ICS9211YF-02 [IDT]

Processor Specific Clock Generator, 400MHz, PDSO24, 0.150 INCH, SSOP-24;
ICS9211YF-02
型号: ICS9211YF-02
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Processor Specific Clock Generator, 400MHz, PDSO24, 0.150 INCH, SSOP-24

时钟 光电二极管 外围集成电路 晶体
文件: 总6页 (文件大小:263K)
中文:  中文翻译
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ICS9211-02  
Integrated  
Circuit  
Systems, Inc.  
Preliminary Product Preview  
Direct Rambus™ Clock Generator  
General Description  
Features  
Compatible with all Direct Rambus™ based IC s  
The ICS9211-02 is a High-speed clock generator providing  
400 MHz differential clock source for direct Rambus  
memory system. It includes DDLL (Distributed Delay locked  
loop) and phase detection mechanism to synchronize the  
direct Rambus channel clock to an external system clock.  
ICS 9211-02 provides a solution for a broad range of Direct  
Rambus memory applications. The device works in  
conjunction with the ICS9250-09.  
Up to 400 MHz differential clock source for direct  
Rambus™ memory system  
Cycle to cycle jitter is less than 60ps  
3.3 + 5% supply  
Synchronization flexibility: Supports Systems that  
need clock domains of Rambus channel to synchronize  
with system or processor clock, or systems that do not  
require synchronization of the Rambus clock to  
another system clock  
The ICS9211-02 power management support system turns  
“off” the Rambus  
channel clock to minimize power  
consumption for mobile and other power –sensitive  
applications. In “clock off” mode the device remains “on”  
while the output is disabled, allowing fast transitions between  
clock-off and clock –on states. In “power down” mode it  
completely powers down for minimum power dissipation.  
Excellent power management support  
REFCLK input is from the ICS9250-09.  
The ICS9211-02 meets the requirements for input frequency  
tracking when the input frequency clock is using Spread  
Spectrum clocking and also the optimum bandwidth is  
maintained while attenuating the jitter of the reference signal.  
Block Diagram  
Pin Configuration  
24-Pin 150 Mil SSOP  
9211-02RevA04/23/99  
PRODUCT PREVIEW documents contain information on new  
products in the sampling or preproduction phase of development.  
Characteristic data and other specifications are subject to change  
without notice.  
ICS9211-02  
Preliminary Product Preview  
Pin Descriptions  
Pin #  
Name  
VDDREF  
REFCLK  
VDD1  
GND1  
GND3  
Type  
REFV  
IN  
PWR  
PWR  
PWR  
Description  
Reference voltage for refclk, to be connected to CK133  
Reference clock, to be connected to CK133  
3.3 V power supply used for PLL  
1
2
3
4
5
Ground for PLL  
Ground for control inputs  
Phase controller input, used to drive a phase aligner  
that adjusts the phase of the busclk.  
Ground for phase aligner  
3.3 V power supply used for phase aligner  
Reference voltage for phase detector inputs connected  
to the controller  
6,7  
PCLK/M, SYNCLK/N  
IN  
8
9
GND2  
VDD2  
PWR  
PWR  
10  
11  
12  
VDDPD  
BUSCLK_ STOP#  
PD#  
REFV  
IN  
Active low output enable/disable  
3.3V CMOS active low power down, the device is  
powered down when the "(PD#) =0"  
3.3V CMOS PLL Multiplier select, logic for selecting the  
multiply ratio for the PLL from the input REFCLK  
3.3V supply for clock out puts  
IN  
14,15  
MULTI (0:1)  
IN  
16  
17  
VDD_OUT  
GND_OUT  
PWR  
PWR  
Ground for clock outputs  
Out put clock connected to the Rambus channel. This  
output is the complement of BUSCLK  
NOT USED  
Out put clock connected to the Rambus channel. This  
output is the true component of BUSCLK  
Ground for clock outputs  
18  
19  
20  
BUSCLKC  
N/C  
OUT  
N/C  
BUSCLKT  
OUT  
21  
22  
GND_OUT  
VDD_OUT  
PWR  
PWR  
3.3V supply for clock out puts  
3.3V CMOS Mode control, used in selecting bypass,  
test, normal, and output test (OE)  
13,23,24  
FS(0:2)  
IN  
2
ICS9211-02  
Preliminary Product Preview  
PLL DIVIDER SELECTION AND PLL VALUES ( PLLCLK = REFCLK*A/B)  
Multo  
Mult1  
A
9
6
16  
8
B
2
1
3
1
PLLCLK for REFCLK=50MHz  
PLLCLK for REFCLK=66.6MHz  
0
0
1
1
0
1
0
1
225  
300  
267  
400  
300  
400  
356  
Reserved  
BYPASS AND TEST MODE SELECTION  
Mode  
FS0  
FS1  
FS2  
Bypclk (int.)  
BusClk  
BusClkB  
Normal  
0
0
0
Gnd  
PAclk  
PAclkB  
Bypass  
1
0
0
PLLclk  
PLLclk  
PLLclkB  
Test  
1
1
0
Refclk  
Refclk  
RefclkB  
Vendor Test A  
Vendor Test B  
Reserved  
0
0
1
-
-
-
-
-
-
1
0
1
-
-
-
-
1
1
1
Output Test (OE)  
0
1
X
Hi-Z  
Hi-Z  
POWER MANAGEMENT MODES  
State  
PwrDnB  
StopB  
NORMAL  
Clk Off  
Powerdown  
1
1
0
1
0
X
3
ICS9211-02  
Preliminary Product Preview  
Absolute Maximum Ratings  
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V  
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND –0.5 V to VDD +0.5 V  
Ambient Operating Temperature . . . . . . . . . . . . . 0°C to +70°C  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are  
stress specifications only and functional operation of the device at these or any other conditions above those listed in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect product reliability.  
Electrical Characteristics-input/supply/Outputs  
Parameters  
Symbol  
Min  
Max  
Unit  
Supply Voltage  
VDD  
3.15  
3.45  
V
Refclk Input cycle time  
tCYCLE,IN  
tJ,IN  
10  
-
40  
250  
60%  
33  
ns  
ps  
Input cycle-to-cycle Jitter  
Input Duty cycle over 10k cycles  
Input frequency of modulation  
40%  
30  
DCIN  
tCYCLE  
KHz  
Fm,in  
Modulation index  
PM,IN  
tCYCLE,PD  
Terr,init  
0.25  
30  
0.5  
100  
0.5  
%
ns  
Phase detector input cycle time at PDclk/M & Synclk/N  
Initial phase error at phase detector inputs  
-0.5  
tCYCLE,PD  
Phase detector input duty cycle over 10k cycles  
Input rise & fall times ( measured at 20%-80% of input voltage) for  
PDCLK/M & SYNCLK/N,&REfCLK  
DCIN,PD  
25%  
75%  
tCYCLE,PD  
T ,T  
IR IF  
-
1
ns  
Input capacitance at PDCLK/M,Synclk/N,&REFCLK  
CIN,PD  
-
7
pF  
pF  
Input Capacitance matching at PCLK/M & SYNCLK/N  
Input capacitance at CMOS pins  
C
IN,PD  
-
-
0.5  
10  
0.3  
-
CIN,CMOS  
VIL  
pF  
Input (CMOS) signal low voltage  
-
Vdd  
Vdd  
Input (CMOS) signal high voltage  
0.7  
VIH  
REFCLK input low voltage  
-
0.3  
Vddi,R  
VIL,R  
REFCLK input high voltage  
VIH,R  
VIL,PD  
VIH,PD  
0.7  
-
-
Vddi,R  
Input signal low voltage for PD inputs and STOP  
0.3  
Vddi,PD  
Input signal high voltage for PD inputs and STOP  
Input supply referance for REFCLK  
0.7  
1.3  
1.3  
-
Vddi,PD  
3.3  
3.3  
V
V
VDD,IR  
Input supply referance vfor PD inputs  
VDDI,PD  
Phase detector phase error for distributed loop measured at  
PDCLK/M & SYNCLK/N(rising  
tERR,PD  
-100  
100  
ps  
Cycle cycle time  
tCYCLE  
2.5  
3.75  
60  
ns  
ps  
ps  
Cycle-to-cycle jitter at Busclk/BUSCLKB  
Total jitter over 2,3, or 4clock cycles  
tJ  
-
-
tJ  
100  
Phase aligner, phase step size (BSCLK/BUSCLKB)  
PLL out put phase error when tracking SSC  
tSTEP  
1
-
ps  
ps  
tERR,SSC  
-100  
100  
Out put crossing-point voltage  
Output voltage swing  
VX  
1.3  
0.4  
1.8  
0.6  
V
V
VCOS  
Output high voltage  
VH  
DC  
-
40%  
-
2
V
tCYCLE  
ps  
Out put duty cycle over 10k cycle  
60%  
50  
Output cycle -to-cycle duty cycle error  
Output rise & fall times ( measured at 20%-80% of output voltage)  
tDC,ERR  
300  
500  
psd  
t
CR,tCF  
Difference between rise and fall times on a single device(20%-80%)  
tCR,CF  
-
100  
ps  
4
ICS9211-02  
Preliminary Product Preview  
General Layout Precautions:  
1) Use a ground plane on the top layer of  
the PCB in all areas not used by traces.  
2) Make all power traces and vias as wide as  
possible to lower inductance.  
Capacitor Values:  
C3 : 100pF ceramic  
All unmarked capacitors are 0.01µF ceramic  
Connections to VDD:  
5
ICS9211-02  
Preliminary Product Preview  
COMMON  
DIMENSIONS  
VARIATIONS  
D
S
SYMBOL  
MIN. NOM. MAX.  
MIN. NOM. MAX. MIN. NOM. MAX.  
N
A
A1  
A2  
B
.061  
.004  
.055  
.008  
.0075  
.064  
.006  
.058  
.010  
.008  
.068  
.0098  
.061  
.012  
.0098  
AA  
AB  
AC  
AD  
.189  
.337  
.337  
.386  
.194  
.342  
.342  
.391  
.196  
.344  
.344  
.393  
.0020 .0045 .0076  
.0500 .0525 .0550  
.0250 .0275 .0300  
.0250 .0280 .0300  
16  
20  
24  
28  
C
D
E
e
H
L
SEE VARIATIONS  
.150  
.155  
.025 BSC  
.236  
.157  
.230  
.010  
.244  
.016  
150 mil SSOP Package  
.013  
N
S
SEE VARIATIONS  
SEE VARIATIONS  
0°  
0.85  
5°  
0.93  
8°  
.100  
Diminisions are in inches  
X
Ordering Information  
ICS9211yF-02  
Example:  
ICS XXXX y F - PPP  
Pattern Number (2 or 3 digit number for parts with ROM code patterns)  
Package Type  
F=SSOP  
Revision Designator  
Device Type (consists of 3 or 4 digit numbers)  
Prefix  
ICS, AV = Standard Device  
PRODUCT PREVIEW documents contain information on new  
products in the sampling or preproduction phase of development.  
Characteristic data and other specifications are subject to change  
without notice.  
6

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