE  
LVDS.  
LVPECL.  
HCSL.  
CML.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
156.25MHz.  
150  
150  
150  
150  
Phase Jitter  
(12kHz–20MHz)  
f
fsec  
JITTER  
1 Room temperature offset ±10ppm.  
©2019 Integrated Device Technology, Inc.  
9
January 23, 2019  
XF Datasheet  
Output Waveforms  
Figure 1. LVDS Output Waveforms  
Output Levels /Rise Time/Fall Time Measurements  
TF  
TR  
OUT0b  
20% to 80%  
OUT0  
VOS  
VOD  
Oscillator Symmetry  
VOH  
OUT0b  
OUT0  
VOL  
½ Period  
Period  
Figure 2. LVPECL Output Waveforms  
Rise Time/Fall Time Measurements  
TF  
TR  
VOH  
OUT0b  
20% to 80%  
OUT0  
VOL  
Oscillator Symmetry  
VOH  
OUT0b  
OUT0  
VOL  
½ Period  
Period  
©2019 Integrated Device Technology, Inc.  
10  
January 23, 2019  
XF Datasheet  
Figure 3. HCSL Output Waveforms  
Rise Time/Fall Time Measurements  
TF  
TR  
VOH  
OUT0b  
20% to 80%  
OUT0  
VOL  
Oscillator Symmetry  
OUT0b  
OUT0  
VOH  
VOL  
½ Period  
Period  
3.3V Differential Clock Input Interface  
CLKx/nCLKx accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR  
input requirements. Figure 4 to Figure 7 show interface examples for the CLKx/nCLKx input driven by the most common driver types. The  
input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver  
termination requirements. For example, in Figure 4, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an  
LVHSTL driver from another vendor, use their termination recommendation.  
Figure 4. CLKx/nCLKx Input Driven by a 3.3V LVPECL Driver  
3.3V  
3.3V  
3.3V  
R3  
R4  
125ohm  
125ohm  
Zo = 50ohm  
CLK  
Zo = 50ohm  
nCLK  
Differential  
Input  
LVPECL  
R1  
84ohm  
R2  
84ohm  
©2019 Integrated Device Technology, Inc.  
11  
January 23, 2019  
XF Datasheet  
Figure 5. CLKx/nCLKx Input Driven by a 3.3V HCSL Driver  
3.3V  
3.3V  
R3*  
33ohm  
Zo = 50ohm  
Zo = 50ohm  
CLK  
nCLK  
Differential  
Input  
R4*  
33ohm  
HCSL  
R1  
50ohm  
R2  
50ohm  
*Optional – R3 and R4 can be 0ohm  
Figure 6. CLKx/nCLKx Input Driven by a 3.3V LVPECL Driver  
3.3V  
3.3V  
Zo = 50ohm  
Zo = 50ohm  
CLK  
nCLK  
Differential  
Input  
LVPECL  
R1  
50ohm  
R2  
50ohm  
R3  
50ohm  
Figure 7. CLKx/nCLKx Input Driven by a 3.3V LVDS  
3.3V  
3.3V  
Zo = 50ohm  
Zo = 50ohm  
CLK  
R1  
100ohm  
nCLK  
Receiver  
LVDS  
©2019 Integrated Device Technology, Inc.  
12  
January 23, 2019  
XF Datasheet  
Package Outline Drawings  
The package outline drawings are located at the end of this document. The package information is the most current data available.  
Ordering Information  
XF  
L
2
3
5
125.000000  
I
Family and ASIC  
Output Type  
Package  
Voltage  
Precision  
Frequency  
Temperature Range  
I: Industrial range40to +85°C  
K: Extended industrial range40to +105°C  
1: 1.8 VDC ±5%  
2: 2.5 VDC ±5%  
3: 3.3 VDC ±5%  
2: 2.5 x 2.0 mm  
C: CML  
L: LVDS  
P: LVPECL  
N: HCSL  
125.000000 Listed in MHz to6 digits  
015.000000MHzto 999.999999MHz  
F00.000000 to F99.999999 1500MHzto 1599.999MHz  
G00.000000 to G99.999999 1600MHzto 1699.999MHz  
H00.000000 to H99.999999 1700MHzto 1799.999MHz  
I00.000000 to I99.999999 1800MHzto 1899.999MHz  
J00.000000 to J99.999999 1900MHzto 1999.999MHz  
K00.000000 to K99.999999 2000MHzto 2099.999MHz  
XF: 150fs jitter  
5: ±50 ppm (K only)  
6: ±25 ppm (I only)  
©2019 Integrated Device Technology, Inc.  
13  
January 23, 2019  
XF Datasheet  
Revision History  
Revision Date  
Description of Change  
January 23, 2019  
Initial release  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
www.IDT.com/go/support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,  
without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same  
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability  
of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not  
convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be rea-  
sonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property  
of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc. All rights reserved.  
©2019 Integrated Device Technology, Inc.  
14  
January 23, 2019  

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